LM741QML

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LM741QML Operational Amplifier

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1FEATURES DESCRIPTION
The amplifier offers many features which make
2
The LM741 is a general purpose operational amplifier
their application nearly foolproof: overload which features improved performance over industry
protection on the input and output, no latch-up standards such as the LM709. They are direct, plug-
when the common mode range is exceeded, as in replacements for the 709C, LM201, MC1439 and
748 in most applications.
well as freedom from oscillations

Connection Diagrams

Figure 1. Metal Can Package Figure 2. Dual-In-Line Package

See Package Number LMC0008C See Package Number NAB0008A

Figure 3. Ceramic Flatpak and SOIC Package

See Package Number NAD0010A & NAC0010A

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2 All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2005–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM741QML
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Schematic Diagram

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

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Absolute Maximum Ratings (1)

Supply Voltage ±22V
Power Dissipation (2) 500 mW
Differential Input Voltage ±30V
Input Voltage (3) ±15V
Output Short Circuit Duration Continuous
Operating Temperature Range −55°C ≤ TA ≤ +125°C
Storage Temperature Range −65°C ≤ TA ≤ +150°C
Junction Temperature (TJ) 150°C
Lead Temperature (Soldering, 10 Seconds) 300°C
Thermal Resistance θJA Metal Can (Still Air) 167°C/W
Metal Can (500LF / Min Air Flow) 100°C/W
CERDIP (Still Air) TBD
CERDIP (500LF / Min Air Flow) TBD
CERPACK (Still Air) 228°C/W
CERPACK (500LF / Min Air Flow) 154°C/W
Ceramic SOIC (Still Air) 228°C/W
Ceramic SOIC (500LF / Min Air Flow) 154°C/W
θJC Metal Can 44°C/W
CERDIP TBD
CERPACK 27°C/W
Ceramic SOIC 27°C/W
Package Weight (typical) Metal Can 1000mg
CERDIP 1100mg
CERPACK 260mg
Ceramic SOIC 225mg
ESD Tolerance (4) 400V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower.
(3) For supply voltages less than ±15V, the absolute maximum input voltage is equal to the supply voltage.
(4) Human body model, 1.5 kΩ in series with 100 pF.

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Quality Conformance Inspection

Mil-Std-883, Method 5005 - Group A
Subgroup Description Temp °C
1 Static tests at 25
2 Static tests at 125
3 Static tests at -55
4 Dynamic tests at 25
5 Dynamic tests at 125
6 Dynamic tests at -55
7 Functional tests at 25
8A Functional tests at 125
8B Functional tests at -55
9 Switching tests at 25
10 Switching tests at 125
11 Switching tests at -55
12 Settling time at 25
13 Settling time at 125
14 Settling time at -55

Electrical Characteristics DC Parameters

The following conditions apply to all the following parameters, unless otherwise specified.
DC: VCC = ±15V, VCM = 0V
Sub-
Symbol Parameter Conditions Notes Min Max Unit
group
VIO Input Offset Voltage VCM = -12V -5.0 5.0 mV 1
-6.0 6.0 mV 2, 3
VCM = 12V -5.0 5.0 mV 1
-6.0 6.0 mV 2, 3
-5.0 5.0 mV 1
-6.0 6.0 mV 2, 3
+VCC = ± 5V -5.0 5.0 mV 1
-6.0 6.0 mV 2, 3
-VIO Adj Offset Null -6.0 mV 1, 2, 3
+VIO Adj Offset Null 6.0 mV 1, 2, 3
IIO Input Offset Current VCM = -12V -200 200 nA 1
-500 500 nA 2, 3
VCM = 12V -200 200 nA 1
-500 500 nA 2, 3
-200 200 nA 1
-500 500 nA 2, 3
VCC = ± 5V -200 200 nA 1
-500 500 nA 2, 3
±IIB Input Bias Current VCM = -12V 0.0 500 nA 1
0.0 1500 nA 2, 3
VCM = 12V 0.0 500 nA 1
0.0 1500 nA 2, 3
0.0 500 nA 1
0.0 1500 nA 2, 3
VCC = ± 5V 0.0 500 mA 1
0.0 1500 nA 2, 3

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Electrical Characteristics DC Parameters (continued)

