Smta-Gdl Smta-Gdl DFM Presentation 2012-07

Design for Manufacturability (DFM) Design for Assembly (DFA)
SMTA Guadalajara Mexico July 12, 2012
Welcome!!!
Joe Belmonte
joe_belmonte@ITMconsulting.org
ITM Consulting
Durham, New Hampshire USA
Joe Belmonte
Motorola Information System Group
Mansfield Massachusetts (MA), USA 1978 to 1995 Manger of Advanced Manufacturing Engineering
Speedline Technologies
(MPM, Camalot, Electrovert) Franklin MA, USA 1995 to 2007 Director of Applications Engineer and Principal Consultant
Joe Belmonte
Bose Corporation
Framingham MA, USA 2007 to 2009 Director of Advanced Manufacturing Engineering
ITM Consulting
Durham New Hampshire, USA 2009 to Present Principal Consultant
Whatever comes out of these gates, we've got a better chance of survival if we work together. Do you understand? If we stay together, we survive.
Gladiator Movie Quotes by Author Unknown
Seminar Agenda
Definition of DFM Customer Satisfaction Requirements Functional Responsibilities of DFM Concurrent Engineering Early Supplier Involvement Well Defined Development Process Defining a Process Six Sigma and Statistical Thinking Understanding and Controlling Process Variation
Seminar Agenda
Inspection and Test Planning Process Characterization Concepts Stencil Design Evaluating Printed Circuit Board Designs Software
The significant problems we face cannot be solved at the same level of thinking we were at when we created them -- Albert Einstein
We are what we repeatedly do. Excellence, then, is not an act, but a habit. -- Aristotle
Ultimate Purpose of DFM/DFA is Customer Satisfaction!!!!!

Quality Reliability Cost Delivery Features
Design for Manufacturability

Design for Manufacturability must include a detailed understanding of the processes that will be used to build the product, how the processes are developed, how the processes are controlled, and how continuous improvement is accomplished.
DFM&DFA Guidelines
The two most important documents the electronic assembler should have are: Workmanship Standards Design for Manufacturability and Assembly (DFMA) Guidelines
Design for Manufacturability Definitions

Design for Manufacturability is the process by which every aspect of the product and process design is formally evaluated to insure the lowest possible product cost, the fastest possible process cycle time, and the highest possible first pass yield.

Designing a product to be produced in the most efficient manner possible (in terms of cost, resources, and time) taking into consideration how the product will be processed, utilizing the existing skill base (and avoiding the learning curve) to achieve the highest yields possible
Phil Zarrow

Design for Manufacturability is the method for creating robust product designs that will be insensitive to long-term dynamic variation in the processes and materials used in the manufacturing and will be immune to foreseeable misuse of the product in the environment in which it is used. -- Motorola DFM is the process whereby manufacturing and test engineers influence the product design to make it as manufacturable and testable as possible by minimizing cycle time, reducing parts, using standard processes and maximizing test coverage. -- Dave Reed, 3COM
What is DFM&DFA ?
Design for Assembly (DFA) - is a technique which will minimize total product cost by targeting: (this is the process
side of product transformation process)
Parts Count (This is the major cost driver in Mfg.) Assembly Time Part Cost The Assembly Process
Design for Manufacturing (DFM) - is a technique for minimizing fabricated part cost: (this is the material and tooling
side of the product development process)
Optimizing the Fabrication Process Material Selection Part Cost Tooling Strategies to reduce cost Tooling Cost Estimates
Customer Satisfaction Requirements

A customer has a right to expect the product to be delivered without defects
A defect is any variation of a required characteristic of the product or its parts, which is far enough removed from its target value to prevent the product from fulfilling the physical and functional requirements of the customer

A customer has a right to expect the product to be delivered when promised
Every occurrence of a defect within the manufacturing process requires time to analyze, repair, and test.

A customer has a right to expect the product not to experience early life failure
Early life failures are the result of latent defects, or abnormalities, which will cause failure at some future time, depending on the degree of abnormality and amount of applied stress. Latent defects are not detectable by normal test or inspections.

A customer has a right to expect the product not to fail excessively in service
If the product design is robust, it will be insensitive to long-term dynamic variation in the process and materials used in manufacturing and will be immune to foreseeable misuse of the product in the environment in which it is used.

Delivered defects are directly proportional to the total number of defects found in the entire manufacturing process. Average cycle time per unit is directly proportional to the total number of defects per unit. Latent defects are directly proportional to the total number of defects found in the entire manufacturing process.

Reducing the total number of defects per unit in the entire manufacturing process will:
Reduce delivered defects Reduce the cycle time per unit Reduce early life failure rate

Reduced total defects per unit will result in:
Increased customer satisfaction Reduced warranty cost Reduced manufacturing cost
Functional Responsibilities of DFM
Functional Responsibilities:
Development Engineering (Product Design)
Using supplied capability studies for suppliers and internal processes, design for 6 sigma performance for both supplier and internal processes Set supplier piece part specifications at 4.5 sigma based on supplier capabilities. Calculate sub-assembly tolerances statistically, then check the prototypes against the calculations. When changes are made in components, maintain up-todate assembly output calculations.
Supply calculations to assist in new product start ups Manufacturing provides performance data to development for use in next product design
Design for Assembly DFA

Reduced part count is the MAJOR advantage to practicing design for assembly DFA Part count drives/touches every aspect of an organization
Design for Assembly DFA

Unnecessary Parts Test
Are all parts of the assembly REQUIRED to Yes - this part meet the function of the may be No design? required Are these parts required to Yes - this part MOVE relative to each other? No may be Must this part be made of required DIFFERENT MATERIAL Yes - this part than other parts in the No may be assembly? required Is this part NECESSARY Yes - this part for disassembly or service of this assembly? No may be
required
Part is a candidate for elimination
Building better products requires a good comparative perspective about other companies to gain insight into other sources of outstanding performance
Product Development Performance Kim Clark & Takahiro Fujimoto
Definitions
Benchmarking
Is the continuous process of measuring products, services and practices against the toughest competitors or those recognized as industry leaders.
Competitive Intelligence
Is the process of gleaming and combining disparate information about a competitor in order to deduce its objectives.
Reverse Engineering
Is the systematic dismantling of a product to understand its technology with the purpose of replication.
Boothroyd Dewhurst DFMA Software Tools and Services

Founded in 1985 in Wakefield Rhode Island USA Provides product design and product manufacturability software tools and consulting services
Component Engineering
At the time of component qualification, display in the component qualification report the actual data on each critical parameter. Show any corrective action required by the supplier so that all parties are aware of what must be done to finish qualification of the part to make it acceptable. Mechanical dimensions must be qualified to the same design margins as those of electrical parameters. This will be done when supplier data for the first piece parts is scrutinized.
New Product Introduction Engineering
Work as closely as possible, as early as possible, with the product development team to insure all aspects of manufacturability and testability are built into the product design from its inception. Work as a member of the product development team. Coordinate and communicate with all concerned groups (manufacturing, sustaining engineering, development, purchasing, component engineering, quality, marketing, sales, etc.) the product development status at each step of the process.
Process/Manufacturing Engineering
Perform process capability studies on all existing processes and place under statistical control. Supply current capability to product development engineers. Start a procedure of process improvement that brings performance of each process to six sigma levels. As processes improve, update development engineering on the new capabilities.
Process/Manufacturing Engineering
During the prototype and pilot runs, every failure must be treated as either a parametric or catastrophic failure, and its source must be corrected by design or process improvements. This applies both to internal failures and supplier failures. At prototype and pilot runs, and in conjunction with production personnel, re-check the process capability data to ensure nothing has changed. Maintain statistical control and statistically analyze for design margins to six sigma. Identify each failure and treat as described.
Product Quality Engineering
Perform specification compliance evaluations Perform accelerated life/reliability evaluations and statistical analysis on all critical parameters. Report the actual design margins found in the finished product to product design and manufacturing.
Advanced Manufacturing Technology
Calculate process capabilities (Cp/Cpk) on each new piece of equipment or new process before turning them over to manufacturing. The manufacturing engineer responsible for the new equipment or process will verify it in production mode and establish the capabilities and statistical controls (SPC) for ongoing manufacturing.
Supplier Component Engineer and Purchasing
Develop supplier process capabilities and furnish them to development engineering. Work with suppliers to improve process capabilities when the design cannot tolerate variation in the suppliers existing processes. Ensure supplier compliance to SPC requirements and require that proof of control is supplied with each lot of material.
Concurrent Engineering
New Product Development Process
Product Development Process
DFMA process and tools can be applied throughout the product development cycle
The Cost of Making Changes

According to President Hiroshi Hamada, Ricoh did not detect a problem with one of its copiers until the machines were shipped to customers. Had the problem been corrected earlier, before the start of production, he estimated the cost of correcting the problem at various stages as follows: At the design phase: Before procuring parts: Before start of production: $ 35 $177 $368
Instead, the cost of correcting this problem was:
$590,000.00
Who Casts the Biggest Shadow?

