1747-L40C PLC To PC Communication Manual

239-9986
Data Sheet
Data Pack D Issued March 1997
Allen-Bradley SLC 500
programmable logic controllers
The RS Allen-Bradley SLC 500 product
line
The SLC 500 family of small logic controllers surpass simple
machine control. A powerful instruction set, advanced
programming tools, and expanded product capabilities give
you all of the right reasons to apply the SLC 500 solution to
your next control application.
The SLC 500 product line is a growing family of small
programmable controllers built around two hardware
options; a fixed controller with an option to expand using a 2-
slot chassis, or a modular I/O controller. The programming
tools and most I/O modules are compatible between the two
hardware options, so you can cost effectively solve a broad
range of applications.
The SLC 500 product line offers a variety of discrete I/O
modules that enable you to cost-effectively configure your
control system. All of the discrete I/O modules are UL and
CSA certified for industrial applications and the majority are
approved for Class I, Division 2 hazardous environments.
Section index
1. When to choose fixed vs modular?
2. System overview
3. Performance specification comparison of fixed
and modular systems
4. Overview
4.1 System configuration
4.2 Programming
5. System selection guide
5.1 Configuring a fixed system
5.1.1 Tabular method
5.1.2 Charting method
5.2 Configuring a modular system
6. Typical SLC system
7. Technical specifications
7.1 Processors
7.2 Power supply modules
7.3 Input modules
7.4 Output modules
7.5 Specialty modules
7.5.1 Analogue modules
7.5.2 High-speed counter module
7.5.3 DH-485/RS-232C interface module
7.6 Programmers and operator interface
7.6.1 APS
7.6.2 HHT
7.6.3 DTAM
7.7 Chassis and cables
7.7.1 Chassis
7.7.2 Cable
7.8 Memory modules and accessories
7.8.1 Memory modules for fixed SLC 5/01 and
SLC 5/02
7.8.2 Card slot filler
7.8.3 Battery
8. SLC application examples
8.1 Application: High-speed position sensing
8.2 Application: Remote dial-up of an SLC
8.3 Application: PID temperature control
9. General installation requirements
9.1 Loading and installation
9.1.1 Considerations for safety
9.1.2 Considerations for power
9.2 Installation environment
9.3 Calculation of heat
9.4 Mounting instructions
9.4.1 Mounting the fixed style
9.4.2 Mounting the modular style
9.5 Wiring instructions
9.5.1 Wiring of power supply
9.5.2 Wiring of I/O equipment
9.5.3 Grounding
10. Dimensions
10.1 Fixed controller
10.2 Expansion chassis
10.3 Modular controller (with power supply)
11. Programming
11.1 Basics
11.2 Ladder logic representation
11.3 SLC memory organisation
12. Programming instructions
12.1 Bit instructions
12.2 Comparison instructions
12.3 Timer and counter instructions
12.4 Communication instructions
12.5 I/O and interrupt instructions
12.6 File copy and file fill instructions
12.7 Math instructions
12.8 Proportional integral derivative instructions
12.9 Move and logical instructions
12.10 Bit shift, FIFO and LIFO instructions
12.11Sequencer instructions
12.12Control instructions
12.13ASCII instructions (applies to SLC 5/03
OS301 processors only)
13. List of instructions
SLC, SLC 500, SLC 5/01, SLC 5/02, SLC 5/03 and DTAM
are trademarks of Allen-Bradley Company, Inc.
1. When to choose fixed vs modular?
There are two hardware styles to choose from - the fixed
hardware style and the modular hardware style.
Fixed hardware style
The SLC 500 fixed style includes a processor with 1K
instruction capacity, a power supply and a fixed number of
I/O in one complete package. The 20, 30, and 40 I/O
versions accept a 2-slot expansion chassis. All fixed I/O units
are panel mountable. The fixed hardware style is
expandable to 72 I/O points.
Modular Hardware Style
For applications requiring more flexibility, the modular style
offers a wide variety of I/O options. Modular style chassis
are available in 4, 7, and 10-slot versions. The chassis can be
connected together to form a system of up to 30 slots.
Choose from 3 power supplies, 3 processors, and a dozen
I/O cards to tailor a system exactly for the application. The
modular hardware style is expandable to 480 I/O points.
SLC 5/ 01
Modular I/O systems that include an SLC 5/01 processor can
be configured with a maximum of three chassis (30 total
slots) from 4 I/O points to a maximum of 256 I/O points. Two
SLC 5/01 processors (CPUs) are available for the modular
I/O system.
B 1K instruction capacity version with capacitor-backed
RAM memory. An optional battery can be used to retain
RAM memory contents for a longer period of time when
power is removed from the processor.
B 4K instruction capacity version with battery-backed
RAM as standard.
Optional EEPROM and UVPROM memory modules are
available for use with the 5/01 processor.
SLC 5/ 02
The SLC 5/02 processor provides enhanced
communications, faster scan times, advanced instructions,
and extensive diagnostics that allow it to work in more
complex applications. It has 4K instruction capacity, with
battery-backed RAM included. Modular I/O systems, which
include an SLC 5/02 processor, can be configured with a
maximum of 3 chassis (30 total slots) from 4 I/O points to a
maximum of 480 I/O points. Optional EEPROM and UVPROM
memory modules are available for use with the SLC 5/02
processor.
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SLC 5/ 03
The SLC 5/03 processor introduces 32-bit technology. It has
a 3-position key switch on the front panel of the module that
allows you to select the mode of operation. It also provides
built-in RS-232 and DH-485 communications for SCADA and
direct programming as well as on-line program editing and
improved system throughput. The SLC 5/03 has battery-
backed RAM included and accommodates real-time
applications. The SLC 5/03 has 12K instruction capacity.
SLC 5/ 04
The SLC 5/04 processors incorporate all of the functionality
of the SLC 5/03 processor and add increased
communications capabilities, more memory, and faster
throughput. The standard DH-485 port has been placed with
a DH+ port, providing high-speed SLC 5/04-to-SLC 5/04
communications and direct connection to PLC-5
S. The
available memory options are 12K, 28K, or 60K user
instructions, all with 4K additional data words.
Modular I/O systems that include an SLC 5/03 or SLC 5/04
processor can be configured with a maximum of three
chassis (30 total slots) from 4 I/O points to a maximum of 960
local I/O points. I/O capacity is expandable via Remote I/O
and DeviceNet.
An optional memory module is available for use with SLC
5/03 or SLC 5/04 processor. It provides UVPROM and
EEPROM functionality.
SLC 500 I/O modules are available with 4, 8, 16, or 32 points.
Combination modules with 2 inputs / 2 outputs, 4 inputs / 4
outputs, and 6 inputs / 6 outputs are also available.
A wide variety of I/O voltages (including ac, dc, and TTL),
analog I/O and speciality modules are available to help you
create a close fit for your application.
Output Terminals
Input Terminals
Power Supply
Processor (CPU)
slot 0
SLC 500 Fixed Controller
Power Supply
Processor
Input Modules
Output Module
slot 0 1 2 3
SLC 500 Modular Controller
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2. System overview
Product RS stock no. Allen-Bradley no. Description and features
817-886 1747-L20C 20 I/O Fixed Hardware Style (12) dc sink in w/HSC &
(8) relay out, ac line power
Processor 817-634 1747-L511 SLC 5/ 01Central Processor Unit (processor)
Program memory - 1K instructions
817-640 1747-L514 SLC 5/ 01Central Processor Unit (processor)
817-656 1747-L524 SLC 5/ 02Central Processor Unit (processor)
157-5173 1747-L532 SLC 5/03 Central Processor Unit (processor)
Program memory - 12K words
216-2469 1747-L541 SLC 5/04 Central Processor Unit (processor)
Program memory - 12K words
817-690 1746-P1 Power Supply chassis mount (120/240Vac 2 Amps with
user power)
Power 817-707 1746-P2 Power Supply chassis mount (120/240Vac 5 Amps with
supply user power)
817-713 1746-P3 Power Supply chassis mount (240Vdc 3.6 Amps with
user power)
817-741 1746-IA16 ac Input Module (16) inputs 100/120Vac
Input
817-729 1746-IB16 dc Input Module (16) inputs sink 24Vdc
module
817-735 1746-IV16 dc Input Module (16) inputs source 24Vdc
157-5230 1746-IB32 dc Input Module (32) inputs sink 24Vdc
817-763 1746-OA16 ac Output Module (16) triac 120/240Vac
Output
817-757 1746-OB16 dc Output Module (16) transistor source 10-50Vdc
module
817-779 1746-OW16 Relay Output Module (16) outputs 10-250 Vac/10-125Vdc
157-5202 1746-OX8 Relay Output Module (8) outputs 5-265Vac/5-125Vac
216-2447 1746-OB32 dc Output Module (32) transistor source 10-50Vdc
817-785 1746-NI4 (4) Analogue Inputs, each selectable to accept either
current or voltage
Analogue
817-791 1746-NO4I Analogue Module (4) current outputs, 020mA
module 817-808 1746-NO4V Analogue Module (4) voltage outputs 10Vdc to + 10Vac
157-5218 1746-NIO4I (2) Analogue Inputs, each selectable to accept either
current or voltage
(2) current outputs - 020mA
216-2453 1746-NIO4V (2) High Resolution Analogue Inputs, each selectable to accept
either current or voltage
(2) Analogue Voltage outputs
216-2532 1746-NT4 Thermocouple/mV input module
216-2548 1746-NR4 RTD/Resistance input module
817-814 1746-HSCE High-Speed Counter Encoder Module
Specialty
817-820 1747-KE DH-485/RS-232C Interface Module
module
817-937 1747-PIC Converter RS-232/DH-485
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Product RS stock no. Allen-Bradley no. Description and features
817-921 1747-PA2E Advanced Programming Software English
- 1747-PA2F Advanced Programming Software French
- 1747-PA2G Advanced Programming Software German
- 1747-PA2I Advanced Programming Software Italian
Program-
- 1747-PA2J Advanced Programming Software Japanese
ming
817-959 1747-PTA1E Memory Pak English
software
- 1747-PTA1F Memory Pak French
- 1747-PTA1G Memory Pak German
- 1747-PTA1I Memory Pak Italian
Hand-Held Terminal
817-943 1747-PT1 Note: Does not include battery or Memory Pak. (A
Memory Pak must be ordered with each Hand-Held
Terminal.)
Operator 817-836 1747-DTAM-E Data Table Access Module with English Users
interface Manual
817-965 1746-A4 4-slot Chassis Modular Hardware Style
Chassis
216-2431 1746-A13 13 slot Chassis Modular Hardware Style
817-915 1746-A2 2-slot Expansion Chassis for Fixed Hardware Style
817-684 1746-C9 36-inch Chassis Interconnect Cable
Cable 157-5195 1747-CP3 SLC 5/03 RS-232 Program Cable
216-2510 1784-CP13 Programming cable I784-KTX to SLC 5/04
Memory
817-842 1747-M1 EEPROM with 1K User Instructions (SLC 5/01 & 5/02)
module
817-858 1747-M2 EEPROM with 4K User Instructions (SLC 5/01 & 5/02)
216-2481 1747-M11 EEPROM with 20K Words (SLC 5/03 & 5/04)
817-864 1746-N2 Modular Card Slot Fillers Orders must be for
two fillers or multiples of two.
Accessory
817-870 1747-BA Battery (For RAM memory retention)
157-5189 1747-AIC Isolated Link Coupler for DH-485 Connection
- D1746-6.4 Analogue User's Manual
- D1746-6.5 High-Speed Counter Encoder Users Manual
- D1747-ND013 DTAM Users Manual
- D1747-NI001 Fixed Hardware Style Installation and Operation
Manual
845-948 D1747-6.2 Modular Hardware Style Installation and Operation
Manual
845-932 D1747-6.3 APS Getting Started Guide
- 9399-APSUM APS User Manual
- 9339-APSIE APS Import/Export Users Manual
- D1747-NM009 HHT Getting Started Guide
- D1747-NP002 HHT User Manual
845-926 D1747-6.15 APS Reference Manual
- D1747-6.12 DH-485/RS-232C Module Manual (for 1747-KE)
Manual
(shipped
with product
and
available
separately)
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3. Performance specification comparison
of fixed and modular systems
The following table describes the general specifications for
the SLC fixed, SLC 5/01 and the SLC 5/02 processors.
' Fixed style and the 1K version SLC 5/01 only The
capacitor back-up is rated at 35C (95F).
^ Lithium battery is optional for the fixed style and the 1K
version SLC 5/01; standard for the 4K version SLC 5/01.
The scan times are typical for a 1K ladder logic program
consisting of simple ladder logic and communication
servicing. Actual scan times depend on your program
size, instructions used, and communication to the
programming device.
* The SLC 5/03 and 5/04 flash EPROM memory module
cannot be erased with UV light. It must be
reprogrammed or erased with a Prom Programmer
using the Memory Module Adaptor.
Specification Fixed SLC 5/ 01 SLC 5/ 02 SLC 5/ 03 SLC 5/ 04
Program memory 1K instructions 1K or 4K instructions 4K instructions 12K words 12K words
Additional data storage 0 0 0 up to 4K words up to 4K words
I/O capacity 72 Discrete 256 Discrete 480 Discrete 960 Discrete 960 Discrete
Max. chassis/ I/O slots 2-slot chassis 3 chassis, 30 slots 3 chassis, 30 slots 3 chassis, 30 slots 3 chassis, 30 slots
Standard RAM Capacitor -2 weeks Capacitor -2 weeks
'
Lithium Battery - Lithium Battery - Lithium Battery -
Lithium Battery Lithium Battery 2 years 2 years 2 years
-5 years
^
-2 years
^
Memory back-up EEPROM or UVPROM EEPROM or UVPROM EEPROM or UVPROM EEPROM or UVPROM EEPROM or UVPROM
options
LED indicators RUN, CPU FAULT, RUN, FAULT, RUN, FAULT, RUN, FAULT, RUN, FAULT,
FORCED I/O, FORCED I/O, FORCED I/O, FORCED I/O, FORCED I/O,
BATTERY LOW BATTERY LOW BATTERY LOW, COMM. BATTERY LOW, BATTERY LOW,
DH-485, RS-232 DH-485, RS-232
Programming APS or HHT APS or HHT APS or HHT APS APS
Processor instruction 52 52 71 71 71
set
Typical scan time
8 ms/K 8 ms/K 4.8 ms/K 1ms/K 0.9ms/K

