TC72

Digital Temperature Sensor with SPI Interface

Features General Description
• Temperature-to-Digital Converter TC72 is a digital temperature sensor capable of
• SPI Compatible Interface reading temperatures from -55°C to +125°C. This
• 10-Bit Resolution (0.25°C/Bit) sensor features a serial interface that allows
communication with a host controller or other
• ±2°C (maximum) Accuracy from -40°C to +85°C
peripherals. The TC72 interface is compatible with the
• ±3°C (maximum) Accuracy from -55°C to +125°C SPI protocol, and does not require any additional
• 2.65V to 5.5V Operating Range external components. However, it is recommended that
• Low Power Consumption: a decoupling capacitor of 0.01 µF to 0.1 µF be provided
- 250 µA (typical) Continuous Temperature between the VDD and GND pins.
Conversion Mode TC72 can be used either in a Continuous Temperature
- 1 µA (maximum) Shutdown Mode Conversion mode or a One-Shot Conversion mode.
• Power Saving One-Shot Temperature The Continuous Conversion mode measures the
Measurement temperature approximately every 150 ms and stores
the data in the temperature registers. In contrast, the
• Industry Standard 8-Pin MSOP Package
One-Shot mode performs a single temperature
• Space Saving 8-Pin DFN (3x3 mm) Package measurement and returns to the power saving
shutdown mode.
Typical Applications
TC72 features high temperature accuracy, ease-of-use
• Personal Computers and Servers and is the ideal solution for implementing thermal
• Hard Disk Drives and Other PC Peripherals management in a variety of systems. The device is
available in both 8-pin MSOP and 8-pin DFN space-
• Entertainment Systems
saving packages. TC72 also features a Shutdown
• Office Equipment mode for low power operation.
• Datacom Equipment
• Mobile Phones Block Diagram
• General Purpose Temperature Monitoring
VDD
Package Types
Internal TC72
TC72 Diode
MSOP Temperature
Sensor
NC 1 8 VDD
CE 2 7 NC
Manufacturer
SCK 3 6 SDI
ID Register
GND 4 5 SDO
10-Bit
Sigma Delta
TC72 A/D Converter
CE
3x3 DFN* Serial SCK
Port SDO
NC 1 8 VDD Interface SDI
Temperature
SCK 2 EP 7 NC Register
CE 3 9 6 SDO GND
GND 4 5 SDI Control
Register
* Includes Exposed Thermal Pad (EP); see Table 3-1.

© 2011 Microchip Technology Inc. DS21743B-page 1

TC72
NOTES:

DS21743B-page 2 © 2011 Microchip Technology Inc.

 TC72
1.0 ELECTRICAL † Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
CHARACTERISTICS a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
1.1 Maximum Ratings† operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
VDD........................................................................ 6.0V device reliability.
All inputs and outputs w.r.t. GND ...-0.3V to VDD +0.3V
Storage temperature .......................... -65°C to +150°C
Ambient temp. with power applied ..... -55°C to +125°C
Junction Temperature ........................................ 150°C
ESD protection on all pins:
Human Body Model (HBM)............................. > 4 kV
Man Machine Model (MM)............................. > 400V
Latch-Up Current at each pin ........................ ±200 mA
Maximum Power Dissipation........................... 250 mW

DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply at VDD = 2.65V to 5.5V,
TA = -55°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Power Supply
Operating Voltage Range VDD 2.65 — 5.5 V Note 1
Operating Current: IDD-CON — 250 400 µA Continuous Temperature Conversion
Normal Mode, ADC Active mode (Shutdown Bit = ‘0’)
Shut-Down Supply Current ISHD — 0.1 1.0 µA Shutdown mode (Shutdown Bit = ‘1’)
Temperature Sensor and Analog-to-Digital Converter
Temperature Accuracy TACY -2.0 — +2.0 °C -40°C < TA < +85°C
(Note 1) -3.0 — +3.0 -55°C < TA < +125°C
Resolution — 10 — Bits Note 4
ADC Conversion Time tCONV — 150 200 ms
Digital Input / Output
High Level Input Voltage VIH 0.7 VDD — — V
Low Level Input Voltage VIL — — 0.2 VDD V
High Level Output Voltage VOH 0.7 VDD — — V IOH = 1 mA
Low Level Output Voltage VOL — — 0.2 VDD V IOL = 4 mA
Input Resistance RIN 1.0 — — MΩ
Pin Capacitance CIN — 15 — pF
COUT — 50 —
Note 1: The TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX will operate from a supply voltage of 2.65V to 5.5V.
However, the TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal
operating voltages of 2.8V, 3.3V and 5.0V respectively. As VDD varies from the nominal operating value,
the accuracy may be degraded. Refer to Figure 2-5 and Figure 2-6.
2: Measured with a load of CL = 50 pF on the SDO output pin of the TC72.
3: All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise
and fall times. The rise and fall times are defined as the 10% to 90% transition time.
4: Resolution = Temperature Range/No. of Bits = (+127°C – -128°C) / (210) = 256/1024 = 0.25°C/Bit