70% Influence 20% 5% 5%
Overhead 30% Material 50% Design 5%

Adapted from Ford Motor Co.
Labor 15%
Product Cost

75 to 90% of project/product costs are determined during the first 7 to 8% of development time.
-- Paul Collins Ph.D., University of Washington and Strategy Research Applications
Concurrent Engineering is a competitive strategy attempting to simultaneously achieve a portfolio of benefits in time, money, and novelty (features). Concurrent Engineering involves multiple functions involved in decision-making on product design so that downstream issues such as manufacturability, marketability, serviceability, and total life cycle problems are anticipated at very early product design stages.
-- Paul Collins Ph.D. University of Washington and Strategy Research Applications
Product Development Time Reductions:
40% to 67%
Product Development Costs reductions:

16% to 46% for Telecommunications 55% to 95% for Aerospace
Engineering Rework Reductions:

50% to 54%
-- Paul Collins Ph.D. University of Washington and Strategy Research Applications
Early Supplier Involvement

Capture the vendors know how and experience early. Share a commitment to the product by working together from the start. Optimize the part design to take advantage of the vendors capabilities and processes. Optimize the part design for ease of manufacture with input from the vendor on the emerging design. Set target cost for tooling and parts using cost models to support the products cost goals. Use this data to open communications with vendors.

Our customers teach us to be good suppliers; perhaps our suppliers could teach us to be good customers. We realize that we are not taking full advantage of the benefits of supplier design expertise early enough in our design process. Many of our customers have enjoyed these benefits for years. They know the value of supplier-customer design teams. Suppliers can help design in quality from the beginning, and shorten the product development cycle time -- Gary Tooker, Motorola

The early supplier involvement process requires the trust and openness to share critical information between the customer and chosen supplier. A supplier must be prepared with personal capable of responding to the customers requirements.

These questions should be asked:
Do you have a standard item that can be substituted? What are the available manufacturing alternatives? Can you suggest a material alternative? Do you have any suggestions that would reduce processing? Are there any product design alternatives that can be made to assist you?

These questions should be asked:
Can you evaluate cost versus precision? Can you suggest procedures to detect and remedy deviations? Does your company have the technical expertise available in a time frame appropriate to the customer requirements? Do you have any further suggestions that might reduce lead time, simplify the part, and/or reduce cost?

What are ways to insure 100% usable purchased parts and materials?
Cpk equal to or greater than 1.5 Supplier specifications that reflect true critical values The specs supplied by the customer must allow the supplier to use the most efficient manufacturing process. Internal policies and procedures must conform to the above.
Benefits of Early Supplier Involvement

Lower development and part cost Optimized manufacturability Improved part quality Improved delivery schedules Improved communications Optimized product design
Benefits of Early Supplier Involvement

Minimized design changes Reduced product development time Optimized material selection Utilized supplier technology Standardized parts Calculated Six Sigma design
Well Defined Development Process

Be documented, graphically and textually
Key terms are defined Documentation is distributed to and understood by all involved parties
Be detailed and specific enough to serve as a working development blueprint; yet flexible enough to accommodate products of varying complexity Minimize all opportunities for parallel development

Define the items listed for each phase: Required inputs and sources Constituent steps and tasks Per step/task, roles and responsibilities Outputs, including documentation specifications Phase entry and exit criteria Necessary functional involvement Be enforced and monitored

A formal review should occur at the end of each development phase in order to:
Detect problems (potential defects) as close as possible to their point of origin. Track and document sources of error and defects. Uncover errors, but NOT to fix them (during the review) Confirm outputs that do not require improvements. Make projects more manageable.
Characteristics of Formal Phase Reviews

Cross functional representation, including customers Material disseminated in advance Scope of material covers wide spectrum May need to occur over several meetings Coordinated by project leader Sign-off and follow-up report required
Defining a Process
Define the Process

The term process means different things to different people. So, it is important to clearly define what we mean by process. A process can be defined as the logical organization of people, materials, environment, equipment, and procedures into work activities designed to produce a specified end result.
Elements of a Process
Materials
Customer Requirements
People
Work Activities
Equipment
Products & Services
Environment Procedures
A key/critical process is basically a "valued-added" process in the Macro Map which inhibits achieving 6 sigma quality in our products or services.
Defining Process Parameters

Design Input Parameter(s) Material Defects Output Parameter(s) Variable Characteristics
Process
Process Parameters
Defining Process Parameters

Input Parameters
A measurement system or a parameter in a process that is used in the creation of process output. Input parameters are materials, methods, measurements, machines, people, and environment.
Process Parameters
Steps or activities completed using the input parameters to generate a product or service.
Output Parameters
The end result of a process. It may include as little as only one specific output on only one product or it my include as much as all products and all outputs produced by the machine(s) and/or operation(s) included in the process.
Identifying Parameters
Choosing those parameters that will be the leading indicators to the quality level being produced by the process. Design Defects
Input Parameter(s) Material
Process
Variable Characteristics
Output Parameter(s)
Process Parameters
Those parameters that have the most significant impact to the next process, clients or our customer.
Process Mapping
Understanding the flow of the process, all inputs, outputs, of each process steps.
Macro-Map : Macro-Mapping is the process of charting the coarse flow of an operation (such as a manufacturing line). Micro-Map : Micro-Mapping breaks down a process in the Macro-Map into several consecutive sub-steps (identifying all inputs and outputs).
Input Parameter(s)
Process A
Process B
Process C
Output Product or Service
Methods Used to Identify Parameters

Brainstorming Techniques Prioritization Matrix Cause and Effect Diagrams (Fishbone) Modified Cause and Effect Diagrams Weighted Voting Affinity Diagrams
Six Sigma and Statistical Thinking
Capability Cp = A = B C pk = C = 0.5 B
Condition 1 2 2.0 2.0 2.0 1.5
Condition 2: 2 Distribution Average Shifted 1.5s from the Nominal Specification
LSL
USL
Condition 1: Distribution Average Centered on Normal Specification
LCL
-6s -5s -4s -3s -2s -1s 1s 2s 3s
UCL
4s 5s 6s
LSL
Nominal
USL
What is Six Sigma?

A discipline of continuous improvement to achieve Total Customer Satisfaction.
Implement Permanent Corrective Actions Define Goals and Targets
Prevent Recurrence Control the Process Standardization Redesign
4 - Action
1 - Plan
Recognize Parameters Identify Key Opportunities Identify Key Processes Improvement Plan Select Project/Team
Measure Improvement Assess Effectiveness Review Projects
3 - Check
2 - Do
Education and Training

Implementation
Key Factors for Success

Management Leadership
Top down Committed
Clear & Aggressive Goals Breakthrough Thinking Training (Black Belt Program) Reinforcing Successes Drive Six Sigma Quality through Statistical Thinking and Analytical Problem Solving
Six Sigma Key Initiative Challenges

The achievement of Error Free Performance in Products, Processes and Services
Six Sigma Quality - 3.4 defects per million opportunities Total Cycle Time Reduction - 10x improvement every 2 years Six Sigma Designs Process and Supplier Characterization Variation Reduction in Processes and Designs Cp/Cpk > 1.5 Total Customer Satisfaction Software Quality - SEI
Six Sigma is a highly disciplined and quantitative approach to improvements
Five Myths of Statistical Thinking & Analytical Problem Solving

Only works in manufacturing Is added effort, takes too long Requires large teams Creates a lot of bureaucracy Just another quality program
The Role of Continuous Improvement

To achieve consistency in our processes, we need to reduce variation. But, how do we: Measure the current levels of variation? Decide what to work on next? Know we have improved? To answer these questions, we must have a process and associated tools. It is here that statistics and statistical thinking play a major role.
The Role of Statistical Thinking in Continuous Improvement

Statistics: The science of turning data into information for making business or engineering decisions in the presence of uncertainty. The electronics business is a data-driven industry. We apply statistical methods to enable us to make quantitative statements in the presence of variability. Statistical methods are like a microscope is to a scientist. They help us focus our expertise on the solution of the problem at hand.
Why Does Statistical Thinking Work?