Bit execution (XIC) 4 microseconds 4 microseconds 2.4 microseconds 0.4 microseconds 0.37ms
Certification UL listed/CSA UL listed/CSA UL listed/CSA UL listed/CSA UL listed/CSA
approved approved approved approved approved
Class 1, Groups A, B, Class 1, Groups A, B, Class 1, Groups A, B, Class 1, Groups A, B, Class 1, Groups A, B,
C or D, Division 2 C or D, Division 2 C or D, Division 2 C or D, Division 2 C or D, Division 2
CE marked for all CE marked for all CE marked for all CE marked for all CE marked for all
application application application application application
directives directives directives directives directives
4. Overview
4.1 System configuration
The basic fixed controller consists of a processor with 1,024
(1K) instruction capacity, a power supply, and a fixed
number of I/O contained in a single package.
The basic modular controller consists of a chassis, power
supply, processor module (CPU), Input/Output (I/O
modules), and an operator interface device for programming
and monitoring.
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Fixed Hardware Components
Fixed Controller with 2-slot Expansion Chassis
Fixed Hardware Controller
Input Module Output Module
Operator Interface
2-Slot Expansion Chassis
for I/O Modules
Power Supply
Processor
Module
Input Module Output Module Specialty
I/O Module
Operator Interface
Chassis
Modular Hardware Components
Modular Controller
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4.2 Programming
The SLC product line can be programmed using two
different methods, one by using the Hand-Held Terminal
(HHT) and the other using the Advanced Programming
Software (APS), which operates on an IBM-AT/XT or
compatible personal computer.
Both methods have extensive diagnostics, expanded ladder
editors, and are available in several languages. As a result,
either method can be used to configure the SLC processors,
enter or modify an application program, monitor the
execution of the application in real-time, or troubleshoot an
application program.
The HHT can be used to configure the SLC 500 Fixed, SLC
5/01 and SLC 5/02 processors. It accepts programs with a
maximum data table size of 6K. Each rung may contain up to
127 instructions.
APS, on the other hand, has a maximum data table size of 16K
and each rung can contain 128 instructions. It can be used to
configure all SLC 500 family processors.
The instructions include:
B Bit instructions
B Timer and counter instructions
B Math instructions
B Control instructions
B Comparison instructions
B Sequencer instructions
B Bit shift, FIFO, and LIFO instructions
B Move and logical instructions
B File instructions
B Special instructions for the SLC 5/02 and above only such
as PID (Proportional, Integral, Derivative).
5. System selection guide
5.1 Configuring a fixed system
You can use either of two methods to determine whether the
2-slot, fixed I/O expansion chassis will support a specific
combination of modules.
B Tabular method
B Charting method.
The table below represents combinations of modules and
indicates whether or not each combination is valid. The chart
that follows represents the region of operating current that
the fixed I/O expansion chassis supports.
5.1.1 Tabular method
Using the table below, locate both of the modules you plan to
use in the fixed I/O expansion chassis. Follow the top row
across until you find one of the modules. Then follow the
right column down until you find the other module. The
symbol shown in the table cell that marks their intersection
gives you information you must know before installing the
modules.
A dot indicates a valid combination.
No symbol indicates an invalid combination.
A triangle indicates an external 24Vdc power supply
may be required.
B
B B B B B B B + B B B B B B B B
B B + +
B B B B B + B B B B B B B B
B B B B + B B B B B B B B
+ +
B B + + B B B B B B
+ + B
+ + + + + + + + +
+ + + + + +
I
A
1
6
O
A
1
6
I
B
1
6
I
V
1
6
O
W
1
6
N
I
4
H
S
C
E
O
B
1
6
N
O
4
I
N
O
4
V
K
E
N
I
0
4
I
I
B
3
2
O
X
8
N
I
0
4
V
N
T
4
N
R
4
O
B
3
2
IA16
OA16
IB16
IV16
OW16
NI4
HSCE
OB16
NO4I
NO4V
KE
NI04I
IB32
OX8
NI04V
NT4
NR4
OB32
B B
+
B B B B B B
B B
B B B B B B
B B B
B B
B B
B
Y
Y
5.1.2 Charting method
The following chart depicts the range of current
combinations supported by the fixed I/O expansion chassis.
To use it, you must first determine the backplane current
draw and operating voltage for both of the modules you plan
to use in the chassis. You can get these specifications from
the table alongside the chart. Next, plot each of the currents
on the chart below. If the point of intersection falls within the
operating region, your combination is valid. If not, your
combination cannot be used in a 2-slot, fixed I/O chassis.
1. Add current draws of both modules.
2. Plot this point on the chart above.
3. Plot current draw.
4. Note the point of intersection.
Important: The NO4I and NO4V analogue output modules
may require an external power supply. Refer to
the analogue user manual.
5Vdc Amps 24Vdc Amps
1A16 0.085 -
OA16 0.370 -
IB16 0.085 -
IV16 0.085 -
OW16 0.170 0.180
N14 0.025 0.085
HS 0.300 -
OB16 0.280 -
NO41 0.055 0.195
NO4V 0.055 0.145
KE 0.150 0.040
NIO4I 0.055 0.145
IB32 0.104 -
OX8 0.085 0.090
OB32 0.452 -
NI04V 0.055 0.115
NR4 0.050 0.050
NT4 0.060 0.040
450
350
400
300
250
200
150
100
50
200 150 100 50
5 V dc
Current
(mA)
24 V dc Current (mA)
Valid Operating Region
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5.2 Configuring a modular system
1. Estimate the total amount of memory this system
requires:
a) Add up the number of discrete I/O points and place it
in (a).
b) Add up the number of analogue I/O points and place
it in (b).
c) Add up the number of specialty I/O modules and
place it in (c).
d) Multiply a, b, and c by the number indicated.
e) Total those numbers to give you a memory estimate.
2. Select a processor:
Place your choice into slot 0 of chassis 1 on the worksheet.
3. Select the I/O:
a) If multiple chassis system, make copies for each
chassis.
b) Write in the chassis number.
c) Write in the appropriate slot numbers.
d) Select your discrete I/O.
e) Select your specialty and analogue I/O.
f) Using the worksheet, list each I/O module in the slot
you desire.
g) List the power consumption of each module in the
esignated columns. Be sure to account for future
expansion.
h) When the chassis is complete, add up each power
consumption column.
4. Select the correct power supply:
a) Compare the Power Consumption totals with each
power supply.
b) Choose the smallest power supply that provides
sufficient power.
Note: The current shown is rated at 55C.
5. Select the chassis:
a) Add up the number of slots used.
b) Select the smallest chassis which can hold your I/O.
Be sure to account for future expansion.
6. Select the miscellaneous devices:
To complete your system, include devices such as:
cables, communication interfaces, operator interface
devices, and memory modules.
Required memory Required I/ O Processor
0 to 1K Less than 256 SLC 5/01
1K to 4K Less than 256 SLC 5/01
1K to 4K Greater than 256 SLC 5/02
Greater than 4K Greater than 256 SLC 5/03-5/04
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SLC 500 Chassis configuration worksheet
1. To estimate your memory requirements, count the number of discrete and analogue I/O points, plus the number of
specialty I/O.
a) discrete I/O points a) _____ 3 10 = ______ Instruction Words
b) analog input and output points b) _____ 3 25 = ______ Instruction Words
c) specialty I/O points c) _____ 3 100 = ______ Instruction Words
Estimated Total Memory Required ______ Instruction Words
2. Select the Processor
Catalogue Number 1747-L511 SLC 5/01 1K Instructions
Catalogue Number 1747-L532 SLC 5/03 12K Words
Catalogue Number I747-L541 SLC 5/04 12K Words
3. Select I/O
Chassis Number ___ Catalogue Number Power Consumption Price
5V 24V
Slot ______ ______ ____________ ______ (Slot 0 Reserved
Slot ______ ______ ____________ ______ or processor in
Slot ______ ______ ____________ ______ chassis)
Slot ______ ______ ____________ ______
Slot ______ ______ ____________ ______
Slot ______ ______ ____________ ______
Slot ______ ______ ____________ ______
Slot ______ ______ ____________ ______
Slot ______ ______ ____________ ______
Slot ______ ______ ____________ ______
Slot ______ ______ ____________ ______
Slot ______ ______ ____________ ______
Slot ______ ______ ____________ ______
Total Current ____________
4. Select the Power Supply (55C rating)
Catalogue Number 1746-P1 2A 46A ______
Catalogue Number 1746-P2 5A 96A ______
Catalogue Number 1746-P3 3.6A 87A ______
5. Select the Chassis
Catalogue Number 1746-A4 4 slots ______
Catalogue Number I746-A13 13 slots ______
6. Select Miscellaneous Devices
__________ ______
__________ ______
__________ ______
__________ ______
Total System Cost ______
' Includes power requirements for the DTAM, PIC, and the HHT.
Power Consumption (Amps)'
5Vdc 24Vdc
0.35 0.105
0.35 0.105
0.35 0.105
0.50 0.175
1.00 0.2
6. Typical SLC system
The figure below consists of some components that make up
a typical installation.
7. Technical specifications
7.1 Processors
The SLC 500 processor product line offers a fixed processor
and two types of chassis-based processors.
The SLC fixed controller is a pre-packaged system
consisting of a processor, power supply, network port, and
I/O points. The fixed controller offers you a comprehensive
ladder logic instruction set including math, compare, move,
and sequencing instructions.
The SLC 5/01 processor offers the instruction set of the SLC
500 fixed controller in a modular hardware configuration.
The SLC 5/01 processor provides:
B Two choices of program memory size 1K or 4K
instructions
B Optional battery back-up for the -L511; standard for the
-L514
B Addressing of up to 256 I/O
B Powerful ladder logic programming instruction set
B Subroutines.
B Built-in DH-485 communication channel (peer-to-peer
communication response to message commands only).
The SLC 5/02 processor expands beyond the SLC 5/01
processor capabilities by offering additional instructions and
increased diagnostics. The SLC 5/02 processor provides:
B Program memory size of 4K instructions
B Ability to handle 32-bit signed math functions
B User fault routines
B Interrupt capability
B PID used to provide closed loop control
B Indexed addressing
B Built-in DH-485 communication channel (initiation of
peer-to-peer communication).
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Main features
B Supports I/O configurations of up to 3 chassis (30 slots)
of I/O. Provides you with the flexibility to expand I/O
capacity as required.
B Supports a variety of input and output modules.
B Provides user selectable program security. The wide
range of system protection capabilities allow you to
secure user data and program files from changes.
B Provides superior system throughput. SLC 500 modular
processors deliver fast overall system throughput times
in addition to fast program scan times.
B Supports user memory sizes from 1 to 12K. By offering
a wide range of user memory, SLC 500 modular
processors can be used in a realm of applications.
The SLC 5/03 processor significantly increases performance
by supplying system throughput times less than 1ms for a
typical 1K user program. Now applications such as high-
speed packaging, sorting, and material handling become
more affordable. With the addition of on-line editing, the SLC
5/03 processor presents a positive solution for your
continuous process application. The SLC 5/03 processor
provides:
B Program memory size of 12K, plus 4K additional data
space
B On-line programming (includes runtime editing)
B Built-in RS-232 channel supporting:
- DFI Full-Duplex for remote or point-to-point
communication, or direct connection to IBM compatible
programming devices
- DFI-Half-Duplex Slave for remote communication to a
master device
- DH-485 (serves as a second DH-485 channel using a
1747-PLC or direct connection to IBM compatible
programming devices)
- ASCII for connection to other ASCII devices, such as
barcode readers, printers and weigh scales
B Built-in DH-485 channel
B Built-in real-time clock/calendar
B 1ms Selectable Timed Interrupt (STI)
B 0.50ms Discrete Input Interrupt (DII)
B Advanced math features - PID and floating point
IEC or NEMA rated enclosure suitable for your
application and
environment that shields your controller from electrical
Disconnect, to remove power from the system
Fused isolation transformer or a constant voltage
transformer, as your application requires
Master control relay/emergency-stop circuit
Terminal blocks or wiring ducts
Suppression devices for limiting EMI (electromagnetic
interference) generation
1
2
3
4
5
6
1
4
3
2
6
5
MCR
Disconnect
Isolation
Transformer
SLC 500 Controller
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B Flash PROM provides firmware upgrades without
physically changing EPROMs
B Keyswitch - RUN, REMote, PROGram (clear faults).
The SLC 5/04 processor provides the baseline funcionality of
the SLC 5/03 processor plus DH+ communication.
Communication via DH+ takes place three times faster than
DH-485 communication, providing you with increased
performance levels. In addition, the SLC 5/04 processor runs
approximately 15% faster than the SLC 5/03 processor,
yielding system thru-put times of 0.90ms for a typical 1K user
program.
The SLC 5/04 processor provides :
B program memory sizes of 12K, plus 4K additional data
space
B high-speed performance - 0.90ms/K typical
B control of up to 960 local I/O, expandable via Remote I/O
and DeviceNet
B online programming (includes runtime editing)
B built-in DH+ channel, supporting :
- high-speed SLC 5/04 to SLC 5/04 communication
- mesaging capability between PLCs
and SLCs
- monitoring capabilities to PLC-2
, PLC-3
,
PLC-5
and PLC-5/250 processors