© 2011 Microchip Technology Inc. DS21743B-page 3

TC72
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, all parameters apply at VDD = 2.65V to 5.5V,
TA = -55°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Serial Port AC Timing (Note 2, 3)
Clock Frequency fCLK DC — 7.5 MHz
SCK Low Time tCL 65 — — ns
SCK High Time tCH 65 — — ns
CE to SCK Setup tCC 400 — — ns
SCK to Data Out Valid tCDD — — 55 ns
CE to Output Tri-state tCDZ — — 40 ns
SCK to Data Hold Time tCDH 35 — — ns
Data to SCK Set-up Time tDC 35 — — ns
SCK to CE Hold Time tCCH 100 — — ns
SCK Rise Time tR — — 200 ns
SCK Fall Time tF — — 200 ns
CE Inactive Time tCWH 400 — — ns
Note 1: The TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX will operate from a supply voltage of 2.65V to 5.5V.
However, the TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal
operating voltages of 2.8V, 3.3V and 5.0V respectively. As VDD varies from the nominal operating value,
the accuracy may be degraded. Refer to Figure 2-5 and Figure 2-6.
2: Measured with a load of CL = 50 pF on the SDO output pin of the TC72.
3: All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise
and fall times. The rise and fall times are defined as the 10% to 90% transition time.
4: Resolution = Temperature Range/No. of Bits = (+127°C – -128°C) / (210) = 256/1024 = 0.25°C/Bit

TEMPERATURE SPECIFICATION
Electrical Specifications: Unless otherwise noted, all parameters apply at VDD = 2.65V to 5.5V,
TA = -55°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range TA -55 — +125 °C
Operating Temperature Range TA -55 — +125 °C
Storage Temperature Range TA -65 — +150 °C
Thermal Package Resistances
Thermal Resistance 8-L 3x3 DFN θJA — 56.7 — °C/W
Thermal Resistance 8-L MSOP θJA — 211 — °C/W

DS21743B-page 4 © 2011 Microchip Technology Inc.

 TC72

SPI READ DATA TRANSFER

(CP = 0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7 = 0)
tCWH

CE

tCCH
1/fCLK
tCC
SCK

tCDH tF tR tCH tCL

tDC

SDI A7 MSb A0 LSb

tCDD tCDZ

SDO HIGH Z HIGH Z

D7 MSb D0 LSb

SPI WRITE DATA TRANSFER

(CP = 0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7 = 1)

tCWH

CE

1/fCLK
tCC tCCH
SCK

tF tR tCH tCL

tDC tCDH

SDI A7 = 1 MSb A0 LSb D7 MSb D0 LSb

Note: The timing diagram is drawn with CP = 0. The TC72 also functions with CP = 1;
however, the edges of SCK are reversed as defined in Table 4-3 and Figure 4-2.

FIGURE 1-1: Serial Port Timing Diagrams.

© 2011 Microchip Technology Inc. DS21743B-page 5

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NOTES:

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 TC72
2.0 TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125°C.

