MCR22-6, MCR22-8

Preferred Device

Sensitive Gate
Silicon Controlled Rectifiers
Reverse Blocking Thyristors
Designed and tested for repetitive peak operation required for CD
ignition, fuel ignitors, flash circuits, motor controls and low-power http://onsemi.com
switching applications.
150 Amperes for 2 s Safe Area SCRs
High dv/dt
1.5 AMPERES RMS
Very Low Forward On Voltage at High Current
Low-Cost TO-226AA (TO-92) 400 thru 600 VOLTS
Device Marking: Device Type, e.g., MCR226, Date Code
G
MAXIMUM RATINGS (TJ = 25C unless otherwise noted)
A K
Rating Symbol Value Unit
Peak Repetitive OffState Voltage VDRM, Volts
*
(RGK = IK, TJ = 40 to +110C, VRRM
Sine Wave, 50 to 60 Hz, Gate Open)
MCR226 400
MCR228 600
On-State Current RMS IT(RMS) 1.5 Amps
(180 Conduction Angles, TC = 80C)
Peak Non-repetitive Surge Current, ITSM 15 Amps 1
TA = 25C 2
3
(1/2 Cycle, Sine Wave, 60 Hz)
Circuit Fusing Considerations (t = 8.3 ms) I2t 0.9 A2s TO92 (TO226AA)
Forward Peak Gate Power PGM 0.5 Watt CASE 029
STYLE 10
(Pulse Width 1.0 msec, TA = 25C)
Forward Average Gate Power PG(AV) 0.1 Watt PIN ASSIGNMENT
(t = 8.3 msec, TA = 25C)
1 Cathode
Forward Peak Gate Current IFGM 0.2 Amp
2 Gate
(Pulse Width 1.0 s, TA = 25C)
3 Anode
Reverse Peak Gate Voltage VRGM 5.0 Volts
(Pulse Width 1.0 s, TA = 25C)
Operating Junction Temperature Range TJ 40 to C
ORDERING INFORMATION
@ Rated VRRM and VDRM +110
See detailed ordering and shipping information in the package
Storage Temperature Range Tstg 40 to C dimensions section on page 7 of this data sheet.
+150
(1) VDRM and VRRM for all types can be applied on a continuous basis. Ratings Preferred devices are recommended choices for future use
and best overall value.
apply for zero or negative gate voltage; however, positive gate voltage
shall not be applied concurrent with negative potential on the anode.
Blocking voltages shall not be tested with a constant current source such
that the voltage ratings of the devices are exceeded.

Semiconductor Components Industries, LLC, 2000 1 Publication Order Number:

May, 2000 Rev. 3 MCR226/D
 MCR226, MCR228

THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Case RJC 50 C/W
Thermal Resistance, Junction to Ambient RJA 160 C/W
Lead Solder Temperature TL +260 C
(Lead Length q1/16 from case, 10 s Max)

ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted.)

Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Peak Repetitive Forward or Reverse Blocking Current IDRM, IRRM
(VAK = Rated VDRM or VRRM; RGK = 1000 Ohms) TC = 25C 10 A
TC = 110C 200 A
ON CHARACTERISTICS
Peak Forward OnState Voltage(1) VTM 1.2 1.7 Volts
(ITM = 1 A Peak)
Gate Trigger Current (Continuous dc)(2) TC = 25C IGT 30 200 A
(VAK = 6 Vdc, RL = 100 Ohms) TC = 40C 500
Gate Trigger Voltage (Continuous dc)(2) TC = 25C VGT 0.8 Volts
(VAK = 7 Vdc, RL = 100 Ohms) TC = 40C 1.2
Gate NonTrigger Voltage(1) VGD 0.1 Volts
(VAK = 12 Vdc, RL = 100 Ohms) TC = 110C
Holding Current IH mA
(VAK = 12 Vdc, Gate Open) TC = 25C 2.0 5.0
Initiating Current = 200 mA TC = 40C 10

DYNAMIC CHARACTERISTICS
Critical Rate of Rise of OffState Voltage dv/dt 25 V/s
(TC = 110C)
v
(1) Pulse Width = 1.0 ms, Duty Cycle 1%.
(2) RGK Current not included in measurement.

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 MCR226, MCR228

Voltage Current Characteristic of SCR

+ Current
Anode +

Symbol Parameter VTM

VDRM Peak Repetitive Off State Forward Voltage
on state
IDRM Peak Forward Blocking Current
IRRM at VRRM IH
VRRM Peak Repetitive Off State Reverse Voltage
IRRM Peak Reverse Blocking Current
VTM Peak on State Voltage + Voltage
IH Holding Current Reverse Blocking Region IDRM at VDRM
(off state) Forward Blocking Region
(off state)
Reverse Avalanche Region
Anode

CURRENT DERATING
TA , MAXIMUM ALLOWABLE AMBIENT TEMPERATURE ( C)
TC , MAXIMUM ALLOWABLE CASE TEMPERATURE ( C)

140 140
120
100 100
80
= 180 dc
60 60
= CONDUCTION dc
ANGLE 40
= 180
20 20
= CONDUCTION ANGLE
0 0
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 0.2 0.4 0.6 0.8 1.0
IT(AV), AVERAGE ON-STATE CURRENT (AMPS) IT(AV), AVERAGE ON-STATE CURRENT (AMP)