B built-in RS-232 channel, supporting:
- DF1 Full-Duplex for remote or point-to-point
communication, or direct connection to IBM
compatible programming devices
- DF1 Half-Duplex Master/Slave for SCADA type
communication
- DH-485 (serves as a second DH-485 channel using
a 1747-PIC or direct connection to IBM compatible
programming devices)
- ASCII for connection to other ASCII devices, such
as bar code readers, printers and weigh scales
B passthru capability to panelView 550 and PanelView
900
B remote I/O passthru
B built-in real-time clock/calander
B 1ms Selectable Timed Interrupt (STI)
B 0.50ms Discrete Input Interrupt (DII)
B advanced math features - PID and floating point
B flash PROM provides firmware upgrades without
physically changing EPROMS
B keyswitch - RUN, REMote, PROGram (clear faults).
' Fixed style and the 1K version SLC 5/01 only the capacitor back-up is rated at 35C (95F).
^ Lithium battery is optional for the fixed style.
The scan times are typical for a 1K ladder logic program consisting of simple ladder logic and communication servicing.
Actual scan times depend on your program size, instructions used, and communication to the programming device.
Specification Fixed
Program memory 1K Instruction
Additional data storage 0
I/O capacity 72 Discrete
Max. chassis/ I/O slots 2-slot chassis
Standard RAM Capacitor2 weeks' Lithium Battery5 years^
Memory back-up options EEPROM or UVPROM
LED indicators RUN, CPU FAULT, FORCED I/O, BATTERY LOW
Programming APS or HHT
Typical scan time 8 ms/K
Processor instruction set 52
Bit execution (XIC) 4 microseconds
Packaged shipping weights 1747-L20 2.40 Kg (5 lb 6 ozs)
1747-L30 2.80 Kg (6 lb 4 ozs)
1747-L40 3.08 Kg (6 lb 14 ozs)
Noise immunity NEMA Standard ICS 2-230
Ambient temperature rating Operating: 0C to +60C (+32F to +140F)
Storage:40C to +85C (40F to +185F)
Humidity 5 to 95% without condensation
Vibration Displacement: .015 inch, peak-to-peak @ 5-57Hz
Acceleration: 2.5 Gs @ 57-2000Hz
Duration: 1hr per axis (x, y, z)
Certification UL listed, CSA approved
PC RUN
CPU FAULT
FORCED I/O
BATTERY LOW
POWER
' Fixed style and the 1K version SLC 5/01 only The capacitor back-up is rated at 35C (95F).
^ Lithium battery is optional for the fixed style and the 1K version SLC 5/01; standard for the 4K version SLC 5/01.
The scan times are typical for a 1K ladder logic program consisting of simple ladder logic and communication servicing.
Actual scan times depend on your program size, instructions used, and communication to the programming device.
* The SLC 5/03 & 5/04 flash EPROM memory module cannot be erased with UV light. It must be reprogrammed or erased
with a PROM programmer using the memory module adaptor.
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PC RUN
CPU FAULT
FORCED I/O
BATTERY LOW
SLC 5/01 CPU
RUN COMM
CPU FAULT
FORCED I/O
BATTERY LOW
SLC 5/02 CPU
RUN
FLT
BATT
SLC 5/03 CPU
OR OR
FORCE
DH485
RS232
RUN REM PROG
Slot 0
Specification SLC 5/ 01 SLC 5/ 02 SLC 5/ 03 SLC 5/ 04
Program memory 1K or 4K instructions 4K instructions 12K words 12K words
Additional data storage 0 0 Up to 4K words Up to 4K words
I/O capacity 256 Discrete 480 Discrete 960 Discrete 960 Discrete
Max. chassis/ I/O slots 3 chassis, 30 slots 3 chassis, 30 slots 3 chassis, 30 slots 3 chassis, 30 slots
Standard RAM Capacitor2 weeks' Lithium Battery2 years Lithium Battery - 2 years Lithium Battery - 2 years
Lithium Battery2 years^
Memory back-up options EEPROM or UVPROM EEPROM or UVPROM EEPROM or UVPROM* EEPROM or UVPROM*
LED indicators RUN, FAULT, FORCED I/O, RUN, FAULT, FORCED I/O, RUN, FAULT, FORCED I/O, RUN, FAULT, FORCED I/O,
BATTERY LOW BATTERY LOW, COMM. BATTERY LOW, DH-485, BATTERY LOW, DH-485,
RS-232 RS-232
Programming APS or HHT APS or HHT APS APS
Processor instruction set 52 71 71 71
Typical scan time 8 ms/K 4.8 ms/K 1 ms/K 1 ms/K
Bit execution (XIC) 4 microseconds 2.4 microseconds 0.4 microseconds 0.37 microseconds
Noise immunity NEMA Standard ICS 2-230
Ambient temperature rating Operating: 0C to +60C (+32F to +140F)
Storage: 40C to +85C (40F to +185F)
Humidity 5 to 95% without condensation
Vibration Displacement: .015 inch, peak-to-peak @ 557Hz
Acceleration: 2.5 Gs @ 57-2000Hz
Certification UL listed/CSA approved
Class 1, Groups A, B, C or D, Division 2
CE marked for all applicable directives
SLC 5/04 CPU
FORCE
DH+
RS232 BATT
FLT
RUN
RUN REM PR OG
OR
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Selecting chasis
The chassis houses the processor and I/O modules. The
power supply mounts on the left side of the chassis. All
components easily slide into the chassis along guides formed
in the chassis. No tools are required to insert or remove the
processor or I/O modules. A maximum of three chassis (30
I/O slots) may be connected in an SLC system.
There are four sizes of chassis that you can choose; 4-slot; 7-
slot; 10-slot and 13-slot.
Selecting modular processors
The processor always occupies the first slot of the first
chassis (slot 0). The SLC 5/01 processor is available with a
memory range of 1K or 4K of user instructions. The SLC
5/02 is available with 4K of user instructions. The SLC
5/03 processor is available with 12K of user instructions
and 4K of additional data words. The SLC 5/04 processor is
available with 20K of user instructions and 4K of additional
data words. These processors operate in an environment up
to +60C (+140F).
The 1K processor is supplied with a 2-week capacitor back-
up as standard and an optional 5-year battery back-up in the
event of power interuption. The 4K, 12K and 20K processors
are supplied with 2-year battery back-up as standard.
Optional memory modules are also available for the SLC
5/01, 5/02, 5/03 and 5/04 processors. For more details on
memory modules, see pages 1-12.
We designed the SLC 500 processors to operate in an
industrial environment, To keep the processor running as
reliably as possible, install all processors in a manner that
provides protection from various corrosive agents such as
dirt, grease, and falling debris, particularly electrically
conducting material.
7.2 Power supply modules
Allen-Bradley offers three different power supplies, two ac
and one 24Vdc. The ac supplies can be configured to
operate using 120 or 240Vac.
Features
B All power supplies have an LED that indicates proper
supply power.
B Supplies have a hold-up time (the time the system is
operational during a brief power loss) typically
between 20 milliseconds and 3 seconds.
B On ac power supplies, you can select either 120V or 240V
operation by setting a jumper.
B ac supplies have an external 24Vdc terminal that can be
used to power I/O devices.
100/120 Volts 200/240 Volts
Fuse
POWER
1746-P1 and -P2 1746-P3
Fuse
POWER
Specification 1746-P1 1746-P2 1746-P3
Line voltage 85-132/170-265Vac 85-132/170-265Vac 19.2-28.8Vdc
47/63Hz 47/63Hz
Typical line power 135VA 180VA 90VA
requirement
Backplane current 2.0A at 5Vdc 5.0A at 5Vdc 3.6A at 5Vdc
capacity (derated by 0.46A at 24Vdc 0.96A at 24Vdc 0.87A at 24Vdc
5% at +60C)
24Vdc user power 200mA 200mA NA
output current
Hold-up time 20 ms to 3000 ms 20 ms to 3000 ms 20 ms to 3000 ms
(load dependent)
Fuse protection 3.0A 3.0A 5.0A
Inrush current 20.0A (max.)
Temperature range 0 to +60C (+32 to + 140F)
Wiring Two #14 AWG wires per terminal (max.)
7.3 Input modules
The 1746 I/O platform is a modular hardware design that
uses a cost and space effective means to add I/O modules to
your control system. I/O modules can interface to ac and dc.
Features
B LEDs indicate the status of each I/O point. Assisting you in
troubleshooting, LEDs illuminate when the proper signal
is received at an input terminal, or when the processor
commands an output channel to turn on.
B Select I/O modules to exactly match your application.
B Expand the I/O capacity of your fixed controller system.
Two discrete I/O modules can be added to the fixed
controllers 2-slot expansion chassis increasing the
flexibility of the system.
B Digital and field circuits are isolated. All modules feature
optical isolation between digital and field circuits resulting
in increased noise immunity, and limited damage to your
system due to an electrical malfunction of the field
wiring.
B Self-lifting field-wire pressure plates cut installation time.
Wiring terminals have self-lifting pressure plates to
secure two #14 AWG field wires.
B Removable terminal blocks help ease the wiring task.
Removable terminal blocks allow you to replace the
module without rewiring it.
B Removable terminal blocks are colour coded for quick
identification. A matching colour band is also provided on
the front of the module to assist in matching the terminal
block to the module.
B Barrier type terminal blocks provided on all modules.
Each terminal block features a barrier on three sides of
each terminal to help prevent accidental shorting of field
wiring.
B Self-locking tabs secure the module in the chassis. No
tools are necessary to install or remove a module from the
chassis. To install a module, you slide it into the chassis
until it latches in place.
239-9986
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Backplane
current Offstate
Voltage Operating No. of Points per Catalogue draw (A) Signal delay current
category voltage inputs common number 5V 24V (ms. max.) (max.)
100/120Vac 85-132 16 16 1746-IA16 0.085 0 on = 35 2mA
off = 45
10-30 sink 16 16 1746-IB16 0.085 0 on = 8 1mA
12/24Vdc
off = 8
10-30 source 16 16 1746-IV16 0.085 0 on = 8 1mA
off = 8
24Vdc 18-30 at 50C 32 8 1746-IB32 0.106 0 on = 3 1mA
18-26.4 at 60C off = 3
sink
Terminal Identification
Diagrams on Each Module
LEDs indicate the status
of each I/O point
INPUT
IN 0
IN 1
IN 2
IN 3
IN 4
IN 5
IN 6
IN 7
IN 8
IN 9
IN 10
IN 11
IN 12
IN 13
IN 14
IN 15
AC COM
AC COM
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15
7.4 Output modules
ac/dc relay, ac triac, and dc transistor output modules are
available.
Features
B LEDs indicate the status of each I/O point. Assisting you in
troubleshooting, LEDs illuminate when the proper signal
is received at an input terminal, or when the processor
commands an output channel to turn on.
B All relay contacts are Silver Cadmium with Gold overlay.
Cold plating resists oxidation and tarnishing resulting
from non-use. Silver Cadmium acts as an excellent
conductor.
B Select I/O modules to exactly match your application.
B Expand the I/O capacity of your fixed controller system.
Two discrete I/O modules can be added to the fixed
controllers 2-slot expansion chassis increasing the
flexibility of the system.
B Digital and field circuits are isolated. All modules feature
optical isolation between digital and field circuits
resulting in increased noise immunity, and limited
damage to your system due to an electrical
malfunction of the field wiring.
B Self-lifting field-wire pressure plates cut installation time.
Wiring terminals have self-lifting pressure plates to
secure two #14 AWG field wires.
B Removable terminal blocks help ease the wiring task.
Removable terminal blocks allow you to replace the
module without rewiring it.
B Removable terminal blocks are colour coded for quick
identification. A matching colour band is also provided on
the front of the module to assist in matching the terminal
block to the module.
B Barrier type terminal blocks provided on all modules.
Each terminal block features a barrier on three sides of
each terminal to help prevent accidental shorting of field
wiring.
B Self-locking tabs secure the module in the chassis. No
tools are necessary to install or remove a module from
the chassis. To install a module, you slide it into the
chassis until it latches in place.
Signal Surge
Backplane delay Continuous Continuous On-state current
Points current (max.) Off-state Load current per current per voltage per
Voltage No. of per draw (resistive leakage current point module drop point
category outputs common Catalogue 5V 24V load) (max.)
^ (min.) (max.)
(max.) (max.) (max.)