3.5 0.20
3 Upper Specification Limit
2.5
Temperature Error (°C)

Shutdown Current (µA)

2
1.5 Mean 0.15 TC72-3.3MXX
1 Mean + 3V TC72-5.0MXX
0.5 VDD = 5.0V VDD = 3.3V
0 0.10 TC72-5.0MXX
-0.5 VDD = 2.8V
-1
-1.5 Mean - 3V
-2 0.05
-2.5 Lower Specification Limit
-3
-3.5 0.00
-55 -25 5 35 65 95 125 -55 -25 5 35 65 95 125
Reference Temperature (°C) Temperature (°C)

FIGURE 2-1: Accuracy vs. Temperature FIGURE 2-4: Shutdown Current vs.
(TC72-X.XMXX). Temperature.

260 0.4
TC72-2.8MXX
Temperature Change (°C)

TC72-X.XMXX 0.3
250
Supply Current (µA)

0.2
TA = +25°C TA = +85°C
240 0.1
230 0.0
-0.1
220
TA = -55°C -0.2 TA = -25°C
210 TA = +25°C
-0.3
TA = +125°C
200 -0.4
2.5 3.0 3.5 4.0 4.5 5.0 5.5 2.6 2.7 2.8 2.9 3.0
Supply Voltage (V) Supply Voltage (V)

FIGURE 2-2: Supply Current vs. Supply FIGURE 2-5: Temperature Accuracy vs.
Voltage. Supply Voltage (TC72-2.8MXX).

400 1.0
TC72-5.0MXX
Temperature Change (°C)

0.8
350 TC72-5.0MXX TC72-3.3MXX
Supply Current (uA)

VDD = 3.3V 0.6

300 VDD = 5.0V
0.4
250 0.2
200 0.0 TA = +85°C
150 TC72-2.8MXX -0.2
VDD = 2.8V -0.4
100 TA = -25°C
-0.6
50 -0.8 TA = +25°C
0 -1.0
-55 -25 5 35 65 95 125 4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5
Temperature (°C) Supply Voltage (V)

FIGURE 2-3: Supply Current vs. FIGURE 2-6: Temperature Accuracy vs.
Temperature. Supply Voltage (TC72-5.0MXX).

© 2011 Microchip Technology Inc. DS21743B-page 7

TC72
Note: Unless otherwise indicated, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125°C.

Percentage of Occurances (%)

50 TC72-X.XMXX 60
Percentage of Occurances (%)

45 Sample Size = 166 TC72-X.XMXX

TA = -55°C 50 Sample Size = 166
40
TA = +65°C
35 40
30
25 30
20
20
15
10 10
5
0
0

-1.50
-1.25
-1.00
-0.75
-0.50
-0.25
0.00
0.25
0.50
0.75
1.00
1.25
1.50
-3
-2.5
-2
-1.5
-1
-0.5

0.5

1.5

2.5
0

3
Temperature Error (°C) Temperature Error (°C)

FIGURE 2-7: Histogram of Temperature FIGURE 2-10: Histogram of Temperature

Accuracy at -55 Degrees C. Accuracy at +65 Degrees C.

60 50
Percentage of Occurances (%)

Percentage of Occurances (%)

TC72-X.XMXX 45 TC72-X.XMXX
50 Sample Size = 166 Sample Size = 166
TA = -40°C 40
TA = +85°C
40 35
30
30 25
20
20 15
10 10
5
0 0
-2 -1.5 -1 -0.5 0 0.5 1 1.5 2 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2
Temperature Error (°C) Temperature Error (°C)

FIGURE 2-8: Histogram of Temperature FIGURE 2-11: Histogram of Temperature

Accuracy at -40 Degrees C. Accuracy at +85 Degrees C.
Percentage of Occurances (%)

60 40
Percentage of Occurances (%)

TC72-X.XMXX TC72-X.XMXX
50 35
Sample Size = 166 Sample Size = 166
TA = +25°C 30 TA = +125°C
40
25
30 20
20 15
10
10
5
0 0
-1.50
-1.25
-1.00
-0.75
-0.50
-0.25
0.00
0.25
0.50
0.75
1.00
1.25
1.50

-2.5

-1.5

-0.5
-3

-2

-1

3
0.5

1.5

2.5

Temperature Error (°C) Temperature Error (°C)

FIGURE 2-9: Histogram of Temperature FIGURE 2-12: Histogram of Temperature

Accuracy at +25 Degrees C. Accuracy at +125 Degrees C.

