MCP 9600
MCP 9600
MCP 9600
5x5 MQFN*
20 19 18 17 16
VDD
PIC® MCU GND 1 15 Alert 4
I2C VIN+ TC+
VIN+ 2 14 Alert 3
MCP9600 EP
TC- GND 3 21 13 GND
4
Alert VIN- VIN- 4 12 Alert 2
ADDR GND GND 5 11 Alert 1
Types K, J, T, 6 7 8 9 10
N, E, B, S, R
GND
GND
GND
GND
VDD
† Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, TA = -40°C to +125°C
(where: TA = TC, defined as Device Ambient Temperature).
Parameters Sym. Min. Typ. Max. Unit Conditions
Thermocouple Sensor Measurement Accuracy
TH Hot-Junction Accuracy (VDD = 3.3V) TH_ACY -1.5 ±0.5 +1.5 °C TA = 0°C to +85°C,
TH = TC + T∆ -3.0 ±1 +3.0 °C TA = -40°C to +125°C
TC Cold-Junction Accuracy (VDD = 3.3V) TC_ACY -1.0 ±0.5 +1.0 °C TA = 0°C to +85°C
-2.0 ±1 +2.0 °C TA = -40°C to +125°C
T∆ Junctions Temperature Delta Accuracy
Type K: T∆ = -200°C to +1372°C T∆_ACY -0.5 ±0.25 +0.5 °C TA = 0°C to +85°C,
VEMF range: -5.907 mV to 54.886 mV VDD = 3.3V (Note 1)
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground.
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Specified Temperature Range TA -40 — +125 °C Note 1
Operating Temperature Range TA -40 — +125 °C
Storage Temperature Range TA -65 — +150 °C
Thermal Package Resistances
Thermal Resistance, MQFN JA — 38.8 — °C/W
Note 1: Operation in this range must not cause TJ to exceed the Maximum Junction Temperature (+150°C).
T
R
P
TA
TA
EE
TO
H
C
-S
-S
R
-S
W
ET
U
AC
IG
-F
D
U
O
tS
tH
TR
tB
tH
tS
tL
tS
L
SC
A
SD
F
,t
tR
A
AT
-D
I
U
-D
tS
D
tH
Note: Unless otherwise indicated, VDD = 2.7V to 5.5V, GND = Ground, SDA/SCL pulled-up to VDD and
TA = -40°C to +125°C.
0.50 0.500
Type K Type K
Sensitivity (Δ°C/LSb)
0.25
Tǻ_ACY (°C)
0.00 0.250
-0.25
-0.50 0.000
-200 300 800 1300 1800 -200 300 800 1300 1800
Tǻ Temperature, ITS-90 Database (°C) Tǻ Temperature, ITS-90 Database (°C)
0.50 0.500
Type J Type J
Sensitivity (Δ°C/LSb)
0.25
Tǻ_ACY (°C)
0.00 0.250
-0.25
-0.50 0.000
-200 300 800 1300 1800 -200 300 800 1300 1800
Tǻ Temperature, ITS-90 Database (°C) Tǻ Temperature, ITS-90 Database (°C)
FIGURE 2-2: Typical Temperature FIGURE 2-5: Temperature Sensitivity with
Accuracy from NIST ITS-90 Database, Type J. 18-bit Resolution, Type J.
0.50 0.500
Type N Type N
Sensitivity (Δ°C/LSb)
0.25
Tǻ_ACY (°C)
0.00 0.250
-0.25
-0.50 0.000
-200 300 800 1300 1800 -200 300 800 1300 1800
Tǻ Temperature, ITS-90 Database (°C) Tǻ Temperature, ITS-90 Database (°C)
FIGURE 2-3: Typical Temperature FIGURE 2-6: Temperature Sensitivity with
Accuracy from NIST ITS-90 Database, Type N. 18-bit Resolution, Type N.