'
24Vdc 16 16 1746-OB16 0.280 0.0A on = 0.10ms 1mA 1mA 0.50A at 30C 8A at 30C 1.20V at 3.0A for
(operating A off = 1.0ms 0.25A at 60C 4A at 60C 0.50A 10ms
voltage
10-50Vdc)
120-240Vac 16 8 1746-OA16 0.370 0.0A on = 0.10ms 2mA 10mA 0.50A at 30C 8A at 30 C 1.50V at 10.0A
(operating A off = 11.0ms 0.25A at 60C 4A at 60 C 0.50A for
Voltage 25ms
85-265Vac)
ac/dc 16 8 1746-OW16 0.170 0.180 on = 10.0ms 0mA 10mA See the chart 16.0A ac Not See the
Relay A A off = 10.0ms that follows 8.0A applicable chart
(operating common that
voltage follows
5-265Vac
5-125Vdc)
ac/dc 8 Individually 1746-OX8 0.085 0.090 on = 10.0ms mA 1mA See the chart Must be Not See the
Relay isolated (removable A A off = 10.0ms that follows limited so applicable chart
(operating terminal the module that
voltage block) power does follows
5-265Vac not exceed
5-125Vdc) 1440Vac
24Vdc 32 16 1746-OB32 0.452 0.0A on = 0.1ms 1mA 1mA 0.1A at 60C 3.2A at 60C 1.2V at 1A for
(operating A off = 1ms 0.1A 10ms
voltage
5-50V dc)
Terminal Identification
Diagrams on Each Module
LEDs indicate the status
of each I/O point.
OUTPUT
IN 0
IN 1
IN 2
IN 3
IN 4
IN 5
IN 6
IN 7
IN 8
IN 9
IN 10
IN 11
IN 12
IN 13
IN 14
IN 15
AC COM
AC COM
' Frequency = 47 to 63Hz
^ Triac outputs turn on at any point in the ac line cycle and turn off at ac line zero cross. Recommended surge suppression
for triac outputs when switching 120Vac inductive loads is Harris MOV part number V220 MA2A or equivalent.
To limit the effects of leakage current through triac outputs, a loading resistor can be connected in parallel with your load.
For typical 120Vac applications, use a 15KW, 2 Watt resistor, for typical 240Vac applications, use a 15KW, 5 Watt resistor.
Repeatability is once every 1 second at 30C. Repeatability is once every 2 seconds at 60C.
~
7.5 Specialty modules
7.5.1 Analogue modules
The SLC 500 family offers these I/O analogue modules for
your control applications.
B NI4 input module
B NIO4I & NIO4V analogue I/O combination module
B NO4I output module
B NO4V output module
B NR4 RTD/resistance input module
B NT4 thermocouple/mV input module.
Features
B High resolution 16-bit input and 14-bit output converters
provide accurate control capabilities.
B Outputs are backplane powered no external power
supply required, reducing system cost.
B User selectable inputs that are configured per channel
for current or voltage inputs.
B Input channel filtering rejects high-frequency noise that
couples into an analogue input signal.
B Image maps directly into the SLC image, saving
memory usage and time.
Important: All analogue modules are isolated from each
other and from the backplane. If the NO4I or the
NO4V is externally powered, the 24Vdc
backplane current draw is 0mA.
239-9986
16
Specification
SLC communication format ________________ 16-bit twos
complement binary
Field wiring to backplane isolation ______________ 500Vdc
Conversion time ________ 512s for all channels in parallel
Current/voltage ranges
NI4 ____ 10Vdc or 20mA (current and voltage input)
NO4I ____________________ 0 to 21mA (current output)
NO4V ______________________ 10V (voltage output)
Step response
Input ________________________________ 60ms at 95%
Output ______________________________ 2.5ms at 95%
Maximum wire size ________________________ #14AWG
Terminal block ____________________________ removable
Noise immunity______________ NEMA Standard ICS 2-230
Environmental conditions
Operating temperature __________________ 0 to +60C
(+32 to +140F)
Storage temperature ________________ -40C to +85C
(-40 to +185F)
Humidity rating __________ 5 to 95% (non-condensing)
Recommended cable____________________ Belden #8761
Certification ______ UL 508 listed, CSA 22.2 142 approved
Hazardous Environment Classification __________ Class I,
Division 2 Hazardous Environment
Maximum Amperes
'
Amperes Voltamperes
Relay Contact Ratings Volts Make Break Continuous Make Break
For OW16 240Vac 7.5A 0.75A
2.5A 1800VA 180VA
120Vac 15A 1.5A
125Vdc
^
0.22A
'
1.0A 28VA
24Vdc
^
1.2A
'
2.0A 28VA
For OX8 240Vac 15A 1.5A
5.0A 3600VA 360VA
120Vac 30A 3.0A
125Vdc
^
0.22A
'
1.0A 28VA
24Vdc
^
1.2A
'
2.0A 28VA
' Connecting surge suppressors across your external load will extend the life of SLC 500 relay contacts. For recommended
surge suppressors when switching ac inductive loads, consult the SLC 500 Installation and Operation Users Manual
(Catalogue Number 1747-N1002). Recommended surge suppression for switching 24Vdc inductive loads is a 1N4004
diode that is reverse wired across the load.
^ For dc voltage applications, the make/break ampere rating for relay contacts can be determined by dividing 28VA by the
applied dc voltage.
For example, 28VA/48Vdc = 0.58A.
For dc voltage applications less than 48V, the make/break ratings for relay contacts cannot exceed 2A.
For dc voltage applications greater than 48V, the make/break ratings for relay contacts cannot exceed 1A.
The continuous current per module must be limited so the module power does not exceed 1440VA.
Specification 1746-NI4 1746-NIO4I 1746-NO4I 1746-NO4V 1746-NIO4
Input channels 4 differential, voltage 2 differential, voltage Not applicable Not applicable 2 differential
per module or current selectable or current selectable voltage or
per channel not per channel current
individually isolated selectable
per channel
Output channels Not applicable 2 current outputs, not 4 current outputs, not 4 voltage outputs, not 2 current outputs, not
per module individually isolated individually isolated individually isolated individually isolated
Backplane current 25mA at 5Vdc 55mA at 5Vdc 55mA at 5Vdc 55mA at 5Vdc 55mA at 5Vdc
draw 88mA at 24Vdc 145mA at 24Vdc 195mA at 24Vdc 145mA at 24Vdc 115mA at 24Vdc
External 24Vdc Not applicable Not applicable 24 10% at 195mA 24 10% at 145mA -
power supply (21.6 to 26.4Vdc) (21.6 to 26.4Vdc)
tolerance
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17
1746-NT4 Thermocouple / mV module
The thermocouple/mV module receives and stores digitally
converted thermocouple and/or dc millivolt (mV) analog
data into its image table for retrieval by all fixed and modular
SLC 500 processors.
The 1746-NT4 module converts input signals from the
following input types.
Features
Cold-junction
compensation and
linearization
Four selectable filters
Individual channel
configuration
Benefits
Provides accurate process
digital temperature
readings
Allows you to tailor system
response to your
environment
Allows you to mix millivolt
and thermopcouple types
Thermocouple temperature ranges
dc millivolt input ranges
Millivolt Range Accuracy
input type (Max. error at 25C/77F)
50mV -50mVdc to +50mVdc 50V
100mV -100mV to +100mVdc 50V
Type of C Temperature F Temperature Accuracy
thermocouple range range (Max. error at
input 25C/ 77F)
Type J -210C to 760C -346F to 1400F 1.06C
Type K -270C to 1370C -454F to 2489F 1.72C
Type T -270C to 400C -454F to 752F 1.43C
Type E -210C to 1000C -454F to 1832F 0.72C
Type N 0C to 1300C 32F to 2372F 1.39C
Type R 0C to 1768C 32F to 3214F 3.59C
Type S 0C to 1768C 32F to 3214F 3.61C
Type B 300C to 1820C 572F to 3308F 3.12C
(0) IN 0+
(1) IN 0-
(2) ANL COM
(3) IN 1+
(4) IN 1-
(5) ANL COM
(6) IN 2+
(7) IN 2-
(8) ANL COM
(9) IN 3+
(10) IN 3-
(11) ANL COM
INPUT
POWER
ANALOG
(0) IN 0+
(1) IN 0-
(2) ANL COM
(3) IN 1+
(4) IN 1-
(5) ANL COM
(6) NOT USED
(7) OUT 0
(8) ANL COM
(9) NOT USED
(10) OUT 1
(11) ANL COM
OUTPUT INPUT
POWER
ANALOG
(0) +24Vdc
(1) DC COM
(0) IN 1+
(1) IN 1-
(2) ANL COM
(3) NOT USED
(4) OUT 0
(5) ANL COM
(6) NOT USED
(7) OUT 1
OUTPUT
POWER
ANALOG
INPUT
CHANNEL
STATUS 1 3
0 2
CJC A+
DO NOT
REMOVE
CJC A-
DO NOT
REMOVE
SHIELD
SHIELD
SHIELD
SHIELD
SHIELD
CJC B-
DO NOT
REMOVE
CJC B+
DO NOT
REMOVE
CHLD+
CHLD-
CHLD1+
CHLD1-
CHLD2+
CHLD2-
CHLD3+
CHLD3-
ANALOG
COM
CJC A+
DO NOT
REMOVE
INPUT
CHANNEL
STATUS 1 3
0 2
CJC A+
DO NOT
REMOVE
CHL 0
RTD
SHIELD
SHIELD
CHL 0
SENSE
CHL 0
RETRN
CHL 2
RTD
CHL 2
SENSE
CHL 2
RETRN
SHIELD
CHL 1
RTD
SHIELD
SHIELD
CHL 1
SENSE
CHL 1
RETRN
CHL 3
RTD
CHL 3
SENSE
CHL 3
RETRN
SHIELD
1746-NI4 1746-NIO4I 1746-NO4I-NO4V 1746-NT4 1746-NR4
Thermocouple specifications
Specification Description
Backplane current draw
5Vdc 60mA
24Vdc 40mA
Temperature scale resolution
(selectable)
C of F and 0.1C or 0.1F
Millivolt scale resolution
(selectable)
0.1 millivolt and 0.01 millivolt (mV)
Open circuit method Upscale
Input step response 300ms at 10Hz
60ms at 50Hz
50ms at 60Hz
12ms at 250Hz
Thermocouple linearization IPTS-68 standard, NBS MN-125,
NBS MN-161
Maximum cable impedance 25Ohms max. loop impedance for
<1LSB error
Calibration Autocalibration at power-up and when
a channel is enabled
Isolation 500Vdc continuous between inputs
and chassis ground, and between
inputs and backplane
Isolation between channels None
Maximum channel-to-channel 2V amximum between any two
common-mode seperation channels (series B)
1
Recommended cable
for thermocouple inputs Appropriate shielded thermocouple
extension wire
2
for mV inputs Belden #8761 or equivalent
(shielded twisted pair)
Maximum wire size Two 14 AWG wires per terminal
239-9986
1
Allows use with a single or multiple grounded thermocouples as long as
the grounds are withim 2V of each other. Series A modules offer zero
volts separation and can be used with a single grounded thermocouple.
Both series A or B can be used with multiple ungrounded themselves.
2
Refer to the thermocouple manufacturer for the correct extension wire.
1746-NR4 RTD/ resistance input module
The RTD/resistance input module enhances the present
temperature control capabilities of your SLC 500 fixed or
modular system by providing the capability to interface with
12 different RTDs and 4 different direct resistance ranges.
RTDs are known for their accuracy, repeatability, linearity,
and long-term stability.
Features
Module interface
capability with a number
of different RTDs
Two selectable excitation
current levels (0.5 and
2mA)
Four selectable filters
Individual channel
configuration
Benefits
Allows you to choose the
best RTD for your
temperature application
Provides capability to limit
RTD self heating and to
provide greater
temperature accuracy
Allows you to tailor system
response to your
environment
Allows you to mix RTD and
resistance device types
RTD temperature ranges, resolution and repeatability
1
The temperature range for the 1000 RTD is dependant on the excitation current.
2
The digits following the RTD type represent the temperature coefficient of resistance (), which is defined as the resistance change per Ohm per C. For
instance, platinum 385 refers to a platinum RTD with = 0.00385 Ohms/Ohm =C or simply 0.00385/C.
3
Actual value at 0C (32F) is 19.042 per SAMA standard RC21-4-1966
4
To maximise the relatively small RTD signal, only 2mA excitation current is allowed.
5
Actual value at 0C (32F) is 100 per DIN standard.
6
Minco Type NA and Minco Type FA (Nickle-Iron).
RTD Type Temp. Range Temp.Range Resolution Repeatability
(0.5mA Excitation)
1
(2.0mA Excitation)
1
100
-200C to +850C -200C to +850C 0.1C 0.2C
(-328F to +1562F) (-328F to +1562F) (0.2F) (0.4F)
200
-200C to +850C -200C to +850C 0.1C 0.2C
(-328F to +1562F) (-328F to +1562F) (0.2F) (0.4F)
Platinum (385)
^
500
-200C to +850C -200C to +850C 0.1C 0.2C
(-328F to +1562F) (-328F to +1562F) (0.2F) (0.4F)
1000
-200C to +850C -200C to +240C 0.1C 0.2C
(-328F to +1562F) (-328F to +464F) (0.2F) (0.4F)
100
-200C to +630C -200C to +630C 0.1C 0.2C
(-328F to +1166F) (-328F to +1166F) (0.2F) (0.4F)
200
-200C to +630C -200C to +630C 0.1C 0.2C
(-328F to +1166F) (-328F to +1166F) (0.2F) (0.4F)
Platinum (3916)
^
500
-200C to +630C -200C to +630C 0.1C 0.2C
(-328F to +1166F) (-328F to +1166F) (0.2F) (0.4F)
1000
-200C to +630C -200C to +630C 0.1C 0.2C
(-328F to +1166F) (-328F to +1166F) (0.2F) (0.4F)
Copper (426)
^
10 Not allowed
-100C to +260C 0.1C 0.2C

(-148F to +500F) (0.2F) (0.4F)
Nickel (618)
^ I
120
-100C to +260C -100C to +260C 0.1C 0.1C
(-148F to +500F) (-148F to +500F) (0.2F) (0.2F)
Nickel (672)
^ I
120
-80C to +260C -80C to +260C 0.1C 0.1C
(-112F to +500F) (-112F to +500F) (0.2F) (0.2F)
Nickel Iron (518)
^ I
604
-100C to +200C -100C to +200C 0.1C 0.1C
(-148F to +392F) (-148F to +392F) (0.2F) (0.2F)
18
239-9986
19
RTD accuracy and temperature drift specifications
1
The accuracy values assume that the module was calibrated within the specified temperature range of 0C to 60C (32F to 140F).
2
The temperature drift specifications apply to a module that has not been calibrated.
3
Module accuracy, using 100 or 200 platinum RTDs with 0.5mA excitation current, depends on the following criteria:
(a) Module accuracy is 0.6C after you apply power to the module or perform an autocalibration at 25C (77F) ambient with module operating temperature
between 0C to 60C (32F to 140F).
(b)Module accuracy is (0.6C + T X 0.034C/C) after you apply power to the module or perform an autocalibration at 25C (77F) ambient with the
module operating temperature between 0C to 60C (32F to 140F).
- where T is the temperature difference between the actual operating temperature of the module and 25C (77F) and 0.034C/C is the temperature drift
shown in the table above for 100 or 200 platinum RTDs.
(c) Module accuracy is 1.0C after you apply power to the module or perform an autocalibration at 60C (140F) ambient with module operating
temperature at 60 C.
4
The digits following the RTD type represent the temperature coefficient of resistance (), which is defined as the resistance change per Ohm per C. For
instance, Platinum 385 refers to a platinum RTD with + 0.00385 Ohms/Ohm - C or simply 0.00385 / C.
5
Actual value at 0C (32F) is 9.042 per SAMA standard RC21-4-1966.
6
To maximise the relatively small RTD signal, only 2mA excitation current is allowed.
7
Actual value at 0C (32F) is 100 per DIN standard.
Resistance input specifications
1
The accuracy values assume that the module was calibrated within the specified temperature range of 0C to 60C (32F to 140F).
2
The accuracy for 150 is dependant on the excitation current: 0.2 at 0.5mA, 0.15 at 2.0mA.
3
The temperature drift for 150 is dependant on the excitation current: 0.006/C at 0.5mA, 0.004 at 2.0mA.
Input type Resistance range Resistance range Accuracy
1
Temperature drift Resolution Repeatability
(0.5mA Excitation) (2.0mA Excitation)
150 0 to 150 0 to 150
2 3
0.01 0.04
500 0 to 500 0 to 500 0.5
0.014/C 0.1 0.2
(0.025/F)
Resistance
1000 0 to 1000 0 to 1000 1.0
0.029/C 0.1 0.2
(0.52/F)
3000 0 to 3000 0 to 1900 1.5
0.043/C 0.1 0.2
(0.077/F)
RTD Type Accuracy
'
Accuracy
'
Temperature drift
^
Temperature drift
^
(0.5mA Excitation) (2.0mA Excitation) (0.5mA Excitation) (2.0mA Excitation)
100
1.0C
0.5C 0.34C/C 0.014C/C

(2.0F) (0.9F) (0.061F/F) (0.025F/F)
200
1.0C
0.5C 0.34C/C 0.014C/C

(2.0F) (0.9F) (0.061F/F) (0.025F/F)
Platinum (385)
2
500
0.6C 0.5C 0.017C/C 0.014C/C
(1.1F) (0.9F) (0.031F/F) (0.025F/F)
1000
0.6C 0.5C 0.017C/C 0.014C/C
(1.1F) (0.9F) (0.031F/F) (0.025F/F)
100
1.0C
0.4C 0.034C/C 0.011C/C

(2.0F) (0.7F) (0.061F/F) (0.020F/F)
200
1.0C
0.4C 0.034C/C 0.011C/C

(2.0F) (0.7F) (0.061F/F) (0.020F/F)
Platinum (3916)