DS21743B-page 8 © 2011 Microchip Technology Inc.

 TC72
3.0 PIN DESCRIPTION
Pin functionalities are described in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

TC72
Symbol Function
3x3 DFN MSOP
1 1 NC No internal connection
2 3 SCK Serial Clock input
3 2 CE Chip Enable input, the device is selected when this input is high
4 4 GND Ground
5 6 SDI Serial Data input
6 5 SDO Serial Data output
7 7 NC No internal connection
8 8 VDD Power supply
9 — EP Exposed pad (Ground)

3.1 No Connection (NC) 3.7 Power Supply (VDD)

This pin is not internally connected to the die. VDD is the Power pin. The operating voltage range, as
specified in the DC electrical specification table, is
3.2 Serial Clock Input (SCK) applied on this pin.

The SCK pin is an Input pin. All communication and 3.8 Exposed Pad (EP)
timing is relative to the signal on this pin. The clock is
generated by the host controller on the SPI bus (see There is an internal electrical connection between the
Section 4.3 “Serial Bus Interface”). Exposed Thermal Pad (EP) and the GND pin; they can
be connected to the same potential on the Printed
3.3 Chip Enable Input (CE) Circuit Board (PCB). This provides better thermal
conduction from the PCB to the die.
The CE is a Chip Enable pin. This is an active high
input, therefore the device is enabled when CE is
toggled to VDD. Once the device is enabled, all serial
communication begins (see Section 4.3 “Serial Bus
Interface”).

3.4 Ground (GND)

The GND is the system Ground pin.

3.5 Serial Data Input (SDI)

The SDI is a Data Input pin, used to transmit data from
the host to the device (see Section 4.3 “Serial Bus
Interface”).

3.6 Serial Data Output (SDO)

The SDO is a Data Output pin, used to transmit data
from the device to the host (see Section 4.3 “Serial
Bus Interface”).

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NOTES:

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 TC72
4.0 FUNCTIONAL DESCRIPTION The Continuous Conversion mode measures the
temperature approximately every 150 ms and stores
TC72 consists of a band-gap type temperature sensor, the data in the temperature registers. TC72 has an
a 10-bit Sigma Delta Analog-to-Digital Converter internal clock generator that controls the automatic
(ADC), an internal conversion oscillator and a double temperature conversion sequence. The automatic
buffer digital output port. The 10-bit ADC is scaled from temperature sampling operation is repeated indefinitely
-128°C to +127°C; therefore, the resolution is 0.25°C until TC72 is placed in Shutdown mode by a write
per bit. The ambient temperature operating range of operation to the Control register. TC72 will remain in
the TC72 is specified from -55°C to +125°C. Shutdown mode until the shutdown bit in the Control
This device features a four-wire serial interface that is register is reset.
fully compatible with the SPI specification and, there- In contrast, the One-Shot mode performs a single
fore, allows simple communications with common temperature measurement and returns to the power-
microcontrollers and processors. TC72 can be used saving shut down mode. This mode is especially useful
either in a Continuous Temperature Conversion mode for low power applications.
or a One-Shot Conversion mode. TC72 temperature
measurements are performed in the background and,
therefore, reading the temperature via the serial I/O
lines does not affect the measurement in progress.

Output
Code
MSB LSB
0111 1101 / 0000 0000

+25°C

+0.25°C

MSB LSB
0001 1001 / 0000 0000

MSB LSB
0000 0000 / 0100 0000
Temp MSB LSB 0°C Temp
0000 0000 / 0000 0000 MSB LSB
-55°C 1111 1111 / 1100 0000 +125°C
MSB LSB
1110 0111 / 0000 0000

-0.125°C

-25°C

MSB LSB
1100 1001 / 0000 0000

Note: The ADC converter is scaled from -128°C to +127°C, but the operating range of the
TC72 is specified from -55°C to +125°C.

FIGURE 4-1: Temperature-To-Digital Transfer Function (Non-Linear Scale).