Creates Bottom Line Results ($) Uses a Disciplined Approach Managed by Data Approach Sound Statistical & Problem Solving Approach Creates Proficient Quality Professionals Standardized Approach that works Across Processes, Products and Organizations.
Statistical Thinking is Different and it Works

Focused Approach
Phased Improvement Methodology
Define, Measure, Analyze, Improve and Control
Understanding and reducing variation are keys to success.
Statistical Thinking is a way of thinking, a thought process, rather than a method of calculating.
Process Variation
Components of Variation
In all aspects of the processunderstand and control
Material
Process
Operator
Measurement Environmental
What Is Variation?
Common Cause Natural, expected variation Difficult to identify Cannot be eliminated DOE can reduce Controllable Ex: Solder Paste Parameters, Temp, R/H, Lead Co-planar.
Special Cause Unnatural, not expected Easily Identified Can be eliminated Ex: Paste dried out on stencil, machine fail, setting changed w/o OK Never change operating parameters for special cause variation (do not tweak!!!)
Types of Defects
Special & Common Causes
SPECIAL CAUSE!!
UCL
COMMON CAUSES!!
LCL
SPECIAL CAUSE!!
Corrective Action : SPC rule violations "Special Cause - changes, anomalies, unusual events "Common Cause - shift in mean, trend in mean, increased variability " Implement contaminate plan, and monitor for repeat occurrences.
-Stop defects from escaping to next process -Keep process in operation while permanent corrective action is implemented
Identification of Special and Common Causes
For repeat occurrences tie specific cause to corrective action using problem solving methods.
Never change operating parameters for Special Cause Variations
Process Tweaking
The definition that best describes tweaking in the electronics manufacturing industry is:
To touch something up, fiddle with the finishing touches or make tiny little changes. In our industry, tweak is usually used in sentences such as I just have to tweak a little bit here and there and it will be perfect. That usually leads to a statement such as "I just tweaked this and THIS AND THIS AND THIS and this and OH NO now this...
If we have done our formal process development and optimization, we are monitoring the process using statistical process control (SPC), and understand the concepts of common cause and special cause variation, we should be adamant about NEVER tweaking the process.
Process Tweaking
What operating parameters should I allow my operators to adjust? NONE!!!! But my operators are very well trained and have all worked with the process for many years. With their knowledge and experience shouldnt they be given the authority to change operating parameters to optimize performance? NO No process operator, no matter how knowledgeable or how experienced, should ever be allowed to adjust ANY operating parameter under ANY circumstances.
The Funnel Experiment

The variation of a process reacts to adjustments made to improve the process.
Individuals X CHART
Dr. Deming discusses 4 different methods that have been commonly used to adjust processes.
9 8.5 8 7.5 7 RANGE CHART 2 1 0 Showing the spread of individuals on and Xbar and R chart.
Rule 1
Leave the funnel fixed, aimed at the target, no adjustment. Results: this is by far the best choice. Rule 1 will produce a stable distribution of points. It produces minimum variance on any diameter drawn through the target
Rule 1
Rule 2
Adjust for the error by moving the target the error distance in the opposite direction of its last position.
X
Tweaking! Never do it. Produces a stable process, but higher variance than rule 1.
Rule 2
Rule 3
Adjust for the error by moving the target the error distance in the opposite direction of the target Worse than tweaking explodes.
X
Rule 3
Rule 4
Set the funnel at each drop right over where it last hit. Explodes
X
Rule 4
Relate to Traveling to Work: Goal 7:00 AM Arrival

Rule 1: Choose a reasonable route and consistently follow the route leaving your home at the same time each day. Day 1 2 3 4 5 Departure 6:30 a.m. 6:30 a.m. 6:30 a.m. 6:30 a.m. 6:30 a.m. Arrival 7:05 a.m. 6:58 a.m. 6:55 a.m. 7:00 a.m. 7:02 a.m.
Rule 1
Rule 2
Compensate the amount of time you arrived at work early or late by leaving your home that much earlier or later, and continue adjusting youre departure each day based on the previous days departure.
Day 1 2 3 4 5 Departure 6:30 a.m. 6:25 a.m. 6:35 a.m. 6:20 a.m. 6:20 a.m. Arrival 7:05 a.m. 6:50 a.m. 7:15 a.m. 7:00 a.m. 6:50 a.m.
Rule 2
Rule 3
Compensate the amount of time you arrived at work early or late by leaving your home that much earlier or later than the original departure time, and continue adjusting your original departure time each day based on how early or late you were the previous day.
X
Rule 3
Rule 4
Compensate the amount of time you arrived at work early or late by leaving your home at the previous days arrival time, and continue adjusting your departure time each day based on the time you arrived the previous day.
X
Rule 4
What Process Performance Metric is Important

The bottom line the only metric that measures how well a process line is performing is how many good products are built each day. How many of what we build today can we ship to our customers? Good product is one built in an acceptable time that passes all required testing the first time without any inspection, touch-up, or repair.
Cycle Time/Throughput Balance

There is a definite balance between product cycle time (how long it takes a product to get from beginning to end of the manufacturing process) and the quality of that product. Producing defective product just to achieve some required cycle time is certainly not acceptable; nor is slowing the process unduly to minimize every possible defect. We must understand and optimize this balance.
Inspection and Test Planning
Inspection & Test Planning

All inspection and test processes are NON VALUE ADDED functions. Inspection and test processes should be kept to a minimum. Focus on capable, stable processes to produce products that will minimizes the requirement for inspection and test.

Inspection and test planning is the activity of:
Designating the stations at which inspection or test should be performed. Establishing the effectiveness of each inspection and test process. Identifying which process contributes the most defects.

How can Inspection & Test Planning assist in Quality Planning ? Knowing the observed defect level, inspection and test effectiveness, we can estimate the submitted defects and escaping defects.

For example:
Observed Defects = 0.25 dpu Insp. Or Test Effectiveness = 0.8 Submitted Defects = 0.31 dpu (0.25/.8) Escaping Defects = 0.06 dpu (0.31 - 0.25)
Submitted
Inspection or Test Process
Escaping
Observed
How can Defect Level Constraints be used in Process Design?

Create a structured process flow diagram for the entire set of assembly operations for the product, identifying:
All inspection/test points. Include the nonconforming product found at each inspection/test point.
Establish maximum defect/unit level for the delivered product. Working from the start of the process to the end, estimate the defect/unit entering, escaping each process step using actual factory data and the effectiveness of the inspection or test process.
How can Defect Level Constraints be used in Process Design?