0.50 0.500
Type S
Sensitivity (Δ°C/LSb)
0.25 Specified Range
Specified Range
Tǻ_ACY (°C)
0.00 0.250
-0.25
Type S
-0.50 0.000
-200 300 800 1300 1800 -200 300 800 1300 1800
Tǻ Temperature, ITS-90 Database (°C) Tǻ Temperature, ITS-90 Database (°C)
0.50 0.500
Type R
Sensitivity (Δ°C/LSb)
0.25 Specified Range
Specified Range
Tǻ_ACY (°C)
0.00 0.250
-0.25
Type R
-0.50 0.000
-200 300 800 1300 1800 -200 300 800 1300 1800
Tǻ Temperature, ITS-90 Database (°C) Tǻ Temperature, ITS-90 Database (°C)
0.50 0.500
Type E Type E
Sensitivity (Δ°C/LSb)
0.25
Tǻ_ACY (°C)
0.00 0.250
-0.25
-0.50 0.000
-200 300 800 1300 1800 -200 300 800 1300 1800
Tǻ Temperature, ITS-90 Database (°C) Tǻ Temperature, ITS-90 Database (°C)
0.50 0.500
Type T Type T
Sensitivity (Δ°C/LSb)
0.25
Tǻ_ACY (°C)
0.00 0.250
-0.25
-0.50 0.000
-200 300 800 1300 1800 -200 300 800 1300 1800
Tǻ Temperature, ITS-90 Database (°C) Tǻ Temperature, ITS-90 Database (°C)
0.50 0.500
Type B Type B
Sensitivity (Δ°C/LSb)
0.25 Specified Range
Specified Range
Tǻ_ACY (°C)
0.00 0.250
-0.25
-0.50 0.000
-200 300 800 1300 1800 -200 300 800 1300 1800
Tǻ Temperature, ITS-90 Database (°C) Tǻ Temperature, ITS-90 Database (°C)
10 0.4
VDD = 3.3V
0.3
Gain Error (% of FSR)
5
Offset Error (µV)
0.2
0.1
0 0
-0.1
-5 -0.2
-0.3
-10 -0.4
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Temperature (°C) Temperature (°C)
FIGURE 2-15: Input Offset Error Voltage FIGURE 2-18: Full-Scale Gain Error.
(VIN+, VIN-).
10.0 0.005
0.004
7.5
Noise (µV, rms)
0.003
5.0
0.002
2.5
0.001
0.0 0.000
-100 -75 -50 -25 0 25 50 75 100 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input Voltage (% of Full-Scale) VDD (V)
FIGURE 2-19: Input Noise, % of Full-Scale. FIGURE 2-22: Integral Nonlinearity across
VDD.
2.0 40%
VDD = 3.3V TA = -40°C to +125°C
722 units at -40°C, +45°C, +125°C VDD = 3.3V
64 units at other temperatures 2787 units
1.0 30%
Spec Limit Occurrences
Tǻ_ACY (°C)
0.0 20%
3.3V
Average 10%
-1.0
Stdev+
+Std. Dev.
Stdev-
-Std. Dev.
0%
-2.0
0.0
0.2
0.4
0.6
0.8
1.0
-1.0
-0.8
-0.6
-0.4
-0.2
-40 -20 0 20 40 60 80 100 120
Tǻ Temperature, ITS-90 Database (°C) Temperature Accuracy (°C)
400 500
SDA, and Alert 1, 2, 3, 4 outputs T-40C
A = -40°C Alert 1, 2, 3, 4 outputs T-40C
A = -40°C
35C
TA = +35°C 35C
TA = +35°C
85C
TA = +85°C 85C
300 400 TA = +85°C
125C
TA = +125°C
125C
VDD - VOH (µA)
TA = +125°C
VOL (µA)
200 300
100 200
0 100
2.5 3.0 3.5 4.0 4.5 5.0 5.5 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V) VDD (V)
FIGURE 2-21: SDA and Alert Outputs, VOL FIGURE 2-24: Alert Outputs, VOH across
across VDD. VDD.