500
0.5C 0.4C 0.014C/C 0.011C/C
(0.9F) (0.7F) (0.025F/F) (0.020F/F)
1000
0.5C 0.4C 0.014C/C 0.011C/C
(0.9F) (0.7F) (0.025F/F) (0.020F/F)
Copper (426)
I
10
Not allowed
I
0.6C
Not allowed
I
0.017C/C
(1.1F) (0.031F/F)
Nickel (618)
I
120
0.2C 0.2C 0.008C/C 0.005C/C
(0.4F) (0.4F) (0.014F/F) (0.014F/F)
Nickel (672)

120
0.2C 0.2C 0.008C/C 0.005C/C
(0.4F) (0.4F) (0.014F/F) (0.014F/F)
Nickel Iron (518)

604
0.3C 0.3C 0.010C/C 0.010C/C
(0.5F) (0.5F) (0.018F/F) (0.018F/F)
RTD Specifications
5Vdc____________________________________ 50mA
24Vdc __________________________________ 50mA
Temperature scale resolution
(selectable)________________ 1C or 1F and 0.1C or 0.1F
Resistance scale resolution
(selectable) __________ 1 or 0.1 for all resistance ranges
In addition, 0.01 for 150 range
RTD excitation current____________ Two current values are
user-selectable (0.5mA and 2.0mA)
1
Open circuit or short
circuit method ______________ Zero, upscale or downscale
Input step response:
________________________________ 300ms at 10Hz
_________________________________ 60ms at 50Hz
_________________________________ 50ms at 60Hz
________________________________ 12ms at 250Hz
Cable impedance (max.) ________________ 25 maximum
per 1000 feet
Wire size (max.) ________ Two 24 AWG wires per terminal
Calibration ________________ Autocalibration at power-up
and when a channel is enabled
Isolation between channels ______________________ None
Isolation______________ 500Vdc continuous between inputs
and chassis ground, and between
inputs and backplane
Common mode voltage seperation ______________ 1 volt
1
Refer to the current recommendations of the RTD
manufacturer to determine the best current source for
your application.
7.5.2 High-speed counter module
The high-speed counter module provides bidirectional
counting of high-speed inputs from quadrature encoders and
various high-speed switches. This single channel accepts
input pulse frequencies of up to 50 kHz, allowing precise
control of fast motions. This module is compatible with the
SLC 5/02 processor.
In addition to providing an Accumulated Count, the module
provides the Rate Measurement indicating the pulse
frequency in Hertz (Hz). The Rate Measurement is
determined by accumulating input pulses over a fixed period
of time. The dynamically configurable Rate Period ranges
from 10 milliseconds to 2.55 seconds.
Input and Output Terminals
Hinged Wiring Terminal
Door with Label
OUTPUT INPUT
VDC
OUT 0
OUT 1
OUT 2
OUT 3
DC COM
A+
B+
A-
B-
Z+
LS/24VDC
Z-
LS/12VDC
LS COM
LS/5VDC
FAULT
HSCE
Color-coded Removable
Terminal Block
I/O Status Indicators
Terminal Block
Release Screws
0
1
2
3
4
5
6
7
A
B
Z
LS
239-9986
20
Features
B Three modes of operation (Range, Rate, and Sequencer)
that allow you to select the best mode to fit your
application.
B Four on-board open collector outputs that allow control
independent of the SLC processor scan by the module.
Specification
5Vdc __________________________________ 320mA
24Vdc _________________________________ 0.0mA
Noise immunity ______________ NEMA Standard ICS 2-230
Operating temp. ____ -0 to +60C (+32 to +140F)
Storage temp. ______ -40 to +85C (-40 to +185F)
Humidity rating________ 5 to 95% (non-condensing)
Max. input frequency
Sequencer and range ____________________ 50kHz
Rate ________________________________ 32.767kHz
7.5.3 DH-485/ RS-232C interface module
The DH-485/RS-232C interface module provides a bridge
between the DH-485 communication network and RS-232
using DFI communication protocol. When used in a SLC 500
chassis with a modem, you can:
B Remotely program and troubleshoot any single SLC 500
processor
B Remotely collect data directly from the data table of any
SLC 500 processor
B Use the SLC 500 as a remote terminal unit.
Features
B It can provide you with local or remote access to examine
ladder programs, monitor program operation, and make
changes if necessary
B By providing a modem connection into your
DH-485 network, it makes troubleshooting installations
over the telephone lines possible!
B It is ideally suited for SCADA/RTU applications where
point-to-point communications is required
B It has a configuration and a DFI serial port that each
accommodate RS-232/423, RS-422, and RS-485
communications
B It is easily configured using either backplane
communication or an ASCII terminal, and it installs
directly into the SLC 500 chassis
B It has a real time clock that can be used by the SLC
processor in conjunction with normal operation
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
8
9
CONFIG
DF1
DH485
Configuration
Port
DF1
Port
DH-485
Port
LEDs
DH-485/RS-232C
Door Label
239-9986
21
B It allows connection from a DH-485 network device to a
single DFI device.
Specification
Operating temp. __________ -0 to +60C (+32 to +140F)
Storage temp. ______ -40 to +85C (-40 to +185F)
Relative humidity ______ 5 to 95% (non-condensing)
Power consumption ________ 5Vdc voltage requires .150A
24Vdc voltage requires .040A
Important: The 1747-KE module requires both 5Vdc and
24Vdc power from the SLC backplane. The
power consumption of the module must be taken
into consideration when planning your SLC 500
system. Refer to the documentation supplied with
your SLC 500 fixed or modular controller for
additional information on power supplies and
current requirements.
7.6 Programmers and operator interface
The following section describes two types of programming
options available for the SLC 500. The first is the Advanced
Programming Software (APS) and the second is the Hand-
Held Terminal (HHT).
7.6.1 APS
The Advanced Programming Software (APS) v5.01 and later,
enables you to program the SLC 500 family processors
using an IBM-AT/XT or compatible personal computer.
Included in the APS software is the APS Import/Export Utility
(APSIE). This software utility allows you to convert APS
archive files and program documentation into ASCII text files
and vice versa.
Features
Full-line processor support to program any SLC 500 fixed,
SLC 5/01, SLC 5/02, SLC 5/03 and SLC504 modular
processors
B Command line entry of instructions and parameters
provides time-saving key strokes
B On-line context-sensitive help provides quick access to
instructions and status file information
B Cut, copy, and paste editor permits ladder logic to be re-
used
B Search and replace allows quick modification of ladder
logic to match unforeseen hardware changes
B DH-485 and DFI support provides a variety of
communication options to meet your application
requirements
B Runtime online editing allowing entry of programs and
data while online in Run mode when using a SLC 5/03 or
later processor
B System autoconfiguration automatically reads system
configuration information (including I/O and chassis
data), saving you valuable save time.
Specification
Computer ________________ 3.0Mbyte of hard drive space
Hardware 640Kbyte RAM, min. 550 Kbyte free at
execution. Extended or expanded
memory recommended,
but not required
Operating system __________________ DOS 3.1 and higher
Printer interface ______________Parallel or serial 80, 132 or
255 columns
SLC-500 ADVANCED PROGRAMMING SOFTWARE RELEASE 3.00
Allen-Bradley Company, Copyright 1991
1747-PA2E
All Rights Reserved
This software is licensed to: Your name
Your company name
000000000000
Display Area
Message
Prompt Press a function key
Data Entry
Status
Main Functions
ONLINE
CONFIG
ONLINE OFFLINE
CONFIG
WHO SYSTEM
CONFIGR
FILE
OPTIONS
PRINT
REPORTS
SYSTEM
UTILS
EXIT
SYSTEM
OFFLINE
PRG/DOC
F1 F2 F3 F4 F5 F6 F7 F8 F9 F10
Tue Jul 24, 1991 Current Offline File: 09 11:03:09 am
Terminal Address: 0 Current Device: 1747-PIC (DH-485) Proc Address:1
Example of software screen for APS Versiopn 3.00
Additional features for APS Version 6.00
B 640Kbytes of RAM (a minimum of 2Mb of extended
memory is required; 3Mb are required for programming
a 1747-L543 processor.)
B 10Mb fixed-disk drive (APS requires 7.5Mb of free disk
space).
B MS DOS version 3.3 or higher (INTERCHANGE
requires MS DOS version 5.0 or higher).
B For operation using Microsoft
Windows : Windows
version 3.1 or Windows for Workgroups version 3.11.
APS 6.0 is not supported on the following operating systems:
B Windows 95
1
B Microsoft Windows NT 351
B IBM OS/2
B IBM OS/2 WARP
239-9986
22
1
Rockwell Software does not recommend the use of APS 6.0 in the
Windows 95 operating system. APS 6.0 was not designed for specific
Windows 95 compatibility, nor has a complete set of tests within this
operating system been completed at the time of the APS 6.0 release.
However, if you still want to attempt to operate in the Windows 95
operating system, there is some background information provided for
you in the APS ReadMe file.
The amount of free conventional RAM that APS requires
depends on what communication drivers you want to load.
If you want to load :
Only the stand alone
communications drivers
300Kb
Microsoft Windows drivers
(INTERCHANGE software)
369Kb
SLC-500 ADVANCED PROGRAMMING SOFTWARE RELEASE 6.00
Rockwell Software Incorporated, Copyright 1989-1995
9323-PA2E
All Rights Reserved
This software is licensed to: Your name
Your company name
000000000000
Press a function key
ONLINE
CONFIG
ONLINE OFFLINE
CONFIG
WHO SYSTEM
CONFIGR
FILE
OPTIONS
PRINT
REPORTS
SYSTEM
UTILS
EXIT
SYSTEM
OFFLINE
PRG/DOC
F1 F2 F3 F4 F5 F6 F7 F8 F9 F10
Fri Nov 24, 1995 Current Offline File: DEFAULT 11:03:09 am
Terminal Address: 0 Current Device: 1747-PIC (DH-485) Proc Address:1
Example of software screen for APS Version 3.00
Exiting the system : You can exit APS software snd return to Windows by accessing the APS
menu and pressing
EXIT
SYSTEM
If you want to load You need
239-9986
23
7.6.2 HHT
The Hand-Held Terminal (HHT) v2.03 is a powerful portable
programming platform used to configure the SLC 500 fixed,
SLC 5/01, and the SLC 5/02 processors, enter or modify an
application program, monitor the execution of the
application program in real-time, or troubleshoot an
application program. The HHT accepts programs with a
maximum data table size of 6K. Each rung may contain up to
127 instructions. This differs from APS which has a maximum
data table size of 16K and each rung can contain 128
instructions.
The programming memory pack is interchangeable and
available in four languages. Note that the HHT does not
support nested branching or conditional output branches.
Features
B Rugged construction designed for a variety of industrial
environments
B Menu-driven firmware displays step-by-step directions
B LCD display shows up to five rungs of ladder logic at one
time
B ZOOM function displays detailed instruction information
B Formatted display shows PID and MSG instructions.
Specification
Display 8 line 3 40 character super-twist
nematic LCD
Keyboard____________________________________ 30 keys
Operating power ______________ 0.105A (max.) at 24Vdc
Operating temp. __________ 0 to +40C (+32 to +104F)
Storage temp. __________ -20 to +65C (-4 to +149F)
Humidity range __________ 5 to 95% (non-condensing)
Display Area
Calculator-style, Color-coded Keyboard
7.6.3 DTAM
The Data Table Access Module (DTAM) aids in accessing
information and monitoring an SLC 500 control system at the
plant floor level. Designed to mount in an enclosure door, the
DTAM allows you to access data file information, change
operating modes, monitor and clear processor faults, and
transfer memory from or to a EEPROM on any SLC 500, or
SLC 5/01, SLC 5/02 or SLC 5/03 processor. Interactive
messaging is also supported between the DTAM and the
SLC 5/02 or SLC 5/03 processor.
Features
B DH-485 network compatible communicating with up to 31
controllers, one at a time, up to 1219m (4000ft).
B Data monitor or modify permitting data values to be
changed in the Run or Program mode.
B Quick recall macros store frequently used address
locations, saving time and simplifying application set-up
and modification.
B Auto-attach mode automatically initiates communication
with the last attached processor after a power cycle,
saving costly down time and reducing key strokes.
B On-board module configuration provides non-volatile
EEPROM memory for easy on-site module set up.
B Multilingual display provides selectable operator
prompting in any of six languages.
B Backlit LCD display allows easy viewing in all lighting
conditions.
B MSG instructions response allows interaction between the
operator and the ladder program. The SLC 5/02, SLC 5/03
or SLC 5/04 ladder program directs the dialog.
Specification
Display ________________ 2 line 3 16 character super-twist
__________________nematic LCD with LED backlighting
Keyboard ________________ 19 keys with tactile feedback
Operating power________________ 0.104A (max.) at 24Vdc
Operating temp. ________ 0 to +55C (+32 to +131F)
Storage temp.____________ -20 to 65C (-4 to +149F)
Humidity range __________ 5 to 95% (non-condensing)
Certification ___________________UL listed, CSA approved.
Meets NEMA type 12 and 13
enclosure applications
Mode/Status Indicator
LCD Display
Keypad
7.7 Chassis and cables
7.7.1 Chassis
Important: The first slot of the first chassis in a modular
system is always reserved for the processor
module.
Description The chassis houses the processor and the I/O
modules. The power supply mounts on the left side of the
chassis. Chassis do not include interconnect cables. All
components easily slide into the slots along guides formed in
the chassis top and bottom. No tools are required to insert or
remove the processors, I/O modules, or communication
modules. The 2-slot expansion chassis is only used with a
fixed controller.
2-Slot Expansion Chassis The 20, 30 and 40 I/O fixed
hardware style units accept a 2-slot expansion chassis. The
expansion chassis mounts on the right side of the processor
without mounting hardware.
Features
B Modules easily slide into chassis slots. No tools are
required for module installation.
B Up to 3 chassis can be interconnected. Locally the
processor can address up to 30 slots.
B Three chassis sizes are available to choose from.
Selection can be suited to your system I/O requirements.
239-9986
24
19527
7.7.2 Cable
The cables are keyed for proper installation. The end of
the cable that plugs into the right socket in the chassis has the
key on the top of the connector. The opposite end of the
cable has the key on the inside of the connector for
insertion into the expansion chassis.
To remove the cable, move the tabs on the socket outward
and connector will pop out.
Features
B 914.4mm (36 inch) Chassis Interconnect Cable This
cable is used when linking modular hardware style
chassis from 152.4mm (6 inches) up to 914.4mm (36
inches) apart in an enclosure.
ATTENTION: The expansion cable must always
exit the right end of the chassis with the
processor.
Refer to the following figures.
P
S
C
P
U
P
S
P
S
C
P
U
P
S
P
S
C
P
U
P
S
P
S
C
P
U
P
S
Chassis 1
Chassis 2
CORRECT INSTALLATION
Chassis 2
INCORRECT INSTALLATION
Chassis 2
Chassis 2
Chassis 1
Chassis 1
Chassis 1
239-9986
25
7.8 Memory modules and accessories
7.8.1 Memory modules for fixed SLC 5/ 01 & SLC 5/ 02
These optional memory modules provide a non-volatile
memory in convenient modular form. The modules plug into
a socket on the processor. You can store (save) your
program in the EEPROM by inserting the module into the
processor and using either the Hand-Held Terminal or
Advanced Programming Software. You can also load (read)
a program from the EEPROM into the processor RAM.
Features
B Use of the UVPROM provides you an extra degree of
program security.
B The UVPROM is compatible with commercially available
UVPROM programming and erasing equipment.
Memory modules for SLC 5/ 03 & SLC 5/ 04
The memory module for the SLC 5/03 and SLC 5/04
processors is called a flash EPROM (Flash Erasable
Programmable Read Only Memory). Flash EPROMs
combine the programming versatility of EEPROMs with the
security precautions of UVPROMs. This means that you have
the option of leaving your EPROM programs write protected
or unprotected. Write protect the EPROM using either your
software or a PROM programmer.
The memory modules consist of a Flash EPROM mounted on
a circuit board with a connector and plastic housing. There
are 2 memory modules acailable that backup up to 32K or
64K user memory.
Socket
7.8.2 Card slot filler
Use these fillers in empty chassis slots to protect equipment
from dust or debris.
7.8.3 Battery
In the SLC fixed style and 1K version SLC 5/01, back-up
power for RAM is provided by a capacitor that will retain the
contents of the RAM for a period of 5 to 30 days. For
applications requiring memory back-up for a longer period
of time an optional replaceable battery, Catalogue Number
1747-BA, is required. The lithium battery provides back-up
for approximately five years. A red BATTERY LOW LED turns
on when the battery voltage has fallen below a threshold
level.
In the SLC modular style (SLC 5/01 4K version, SLC 5/02, SLC
5/03 and SLC 5/04), back-up power for RAM is provided by
a replaceable battery. The lithium battery provides back-up
for approximately five years for the 1747-L511 and two years
for the 1747-L514, 1747-L524, 1747-L532 and 1747-L541.
A red BATTERY LOW LED alerts you when the battery
voltage has fallen below a threshold level.
L
A
S
E
R
L
i
t
h
i
u
m
White
Lead
Red
Lead
Battery
Connector
Retainer
Clips
CPU
Battery
Connector
Red Lead
Retaining
Clips
White
Lead
8. SLC application examples
8.1 Application: High-speed position sensing
Operation
B Incremental encoder/high-speed counter (HSCE) tracks
position of aspirin boxes on the conveyor line.
B When photo-switch senses box, high-speed counter starts
counting. A given number of counts later, when the box is
centred over the ink-jet printer, the HSCE triggers the
printer to print the date code onto the box.
B Boxes are counted and stacked inside of the shrink-wrap
machine by the SLC. When the SLC has counted the
proper number of boxes (via photo-switch inside of the
shrink-wrap machine), it triggers the machine to wrap.
Product features
B HSCE runs its own control profile independent of the
program running in the SLC 5/02 processor the only
ladder logic programming needed is to download the
control profile to the HSCE. The ink-jet printer is triggered
by output on board the HSCE card.
B Discrete input and output cards provide an interface to a
wide variety of switches, sensors, and actuators.
System requirements RS stock no.
1 1746-A4 chassis 817-965
1 1746-P1 power supply 817-690
1 1747-L524 SLC 5/02 CPU 817-656
1 1746-HSCE high-speed counter module 817-814
1 1746-IB16 16-point DC input card 817-729
1 1746-OB16 16-point DC output card 817-757
Shrink-wrap Machine
Photo-switch Incremental
Encoder
Ink-jet Printer
Date Code
SLC 5/02
HSCE
IB16
OB16
239-9986
26
8.2 Application: Remote dial-up of an SLC
Operation
B The SLC 5/02 system controls the operation of a machine.
B The PC can dial into the processor to extract data about
the system. Also, if the PC is running APS software, it can
monitor or change the program in each of the SLCs in the
system.
Product features
B The KE module allows remote dial-up capability to SLC
processors.
B Upload and download programs or monitor system
operations remotely using APS software.
B Monitor system over telephone lines using operator
interface software designed to communicate with the KE.
1 1746-A4 chassis 817-965
1 1747-L524 SLC 5/02 CPU 817-656
1 1746-KE RS-232 communications card 817-820
2 Hayes compatible auto-answer modems -
KE Interface Module
Machine
Modem
Modem
239-9986
27
8.3 Application: PID temperature control
Operation