© 2011 Microchip Technology Inc. DS21743B-page 11

TC72
4.1 Temperature Data Format 4.3 Serial Bus Interface
Temperature data is represented by a 10-bit two’s com- The serial interface consists of the Chip Enable (CE),
plement word with a resolution of 0.25°C per bit. The Serial Clock (SCK), Serial Data Input (SDI) and Serial
temperature data is stored in the Temperature registers Data Output (SDO) signals. TC72 operates as a slave
in a two’s complement format. The ADC converter is and is compatible with the SPI bus specifications. The
scaled from -128°C to +127°C, but the operating range serial interface is designed to be compatible with the
of TC72 is specified from -55°C to +125°C. Microchip PIC® family of microcontrollers.
The CE input is used to select TC72 when multiple
EXAMPLE 4-1: devices are connected to the serial clock and data
lines. The CE is active-high, and data is written to or
Temperature = +41.5°C read from the device, when CE is equal to a logic high
MSB Temperature Register = 00101001b voltage. The SCK input is disabled when CE is low. The
= 25 + 23 + 20 rising edge of the CE line initiates a read or write
operation, while the falling edge of CE completes a
= 32 + 8 + 1 = 41
read or write operation.
LSB Temperature Register = 10000000b = 2-1 = 0.5
The SCK input is provided by the external
microcontroller and is used to synchronize the data on
the SDI and SDO lines. The SDI input writes data into
TABLE 4-1: TC72 TEMPERATURE
TC72’s Control register, while the SDO outputs the
OUTPUT DATA temperature data from the Temperature register and
Binary the status of Shutdown bit of the Control register.
Temperature Hex
MSB / LSB TC72 has the capability to function with either an
+125°C 0111 1101/0000 0000 7D00 active-high or low SCK input. The SCK inactive state is
+25°C 0001 1001/0000 0000 1900 detected when the CE signal goes high, while the
polarity of the clock input (CP) determines whether the
+0.5°C 0000 0000/1000 0000 0080 data is clocked and shifted on either the rising or falling
+0.25°C 0000 0000/0100 0000 0040 edge of the system clock, as shown in Figure 4-2.
0°C 0000 0000/0000 0000 0000 Table 4-3 gives the appropriate clock edge used to
transfer data into and out of the registers. Each data bit
-0.25°C 1111 1111/1100 0000 FFC0
is transferred at each clock pulse, and the data bits are
-25°C 1110 0111/0000 0000 E700 clocked in groups of eight bits, as shown in Figure 4-3.
-55°C 1100 1001/0000 0000 C900 The address byte is transferred first, followed by the
data. A7, the MSb of the address, determines whether
TABLE 4-2: TEMPERATURE REGISTER a read or write operation will occur. If A7 = ‘0’, one or
Address/ more read cycles will occur; otherwise, if A7 = ‘1’, one
D7 D6 D5 D4 D3 D2 D1 D0 or more write cycles will occur.
Register
02H Data can be transferred either in a single byte or a
Sign 26 25 24 23 23 21 20 multi-byte packet, as shown in Figure 4-3. In the 3-byte
Temp. MSB
01H packet, the data sequence consists of the MSb
2-1 2-2 0 0 0 0 0 0 temperature data, LSb temperature data, followed by
Temp. LSB
the Control register data. The multi-byte read feature is
initiated by writing the highest address of the desired
4.2 Power-Up And Power-Down packet to registers. TC72 will automatically send the
TC72 is in low-power consumption Shutdown mode at register addressed and all of the lower address
power-up. The Continuous Temperature Conversion registers, as long as the Chip Enable pin is held active.
mode is selected by performing a Write operation to the
Control register, as described in Section 5.0 “Internal
Register Structure”.
A supply voltage lower than 1.6V (typical) is considered
a power-down state for TC72. If the supply voltage
drops below the 1.6V threshold, the internal registers
are reset to the power-up default state.

DS21743B-page 12 © 2011 Microchip Technology Inc.

 TC72
TABLE 4-3: OPERATIONAL MODES
Mode CE SCK (Note 1) SDI SDO
Disable L Input Disabled Input Disabled High Z
Write (A7 = 1) H CP=1, Data Shifted on Falling Edge, Data Bit Latch High Z
Data Clocked on Rising Edge
CP=0, Data Shifted on Rising Edge,
Data Clocked on Falling Edge
Read (A7 = 0) H CP=1, Data Shifted on Falling Edge, X Next data bit shift,
Data Clocked on Rising Edge Note 2
CP=0, Data Shifted on Rising Edge,
Data Clocked on Falling Edge
Note 1: CP is the Clock Polarity of the microcontroller system clock. If the inactive state of SCK is logic level high,
CP is equal to ‘1’; otherwise, if the inactive state of SCK is low, CP is equal to ‘0’.
2: During a Read operation, SDO remains at a high impedance (High Z) level until the eight bits of data begin
to be shifted out of the Temperature register.