500 2.0
ADDR/SDA/SCL pins T-40C
A = -40°C
35C
TA = +35°C
I2C Inactive, IDD (µA)
400 85C
TA = +85°C
TA = +125°C
125C
ILEAK (µA)
300 1.0
-40C
TA = -40°C
200 35C
TA = +35°C
85C
TA = + 85°C
125C
TA = +125°C
100 0.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V) VDD (V)
FIGURE 2-25: I2C Inactive IDD across VDD. FIGURE 2-28: SDA, SCL and ADDR Input
Pins Leakage Current, ILEAK across VDD.
2500 60.0
-40C
TA = -40°C T-40C
A = -40°C
35C
TA = +35°C 35C
TA = +35°C
85C
TA = + 85°C 85C
TA = +85°C
2000
I2C Active, IDD (µA)
125C
TA = +125°C 125C
40.0 TA = +125°C
20.0
1000
500 0.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V) VDD (V)
FIGURE 2-26: I2C Active IDD across VDD. FIGURE 2-29: I2C Interface Clock Stretch
Duration, tSTRETCH across VDD.
5.0 2.0%
-40C
TA = -40°C Conditions:
35C
TA = +35°C tCALC = 12 ms (typical)
4.0 85C
TA = + 85°C VDD = 3.3V
125C 1.0% TA = Room Temperature
TA = +125°C
ΔtCALC (%)
3.0
ISHDN (µA)
0.0%
2.0 -40C
TA = -40°C
35C
TA = +35°C
-1.0% 85C
TA = + 85°C
1.0 125C
TA = +125°C
0.0 -2.0%
2.5 3.0 3.5 4.0 4.5 5.0 5.5 2.5 3.0 3.5 4.0 4.5 5.0 5.5
VDD (V) VDD (V)
3.2 Thermocouple Input (VIN+, VIN-) 3.7 Serial Data Line (SDA)
The thermocouple wires are directly connected to SDA is a bidirectional input/output pin used to serially
these inputs. The positive node is connected to the transmit data to/from the host controller. This pin
VIN+ pin while the negative node connects to the VIN- requires a pull-up resistor (see Section 4.0 “Serial
node. The thermocouple voltage is converted to degree Communication”).
Celsius.
TH MSB Data
MCP9600 Master
A A
A A A
SDA S 1 1 0 0
2 1 0 W C
K
0 0 0 0 0 0 X X C P
K
1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8
SCL
A A N
A A A
SDA S 1 1 0 0 R C 0 0 0 0 0 0 0 1 C 1 0 0 1 0 1 0 0 A P
2 1 0 K K K
Master Master
MCP9600
FIGURE 4-3: Timing Diagram to Set a Register Pointer and Read a Two Byte Data.
A A A
A A A
SDA S 1 1 0 0
2 1 0 W C
K
0 0 0 0 0 1 0 X C
K
X X X X X X X X C
K
P
A N
A A A
SDA S 1 1 0 0 R C X X X X X X X X A P
2 1 0 K K
Master
MCP9600
FIGURE 4-4: Timing Diagram to Set a Register Pointer and Read a Two Byte Data.
1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8
SCL
A A A
A A A
SDA S 1 1 0 0
2 1 0 W C
K
0 0 0 1 0 0 X X C
K
X X X X X X X X C
K
1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8
SCL
A A N
A A A
SDA S 1 1 0 0 R C X X X X X X X X C X X X X X X X X A P
2 1 0 K K K
FIGURE 4-5: Timing Diagram to Set a Register Pointer and Read a Two Byte Data.
1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8
SCL
A A
A A A
SDA S 1 1 0 0
2 1 0
R C
K
0 0 0 0 0 0 0 0 C
K
A A N
X X X X X X X X C X X X X X X X X C X X X X X X A P
K K K
Note 1: All registers can be read sequentially starting from the previously set register pointer.
FIGURE 4-6: Timing Diagram to Sequential Read all Registers Starting from TH Register.