Figure 1. Maximum Case Temperature Figure 2. Maximum Ambient Temperature

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 MCR226, MCR228

5.0

3.0

2.0 TJ = 110C
25C

1.0

I T , INSTANTANEOUS ON-STATE CURRENT (AMP)

0.7

0.5

0.3

0.2

0.1

0.07

0.05

0.03

0.02

0.01
0 0.5 1.0 1.5 2.0 2.5
VT, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS)

Figure 3. Typical Forward Voltage

r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)

1.0
0.7
0.5
0.3
0.2

0.1
0.07
0.05
0.03
0.02

0.01
0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 200 500 1000 2000 5000 10000
t, TIME (ms)

Figure 4. Thermal Response

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 MCR226, MCR228

TYPICAL CHARACTERISTICS

0.8 100
VGT, GATE TRIGGER VOLTAGE (VOLTS)

VAK = 7.0 V

I GT GATE TRIGGER CURRENT ( A)

50
0.7 RL = 100
30
20
0.6
10
0.5
5.0

0.4 3.0
2.0

0.3 1.0
75 50 25 0 25 50 75 100 110 40 20 0 20 40 60 80 100 110
TJ, JUNCTION TEMPERATURE (C) TJ JUNCTION TEMPERATURE (C)
Figure 5. Typical Gate Trigger Voltage Figure 6. Typical Gate Trigger Current

P(AV) MAXIMUM AVERAGE POWER DISSIPATION (WATTS)

10 2.0
1.8 180
120
90
I H , HOLDING CURRENT (mA)

VAK = 12 V 1.6 60
30
RL = 100 1.4
5.0 1.2
1.0
dc
0.8
2.0 0.6
0.4
0.2
1.0 0
40 20 0 20 40 60 80 100 110 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
TJ, JUNCTION TEMPERATURE (C) IT(AV), AVERAGE ON-STATE CURRENT (AMPS)

Figure 7. Typical Holding Current Figure 8. Power Dissipation

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 MCR226, MCR228

TO92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL

H2A H2A
H2B H2B

W2
H4 H5
T1
L1
H1
W1 W
L T

F1 T2
F2
P2 P2 D

P1
P

Figure 9. Device Positioning on Tape

Specification
Inches Millimeter
Symbol Item Min Max Min Max
D Tape Feedhole Diameter 0.1496 0.1653 3.8 4.2
D2 Component Lead Thickness Dimension 0.015 0.020 0.38 0.51
F1, F2 Component Lead Pitch 0.0945 0.110 2.4 2.8
H Bottom of Component to Seating Plane .059 .156 1.5 4.0
H1 Feedhole Location 0.3346 0.3741 8.5 9.5
H2A Deflection Left or Right 0 0.039 0 1.0
H2B Deflection Front or Rear 0 0.051 0 1.0
H4 Feedhole to Bottom of Component 0.7086 0.768 18 19.5
H5 Feedhole to Seating Plane 0.610 0.649 15.5 16.5
L Defective Unit Clipped Dimension 0.3346 0.433 8.5 11
L1 Lead Wire Enclosure 0.09842 2.5
P Feedhole Pitch 0.4921 0.5079 12.5 12.9
P1 Feedhole Center to Center Lead 0.2342 0.2658 5.95 6.75
P2 First Lead Spacing Dimension 0.1397 0.1556 3.55 3.95
T Adhesive Tape Thickness 0.06 0.08 0.15 0.20
T1 Overall Taped Package Thickness 0.0567 1.44
T2 Carrier Strip Thickness 0.014 0.027 0.35 0.65
W Carrier Strip Width 0.6889 0.7481 17.5 19
W1 Adhesive Tape Width 0.2165 0.2841 5.5 6.3
W2 Adhesive Tape Position .0059 0.01968 .15 0.5
NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements.
4. Maximum noncumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.

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 MCR226, MCR228

ORDERING & SHIPPING INFORMATION: MCR22 Series packaging options, Device Suffix
Europe
U.S. Equivalent Shipping Description of TO92 Tape Orientation
MCR228RL1 Radial Tape and Reel (2K/Reel) Flat side of TO92 and adhesive tape visible
MCR226,8 Bulk in Box (5K/Box) N/A, Bulk
MCR226RLRA Radial Tape and Reel (2K/Reel) Round side of TO92 and adhesive tape visible
MCR226RLRP Radial Tape and Fan Fold Box (2K/Box) Round side of TO92 and adhesive tape visible
MCR228ZL1 Radial Tape and Fan Fold Box (2K/Box) Flat side of TO92 and adhesive tape visible

PACKAGE DIMENSIONS

TO92 (TO226AA)
CASE 02911
ISSUE AJ

NOTES:
A B 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
P BEYOND DIMENSION K MINIMUM.
L
SEATING INCHES MILLIMETERS
PLANE K DIM MIN MAX MIN MAX
A 0.175 0.205 4.45 5.20
B 0.170 0.210 4.32 5.33
C 0.125 0.165 3.18 4.19
D 0.016 0.021 0.407 0.533
X X D G 0.045 0.055 1.15 1.39
G H 0.095 0.105 2.42 2.66
J 0.015 0.020 0.39 0.50
H J K 0.500 12.70
L 0.250 6.35
V C N 0.080 0.105 2.04 2.66
P 0.100 2.54
SECTION XX R 0.115 2.93
1 N V 0.135 3.43
N STYLE 10:
PIN 1. CATHODE
2. GATE
3. ANODE

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 MCR226, MCR228

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without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
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8