4.4 Read Operation

The TC72 uses the CE, SCK and SDO lines to output CP = 0
the Temperature and Control register data. Figure 4-3
shows a timing diagram of the read operation. CE
Communication is initiated by the chip enable (CE)
going high. The SDO line remains at the voltage level
of the LSb bit that is output and goes to the tri-state SCK
level when the CE line goes to a logic low level.

4.5 Write Operation SHIFT CLOCK

EDGE EDGE
Data is clocked into the Control register in order to
enable TC72’s power saving shutdown mode. The
write operation is shown in Figure 4-3 and is CP = 1
accomplished using the CE, SCK and SDI lines.

CE

SCK

SHIFT CLOCK
EDGE EDGE

FIGURE 4-2: Serial Clock Polarity (CP)

Operation.

© 2011 Microchip Technology Inc. DS21743B-page 13

TC72

Single Byte Write Operation

(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1)

CE

SCK
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

A7=1

SDI A A A A A A A A D D D D D D D D
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
MSb LSb
SDO High Z

Single Byte Read Operation

(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0)

CE

SCK
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

A7=0

SDI A A A A A A A A
7 6 5 4 3 2 1 0

SDO High Z High Z

D D
7 0
MSb LSb

SPI Multiple Byte Transfer

CE

SCK

Write Operation
(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1)
SDI
Address Byte = 80hex Control Byte
A7 A0 D7 D0

SDO High Z

Read Operation
(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0)
SDI Address Byte = 02hex
A7 A0

MSB Temp. Byte LSB Temp. Byte Control Byte

SDO High Z High Z
D7 D0 D7 D0 D7 D0

FIGURE 4-3: Serial Interface Timing Diagrams (CP=0).

DS21743B-page 14 © 2011 Microchip Technology Inc.

 TC72
5.0 INTERNAL REGISTER
STRUCTURE
TC72 registers are listed below.

TABLE 5-1: REGISTERS FOR TC72

Read Write Bit Bit Bit Bit Bit Bit Bit Bit Value on
Register
Address Address 7 6 5 4 3 2 1 0 POR/BOR
Control 00hex 80hex 0 0 0 One-Shot 0 1 0 Shutdown 05hex
(OS) (SHDN)
LSB Temperature 01hex N/A T1 T0 0 0 0 0 0 0 00hex
MSB Temperature 02hex N/A T9 T8 T7 T6 T5 T4 T3 T2 00hex
Manufacturer ID 03hex N/A 0 1 0 1 0 1 0 0 54hex

5.1 Control Register One-Shot mode is selected by writing a ‘1’ into bit 4 of
the Control register. The One-Shot mode performs a
The Control register is both a read and a write register single temperature measurement and returns to the
that is used to select either the Shutdown, Continuous power-saving Shutdown mode. After completion of the
or One-Shot Conversion operating mode. The Temper- temperature conversion, the One-Shot bit (OS) is reset
ature Conversion mode selection logic is shown in to ‘0’ (i.e. “OFF”). The user must set the One-Shot bit
Table 5-2. The Shutdown (SHDN) bit is stored in bit 0 to ‘1’ to initiate another temperature conversion.
of the Control register. If SHDN is equal to ‘1’, TC72 will
go into power-saving Shutdown mode. If SHDN is Bits 1, 3, 5, 6 and 7 of the Control register are not used
equal to ‘0’, TC72 will perform a temperature by TC72. Bit 2 is set to a logic ‘1’. Any write operation
conversion approximately every 150 ms. to these bit locations will have no affect on the
operation of TC72.
At power-up, the SHDN bit is set to ‘1’. Thus, TC72 is
in Shutdown operating mode at startup. Continuous
5.2 Temperature Register
Temperature Conversion mode is selected by writing a
‘0’ to the SHDN bit of the Control register. The Temperature register is a read-only register and
Shutdown mode can be used to minimize the power contains a 10-bit two’s complement representation of
consumption of TC72 when active temperature the temperature measurement. Bit 0 through Bit 5 of
monitoring is not required. The Shutdown mode the LSB Temperature register are always set to a logic
disables the temperature conversion circuitry; ‘0’.
however, the serial I/O communication port remains At Power-On Reset (POR) or a Brown-Out Reset
active. A temperature conversion will be initialized by a (BOR) low voltage occurrence, the temperature regis-
Write operation to the Control register to select either ter is reset to all zeroes, which corresponds to a tem-
the Continuous Temperature Conversion or the One- perature value of 0°C. A VDD power supply less than
Shot operating mode. The temperature data will be 1.6V is considered a reset event and will reset the
available in the MSB and LSB Temperature registers Temperature register to the power-up state.
approximately 150 ms after the Control register Write
operation. 5.3 Manufacturer ID Register
The Manufacturer Identification (ID) register is a read-
only register used to identify the temperature sensor as
a Microchip component.

