The document provides an overview of the LTCC (Low-Temperature Co-fired Ceramic) process which involves punching and printing ceramic tapes, laminating the tapes together with green dielectric tape, co-firing the laminated stack, trimming and testing the final product. The process allows for complex three-dimensional structures to be created.
The document provides an overview of the LTCC (Low-Temperature Co-fired Ceramic) process which involves punching and printing ceramic tapes, laminating the tapes together with green dielectric tape, co-firing the laminated stack, trimming and testing the final product. The process allows for complex three-dimensional structures to be created.
The document provides an overview of the LTCC (Low-Temperature Co-fired Ceramic) process which involves punching and printing ceramic tapes, laminating the tapes together with green dielectric tape, co-firing the laminated stack, trimming and testing the final product. The process allows for complex three-dimensional structures to be created.
The document provides an overview of the LTCC (Low-Temperature Co-fired Ceramic) process which involves punching and printing ceramic tapes, laminating the tapes together with green dielectric tape, co-firing the laminated stack, trimming and testing the final product. The process allows for complex three-dimensional structures to be created.
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LTCC Process Overview
; ,LAIL-rViA VIA CONDUCTOR BLANKING PUNCHING FILLING PRINTING GREEN DIELECTRIC TAPE