If the estimated process delivery defect/unit is greater than the maximum allowed:
Revise the process flow where necessary by:
Redesigning the operations for increased process capability to produce fewer defects. Implement Statistical Process Control and Design of Experiments (DOE) to reduce process variation.
Inspection or Test Process Effectiveness

Submitted Defects
Inspection or Test Process
Escaping Defects
Observed Defects
Submitted Observed Escapes Defects dpu Effectiveness 1,487 0.1375 152 0.014 1,335 0.1235
10.22 % = (152/1,487) * 100

Stencil Printing & Placement Process Supplier
0.030 dpu
d0
0.1375 dpu
Pre-Reflow Inspection
Reflow Process
0.1235 dpu
0.1763 dpu
Post-Reflow Inspection
0.1473 dpu
Test Process
dn
0.0314 dpu
d1
0.1075 dpu
d2
0.014 dpu
d3
0.0528 dpu
d4
0.029 dpu
d5
0.1159 dpu
Pre-IR Inspection Observed Escapes Defects dpu Effectiveness 152 0.014 1,335 0.1235
Post-IR Inspection Observed Escapes 317 0.029 1,588 0.1473
Test Process Observed Escapes 1,251 0.1159 340 0.0314
10.22 %
16.64 %
78.62 %
Inspection & Test Planning: Summary

Eliminating defects is the most important key to achieving a World - Class Manufacturing Operation. Defects per unit is the best measure of actual total product quality because it allows prediction, analysis, planning and benchmarking by product / process development teams
Process Characterization Concepts
Process Characterization
Process Characterization is a technique to identify and minimize sources of variation in our processes and to obtain an understanding 1 Definition of the quantitative effects of the process 2 Process Monitoring Process Output inputs on the process outputs. Statistical methods are employed throughout the process characterization program to isolate sources of variation to meet stability and capability 5 requirements. 4
Process Stability
Eight Steps to Process Characterization

1 Machine Acceptance 8 Process Monitoring 7 Institutionalize and Documentation 2 Process Definition 3 Selection of Process Outputs
6 4 Process Capability Measurement Equipment Assessment 5 Process Stability
Machine Acceptance Studies

Prevention vs. Reaction
Statistically confirms machine operation Reduces special cause variation due to machine operation Minimizes loss of production time Minimizes machine down time
Defect Reduction Methodology Process Characterization Approach

Material Design Process Input Parameters Defects Are Caused By Many Parameters Output Parameters 1. Identified, Cpk=1.5 2. Identified, Cant Measure 3. Have Not Identified Defects
DOEs; Optimization, Control
Evidence of Process Characterization Methodology

Process Focus Attribute and Variable Data Terminology of Cp/Cpks Identifying Process Parameter to Study Performing Capability Studies Optimizing the Process Implementing Process Controls Identifying Additional Critical Parameters
Reuse Of Other Facilities Findings Use of DOEs & Statistical Methods Apparent
Correlating Parameters to Actual Process Improvement
Process Characterization Methodology

Is a way of understanding, controlling and coping with variability - that is managing variability.
Management Commitment to Statistical Data Analysis and Problem Solving Implement Statistical Process Control (SPC) to monitor key process parameters Daily Quality Meetings Root Cause Corrective Actions Measurement Systems Analysis Design of Experiments Continuous Process Improvements SPC Audits
Process Characterization Methodology

Results:
Reducing Defect Rate (dpu), Cycle Time, Repair costs, and increasing Productivity. Increasing the time the process is in an ideal state. Decreasing the process variability. Increasing the time that the process characteristics mean remains at its target value or remains constant at acceptable level. Reducing the number of out of control conditions on SPC .
Intent and Expectation Quality Goals

Material Design Process 2 Input Parameters
DOEs; Optimization; Control
Defects 3 Output Parameters

1. Identified, Cpk=1.5 3. Have Not Identified
2. Identified, Cant Measure
1. Institutionalize statistical methods based problem solving techniques 2. It is more important to identify (and control) additional parameters that have an impact on actual process performance than to pursue parameters that have a low impact on actual process performance . 3. Quality reviews should address the impact of process characterization efforts on reducing DPU. This is expected to be qualitative at first and should become quantitative as time progresses.
Evolution of Continuous Improvement in the Reduction of Variation

Before Using Statistical Methods LSL USL LSL SPC Implementation USL Utilizing Design of Experiments LSL USL
The Process is not in control, not predictable.
Using SPC, the process is in control, but its capability is poor.
Using DOE & problem Solving techniques, the process capability has improved.
Link Process Characterization to DPHU Efforts

Initial Characterization Activity Additional Parameter (Identified, Optimized, Controlled) DPHU Additional Parameter
Time
Continuous Improvement Activity in a Process Characterization Environment
Involves:
Reducing the number of out of control conditions. Increasing the time the process is in an ideal state. Decreasing the process variability. Increasing the time that the process characteristics mean remains at its target value or remains constant at some acceptable level.
Machine Acceptance Studies
Process Characterization Process

Passes
Develop SPC Quality Plan
Define Statistical/Engineering objectives Identify Machine Response Parameter(s) Define Measurement Tech./Equipment Define Response Parameter(s) Tolerance Measurement R&R Studies Machine Capability , R&R studies, etc. Operations Macro Map Develop Required Process Procedures Define Response Parameter(s) Define Measurement Tech. / Equipment Define Response Parameter(s) Tolerance
Process Definition
Selection of Process Output(s)
Repeatability and Reproducibility Study
Fails
Data Collection for SPC
Improve Technique or Investigate Improved Measurement Device
Process Stability Out of Control Identify Common & Special Causes In Control Process Capability Cp & Cpk > 1.5 Process <PPM Goal
Critical Outputs of the Process are Stable, St index must be 2 % or less. Test Distribution for Normality Process Capability Cp & Cpk indices
>
1.5.
Set Input Controls Meets Capability Requirement
Identify Potential Causes Develop Process Micromap Develop Cause & Effect Diagram Test each cause/solution through experimentation and statistical data analysis or pattern analysis. Develop / Revise Problem & Solution matrix to Out of Control
Establish "Best" operating target and range for all critical input parameters. Implement Control Strategy for all Critical (input) Parameters and set to their optimal levels. Achieve Quality Levels through Improvement / Optimization Studies. Define Critical Process ( input) Parameter(s)
Fails
Process Improvement / Optimization Study
Passes
Long Term Process Monitoring Process Capability Studies Document Process Characterization studies.
Process Monitoring (Documentation)
Printing Positrol Diagram

To support the Process Characterization initiative, the following matrix of important characteristics should be available to process engineers for use in their respective processes as required to achieve defect reductions.
IN PUT CHARACTERISTICS Supplier materials, methods, machine parameters and environment Suggested Measurement Suggested Process Important Characteristic Process Tolerance Equipment Control Solder Paste Viscosity By paste type Viscometer X bar, R control charts Dependent upon Stencil Stencil Aperture W idth Micro view system X bar, R control charts Mfgr. Facility Temperature & Humidity By paste type Temp./Humidity gage X bar, R control charts 10 to 15 min.'s (Paste Equipment's paste knead or Equipment's process Time solder paste sits on stencil Dependent) double print next board software Stencil W ash: IPA - % flux on Board From supplier Omega Meter Process Log Stencil W ash: Saponifier - Tritation From supplier Tritation kit from supplier Process Log Stencil Quality (Dents, cleanliness, wear & Not Applicable Visual Inspection Process Log & Audits tear) Support Tooling (Placement, Cleanliness, Not Applicable Visual Inspection Process Log & Audits W ear & Tear)

Important Characteristic Solder Paste Height Solder Paste Coverage Process Defects & Errors Solder Paste Volume O U TPU T CHARACTERISTICS Produced by machine or operation Suggested Measurement Process Tolerance Equipment 8 mil +/- 2 mils CyberSentry or SVS system 6 mil -1,+2 mils +/- 10% Target Not Applicable +/- 30 % of Target Equipment 2D system Factory Reporting System, Trend Charts CyberSentry or SVS system Suggested Process Control X bar, R control charts Equipments 2D error detection system U-Control chart by process, Pareto Charts, X bar, R control charts
Important Characteristic Frequency of stencil wiping
O PERATO R D EPEN DEN T CH ARACTERISTICS Suggested Measurement Process Tolerance Equipment Every 6 to 8 boards (Paste Not Applicable Dependent) Ambient for 24 hrs Not Applicable
Solder Paste Handling from refrigeration
Suggested Process Control Process audits or automatic wiping Process Log, date / time stamp paste container

PREVENTATIVE MAIN TENANCE CHARACTERISTICS Suggested Measurement Important Characteristic Process Tolerance Equipment Height of Support nest plate to base Screen printer mfgr. Height Gage Stencil holder to base parallelism Screen printer mfgr. Height Gage Blade Angle Screen printer mfgr. Calib. to 90 degrees Force applied to right/left side of print Screen printer mfgr. Calibration on control cards head Printer Cleanliness (Nest, Stencil, base, Not Applicable Visual Inspection height sensor, etc.) Squeegee Blade ( Dents and angle ) Not Applicable Visual Inspection
O THER CHARACTERISTICS Suggested Measurement Process Tolerance Equipment Not Applicable Not Applicable
Suggested Process Control PM Logs & Audits PM Logs & Audits PM Logs & Audits PM Logs & Audits PM Logs & Audits Process Log & Audits
Important Characteristic Operator Certification Program
Suggested Process Control W ritten and/or observation tests
Stencil Design
Paste Flow in Apertures
OMNIX 5000 Poly Blade
Type III Powder 25 mil Width
1.5 in/sec Print Speed 1.5 lb/in Squeegee Pressure
Solder Paste Release Performance
10 mil Diameter Aperture 0.1 in/sec Stencil Release Velocity
Design Rules For Stencils

