President Biden signed the bipartisan CHIPS and Science Act into law on August 9, 2022. The Department of Commerce is overseeing $50 billion to revitalize the U.S. semiconductor industry and strengthen the country’s economic and national security. Of that sum, CHIPS for America within the U.S. Department of Commerce is responsible for administering $11 billion to advance U.S. leadership in semiconductor research and development (R&D) through four programs:    

• The CHIPS National Semiconductor Technology Center (NSTC) Program
• The CHIPS National Advanced Packaging Manufacturing Program (NAPMP) 
• The CHIPS Metrology Program   
• The CHIPS Manufacturing USA Program

CHIPS for America has released the following Notice of Funding  Opportunities (NOFO) for CHIPS R&D Programs: 

October 30, 2024: NOFO: CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and Processes (CARISSMA) Competition

October 18, 2024: NOFO: CHIPS National Advanced Packaging Manufacturing Program (NAPMP)

• The U.S. Department of Commerce issued a NOFO to seek proposals for new R&D activities that will establish and accelerate domestic capacity for semiconductor advanced packaging.
•  CHIPS for America anticipates making available up to approximately $1.6 billion for funding multiple awards across five R&D areas with the potential for follow-on funding for prototyping activities.
• The five R&D areas are:
  • Equipment, tools, processes, and process integration
  •  Power delivery and thermal management
  • Connector technology, including photonics and radio frequency (RF)
  • Chiplets ecosystem
  • Co-design/electronic design automation (EDA)
• Concept papers are due on December 20, 2024. Concept papers received after this deadline will not be reviewed or considered.
• On October 22, 2024, the CHIPS Research and Development Office hosted a one-day meeting for potential applicants to this funding opportunity, followed by on-demand webinars explaining each research and development area. 
• Following Proposer’s Day, the webinars can be found here.

May 5, 2024: NOFO: CHIPS Manufacturing USA institute

• U.S. Department of Commerce issued a NOFO to seek proposals from eligible applicants for activities to establish and operate a CHIPS Manufacturing USA institute focused on digital twins for the semiconductor industry. 

• The CHIPS for America Program anticipates up to approximately $285 million for a first-of-its kind institute focused on the development, validation, and use of digital twins for semiconductor manufacturing, advanced packaging, assembly, and test processes. 

• Concept papers were due June 20, 2024. 

• Full applications were due September 9, 2024.

• Dr. Eric Forsythe, director, and Dr. Michael McKittrick, deputy director, CHIPS Manufacturing USA Program, held a briefing on details of the NOFO on May 8, 2024, at 4:00 pm ET. The presentation and recording are posted on the CHIPS.gov webinars and events page.

February 28, 2024: NOFO: CHIPS NAPMP Materials and Substrates Research and Development

• The U.S. Department of Commerce issued a NOFO to seek applications for R&D activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors.
• The CHIPS for America program anticipates awarding approximately $300 million in amounts up to approximately $100 million over up to 5 years per award. Program awards may be leveraged by voluntary co-investment. 
• On March 1, 2024, CHIPS for America hosted a briefing on details of the NOFO. The presentation can be found here.
• Full proposals were due July 3, 2024.