The following conditions apply to all the following parameters, unless otherwise specified.
DC: VCC = ±15V, VCM = 0V
Sub-
Symbol Parameter Conditions Notes Min Max Unit
group
ICC Power Supply Current 2.8 mA 1
2.5 mA 2
3.5 mA 3
+AVS Open Loop Voltage Gain RL = 2KΩ, VO = 0 to 10V See (1) 50 V/mV 1
(1)
See 25 V/mV 2, 3
−AVS Open Loop Voltage Gain RL = 2KΩ, VO = 0 to −10V See (1) 50 V/mV 1
See (1) 25 V/mV 2, 3
+PSRR Power Supply Rejection Ratio +VCC = 15V to 5V, -VCC = -15V 77 dB 1, 2, 3
-PSRR Power Supply Rejection Ratio -VCC = -15V to -5V, 77 dB 1, 2, 3
+VCC = +15V
CMRR Common Mode Rejection Ratio -12V ≤ VCM ≤ 12V 70 dB 1, 2, 3
+IOS Output Short Circuit Current -45 -5.0 mA 1,2
-50 -5.0 mA 3
-IOS Output Short Circuit Current 5.0 45 mA 1,2
5.0 50 mA 3
+VOpp Output Voltage Swing RL = 10KΩ 12 V 1, 2, 3
RL = 2KΩ 10 V 1, 2, 3
VCC = ± 20V, RL = 10KΩ 16 V 1, 2, 3
VCC = ± 20V, RL = 2KΩ 15 V 1, 2, 3
-VOpp Output Voltage Swing RL = 10KΩ -12 V 1, 2, 3
RL = 2KΩ -10 V 1, 2, 3
VCC = ± 20V, RL = 10KΩ -16 V 1, 2, 3
VCC = ± 20V, RL = 2KΩ -15 V 1, 2, 3
RI Input Resistance See (2) 0.3 MΩ 1
(3)
VI Input Voltage Range VCC = ± 15V See ±12 V 1, 2, 3
VO Output Voltage Swing VCC = ± 5V See (2) ±2.0 V 1, 2, 3

(1) Datalog reading in K = V/mV

(2) Specified parameter, not tested.
(3) Ensured by CMRR, IIB, IIO, VIO

Electrical Characteristics AC Parameters

The following conditions apply to all the following parameters, unless otherwise specified.
AC: VCC = ±15V, VCM = 0V
Sub-
Symbol Parameter Conditions Notes Min Max Unit
group
+SR Slew Rate VI = -5V to 5V, AV = 1, RL = 2KΩ 0.2 V/µS 7
-SR Slew Rate VI = 5V to -5V, AV =1, RL = 2KΩ 0.2 V/µS 7
tR Rise Time RL = 2KΩ, AV = 1, CL = 100pF 1.0 µS 7
OS Overshoot RL = 2KΩ, AV = 1, CL = 100pF 30 % 7
GBW Gain Bandwidth VI = 50mVRMS, ƒ = 20KHz, RL = 250 KHz -
2KΩ

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Typical Application

Figure 4. Offset Nulling Circuit

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REVISION HISTORY
Date Revision Section Originator Changes
Released
08/22/05 A New Release to the corporate format L. Lytle 1 MDS datasheet converted into one corporate
datasheet format. Since drift is not performed
on 883 product, the table was removed.
MNLM741-X Rev 1A0 will be archived.
03/26/13 A All - Changed layout of National Data Sheet to TI
format.

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 PACKAGE OPTION ADDENDUM

www.ti.com 17-Jun-2023

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)

LM741 MD8 ACTIVE DIESALE Y 0 400 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 125 Samples

LM741H/883 ACTIVE TO-99 LMC 8 20 RoHS & Green Call TI Level-1-NA-UNLIM -55 to 125 LM741H/883 Q ACO Samples
LM741H/883 Q >T
LM741J/883 ACTIVE CDIP NAB 8 40 Non-RoHS Call TI Level-1-NA-UNLIM -55 to 125 LM741J Samples
& Green /883 Q ACO
/883 Q >T

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

Addendum-Page 1
 PACKAGE OPTION ADDENDUM

www.ti.com 17-Jun-2023

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2
 PACKAGE MATERIALS INFORMATION

www.ti.com 9-Aug-2022

TUBE

T - Tube
height L - Tube length

W - Tube
width

B - Alignment groove width

*All dimensions are nominal

Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
LM741J/883 NAB CDIP 8 40 506.98 15.24 13440 NA

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 9-Aug-2022

TRAY

L - Outer tray length without tabs KO -

Outer
tray
height

W-
Outer
tray
width
Text

P1 - Tray unit pocket pitch

CW - Measurement for tray edge (Y direction) to corner pocket center
CL - Measurement for tray edge (X direction) to corner pocket center

Chamfer on Tray corner indicates Pin 1 orientation of packed units.

*All dimensions are nominal

Device Package Package Pins SPQ Unit array Max L (mm) W K0 P1 CL CW
Name Type matrix temperature (mm) (µm) (mm) (mm) (mm)
(°C)
LM741H/883 LMC TO-CAN 8 20 2 X 10 150 126.49 61.98 8890 11.18 12.95 18.54

Pack Materials-Page 2
 MECHANICAL DATA
NAB0008A

J08A (Rev M)

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