There are two rules used in Stencil Design
Aspect Ratio Rule
The aspect ratio rule has been used for a great deal of time in determining how well solder paste will transfer from the aperture to the surface of the printed circuit board
Area Ratio Rule

As smaller components have been used in electronics products requiring smaller stencil apertures the area of the opening of the aperture and the area of the walls of the aperture have become closer requiring the use of the area ratio rule in stencil design
Aspect Ratio Rule

For Optimal Transfer Efficiency
Aspect Ratio
Ensures that the aperture will allow the printed material to release onto the substrate. Aspect Ratio - W / t > 1.5 (chem-etch) For Example: 9 mil. aperture min. use 6 mil foil.
Width > 1.5 x t
Violation of Aspect Ratio
Correct Aspect Ratio
Stencils - Aperture Design

Typical Fine Pitch Apertures
Reduce aperture size by 20% to your pad size, maintain a minimum of 1.5 aspect ratio of aperture width to stencil thickness. (25mil pitch and Below).
Minimum Aperture Design Guidelines:

w t
Aspect Ratio = W / t >1.5 Width >= 4-5 Particle Diameters
Design Rules For Stencils Aspect Ratio

For Fine Pitch QFPs, Aspect Ratio Was The Limiting Factor for Printing: Aspect Ratio is .. Aperture width (WA) Stencil Thickness (TS)
A Typical 0.4mm (16mils) Pitch QFP Aspect Ratio is 9 = 1.8 5
However as the apertures have become smaller, the area of the opening of the aperture and the area of the aperture walls have become very much the same. Aspect Ratio alone is not the only stencil design calculation that must be used to insure an optimum stencil design. The Area Ratio must also be used.
Design Rules For Stencils Area Ratio Area Ratio

Area of the opening Area of the aperture walls The holding force of the solder paste to the printed circuit board pad must be greater than the holding force of the solder paste to the stencil aperture for the solder paste to release from the aperture and attach to the printed circuit board pad
Area Ratio Rule

For Optimal Transfer Efficiency Area Ratio
Ensures that the forces pulling a material onto the pad are greater than the forces holding it in the aperture.
Pad Pulling Tension (P)
=
Aperture (Length (L) Width (W))
Retaining Wall Tension (R) Stencil Thickness (T) Aperture Perimeter (2 (L+ W))
L
0.6
w T
Area Ratio for Square and Rectangular Apertures
Area Ratio for Circular Apertures
Why is Wall/Pad Ratio Important?

Area Ratio
Key process feature for successful fine pitch printing is paste release from stencil.
Violation of Area Ratio Rule
2
Correct Area Ratio
Comparing Aspect Ratio and Area Ratio

1 mm
0.15 mm Stencil 0.25mm 0.2 mm .(008)
Circle Aperture Wall Area Pad Surface Area Aspect Ratio Surface Area Ratio = 0.118 mm2 = 0.049 mm2 = 1.67 = 0.42
Rectangle Aperture Wall Area Pad Surface Area Aspect Ratio Surface Area Ratio = 0.36 mm2 = 0.2 mm2 = 1.34 = 0.56
The circle is more difficult to print because of the lower Surface Area Ratio. The aspect ratio is no longer a good indicator as here it suggests that the circle would be easier to print - it isnt
Sample Area Ratio Chart
Relationship:
Transfer Efficiency Area Ratio Standard Deviation
120.00% 100.00% Transfer Efficiency (FT) 80.00% 150.00 60.00% 100.00 40.00% 20.00% 0.00% 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 50.00 250.00
0.00
Area Ratio (AR)
The higher the relative AR, the higher the relative FT, the lower the absolute SD
Standard Deviation (SD)
200.00
Reduction of Aperture Size

25 mil 20 mil
15 mil
10 mil
Paste Release for a 15 mil (.015) Circle

15 mil (.38 mm) Dia. Circle (Area Ratio = 0.96)
Paste A SnPb Paste A Lead Free
Paste B SnPb
Paste B Lead Free
Paste Release for a 10 mil (.010) Circle

10 mil (.25 mm) Dia. Circle (Area Ratio = 0.64)
Paste A SnPb Paste A Lead Free
Paste B SnPb
Paste B Lead Free
Low Area Ratio Solder Paste Release
High Area Ratio Solder Paste Release
Print to Pad Ratio Gasketing

The ratio between the aperture width and pad should be at least 1:1.2 Often called Aperture Reduction EXAMPLE: 20 MIL (.5mm) Pitch Component
STENCIL OPENING
10 MIL 12 MIL
STENCIL SMT PAD
SMT PAD
12 x 0.80 = 10 mil aperture
Aperture to Pad Alignment

PCB Pads Over-etched
Making them smaller than the size in the Gerber data. For boards that are over-etched, Good gasketing is ensured by reducing the size of the aperture to the pad
Printed Circuit Board Tolerance Machine Alignment Tolerance

Stencil to PCB Even the most accurate printing equipment has an alignment tolerance
Stencil Tolerance
Stencil Design
Land Pattern & Aperture Design for 2-sided components
Land Pattern
Y A Y X B C B C Y
Aperture Design
Y A Y
C = L(max) + 0.030 A = L(min) - 2 x T(max) X = W(max) + 0.010 Y = (C-A) / 2 X D = 0.75 * Y F = X - 0.002
B = pad pitch
L(max) and (min) are the part length tolerances W(max) is the part width tolerance
D
The Home Plate design for chips was created to assist in reducing the effect of Solderballing when using No-Clean solder pastes, when too much paste is applied and too much solder is trapped beneath the part.
T(max) is the part thickness tolerance
Aperture Modifications (examples)

Shapes
XA XA XA
Size
YA
YP
YA
YP
YA
YP
XP
Exceptions
Poor Gasketing: Stencil Design

The speed at which squeeze out accumulates is dependent on the width of aperture relative to the pad
Apertures reduced relative to the pad width will minimize squeeze out and prevent bridging.
Reduced
Not Reduced
Gasketing (Sealing)
The contact of the PWB and stencil form a gasket or seal between the stencil aperture and the printed circuit board component pad. If the gasket is broken, solder shorts will occur.
Stencil Board Solder Mask Gasket Pads
Pad & Aperture Size Recommendations
English Units
Pitch .025 .020 .016 .012 Pad Width .015 .012 .010 .008 Aperture .012 .009-.010 .007-.008 .005-.006 Stencil thick .006 .005-.006 .005 .004-.005 A.R. 2.0 1.7 1.4 1.2
Pad & Aperture Size Recommendations
Metric Units
Pitch .64 mm .51 mm .41 mm .30 mm Pad Width .38 mm .30 mm .25 mm .20 mm Aperture .30 mm .23-.25 mm .18-.20 mm .127-.15 mm Stencil thick .15 mm .127-.15 mm .127 mm .1-.127 mm A.R. 2.0 1.7 1.4 1.2
Stencils Passive Devices

Common Resistor Sizes, Land Patterns, and Stencil Openings (from IPC-SM-782) specifications)
Board / Mask Problems

Paste Bleed out
Solder Mask over Pads
Silkscreen, and labels can prop up the stencil and prevents good gasketing which causes bleed out.
Board Legends
Labels or legends can also cause gasket problems
Legend, Trace and Silkscreen is too high
Component Reference ID (ink)
Cookson Stencil Design Principles

1. Keep aperture shape the same as pad shape, unless otherwise required (by volume or process requirements)
Maximized board to stencil alignment repeatability
2. Apply absolute aperture reduction relative to pad

Maximized board to stencil alignment repeatability (2x -1 mil around)
3. Center aperture on pad

Maximized board to stencil alignment repeatability
4. When maximizing volume, use squares over circles

Maximizes volume (4/ greater volume then circles) while minimizing pitch issues
5. Area Ratio is main factor for paste release (see FIG 1)

Highest Area Ratios ( 0.66) provide Lowest Standard Deviation on Transfer Efficiency

6. Medium taper gives best transfer efficiency (smallest standard deviation)
Taper of 0.8 0.2 mil provide Highest Transfer Efficiency with the Lowest Standard Deviation.
7. Aperture Design Modifications are independent from stencil manufacturing technique

Recommend thinner foil thickness (-5%) for ALPHA FORM stencils due to increased Transfer Efficiencies.
8. Component Technology 20 mil pitch and or Stencil Thickness 4 mil use ALPHA FORM Electroforming Technology
Highest volume deposits with lowest standard deviations measured under these circumstances with POS
9. Use Custom Shapes for discrete components

A 66% home plate design to increase process window by improving component alignment & outgassing, reduce squeeze balls & tombstoning effects.