ADC core
+ VIN+
Del Sig
Thermocouple VIN-
User Registers:
Thermocouple Hot-Junction, TH
Hysteresis
Hysteresis
Hysteresis
Hysteresis
Device ID
SCL
I2C Module
SDA
ADDR
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Temperature 0°C
TH = (UpperByte x 24 + LowerByte x 2-4)
Temperature 0°C
TH = 1024 - (UpperByte x 24 + LowerByte x 2-4)
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 SIGN:
1 = TA 0°C
0 = TA 0°C
bit 14-0 TH: Data in two’s complement format
This register contains the error corrected and cold-junction compensated Thermocouple temperature.
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 SIGN:
1 = TA 0°C
0 = TA 0°C
bit 14-0 T∆: Data in two’s complement format
This register contains Thermocouple Hot-Junction temperature data.
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 23-0 ADC Data<23:0>: Raw ADC Data, including sign bits
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7 Burst Complete, Flag bit: Burst mode Conversions Status flag. Once Burst mode is enabled, this bit
is normally set after the first Burst is complete. User can clear it and poll the bit periodically until the
next Burst of temperature conversions is complete (see Register 5-8).
1 = T∆ register Burst mode Conversions Complete
0 = Writing 0 has no effect
bit 6 TH update, Flag bit: Temperature Update flag.
1 = Temperature Conversion Complete
0 = Writing 0 has no effect
This bit is normally set. User can clear it and poll the bit until the next temperature conversion is
complete.
bit 5 Unimplemented: Read as “0”.
bit 4 Input Range, Flag bit: Over Voltage Detection bit (READ ONLY):
1 = The ADC code is beyond the selected thermocouple type
0 = The ADC code is within the measurement range of the selected thermocouple type
If this bit is set, then the ADC data is not converted to degree Celsius (Temperature data conversion
is bypassed). Both T∆ and TH hold the previous temperature data.
bit 3 Alert 4 Status (READ ONLY)
1 = TX TALERT4
0 = TX ≤TALERT4
Where: TX is either TH or TC (User selectable, see Register 5-10)
bit 2 Alert 3 Status (READ ONLY)
1 = TX TALERT3
0 = TX ≤TALERT3
Where: TX is either TH or TC (User selectable, see Register 5-10)
bit 1 Alert 2 Status (READ ONLY)
1 = TX TALERT2
0 = TX ≤TALERT2
Where: TX is either TH or TC (User selectable, see Register 5-10)
bit 0 Alert 1 Status (READ ONLY)
1 = TX TALERT1
0 = TX ≤TALERT1
Where: TX is either TH or TC (User selectable, see Register 5-10)
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
1←samples→128
FIGURE 5-7: Burst Mode Operation.
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 15 SIGN:
1 = TA 0°C
0 = TA 0°C
bit 14-2 Alert 1, 2, 3 and 4: Data in two’s complement format
bit 1-0 Unimplemented:
TH 0
Output Mode Control
TC 1 Comparator 0 0
TALERT2
TALERT3 + THYST3
TH TALERT2 - THYST2
TALERT3
TALERT3
TALERT4
TALERT4 + THYST4
TALERT4
Alert 1 Output
Comparator
(Active-Low)
Interrupt
Comparator
(Active-Low)
Interrupt
Int. Clear
Alert 2 Output
Comparator
(Active-Low)
Interrupt
Int. Clear
Alert 3 Output
Comparator
(Active-Low)
Interrupt
Int. Clear
FIGURE 5-9: Alert Limits Boundary Conditions and Output Characteristics when Set to Detect TH.
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
bit 7-0 Alert Hysteresis: Alert Hysteresis range 0x00 to 0xFF, which represents 1°C to 255°C.
is is
Alert Output es Alert Output es
ster s ter
Hy Hy
ACtive -Low
ACtive -Low
sis is
Alert Output Alert Output es
ere ter
H yst H y s
ACtive -High
ACtive -High
The Comparator mode is useful for thermostat-type Alert 1 Configuration 0000 1000
applications, such as on/off switches for fan controllers, Alert 2 Configuration 0000 1001
buzzer or LED indicators. The Alert output asserts and Alert 3 Configuration 0000 1010
deasserts when the temperature exceeds the
user-specified limit and the user-specified hysteresis Alert 4 Configuration 0000 1011
limit. The Interrupt mode is useful for interrupt driven
microcontroller based systems. The Alert Outputs are
asserted each time the temperature exceeds the user
specified Alert limit and Hysteresis limits.
