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Summer15 Syllabus

This document provides information about the ECE 4752 Microelectronics Processing Laboratory course including the instructor, teaching assistant, textbook references, grading breakdown, exam and report due dates, and weekly schedule. The course consists of both a lecture and weekly lab session. Safety is the top priority in the lab. Students will complete various microelectronics fabrication processes like oxidation, photolithography, diffusion, etching, deposition and device characterization. Lab reports are due at the end of the term.

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128 views2 pages

Summer15 Syllabus

This document provides information about the ECE 4752 Microelectronics Processing Laboratory course including the instructor, teaching assistant, textbook references, grading breakdown, exam and report due dates, and weekly schedule. The course consists of both a lecture and weekly lab session. Safety is the top priority in the lab. Students will complete various microelectronics fabrication processes like oxidation, photolithography, diffusion, etching, deposition and device characterization. Lab reports are due at the end of the term.

Uploaded by

Washim Washimmachine
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Download as DOC, PDF, TXT or read online on Scribd
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ECE 4752 Microelectronics Processing Laboratory

Time:
Instructor:
Text:
Reference:

Lecture Monday & Wednesday, 10:40-11:50 AM, VL C241 Weekly laboratory session as assigned
Professor Bruno Frazier, 223 Pettit Building, Bruno.Frazier@ece.gatech.edu
G. May & S. Sze, Fundamentals of Semiconductor Fabrication, ISBN: 0-471-23279-3
R. Jaeger, Introduction to Microelectronic Fabrication, 2nd edition, ISBN: 0-201-44494-7

Laboratory Instructor:
Teaching Assistant:

Dr. Seung-Joon Paik, 114 Pettit Building, spaik8@gatech.edu


TBD, tbd@gatech.edu

Office Hours:

Frazier Monday and Wednesday, 11:30-12:30 or by appointment


TBD, MiRC

Grading:
Your grade will be based on lab and lecture attendance (5%), exam 1 (20%), final exam (design project) (20%),
homework (10%), laboratory reports with updated model (35%), laboratory notebook (10%). The content of the
laboratory notebook and laboratory reports is described in more detail per the additional handout.
The Examination will be held per the attached schedule. A grade of zero will be given for any missed exam for
which there have been no arrangements made beforehand, unless you have a written medical excuse.
The Process Design Project is due on the final exam date at 12:00 PM.
Laboratory Notebooks are due on the last day of classes before exam week.
Characterization Lab Reports are due the last day of classes before exam week.
Class Rules and Regulations:
1. In the laboratory sessions, please note: safety is of the utmost concern in this class. Although all procedures in
this laboratory are safe if done properly, improper procedures can result in severe injuries.
2. The laboratory reports and the computer modeling projects will be an individual effort (i.e., one laboratory report
from each student). If you have any questions regarding when your fellow students can help you and when they
can't, please ask the instructor.
3. Because we are on a tight schedule, and because independent work in the laboratory cannot be allowed due to
safety reasons, it is extremely important that you attend EVERY laboratory session. If either you cannot attend a
session, please notify me and Ms. Rose as soon as possible. In these cases, the laboratory instructor can be 'hired' to
process your wafers for you, at a 'cost' of a 20 exam points for the course per occurrence.

ECE4752 SUMMER 2015


MW 10:40 11:50 AM VAN LEER C241
LECTURE

READING

LAB SESSION

Week 1

Overview, Safety
Materials

Chapter 1 & 2

Safety Training

Week 2

Oxidation

Chapter 3

Safety, Wafer Clean


Oxidation

Week 3

Photolithography

Chapter 4

Photolithography
P-Well Pre-Deposition

Week 4

Diffusion
Ion Implantation

Chapter 6&7

Week 5

Wet / Dry Etching Processes

Chapter 5

Week 6

Deposition Technologies

Chapter 8

Week 7

Device Characterization

Chapter 10

Week 8

EXAM 1

Week 9

IC Packaging

Chapter 10

Sinter/Anneal

Week 10

MEMS Processes 1

Chapter 9

Device
Characterization

Week 11MEMS Processes 2

Chapter 9

Device

REPORTS DUE

Safety Materials Due

No LR Due

Field Oxidation - P Well Drive-in (between labs)


P S/D Photolith
LR 1 Oxidation Due
P S/D Pre-Dep

Field Oxidation,
P+ Drive-in
N S/D Photo

LR 2 Photolithography Due

N Pre-Dep
Gate/Contact Photo

LR 3 P Well Diffusion Due

Gate Oxidation
Contact Photolith

LR 4 P S/D Diffusion Due


(T & W Reports Due Th)

Metallization
Metal Photolith

LR 5 N S/D Diffusion Due

LR 6 Contacts /
Metallization Due

LR 7 Characterizaton Due
Characterization

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