10.Area Array type of packages require Square Apertures
Maximizes volume (4/ greater volume then circles) while minimizing pitch issues Different rules apply for fine feature BGAs
11.Solder Spreading Characteristics require different aperture design modifications

No aperture reductions for Lead Free Alloys and Water Soluble Pastes: they dont spread to the edges of the pads and will leave exposed pad finish
12.Stencil Thickness & Use of Steps will be determined by the smallest aperture and the largest aperture
Using the stencil thickness look-up tables based on pad sizes and Aspect Ratio (1:1.5)
13.Large apertures require support bars to prevent scooping, squeegee damage and voids.
Apertures 150 mil in X and/or Y require support bar 20 mil in X and/or Y.

14. Stepped areas required offset angle to prevent squeegee damage
Steps should be rotated using a -5angle Consistent tension provides improved positional accuracy and reduced variation Stencil storage space reduction 45Is neutral, however, altering 0or 90apertures would be below manufacturing tolerances and is therefore not significant
15. Frame less stencils should be considered
16. Aperture Orientation is a factor in stencil design 17. Squeegees and enclosed print heads is not a factor in stencil design
No data (yet) to design specific design rules No data (yet) to design specific design rules
18. Reversed Taper only for experimental use
Common Stencil Types
Stencil aperture (0.007 X 0.0875) at 10X
Electroplated
Laser cut
Chemical etched
Stencil aperture definition will impact paste deposition volume and defect rate
Conventional Stencil Technology

Manufacturing Processes
Chemically etched
Concerns
Isotropic etching produces Tapered sidewalls limiting pitch
Magnified image
Laser Cut
Sequential process Laser-metal Interaction hence rough aperture sidewalls Aperture size and shape varies
Electroformed
Stencil Release Performance
Laser Cut Paste D 20 mil Aperture
ElectroFormed Paste D 20 mil Aperture
Evaluating Printed Circuit Board Designs
Classification of Electronic Assemblies

ANSI/J-STD-001 classifies three levels of electronic assemblies based on end-item use. The 3 classifications were established to reflect differences in producibility, complexity, functional performance requirements and verification frequency. They are as follows: Class 1- General Electronic Products:
Consumer products, computer and computer peripherals, and hardware suitable for applications where the major requirement is a function of the completed assembly
(Source: Printed Circuits Handbook, pp 36.3, Coombs, ISBN: 0-07-012754-9)
Classification of Electronic Assemblies

Class 2- Dedicated Service Electronic Products: Includes communication equipment, sophisticated business machines, and instruments where high performance and extended life are required, and for which uninterrupted service is desired but not critical Class3- High Performance Electronic Products: Includes equipment for commercial and military products where continued performance or performance on demand is critical
Standard Multi-Layer Interconnection

3. DH Dp + 4 mils, Max DH 2.5Dp
PGA
4. Max Pad D < 3 DH
BGA Blind Via PTH Line PTH Land
Buried Line
1. 0.25-0.5 mm clearance pin to hole
Buried Via SMT Pad
PTH Used as Interconnect
Passive Discrete
General Requirements
PCB Should have good rigidity, minimal routing. PCB should have minimal warpage. Fiducials located on Breakaways of panelized boards may decrease accuracy. If aperture is not reduced, bridging and need for wiping will be increased.
Printed Circuit Board Size

Maximum printed circuit board size (length, width, and thickness) determined by the particular process equipment being used. Minimum printed circuit board size (length, width, and thickness) determined by the particular process equipment being used. Boards smaller than the minimum size may be panelized (two or more individual circuits per panel).
Printed Circuit Board Size

One factor that must be considered is the printed circuit board fabrication vendors material usage from a single process sheet. Significant savings can be obtained by increasing the number of boards that can be fabricated from a single process sheet. It is important to understand the printed circuit board suppliers guidelines and preferences and adhere to them in designing the board. This is an excellent example of early supplier involvement.
Printed Circuit Board Shape

Rectangular shaped boards with no cut outs or breakaways are always preferred. When breakaways are necessary, there are two common options;
The Route and Tab Method The V Groove Method
Component Spacing
There is no limit on maximum interpackage spacing Land to land spacing between adjacent components should be 1.25 mm clear space all around the edges of the printed board if boards are tested off the connector or 2.5 mm minimum if vacuum seal for testing is used.
Source: IPC-SM-782A, Section 3.6.1.1, pp 20
Component Spacing
Source: IPC-SM-782A, page 21
Lead Protrusions
For single sided PCB Assembly, lead or wire protrusion must be a minimum of 0.5 mm for all classes For double-sided and multilayer PCB Assembly, in all classes, the minimum lead protrusion is that the lead end be visible in the solder The maximum lead protrusion for Class 1 is that there should be no danger of shorts
Lead Protrusions
For Class 2, the maximum lead protrusion is 2.5 mm and for Class 3 the maximum lead protrusion is 1.5 mm For boards thicker than 2.3 mm, the lead protrusions may not be visible
Source: Printed Circuits Handbook, pp 36.27
Edge Clearance Example

No SMT components should be placed within 0.150 (3.81 mm) from the edges of a board. No traces or planes should be routed within 0.050 (1.27 mm) from the edge of a board. No via holes should be placed within 0.100 (2.54 mm) from the edge of a board. No test points (pads or via holes) should be placed within 0.125 (3.18 mm) from the edge of a board.
Component Hole Size

Suppliers will have recommended hole sizes for specific components If a hole size is not recommended; use a hole that is .015 (.38 mm) larger than maximum lead diameter (round lead) or lead diagonal (square or rectangular lead). If the component is being automatically inserted, use the hole size recommended by the insertion equipment supplier.
Tooling Holes
Required for location and fixturing of the boards during the fabrication, assembly and test processes. Requirements must be specified on a board outline drawing. Specific quantity, size, location, clearance, etc. will be determined by the Manufacturing/Process Engineer and specified in the printed circuit board design guidelines
Tooling Holes Requirement Example

Quantity 4 Size (diameter) 0.159 +0.002 / - 0.001 Location 4 corners Plating Non plated Clearance (diameter) 0.25 from edge of hole lower left corner hole
Datum
Fiducial Marks
Used by all automatic process equipment to precisely locate each printed circuit board. Two types of fiducial marks are used;
Board Level Component Level
Board level are used on every board to adjust the location of the stencil in the printer and to modify programs in the other process equipment. Component level are used on boards with complex components for very precise alignment. Exact shape and location determined by process
Board Level Fiducial Marks Example

Quantity: Location: Size: Clearance: 3 (minimum) Corners of the board .040 (1 mm) diameter pad .120 (3 mm) diameter (no soldermask, traces, via holes, and legend/silk-screening) .250 (6.35 mm) minimum
Edge Distance:
Board Level Fiducial Marks

A test board displaying a variety of fiducial mark geometries that can be used for stencil to board alignment
Courtesy or Speedline Technologies
Component Level Fiducial Marks Example Component

BGA .025 (.65 mm) pitch or greater .020 (.5 mm) pitch less than 120 pins .020 (.5 mm) pitch more than 120 pins Less than .020 (.5 mm) pitch
Local Fiducial Required

