Figure 1 - Terminal Connections
Figure 1 - Terminal Connections
Devices, Inc.s QML certified line per MIL-PRF-38535 Level V except as modified herein.
The manufacturing flow described in the STANDARD SPACE LEVEL PRODUCTS PROGRAM brochure is to
be considered a part of this specification. This brochure may be found at: http://www.analog.com/aeroinfo.
This data sheet specifically details the space grade version of this product. A more detailed operational
description and a complete data sheet for commercial product grades can be found at
http://www.analog.com/ADG201.
Description
ADG201-803Q
.
Letter
Q
Descriptive designator
GDIP1-T16
:
Thermal Resistance, cerdip (Q) Package
Junction-to-Case (JC) = 35C/W Max
Junction-to-Ambient (JA) = 120C/W Max
TABLE I NOTES:
1/ V+ = +15V, V- = -15V, unless otherwise specified
2/ The limiting terms "min" (minimum) and "max" (maximum) shall be considered to apply to magnitudes only. Negative current shall be defined as
conventional current flow out of a device terminal.
3/ These parameters may not be tested, but shall be guaranteed to the limits specified in table I herein.
4/ Test not required if applied as a forcing function.
5.1
5.2
5.3
6.1
Full WLA per MIL-STD-883 TM 5007 is not available for this product fabricated in a QMLQ wafer
process facility. SEM Inspection only is available per MIL-STD-883, TM2018.