TABLE 5-2: CONTROL REGISTER TEMPERATURE CONVERSION MODE SELECTION

Operational Mode One-Shot (OS) Bit 4 Shutdown (SHDN) Bit 0
Continuous Temperature Conversion 0 0
Shutdown 0 1
Continuous Temperature Conversion 1 0
(One-Shot Command is ignored if SHDN = ‘0’)
One-Shot 1 1

© 2011 Microchip Technology Inc. DS21743B-page 15

TC72
NOTES:

DS21743B-page 16 © 2011 Microchip Technology Inc.

 TC72
6.0 APPLICATIONS INFORMATION
VDD
The TC72 does not require any additional components
in order to measure temperature; however, it is 0.1µF
recommended that a decoupling capacitor of 0.1mF to
1mF be provided between the VDD and GND pins. VDD
Although the current consumption of the TC72 is
modest (250 mA, typical), the TC72 contains an on PICmicro®
chip data acquisition with internal digital switching TC72
MCU
circuitry. Thus, it is considered good design practice to
use an external decoupling capacitor with the sensor. A CE I/O
high frequency ceramic capacitor should be used and
be located as close as possible to the IC power pins in SCK SCK
order to provide effective noise protection to the TC72.
The TC72 measures temperature by monitoring the SDO SDI
voltage of a diode located on the IC die. The IC pins of
SDI SDO
the TC72 provide a low impedance thermal path
between the die and the PCB, allowing the TC72 to GND
effectively monitor the temperature of the PCB board.
The thermal path between the ambient air is not as
efficient because the plastic IC housing package
functions as a thermal insulator. Thus, the ambient air FIGURE 6-1: Typical Application.
temperature (assuming that a large temperature
gradient exists between the air and PCB) has only a
small effect on the temperature measured by the TC72.
Note that the exposed metal center pad on the bottom
of the DFN package is connected to the silicon
substrate. The center pad should be connected to
either the PCB ground plane or treated as a “No
Connect” pin. The mechanical dimensions of the center
pad are given in Section 7.0 “Packaging
Information” of this data sheet.
A potential for self-heating errors can exist if the TC72
SPI communication lines are heavily loaded. Typically,
the self-heating error is negligible because of the
relatively small current consumption of the TC72. A
temperature accuracy error of approximately +0.5°C
will result from self-heating if the SPI communication
pins sink/source the maximum current specified for the
TC72. Thus, to maximize temperature accuracy, the
output loading of the SPI signals should be minimized.

© 2011 Microchip Technology Inc. DS21743B-page 17

TC72
7.0 PACKAGING INFORMATION

7.1 Package Marking Information

8-Lead MSOP Example:

XXXXXX TC722M
YWWNNN 109256

8-Lead DFN Example:

XXXXXXXX 7228
MYWW M109
NNN 256

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
e3 Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

DS21743B-page 18 © 2011 Microchip Technology Inc.

 TC72

       

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© 2011 Microchip Technology Inc. DS21743B-page 19

TC72

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

DS21743B-page 20 © 2011 Microchip Technology Inc.