No No No Yes Yes
Component Selection
Always use existing components if possible
Reduce component variety Reduce component cost Reduce material storage and handling Reduce feeder requirements Minimize required feeder carriage space Purchase larger component reels
Component Selection
Maximize use of SMT components (ABC Costing) Minimize use of manually inserted components Consider through hole connectors if the Pin in Paste Process is used Use quality and cycle time data to influence component selection on new products Understand the impact on the process of new components prior to approving for design
Activity Based Costing

Calculates the total cost of the assembly operation
Equipment People Overhead (lights, heat, etc.)
Calculates number of components to be inserted Divides the total cost by the total components to determine the cost to assemble a component Automatically inserted components will have a much lower cost than manually inserted components Cost of assembly + material = product cost Some operations consider the cost of test
Slow Secondary Operations

Avoid components that require slow secondary operations that are longer than the cycle time of the SMT manufacturing process and/or cannot be done in the in line process.
Undefill Incapsulant Hand soldering Wire bonding
Flip Chip, Chip on Board (COB), some Chip Scale Packages (CSP), TAB
Passive Use Growth

A billion hours ago the stone age was the future A billion minutes ago Caesar ruled Rome A billion passives ago was this morning! Every year enough are produced to give each man, woman and child on the planet 160 passives
Size of 01005 Component

01005 Package Size = 10 mil (.010) X 5 mil (.005)
Or 0.25 mm X 0.125 mm Their width (5 mils) is only slightly larger than the thickness of a human hair and their length about the thickness of a sheet of resume paper!
Imperial/Metric Component Sizes
0603 0402
0201
01005
Chip Component Size & Spacing Comparisons
Houston et al; Implementation of 01005s: a Case Study; SMTAI-08
Chip Size and Spacing Options
Chen, et al.; ASSEMBLY PROCESS RESEARCH ON 01005 CHIP COMPONENTS IN LEAD-FREE SYSTEM; SMTAI-06
Flip Chip
Chip on Board (COB)
FC = SMT Process
Print Underfill or Dip Apply Underfill Print Solder Paste for SMT Assembly
BGA
Chip
BGA
Chip
Bare Chip Placement piercing underfill to form partial fillets
Simultaneous Solder Interconnect Reflow and Underfill Cure
Component Placement
The Printed Circuit Design Guidelines must specify the requirements for the placement of all components used (refer to PCB Design Guidelines for exact values).
Board side Soldering process to be used Spacing between components for reflow soldering Spacing between components for wave soldering Spacing between components and test points Direction of travel through wave solder process Size and location of solder thief pads for wave soldering
Component Footprints and Pads

A library of component foot prints and pads is usually specified in the Printed Circuit Board Design Guidelines and maintained in the CAD System used to design the boards. There is an IPC Printed Circuit Board Design Specification (IPC781) that details component footprints and pad sizes. Reduce aperture size by 20% to your pad size, maintain a minimum of 1.5 aspect ratio of aperture width to stencil thickness. (.025/.64 mm pitch and below).
Wave Soldering Printed Circuit Board Design
Portions
Board Design Considerations for Wave Soldering

Preferred
Not Preferred

The ratio of the size of a printed board hole to the diameter of a through-hole lead The distance of solder joints from the edge of a printed board The distance from a component body to the edge of a printed board
Source: IPC-AJ-820, Section 8.3.7, pp 8-15

The rigidity of the base material at the elevated soldering temperature The degree of retention that is used to prevent component movement during soldering The degree to which solder resist marks and legend marking are used with respect to not having them bleed onto surfaces that are to be soldered

The thermal loading of the printed board The relieving of large metal planes, such as ground planes, in order to minimize heat sinking effects. The configuration of lands
Lead Configuration for Through-Hole Assembly 1. Generally 0.25 to 0.5 mm clearance between Lead to Hole is used (Source: IPC-AJ-820, Section 2) 2. The hole size should be no less than lead diameter plus 4 mils and the maximum hole diameter should be no more than 2.5 times the lead diameter (Source:
Printed Circuits Handbook, pp 28.3, Coombs, ISBN: 0-07-012754-9)
3. The pad area around the solder joint is usually circular and should be no more than 3 times the diameter of the hole in the board (Source: Printed Circuits Handbook,
pp 28.3,Coombs, ISBN: 0-07-012754-9)
Pad Dia = 3 x pin dia is common (Source: Soldering Handbook for

Printed Circuits and Surface Mounting, Manko, H., ISBN:013-823055-2)
4. The lead if clinched should not extend beyond the edge of the land (Source: IPC-AJ-820, Section 2)
Lead to Hole Clearance
Lead to Hole Clearance
Plated-Through Hole/Component Hole Lands

The size and shape of all through hole lands and their annular rings should be maximized wherever feasible Worst Case land to Hole relationship is given below Land Size, minimum: Lmin = a + 2b + c, where,
a = Maximum diameter of the finished hole b = Minimum annular ring requirements c = A standard fabrication allowance
Source IPC-D-330, Section 6, pp 45
Lmin a Land or Pad Diameter = 3 x pin diameter, but at least 0.025 inches Edge Clearance >0.125 inches b
Pin or Lead
Hole (Shown with Solder)
Lead Height to Pad Ratio
Pad LH/Pad Diameter = 1.1 to 1.2
LH
Plated-Through Hole/Component Hole Lands Sound joints are obtained with a ratio of 1:1 to 1:2 between lead height and pad width Clearance of 0.125 in along the long edges of the board
(Source: Soldering Handbook for Printed Circuits and Surface Mounting, Manko, H., ISBN:013-823055-2)
Passive Dimensions
H W
Solder Fillet Pad PWB
Basic SMT Land Pattern Criteria

Following is a common land size design guideline for both Reflow and Wave soldered assemblies for resistors Land Width (X) = Wmax - K Land Length (Y) = Hmax + K Gap (A) = Lmax - 2T - K where: W = Component Width L= Component Length H= Component Height T= Solderable termination width K= 0.25 mm (Source: IPC-D-330, Section 11, pp 51)
L T
K/2
X
K/2
W A
K/2
SMT Land Pattern Criteria
Component & Land Dimensions for a DIP
Source: IPC-SM-782, Section 13.1,

DIP Component Dimensions
Component Identifier DIP 8 DIP 14 DIP 16 DIP 18 DIP 20 DIP 22L DIP 24 DIP 24L L (mm) min max
7.62 7.62 7.62 7.62 7.62 9.91 7.62 9.91 8.25 8.25 8.25 8.25 8.25 10.79 8.25 10.79
S (mm) min max

6.86 6.86 6.86 6.86 6.86 9.15 6.86 9.15 7.54 7.54 7.54 7.54 7.54 10.07 7.54 10.07
W (mm) min max

0.36 0.36 0.36 0.36 0.36 0.36 0.36 0.36 0.56 0.56 0.56 0.56 0.56 0.56 0.56 0.56
T (mm) min max

0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.38 0.38 0.38 0.38 0.38 0.38 0.38 0.38
A (mm) min max

6.1 6.1 6.1 6.1 6.1 8.39 6.1 8.39 7.11 7.11 7.11 7.11 7.11 9.65 7.11 9.65
H (mm) P (mm) B (mm) min max max basic

8.84 18.42 18.93 21.47 23.5 26.67 28.6 29.21 10.92 20.19 21.33 23.49 26.9 28.44 32.3 30.98 5.33 5.33 5.33 5.33 5.33 5.33 5.33 5.33 2.54 2.54 2.54 2.54 2.54 2.54 2.54 2.54
DIP Land Pattern Dimensions