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown
V CSAMPLE
ADDR (3.2 pF)
VIN+
MCP9600
4 Unit 7/8
Alert VIN- FIGURE 6-5: Thermocouple Input Stage.
GND
Types K, J, T,
N, E, B, S, R 6.3.3 OPEN AND SHORT DETECTION
CIRCUITS
TABLE 6-2: RECOMMENDED External circuits can be added to detect the
RESISTOR VALUES FOR thermocouple status as open (physically disconnected)
I2C ADDRESSING or as short (thermocouple wire in contact with the
system chassis or ground). If a passive circuit is added
Command Values
Device # to the input stage, then the circuit loading effect to the
Byte RXA (k) RXB (k) ADC input stage must be considered. The load
impedance to the input stage is recommend to be at
1 1100 0000 ADDR pin tied to GND least 10 times greater than ZIN_DF so that the device is
2 1100 0010 R2A = 10 R2B = 2.2 dominant during sampling. System calibration is also
3 1100 0100 R3A = 10 R3B = 4.3 required to ensure proper accuracy. In addition,
external loads can degrade the device performance,
4 1100 0110 R4A = 10 R4B = 7.5
such as input offset, gain, and Integral Nonlinearity
5 1100 1000 R5A = 10 R5B = 13 (INL) errors. If a low impedance active circuit is added,
6 1100 1010 R6A = 10 R6B = 22 then both offset and gain errors must be calibrated. For
7 1100 1100 R7A = 10 R7B = 43 open circuit detection, the Over Voltage bit in the status
register (Register 5-6) can also be used to detect
8 1100 1110 ADDR pin tied to VDD
whether the measured input voltage for the selected
Note: Standard 5% tolerance resistors are used in Thermocouple is within range.
the table, however, 1% tolerance resistors
provide better ratio matching.
C Del Sig
R ADC core
+ VIN+ Thermocouple L R VIN-
C Del Sig
Thermocouple R VIN-
FIGURE 6-7: Adding Ferrite Beads.
PIN 1 PIN 1
MCP9600
e3
I/MX ^^
1520256
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body
[MQFN] - (Also called VQFN)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D A B
NOTE 1 N
1
2
E
(DATUM B)
(DATUM A)
2X
0.10 C
2X
0.10 C
TOP VIEW
0.10 C A1
C
A
SEATING
PLANE 20X
(A3) 0.08 C
SIDE VIEW
D2
E2
2
K
1
NOTE 1
N
L 20X b
e 0.10 C A B
0.05 C
BOTTOM VIEW
Microchip Technology Drawing C04-186A Sheet 1 of 2
20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body
[MQFN] - (Also called VQFN)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 20
Pitch e 0.65 BSC
Overall Height A 0.90 0.95 1.00
Standoff A1 0.00 0.02 0.05
Terminal Thickness A3 0.20 REF
Overall Length D 5.00 BSC
Exposed Pad Length D2 3.15 3.25 3.35
Overall Width E 5.00 BSC
Exposed Pad Width E2 3.15 3.25 3.35
Terminal Width b 0.25 0.30 0.35
Terminal Length L 0.35 0.40 0.45
Terminal-to-Exposed-Pad K 0.20 - -
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body
[MQFN] - (Also called VQFN)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
X2
EV
20
1
ØV
2 G
Y2
C2 EV
Y1
E
X1 SILK SCREEN
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Contact Pitch E 0.65 BSC
Optional Center Pad Width W2 3.35
Optional Center Pad Length T2 3.35
Contact Pad Spacing C1 4.50
Contact Pad Spacing C2 4.50
Contact Pad Width (X20) X1 0.40
Contact Pad Length (X20) Y1 0.55
Distance Between Pads G 0.20
Thermal Via Diameter V 0.30
Thermal Via Pitch EV 1.00
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
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