 TC72

Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging

© 2011 Microchip Technology Inc. DS21743B-page 21

TC72

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  )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW
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DS21743B-page 22 © 2011 Microchip Technology Inc.

 TC72
APPENDIX A: REVISION HISTORY

Revision B (July 2011)

The following is the list of modifications:
1. Updated DFN pin drawing.
2. Added new chapter Section 3.0 “PIN
Description”.
3. Moved Typical Application figure in Section 6.0
“Applications information” (see Figure 6-1).
4. Updated Section 7.0 “Packaging
Information”

Revision A (October 2002)

• Original data sheet for the TC72 device.

© 2011 Microchip Technology Inc. DS21743B-page 23

TC72
NOTES:

DS21743B-page 24 © 2011 Microchip Technology Inc.

 TC72
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. XX X /XX
Examples:
Device Voltage Temperature Package a) TC72-2.8MUA: Digital Temperature Sensor,
Range Range 2.8V, 8LD MSOP package.
b) TC72-2.8MUATR: Digital Temperature Sensor,
2.8V, 8LD MSOP
(tape and reel) package.
Device: TC72: Digital Temperature Sensor w/SPI Interface
c) TC72-2.8MMF: Digital Temperature Sensor,
2.8V, 8LD DFN package.
d) TC72-3.3MUA: Digital Temperature Sensor,
Voltage Range: 2.8 = Accuracy Optimized for 2.8V
3.3 = Accuracy Optimized for 3.3V 3.3V, 8LD MSOP package.
5.0 = Accuracy Optimized for 5.0V e) TC72-3.3MMF: Digital Temperature Sensor,
3.3V, 8LD DFN package.
f) TC72-5.0MUA: Digital Temperature Sensor,
Temperature Range: M =-55°C to +125°C 5.0V, 8LD MSOP package.
g) TC72-5.0MMF: Digital Temperature Sensor,
5.0V, 8LD DFN package.
Package: MF = Dual, Flat, No Lead (DFN) (3x3mm), 8-lead h) TC72-5.0MMFTR: Digital Temperature Sensor,
5.0V, 8LD DFN (tape and
MFTR = Dual, Flat, No Lead (DFN) (3x3mm), 8-lead
(Tape and Reel) reel) package.
UA = Plastic Micro Small Outline (MSOP), 8-lead
UATR = Plastic Micro Small Outline (MSOP), 8-lead
(Tape and Reel)

© 2011 Microchip Technology Inc. DS21743B-page 25

TC72
NOTES:

DS21743B-page 26 © 2011 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device Trademarks

applications and the like is provided only for your convenience
The Microchip name and logo, the Microchip logo, dsPIC,
and may be superseded by updates. It is your responsibility to
KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
ensure that your application meets with your specifications.
PIC32 logo, rfPIC and UNI/O are registered trademarks of
MICROCHIP MAKES NO REPRESENTATIONS OR
Microchip Technology Incorporated in the U.S.A. and other
WARRANTIES OF ANY KIND WHETHER EXPRESS OR countries.
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION, FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
INCLUDING BUT NOT LIMITED TO ITS CONDITION, MXDEV, MXLAB, SEEVAL and The Embedded Control
QUALITY, PERFORMANCE, MERCHANTABILITY OR Solutions Company are registered trademarks of Microchip
FITNESS FOR PURPOSE. Microchip disclaims all liability Technology Incorporated in the U.S.A.
arising from this information and its use. Use of Microchip Analog-for-the-Digital Age, Application Maestro, chipKIT,
devices in life support and/or safety applications is entirely at chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
the buyer’s risk, and the buyer agrees to defend, indemnify and dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
hold harmless Microchip from any and all damages, claims, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
suits, or expenses resulting from such use. No licenses are Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
conveyed, implicitly or otherwise, under any Microchip MPLINK, mTouch, Omniscient Code Generation, PICC,
intellectual property rights. PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2011, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.

ISBN: 978-1-61341-429-3

Microchip received ISO/TS-16949:2009 certification for its worldwide

headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

© 2011 Microchip Technology Inc. DS21743B-page 27

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DS21743B-page 28 © 2011 Microchip Technology Inc.