Component Y (mm) C (mm) D (mm) E (mm) Placement Grid ref ref ref ref (No. of Grid Elements) RLP No. Identifier Z (mm) G (mm) X (mm) 9.8 5.4 1.2 2.2 7.6 7.62 2.54 860 DIP 8 22x24 9.8 5.4 1.2 2.2 7.6 15.24 2.54 22x42 861 DIP 14 9.8 5.4 1.2 2.2 7.6 17.78 2.54 862 DIP 16 22x44 9.8 5.4 1.2 2.2 7.6 20.32 2.54 863 DIP 18 22x48 9.8 5.4 1.2 2.2 7.6 22.86 2.54 864 DIP 20 22x56 12.4 8 1.2 2.2 10.2 25.4 2.54 26x58 865 DIP 22L 9.8 5.4 1.2 2.2 7.6 27.94 2.54 866 DIP 24 38x66 12.4 8 1.2 2.2 10.2 27.94 2.54 867 DIP 24L 26x64
Reference: IPC-SM-782, Section 13.1
Component Spacing
There is no limit on maximum interpackage spacing Land to land spacing between adjacent components should be 1.25 mm clear space all around the edges of the printed board if boards are tested off the connector or 2.5 mm minimum if vacuum seal for testing is used.
Source: IPS-SM-782A, Section 3.6.1.1, pp 20
Component Spacing
Source: IPC-SM-782A, page 21
PCB Orientation to Wave
PCB Orientation to Wave
Just strong enough to get through the wave
Glue Attachment
Component Placement Secondary Side
SMT Passive Chip Spacing for Wave Solder
Component Orientation for Wave Solder Applications
Source: IPC-SM-782A, pp 21
Wave Soldering Component Orientation

All passives should be mounted parallel to each other All SOICs shall be perpendicular to the long axis of passive components The longer axes of SOICs and of passive components should be parallel & perpendicular respectively to the direction of travel of the printed board along the conveyor of the wave soldering machine
Source: IPC-D-330, Section 11, pp 4
Solder Skips Some Reasons Why

Insufficient flux Flux not active enough Flux over thinned or old Solder wave low Solder wave not even Conveyor speed too fast Board warpage Hole to lead ratio too large Solder mask in hole
Skips: Possible Causes

Bent Fingers Bent Pallet Bent Rails Solder Pot not Level Bowed boards Overshadowing by another lead Shadowing Poor component orientation Clogged chip wave nozzle(s) Not using chip wave Rotary speed on rotary chip wave too slow
Skips from Shadowing
Component Orientation
Direction of Travel of Board Passives Mounted Parallel to each other
Solder Thief to prevent Bridging
Component Orientation
Better

Components should also be placed so that they do not shadow other components Components which block access of the wave to the component leads must have spacing distance at least twice the height of the tallest component, this allows the wave to contact any shielded solder joint.
(Reference: Printed Circuits Handbook, pp 5.36, Coombs, ISBN: 0-07-012754-9)
2x x
Solder Wave Components
Through Hole Component Mounting
Through Hole Component Mounting
Lead Protrusions
Pad Diameter Lead Height Pin Diameter
Lead Height = 1.1 or 1.2 Pad Diameter Pad Diameter = 3 x pin diameter, but at least 0.025 inches
Lead Protrusions
For single sided PCB Assembly, lead or wire protrusion must be a minimum of 0.5 mm for all classes For double-sided and multilayer PCB Assembly, in all classes, the minimum lead protrusion is that the lead end be visible in the solder The maximum lead protrusion for Class 1 is that there should be no danger of shorts
Lead Protrusions
For Class 2, the maximum lead protrusion is 2.5 mm and for Class 3 the maximum lead protrusion is 1.5 mm For boards thicker than 2.3 mm, the lead protrusions may not be visible
Source: Printed Circuits Handbook, pp 36.27
Wave Solder Pallets
Wave Solder Pallets
Software Tools Developed by Doctor Ron Lasky

Ronald C. Lasky, Ph.D., PE Instructional Professor, Thayer School of Engineering, Dartmouth College Director, Cook Engineering Design Center Director, Lean Six Sigma Lean Six Sigma Master Black Belt Instructor Senior Technologist, Indium Corporation 8000 Cummings Hall, Dartmouth College Hanover, NH 03755
LineSimulator
A tool that aids in attaining the most effective use of inventory, capital equipment, time, and manpower is LineSimulator. LineSimulator is an Excel- based software tool which aids in the design and optimization of SMT assembly lines for maximum productivity. LineSimulator enables line simulation to be performed easily, and at a low cost, as it offers most of the operations of expensive software such as Arena- and Witness-. While LineSimulator offers a low-cost alternative to expensive productivity software, many feel that its ease of use and intuitive simplicity are its biggest assets.
ProfitPro
(cost)
REAL-TIME COST ESTIMATING Real-time cost estimating simply uses the elements of cost as discussed in the introduction and calculates the cost and number of boards produced. While it is simple in concept and involves no sophisticated mathematics, the calculations are quite tedious and cumbersome as they include many production variables such as cycle time, hours per shift, shifts per day, days per week, set up time, unscheduled and scheduled downtime. Yield loss and cost of repair must be considered as well as inventory turns and interest rates. The equations have been entered into an Excel-based computer program called ProfitPro.
ReflowCoach
It is well understood that proper reflow is critical to the optimization of an SMT production line. In fact, a proper reflow procedure delivers reduced defects in component attachment, inspection, and in the ultimate solder assembly. Many people struggle with proper reflow design and profiling. ReflowCoach is designed to provide information, guidance, and profiling details. ReflowCoach is an Excel-based software tool for optimizing the reflow process. It combines your reflow furnaces capabilities with your solder materials recommended procedures to deliver an optimized reflow profile for the assembly you are making. The solder paste specifications are hardwired in.
WaveCoach
Wave Soldering is among the oldest electronics assembly procedures in practice today. Even with all our experience, we find that improvements can still be gained through the implementation of experience and technology. WaveCoach, is a tool that may help you improve your Wave Soldering quality, yields, and profitability. WaveCoach is an Excel-based software tool for optimizing the wave soldering process. It assists in the development and creation of the pre-heat profile and wave soldering machine parameters desired for each specific assembly. To implement WaveCoach, you will require: A PC with a running version of Microsoft Excel The pre-heat profile The specs for the flux you are using in your process Wave machine info (conveyor speed & wave length)
StencilCoach
Can be used to calculate stencil aperture volume requirement for the Pin in Paste process Can be used for all stencil aperture design calculations If you would like the software, please e mail me or give me your business card and I will e mail it to you
Stencil Design Software Stencil Coach Created by Doctor Ron Lasky
StencilCoach
If we did all the things we are capable of, we would literally astound ourselves -- Thomas Edison
Thank You!!!!
Joe Belmonte
joe_belmonte@ITMconsulting.org
ITM Consulting
Durham, New Hampshire USA
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Design for Manufacturability (DFM) Design for Assembly (DFA)

SMTA Guadalajara Mexico July 12, 2012

Ultimate Purpose of DFM/DFA is Customer Satisfaction!!!!!

Design for Manufacturability

Design for Manufacturability Definitions

Design for Manufacturability

Design for Manufacturability

Design for Manufacturability

Customer Satisfaction Requirements

Customer Satisfaction Requirements

Customer Satisfaction Requirements

Customer Satisfaction Requirements

Customer Satisfaction Requirements

Customer Satisfaction Requirements

Customer Satisfaction Requirements

Customer Satisfaction Requirements

Functional Responsibilities of DFM

Design for Assembly DFA

Design for Assembly DFA

Part is a candidate for elimination

Boothroyd Dewhurst DFMA Software Tools and Services

New Product Development Process

Product Development Process

The Cost of Making Changes

Instead, the cost of correcting this problem was:

Who Casts the Biggest Shadow?

Overhead 30% Material 50% Design 5%

Design for Manufacturability

Product Development Costs reductions:

Engineering Rework Reductions:

Early Supplier Involvement

Early Supplier Involvement

Early Supplier Involvement

Early Supplier Involvement

Early Supplier Involvement

Early Supplier Involvement

Early Supplier Involvement

Benefits of Early Supplier Involvement

Benefits of Early Supplier Involvement

Well Defined Development Process

Well Defined Development Process

Well Defined Development Process

Well Defined Development Process

Characteristics of Formal Phase Reviews

Define the Process

Products & Services

Defining Process Parameters

Defining Process Parameters

Output Product or Service

Methods Used to Identify Parameters

Six Sigma and Statistical Thinking

Condition 1 2 2.0 2.0 2.0 1.5

Condition 2: 2 Distribution Average Shifted 1.5s from the Nominal Specification

Condition 1: Distribution Average Centered on Normal Specification

What is Six Sigma?

Prevent Recurrence Control the Process Standardization Redesign

Measure Improvement Assess Effectiveness Review Projects

Education and Training

Key Factors for Success