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REL22

The document describes REL22, a lead-free solder alloy developed by AIM for use in harsh environments. It has enhanced durability and reliability equal to tin-silver-bismuth alloys. REL22 has improved thermal cycling performance, creep rates lower than SAC alloys, and better wetting compared to other lead-free alloys. It is comprised of tin, bismuth, silver, copper, antimony, nickel and grain refiners.

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93 views

REL22

The document describes REL22, a lead-free solder alloy developed by AIM for use in harsh environments. It has enhanced durability and reliability equal to tin-silver-bismuth alloys. REL22 has improved thermal cycling performance, creep rates lower than SAC alloys, and better wetting compared to other lead-free alloys. It is comprised of tin, bismuth, silver, copper, antimony, nickel and grain refiners.

Uploaded by

azb00178
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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REL22 HIGH-RELIABILITY LEAD-FREE SOLDER ALLOY

FEATURES
Enhanced Durability for Use in Extremely Harsh Environments
Reliability Equal to Sn/Ag/Bi/Sb/Ni/Cu Alloys with Wider Assembly Process Window
Mitigates Tin Whisker Formation
Creep Rates Lower Than SAC Alloys
High Reliability / High Strength
Improved Thermal Cycling Performance
Improved Wetting Versus All Low/No-Silver Alloys
For use in Lead-Free Process Only

DESCRIPTION
AIM’s REL22TM alloy is comprised of tin, bismuth, silver, copper, antimony, nickel and trace amounts of elemental grain structure
refiners. The alloy provides significantly improved durability for use in applications where thermal shock, vibration and high g-forces
are a concern. REL22 is the solution when SAC alloys are incapable of surviving in harsh environments, such as automotive,
aerospace and geographical exploration equipment.

AVAILABILITY
REL22 is available in bar (1.1 kg / 2.5 lb), solid feeder wire (diameters of 3.175 mm /.125”), and no clean solder paste (M8 T4 500 gr
jar). Other product options are available upon special request.

PHYSICAL PROPERTIES
Results
Parameter
REL22 SAC305
Melting Properties 210-212°C with a range of 2 degree 217-220°C with a range of 20 degrees
undercooling undercooling
Wetting Time 0.8/sec 0.9/sec
Wetting Force 4.4/mN 4.4/mN
Hardness 29/HV10 14/HV10
Tensile Strength (aged 150°C 86 MPa 34 MPa
for 24 hours)
Microstructure Analysis (aged)

150° for 24 hours

Document Rev #NF9


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HANDLING & STORAGE
Solid wire and bar solder products have an indefinite shelf life when proper storage conditions are observed. See solder paste TDS for
shelf life information. Consult the SDS for specific handling procedures.

SAFETY
Use with adequate ventilation and proper personal protective equipment. Refer to the accompanying Safety Data Sheet for any
specific emergency information. Do not dispose of any hazardous materials in non-approved containers.

CLEANING
Refer to data sheets provided by the flux manufacturer.

Document Rev #NF9


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