B Operator enters bath temperature from DTAM.
B Temperature sensor converts bath temperature to 4-20
mA signal.
B PID instruction in SLC 5/02 monitors bath temperature and
controls variable heater (via 4-20 mA signal) to keep bath
temperature constant.
Product features
B SLC 5/02 processor has integral PID instruction no need
for additional PID card.
B Analogue input card has 4 input channels that are
individually configurable for either voltage or current.
B DTAM operator interface enables operator to monitor and
change data values in any SLC processor.
1 1746-A4 chassis 817-965
1 1747-L524 SLC 5/02 CPU 817-656
1 1746-NI4 analogue input module 817-785
1 1746-NO4I analogue output module
current output 817-791
1 1747-DTAM operator interface 817-836
SLC 5/02
DTAM
Heater Amplifier
Variable Heater
Temperature
Sensor
NI4
NO4I
9. General installation requirements
9.1 Loading and installation
9.1.1 Considerations for safety
Safety considerations are an important element of proper
system installation. Actively thinking about the safety of
yourself and others, as well as the condition of your
equipment, is of primary importance. Several safety areas
are discussed below.
Disconnecting main power
The main power disconnect switch should be located where
operators and maintenance personnel have quick and easy
access to it. Ideally, the disconnect switch is mounted on the
outside of the enclosure, so that it can be accessed without
opening the enclosure. In addition to disconnecting electrical
power, all other sources of power (pneumatic and hydraulic)
should be de-energised before working on a machine or
process controlled by an SLC controller.
Safety circuits
Circuits installed on the machine for safety reasons, like
overtravel limit switches, stop push buttons, and interlocks,
should always be hard-wired directly to the master control
relay. These devices must be wired in series so that when
any one device opens, the master control relay is de-
energised thereby removing power to the machine. Never
alter these circuits to defeat their function. Serious injury or
machine damage could result.
Power distribution
There are some points about power distribution that you
should be aware of. First, the master control relay must be
able to inhibit all machine motion by removing power to the
machine I/O devices when the relay is de-energised.
Second, if you are using a dc power supply, interrupt the
load side rather than the ac line power. This avoids the
additional delay of power supply turn-on and turn-off. The dc
power supply should be powered directly from the fused
secondary of the transformer. Power to the dc input and
output circuits is connected through a set of master control
relay contacts.
Periodic testing of a master control relay circuit
Any part can fail, including the switches in a master control
relay circuit. The failure of one of these switches would most
likely cause an open circuit, which would be a safe power-off
failure. However, if one of these switches shorts out, it no
longer provides any safety protection. These switches
should be tested periodically to assure they will stop
machine motion when needed.
Emergency-stop switches
Adhere to the following points concerning emergency-stop
switches:
B Do not program emergency-stop switches in the
controller program. Any emergency-stop switch should
turn off all machine power by turning off the master control
relay.
B Observe all applicable local codes concerning the
placement and labelling of emergency-stop switches.
B Install emergency-stop switches and the master control
relay in your system. Make certain that relay contacts
have a sufficient rating for your application. Emergency-
stop switches must be easy to reach.
The figure below shows the master control relay (MCR)
wired in a grounded system.
239-9986
28
Input states on power down
The power supply hold-up time as described above is
generally longer than the turn-on and turn-off times of the
input modules. Because of this, the input state change from
On toOff that occurs when power is removed may be
recorded by the processor before the power supply shuts
down the system.
Understanding this concept is important. The user program
should be written to take this effect into account. For
example, hard wire power to one spare input. In the user
program, check to be sure that one input is on; otherwise,
jump to the end of the program and avoid scanning the logic.
Use of a common power source as recommended in the
previous section is assumed.
9.2 Installation environment
The SLC 500 processors are designed to operate in an
industrial environment. To keep the processor running as
reliably as possible, install all processors in a manner that
provides protection from various corrosive agents such as
dirt, grease, and falling debris, particularly electrically
conducting material.
The following figure depicts acceptable spacing layouts.
Follow the recommended minimum spacing to allow for
convection cooling within the enclosure. Cooling air in the
enclosure must be kept within a range of 0 to +60C (32F
to +140F).
Important: Be careful of metal chips when drilling
mounting holes for the controllers. Do not drill
holes above a mounted SLC 500 controller.
L1 L2
230 V ac
Disconnect
Isolation
Transformer
X1 X2 115 V ac
Fuse
Start
Stop
Overtravel
Limit Switch
Emergency-Stop
Push Button
Operation of either of these contacts will
remove power from the controller external I/O
circuits, stopping machine motion.
MCR
Suppr.
MCR
MCR
230 V ac
I/O Circuits
MCR
Fuse
115 V ac
I/O Circuits
Suppressor
Master Control Relay
(MCR)
MCR
24 V dc
I/O Circuits
Incoming Line Terminals.
Connect to 115 V ac terminals of
Power Supply.
Incoming line terminals. Connect
to 24 V dc terminals of Power
Supply.
_
+
DC Power Supply.
Use N.E.C. Class 2
for UL Listing.
(Lo) (Hi)
9.1.2 Considerations for power
We strongly recommend that all chassis power supplies
have the same power source as the input and output
devices. This helps reduce the chance of electrical
interference due to multiple sources and grounds as well as
helps maintain system integrity if power is interrupted.
The processor detects the absence of power to any chassis
in the system. If power to any chassis is lost (or not yet
applied), the CPU FAULT LED turns on and all controller
outputs are de-energised.
This fault detection makes it necessary that you apply power
to the expansion chassis before you apply power to the
chassis containing the processor to avoid an unwanted fault.
Of course, applying power in sequence is unnecessary if all
chassis have a common power source.
Loss of power source
The chassis power supplies are designed to withstand brief
power losses without affecting the operation of the system.
The time the system is operational during power loss is
called program scan hold-up time after loss of power. The
duration of the power supply hold-up time depends on the
number, type and state of the I/O modules, but is typically
between 20 mS and 3 seconds. When the duration of power
loss reaches a limit, the power supply signals the processor
that it can no longer provide adequate dc power to the
system. This is referred to as a power supply shutdown. The
power LED is turned off.
In multi-chassis systems, power outages of 20 to 300
milliseconds in duration can cause a remote power fail error
to occur. You can clear this error by cycling power to your
system or by using a programming device.
239-9986
29
Recommended Spacing
A. 15.3 to 20 cm (6 to 8 inches) (When using the 1746-C9
cable)
B. Greater than 10.2 cm (4 inches)
C. Greater than 15.3 cm (6 inches)
D. 7.7 to 10.2 cm (3 to 4 inches) (When using the 1746-C7
cable)
9.3 Calculation of heat
To calculate the heat dissipation of your SLC 500 controller
you must consider two things:
B The maximum heat dissipated (with field power applied)
by the processor, all I/O and specialty modules, and any
peripheral devices for each chassis.
B The maximum load on the power supply of the
processor, each I/O and specialty module, peripheral
device, and device drawing power directly off the power
supply via the POWER OUT terminals. Then equate this
power supply loading to power supply heat dissipation.
To determine the maximum heat dissipation, use one of
these methods:
B Calculated Watts
B Total Watts.
Use calculated Watts if you know exactly how many outputs
and input on each card will be active at any given time. This
method will give you a lower, more accurate heat dissipation
SLC 500
SLC 500
SLC 500
A
A
B B
C
C
SLC 500
SLC 500
A
B
B
D
C
C
SLC 500
calculation than the total Watts method. With this method,
first, use the formula below for calculating the heat
dissipation of each module. Then use these values in step 1
of the worksheet that follows.
(points energised 3 Watts per point) + minimum
Watts = heat dissipation of module
Use total Watts if you are not sure how many points on a
module will be energised at any time. Total Watts is the Watts
per point (with all points energised) plus the minimum Watts.
Once you have determined which way you will calculate the
heat dissipation of your modules, see the Example
Worksheet for Calculating Heat Dissipation. This worksheet
shows you how to calculate the heat dissipation for the
example SLC control system opposite.
The following table details the total Watts dissipated by the
modules and peripheral devices in the above SLC 500
controller. The numbers were taken from the power supply
loading table.
' This output card uses 5.5 Watts because only 10 points
are on at any one time. Using the calculated Watts formu-
la(number of points energised 3 Watts per point) + min-
imum Watts = heat dissipation of module the calculated
Watts for the 1746-OW16 module is 5.5W: (10 points X
.033) + 5.17 = 5.5W.
Important: The user power on the 1746-P1 power supply for
Chassis 2 is being used to power a peripheral
(100mA at 24Vdc).
Chassis 2
Slot No. Catalogue No. Min. Watts Max. Watts
Power supply 1746-P1 N/A 17.0
4 1746-IA16 .425 4.8
5 1746-IA16 .425 4.8
6 1746-OW16 5.17 5.5
'
7 1746-OW16 5.17 5.7
N/A N/A N/A N/A
Chassis 1
Slot No. Catalogue No. Min. Watts Max. Watts
Power supply 1746-P1 N/A 16.0
0 1747-L511 N/A 1.75
1 1746-BAS 3.75 3.8
2 1746-IA8 .250 2.4
3 1746-OV8 .675 6.9
Periphera1 747-DTAM 2.5 2.5
device
Peripheral Device
Slot 0 1 2 3 Slot 4 5 6 7
DTAM Chassis 1 Chassis 2
239-9986
Use the table below to calculate the power supply loading for
each chassis you have (step 1 of the worksheet).
30
Use the graphs below for determining the power supply
dissipation in step 2 of the worksheet.
1746-P1 Power Supply Change in Power
Dissipation due to Output Loading
18
16
14
12
10
8
6
4
2
0
0 5 10 15 20 25
Power Supply Loading (Watts)
P
o
w
e
r
S
u
p
p
ly
D
is
s
ip
a
tio
n
(
W
a
tts
)
18
16
14
12
10
8
6
4
2
0
0 10 20
P
o
w
e
r
S
u
p
p
ly
D
is
s
ip
a
tio
n
(
W
a
tts
)
20
30 40 50
5
0
0 5 10 15 20 25
P
o
w
e
r
S
u
p
p
ly
D
is
s
ip
a
tio
n
(
W
a
tts
)
30 35 40
10
15
20
25
Hardware Catalogue Watts per Minimum Maximum
component Numbers Point Watts Watts
1747-L20C 0.20 17.4 21.0
1747-L30C 0.20 18.7 24.0
1747-L40C 0.20 19.9 27.0
Processors 1747-L511 N/A N/A 1.75
1747-L514 N/A N/A 1.75
1747-L524 N/A N/A 1.75
1747-L532 N/A 2.90 2.90
1747-L541 N/A 4.00 4.00
1746-IA16 .27 .425 4.80
Input 1746-IB16 .20 .425 3.60
modules 1746-IB32 .20 .530 6.90
1746-IV16 .20 .425 3.60
1746-OA16 .462 1.85 9.30
Output 1746-OB16 .338 1.40 7.60
modules 1746-OB32 0.078 2.26 4.80
1746-OW16 .033 5.17 5.70
1746-OX8 .825 2.59 8.60
1746-N14 N/A 2.17 2.2
Analogue 1746-NIO4I N/A 3.76 3.80
and 1746-NO4I N/A 4.96 5.0
speciality 1746-NO4V N/A 3.78 3.8
modules 1746-NI04V N/A 3.04 3.10
1746-NR4 N/A refer for details
1746-NT4 N/A refer for details
1746-HSCE N/A 1.6 1.6
1747-KE N/A 3.75 3.8
1747-DTAM N/A 2.5 2.5
Peripheral
1747-PT1 N/A 2.5 2.5
devices
1747-PIC N/A 2.0 2.0
239-9986
31
Example Worksheet for Calculating Heat Dissipation
Procedure: Chassis 1 Chassis 2 Chassis 3 Heat Dissipation
1. Calculate the heat dissipation for each chassis without the power supply.
A. Write in the watts (calculated watts or maximum watts) dissipated by the
processor, I/O and specialty modules, and any peripheral devices attached to
the processor. Then, for each chassis, add these values together.
Chassis 1 Chassis 2 Chassis 3
Cat. No. Ht. Dis. Cat. No. Ht. Dis. Cat. No. Ht. Dis.
peripheral devices:
peripheral devices:
Total:
B. Place the heat dissipation for each chassis into the appropriate columns.
2. Calculate the heat dissipation for each power supply.
A. Calculate the power supply loading for each chassis: write in the minimum
watts for each device and then, for each chassis, add these values together.
Important: If you have a device connected to user power, multiply 24V by the
current used. (4.8 W is the maximum watts.) Include user power in the total
power supply loading.
Chassis 1 Chassis 2 Chassis 3
Cat. No. Min.Ht. Dis. Cat. No. Min. Ht. Dis. Cat. No. Min. Ht. Dis.
user power:
peripheral devices:
peripheral devices:
Total:
B. Use the power supply loading for each chassis to determine the power supply
dissipation. Place the power supply dissipations into the appropriate columns.
3.Add the chassis dissipation to the power supply dissipation.
4. Add across the columns for the total heat dissipation of your SLC 500 con-
troller.
5. Convert to BTUs/ hr. Multiply the total heat dissipation of your SLC 500 con-
troller by 3.414.
Total heat dissipation of the SLC 500 controller: BTUs/ hr
_________ _________ _________
_________+ ________+ _________= ___________W
3.414
________ ________ _________
239-9986
32
9.4 Mounting instructions
9.4.1 Mounting the fixed style
You can mount the fixed hardware style units directly to the
back panel of your enclosure using the mounting tabs and
#10 and #12 screws. The torque requirement is 3.4 N-m (30
in-lbs) maximum.
The expansion chassis mounts on the right side of the fixed
controller. The chassis has mounting tabs that are inserted
into slots in the fixed controller and slid forward. No tools are
required.
1. Insert the mounting tabs of the expansion chassis into the
mounting slots of the controller.
2. Slide the expansion chassis forward until the back of the
expansion chassis is flush with the fixed controller and the
connector on the expansion circuit board is mated with
the connector in the controller.
Mounting
Slots
Right Side of the
Fixed Controller
9.4.2 Mounting the modular style
You can mount the modular hardware style units directly to
the back panel of your enclosure using the mounting tabs
and #10 and #12 screws. The torque requirement is 3.4 N-m
(30 in-lbs) maximum.
9.5 Wiring instructions
9.5.1 Wiring of power supply
To install the power supply, do the following:
1. Align the circuit board with the card guide on the left side
of the chassis. Slide the power supply in until flush with
the chassis.
2. Fasten the power supply to the chassis with the two
philips head screws.
3. Place the jumper to match the input voltage. (This does
not apply to 1746-P3, which does not have a jumper.)
ATTENTION: Make jumper selection before
applying power. Hazardous voltage is present
on exposed pins when power is applied.
4. Remove the warning label from the top of the power
supply.
5. Connect line power to the power supply.
POWER
100/120 Volts 200/240 Volts
Catalog Number
1746-P1 & P2
Catalog Number
1746-P3
PWR OUT + 24 V dc
PWR OUT COM
120/240 V ac
V ac NEUT
CHASSIS GROUND
NOT USED
NOT USED
+ 24 V dc
DC NEUT
CHASSIS
GROUND
239-9986
33
ATTENTION: If you have a 1746-P3 power
supply, see the next page for special
grounding considerations.
On the 1746-P1 and -P2 power supply, use the PWR OUT
+24Vdc and PWR OUT COM terminals to power sensors.
The terminals provide an isolated, non-fused, 200mA, 24Vdc
power supply.
9.5.2 Wiring of I/ O equipment
Careful wire routing within the enclosure helps to cut down
electrical noise between I/O lines. Follow these rules for
routing your wires:
B Route incoming power to the controller by a separate
path from wiring to I/O devices. Where paths must cross,
their intersection should be perpendicular.
Important: Do not run signal or communications wiring and
power wiring in the same conduit.
B If wiring ducts are used, allow for at least two inches
between I/O wiring ducts and the controller. If the
terminal strips are used for I/O wiring, allow for at least
two inches between the terminal strips and the
controller.
B Segregate I/O wiring by signal type. Bundle wiring with
similar electrical characteristics together. Wires with
different signal characteristics should be routed into the
enclosure by separate paths.
ATTENTION: If the controller is being installed
within a potentially hazardous environment
(that is, Class I, Division 2), all wiring must
comply with the requirements stated in the
National Electrical Code 501-4 (b).
The following are general recommendations for wiring I/O
devices.
ATTENTION: Before you install and wire I/O
devices, disconnect power from the controller
and any other source to the I/O devices.
Use acceptable wire gauge The I/O wiring terminals are
designed to accept #14 or smaller AWG stranded wires, and
two wires per terminal (maximum). Maximum torque .9 N-m
(8 in-lb).
Label wires Label wiring to I/O devices, power sources,
and ground. Use tape, shrink-tubing, or other dependable
means for labelling purposes. In addition to labelling, use
coloured insulation to identify wiring based on signal
characteristics. For example, you may use blue for dc I/O
wiring and red for ac I/O wiring.
Bundle wires Bundle wiring for each similar I/O device
together. If you use ducts, allow at least 5 cm (2 in.) between
the ducts and the controller so there is sufficient room to wire
the devices.
Identify terminals Terminal cover plates have a write-on
area for each terminal. Use this area to identify your I/O
devices. Label the Removable Terminal Block (RTB) if you
have not already.
ATTENTION: Calculate the maximum
possible current in each power and common
wire. Observe all local electrical codes
dictating the maximum current allowable for
each wire size. Current above the maximum
ratings may cause wiring to overheat, which
can cause damage.
Capacitors on input modules have a stored
charge that can cause a non-lethal shock.
Avoid mounting the controller in a position
where installation or service personnel would
be in danger from startle reaction.
9.5.3 Grounding
In solid-state control systems, grounding helps limit the
effects of noise due to electromagnetic interference (EMI).
The grounding path for the controller and its enclosure is
provided by the equipment grounding conductor. The figure
below shows you how to run ground connections from the
chassis to the ground bus. The two methods shown for
grounding your modular controller are acceptable; however,
the ground bus is preferred.
1 1
1
1746-P1, P2
or P3
SLC 500
SLC 500
Ground Bus
1746-P1, P2
or P3
Ground
Bus
Earth
Ground
#8
AWG
Wire
#10
AWG
Wire
1 Use 10 AWG wire; keep length as short as possible.
239-9986
34
Special grounding considerations for dc applications
using 1746-P3
ATTENTION: Any voltage applied to the
1746-P3 DC NEUT terminal will be present at
the SLC logic ground and the processor DH-
485 port. To prevent unwanted potentials
across the logic ground of the controller
and/or damage to the SLC chassis, the DC
NEUTRAL of the external dc power source
must be either isolated from the SLC chassis
ground, or connected to earth ground. See
the figure below:
10. Dimensions
10.1 Fixed controller
C
A
T
S
E
R
I
A
L

N
O
.
20
(0.79)
30 and 40 I/O Fixed Style Hardware
20 I/O Fixed Style Hardware
millimeters
(inches)
Front View Left Side View
105
(4.13)
11 Dia.
(0.433)
158
(6.22)
140
(5.51)
5.5 Dia.
(0.217)
20
(0.79)
14
(0.55)
1.0
(0.4)
171
(6.73)
12.5
(0.49)
145
(5.71)
105
(4.13)
5.5
(0.217)
165
(6.0)
5.50 Dia.
(0.217)
11 Dia.
(0.433)
158
(6.22)
140
(5.51)
1.0
(0.04)
5.5 Dia.
(0.217)
171
(6.73)
175
(6.89)
30
(1.18)
145
(5.71)
5.50 Dia.
(0.217)
14
(0.55)
55
(0.217)
175
(6.89)
260
(10.24)
6.35
(0.25)
30
(1.18)
C
A
T
S
E
R
I
A
L

N
O
.
Front View Right Side View
SLC Logic Ground
Processor SLC 500 Chassis
1746-P3
Door External DC Power Source
DH-485
Port
+24 V dc
DC Neut
Chassis
Ground
Chassis
Ground
DC Neut
+24 V dc
Not Used
Not Used
A jumper wire is recommended between
the DC NEUT and Chassis Ground of the
external power source.
Earth Ground Earth Ground
239-9986
35
10.2 Expansion chassis
10.3 Modular controller (with power supply)
1 2
11 Dia.
(0.433)
175
(6.89)
5.5 Dia.
(0.217)
158
(6.22)
5.5 Dia.
(0.217)
45
(1.77)
140
(5.51)
171
(6.73)
14
(0.55)
320
(12.60)
340
(13.39)
140
(5.51)
171
(6.73)
1.0
(0.04)
145
(5.71)
Dimensions for power supply catalog number 1746-P1
Dimensions for power supply catalog number 1746-P2 &
1746-P3
2
1
7-Slot Modular Chassis
1 2
11 Dia.
(0.433)
70
(2.76)
5.5 Dia.
(0.217)
158
(6.22)
5.5 Dia.
(0.217)
45
(1.77)
140
(5.51)
171
(6.73)
14
(0.55)
215
(8.46)
235
(9.25)
140
(5.51)
171
(6.73)
1.0
(0.04)
145
(5.71)
millimeters
(inches)
C
A
T
S
E
R
I
A
L

N
O
.
2-Slot Expansion Chassis
Front View
millimeters
(inches)
Right Side View
80
(3.15)
40
(1.57)
40
(1.57)
5.5 Dia.
(0.217)
11 Dia.
(0.433)
158
(6.22)
5.5 Dia.
(0.217)
14
(0.55)
14
(0.55)
140
(5.51)
1.0
(0.04)
18.5
(0.728)
171
(6.73)
145
(5.71)
4.83
(0.190)
239-9986
36
11. Programming
11.1 Basics
Familiar ladder logic programming makes the SLC 500
family easy to program. A ladder logic program consists of a
number of rungs, on which you place instructions. Both the
fixed and modular controllers are programmed in the same
manner using either a hand-held terminal or a personal
computer. The SLC 500 controllers provide a powerful set of
instructions for control of complex systems.
11.2 Ladder logic representation
A ladder logic program consists of a number of rungs, on
which you place instructions. Instructions each have a data
address associated with them and based on the status of
these instructions the rung is solved.
The figure below shows a simple 1-rung ladder program.
The rung includes two input instructions and an output
instruction. Note, in the example below each instruction has
a name (Examine if Closed), a mnemonic (XIC), and an
address (I:1/0).
True/ False Status: The data file bits that these instructions
are addressed to will be either a logic 0 (Off) or a logic 1
(ON). This determines whether the instruction is regarded as
true or false:
]
0
[ ] [ ( )
Input Instructions Output Instruction
XIC XIO OTE
XIC = Examine if Closed
XIO = Examine if Open
OTE = Output Energize
Address I:1/0
Address I:1/1
Address O:3/0
A simple rung, using bit instructions.
I:1.0 I:1.0 O:3.0
1 0
/
11 Dia.
(0.433)
140
(5.51)
5.5 Dia.
(0.217)
158
(6.22)
5.5 Dia.
(0.217)
140
(5.51)
14
(0.55)
435
(17.13)
455
(17.91)
171
(6.73)
1.0
(0.04)
145
(5.71)
Dimensions for power supply catalog number 1746-P1
Dimensions for power supply catalog number 1746-P2 &
1746-P3
55
(.217)
140
(5.51)
1 2
1
2
1 2
145
(5.71)
55
(2.17)
171
(6.73)
140
(5.51)
171
(6.73)
14
(0.55)
140
(5.51)
105
(4.13)
540
(21.26)
560
(22.05)
11 Dia.
(0.433)
5.5 Dia.
(0.217)
140
(5.51)
5.5 Dia.
(0.217)
158
(6.22)
1.0
(0.04)
The status of the instruction is
If the data file XIC XIO OTE
bit is Examine if closed Examine if open Output energise
] [ ] / [ ( )
Logic 0 False True False
Logic 1 True False True
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37
11.3 SLC memory organisation
The processor provides control through the use of a
program you create. The program you create is called a
processor file. This file contains other files that break your \
B Program Files provide storage and control of the main
program and subroutines.
B Data Files contains the status of inputs, outputs, the
processor, timers, counter, and so on.
Processor Files: Each CPU can hold 1 processor file at a
time. The processor file is made up of program files (up to
256 per controller) and data files (up to 256 per controller).
Processor files are created in the off-line mode using APS.
These files are then restored, also referred to as
downloaded, to the processor for on-line operation.
Program Files: Program files contain controller information,
the main control program, and any subroutine programs.
The first three program files are required for each processor
file. These are:
B File 0 This file stores the controller configuration and
other system information.
B File 1 This file is reserved for internal controller use.
Processor File
Program Files Data Files
B File 2 This file stores the main control program.
Files 3 255 These files are optional and used for
subroutine programs.
Most of your work with program files will be in file 2, the main
program file. This file contains your ladder logic program
which you create to control your application.
Data Files: Data files contain the data associated with the
program files. Each processor file can contain up to 256 data
files. These files are organised by the type of data they
contain. Each piece of data in each of these files has an
address associated with it that identifies it for use in the
program file. For example, an input point has an address that
represents its location in the input data file. Likewise, a timer
in the timer data file has an address associated with it that
allows you to represent it in the program file.
The first 9 data files (0-8) have default types. You designate
the remainder of the files (9-255). The default types are:
B File 0 Output Data This file stores the state of the output
terminals for the controller.
B File 1 Input Data This file stores the status of the input
terminals for the controller.
B File 2 Status Data This file stores controller operation
information.
B Files 3 7 These files are pre-defined as Bit, Timers,
Counters, Control and Integer data storage, respectively.
B File 8 - Floating Point. This file stores single precision non-
extended 32-bit numbers. Valid range is 1.1754944e-38
to 3.40282347e-38. Only SLC 5/03 OS301 processors
use this file.
B File 9-255 User Defined. These files are user-defined as
Bit, Timer, Counter, Control and Integer data storage. For
SLC 5/03 OS301 processors, floating point, string and
ASCII files are also supported. In addition, File 9 is
specifically available as a Communication Interface File.
Most of your work with data files will be in files 0 and 1, the
output and input files.
12. Programming instructions
12.1 Bit instructions
Instruction mnemonic and name Function - conditional instructions input or output
XIC Examine if Closed Conditional instruction. True when bit is on (1).
XIO Examine if Open Conditional instruction. True when bit is off (0).
OSR One Shot Rising Conditional instruction. Makes rung true for one scan upon each false-to-true
transition of conditions preceding it in the rung.
OTE Output Energise Output instruction. True (1) when conditions preceding it are true. False when
conditions preceding it go false.
OTL Output Latch Output instruction. Addressed bit goes true (1) when conditions preceding the
OTL instruction are true. When conditions go false, OTL remains true until the
rung containing an OTU instruction with the same address goes true.
OTU Output Unlatch Output instruction. Addressed bit goes false (0) when conditions preceding the
OTU instruction are true. Remains false until the rung containing an OTL instruc
tion with the same address goes true.
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12.2 Comparison instructions
12.3 Timer and counter instructions
12.4 Communication instructions
Instruction mnemonic and name Function - Output instructions
TON Timer On-Delay Counts time intervals when conditions preceding it in the rung are true.
Produces an output when accumulated value (count) reaches the preset value.
TOF Timer Off-Delay Counts time intervals when conditions preceding it in the rung are false.
RTO Retentive Timer This is an On-Delay timer that retains its accumulated value when:
Rung conditions go false.
The mode changes to program from run or test.
The processor loses power.
A fault occurs.
CTU Count Up Count up for each false-true transition of conditions preceding it in the rung.
CTD Count Down Count down for each false-true transition of conditions preceding it in the rung.
HSC High-Speed Counter Applies to 24Vdc fixed I/O controllers only. Counts high-speed pulses from a
high-speed input. Maximum pulse rate of 8kHz.
RES Reset Used with timers and counters. When conditions preceding it in the rung are
true, the RES instruction resets the accumulated value and control bits of the
timer or counter.
MSG Message Read/Write This instruction transfers data from one node to another on the communication
network. When the instruction is enabled, message transfer is pending. Actual
data transfer takes place at the end of the scan.
SVC Service Communications When conditions preceding it in the rung are true, the SVC instruction interrupts
the program scan to execute the service communication portion of the operating
cycle.
Instruction mnemonic and name Function - (Input) instructions
EQU Equal Instruction is true when source A = source B.
NEQ Not Equal Instruction is true when source A source B.
LESS Less Than Instruction is true when source A < source B.
LEQ Less Than or Equal Instruction is true when source A source B.
GRT Greater Than Instruction is true when source A > source B.
GEQ Greater Than or Equal Instruction is true when source A source B.
MEQ Masked Comparison for Equal Compares 16-bit data of a source address to 16-bit data at a reference address
through a mask. If the values match, the instruction is true.
LIM Limit Test True/false status of the instruction depends on how a test value compares to
specified low and high limits.
12.5 I/ O and Interrupt instructions
12.6 File Copy and File Fill instructions
12.7 Math instructions
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39
COP File Copy When rung conditions are true, the COP instruction copies a user-defined source
file to the destination file.
FLL File Fill When rung conditions are true, the FLL instruction loads a source value into a
specified number of elements in a user-defined file.
ADD Add When rung conditions are true, the ADD instruction adds source A to source B
and stores the result in the destination.
SUB Subtract When rung conditions are true, the SUB instruction subtracts source B from
source A and stores the result in the destination.
MUL Multiply When rung conditions are true, the MUL instruction multiplies source A by
source B and stores the result in the destination.
DIV Divide When rung conditions are true, the DIV instruction divides source A by source B
and stores the result in the destination and the math register.
DDV Double Divide When rung conditions are true, the DDV instruction divides the contents of the
math register by the source and stores the result in the destination and the math
register.
NEG Negate When rung conditions are true, the NEG instruction changes the sign of the
source and places it in the destination.
CLR Clear When rung conditions are true, the CLR instruction clears the destination to zero.
TOD Convert to BCD When rung conditions are true, the TOD instruction converts the source value to
BCD and stores it in the math register or the destination.
FRD Convert from BCD When rung conditions are true, the FRD instruction converts a BCD value in the
math register or the source to an integer and stores it in the destination.
DCD Decode When rung conditions are true, the DCD instruction decodes 4-bit value (0 to
16), turning on the corresponding bit in 16-bit destination.
SQR Square Root When rung conditions are true, the SQR instruction calculates the square root of
the source and places the integer result in the destination.
SCL Scale When rung conditions are true, the SCL instruction multiplies the source by a
specified rate. The result is added to an offset value and placed in the destination.
Instruction Mnemonic and Name Function - Output instructions
IIM Immediate Input with Mask When conditions preceding it in the rung are true, the IIM instruction is enabled
and interrupts the program scan to write a word of masked external input data to
the input data file.
IOM Immediate Output with Mask When conditions preceding it in the rung are true, the IOM instruction is enabled
and interrupts the program scan to read a word of data from the output data file
and transfer the data through a mask to the corresponding external outputs.
IIE I/O Interrupt Enable The IIE, IID, and RPI instructions are used with specialty I/O modules capable of
IID I/O Interrupt Disable generating an I/O interrupt.
RPI Reset Pending
I/O Interrupt
REF I/O Refresh When conditions preceding it in the rung are true, the REF instruction interrupts
the program scan to execute the I/O scan (write outputs-service comms-read
inputs). The program scan then resumes.
STD Selectable Timed Disable Associated with the Selectable Timed Interrupt function. STD and STE are used to
prevent an STI from occurring during a portion of the program; STS initiates an
STE Selectable Timed Enable STI.
STS Selectable Timed Start
INT Interrupt Subroutine Associated with STI interrupts and I/O event-driven interrupts.
12.8 Proportional Integral Derivative Instruction
12.9 Move and Logical instructions
12.10 Bit Shift, FIFO, and LIFO instructions
12.11 Sequencer instructions
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40
MOV Move When rung conditions are true, the MOV instruction moves a copy of the source
to the destination.
MVM Masked Move When rung conditions are true, the MVM instruction moves a copy of the source
through a mask to the destination.
AND And When rung conditions are true, sources A and B of the AND instruction are
ANDed bit by bit and stored in the destination.
OR Inclusive Or When rung conditions are true, sources A and B of the OR instruction are ORed
bit by bit and stored in the destination.
XOR Exclusive Or When rung conditions are true, sources A and B of the XOR instruction are
Exclusive ORed bit by bit and stored in the destination.
NOT Not When rung conditions are true, the source of the NOT instruction is NOTed bit
by bit and stored in the destination.
BSL Bit Shift Left On each false-to-true transition, these instructions load a bit of data into a bit
BSR Bit Shift Right array, shift the pattern of data through the array, and unload the end bit of data.
The BSL shifts data to the left and the BSR shifts data to the right.
First In First Out (FIFO) The FFL instruction loads a word into an FIFO stack on successive false-to-true
FFL Load (FFL) transitions. The FFU unloads a word from the stack on successive false-true tran
FFU Unload (FFU) sitions. The first word loaded is the first to be unloaded.
Last In First Out (LIFO) The LFL instruction loads a word into an LIFO stack on successive false-to-true
LFL Load (LFL) transitions. The LFU unloads a word from the stack on successive false-to-true
LFU Unload (LFU) transitions. The last word loaded is the first to be unloaded.
SQO Sequencer Output On successive false-to-true transitions, the SQO moves a step through the pro-
grammed sequencer file, transferring step data through a mask to a destina tion
word.
SQC Sequencer Compare On successive false-to-true transitions, the SQC moves a step through the pro
grammed sequencer file, comparing the data through a mask to a source word
or file for equality.
SQL Sequencer Load On successive false-to-true transitions, the SQL moves a step through the
sequencer file, loading a word of source data into the current element of the
sequencer file.
PID Proportional Integral This instruction is used to control physical properties such as temperature,
Derivative pressure, liquid level, or flow rate of process loops.
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41
12.12 Control instruction
12.13 ASCII instructions (applies to SLC 5/ 03 OS301 processors only)
41
Instruction mnemonic and name Function - Conditional or output instructions
JMP Jump to Label Output instruction. When rung conditions are true, the JMP instruction causes the
program scan to jump forward or backward to the corresponding LBL instruction.
LBL Label This is the target of the correspondingly numbered JMP instruction.
JSR Jump to Subroutine Output instruction. When rung conditions are true, the JSR instruction causes the
processor to jump to the targeted subroutine file.
SBR Subroutine Placed as first instruction in a subroutine file. Identifies the subroutine file.
RET Return from Subroutine Output instruction, placed in subroutine. When rung conditions are true, the RET
instruction causes the processor to resume program execution in the main pro
gram file or the previous subroutine file.
MCR Master Control Reset Output instruction. Used in pairs to inhibit or enable a zone within a ladder pro
gram.
TND Temporary End Output instruction. When rung conditions are true, the TND instruction stops the
program scan, updates I/O, and resumes scanning at rung 0 of the main program
file.
SUS Suspend Output instruction, used for troubleshooting. When rung conditions are true, the
SUS instruction places the controller in the Suspend Idle mode. The suspend ID
number is place in word S:7 and the program file number is placed in S:8.
ABL Test Buffer for Line Determines the number of characters in the buffer, up to and including the end-
of-line characters (termination).
ACB No. of Characters in Buffer Determines the total characters in the buffer.
ACI ASCII String to Integer Converts an ASCII string to an integer value.
ACL ASCII Clear Receive and/or Clears the ASCII buffer.
Transmit Buffer
ACN ASCII String Concatenate Combines two strings using ASCII strings as operands.
AEX ASCII String Extract Creates a new string by taking a portion of an existing string and linking it to a
new string.
AHL ASCII Handshake Lines Sets or resets the RS-232 Data Terminal Ready and Request to Sender handshake
control lines for the modem.
AIC ASCII Integer to String Converts an integer value to an ASCII string.
ARD ASCII Read Characters Reads characters from the buffer and stores them in a string.
ARL ASCII Read Line Reads characters from the buffer up to and including the end-of-line characters
and stores them in a string.
ASC ASCII String Search Searches an existing string for an occurrence of the source string.
ASR ASCII String Compare Compares two ASCII strings.
AWA ASCII Write with Append Adds the two appended characters set from the ASCII configuration menu.
AWT ASCII Write Writes characters from a source string to a display device.
239-9986
13. List of instructions
Use the following instructions with the Advanced
Programming Software (APS) or the Hand-Held Terminal
(HHT).
BitInstructions
Examine If Closed
Examine If Open
One-Shot Rising
Output Energise
Output Latch
Output Unlatch
Timer and Counter Instructions
Timer On/Timer Off-Delay
Retentive On-Delay Timer
Count Up/Count Down
High-Speed Counter
Reset
I/ O and Interrupt Instructions
Immediate Input/Output With Mask
I/O Interrupt Enable/Disable*
Reset Pending I/O Interrupt*
I/O Refresh*
Selectable Timed Interrupt Enable/Disable*
Selectable Timed Interrupt Start*
Interrupt Subroutine*
Comparison Instructions
Equal
Not Equal
Less Than
Greater Than
Less Than or Equal
Greater Than or Equal
Masked Comparison for Equal
Limit Test*
Move and Logical Instructions
Move
Masked Move
And
Or
Exclusive Or
Not
I/ O Message Instructions
Service Communications*
Message*
Math Instructions
Add/Subtract
Multiply/Divide
Double Divide
Clear
Negate
Decode
Square Root*
Scale*
Control Instructions
Label
Jump
Jump to Subroutine
Return from Subroutine
Master Control Reset
Temporary End
Suspend
Subroutine
Sequencer Instructions
Sequencer Output
Sequencer Compare
Sequencer Load*
Bit Shift, FIFO, and LIFO Instructions
Bit Shift Right/Left
Load/Unload, First In First Out*
Load/Unload Last In First Out*
File Instructions
Copy File
Fill File
Special Instruction
Proportional, Integral, Derivative*
* SLC 5/02 and SLC 5/03 processors only.
The information provided in RStechnical literature is believed to be accurate and reliable; however, RS Components assumes no responsibility for inaccuracies
or omissions, or for the use of this information, and all use of such information shall be entirely at the users own risk.
No responsibility is assumed by RS Components for any infringements of patents or other rights of third parties which may result from its use.
Specifications shown in RS Components technical literature are subject to change without notice.
RS Components, PO Box 99, Corby, Northants, NN17 9RS Telephone: 01536 201234
An Electrocomponents Company RS Components 1997

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239-9986

8 ms/K 8 ms/K 4.8 ms/K 1ms/K 0.9ms/K

and PLC-5/250 processors

(max.) (max.) (max.)

-100C to +260C 0.1C 0.2C

0.5C 0.34C/C 0.014C/C

0.5C 0.34C/C 0.014C/C

0.4C 0.034C/C 0.011C/C

0.4C 0.034C/C 0.011C/C

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