E22 Usermanual EN v1.10

SX1262/SX1268 Wireless Module
E22 Series
User Manual
This manual may be modified based on product upgrade, please refer to the latest version.
All rights to interpret and modify this manual belong to Chengdu Ebyte Electronic Technology Co., Ltd.
SX1262/SX1268 wireless module E22 series user manual
Version Date Description Issued by
1.00 2018/04/27 Initial version huaa
1.10 2018/08/06 Modified version 01 Huaa
Brief Introduction
With multiple frequency band and wide frequency range , E22 series are small size (pin spacing :1.27mm) SMD wireless transceiver
module designed by Chengdu Ebyte. It features long range transmission and super low power consumption.
The E22 series is the first wireless module in China to adopt Semtech's SX1262, SX1268 RF chip. This chip provides a variety of
modulation methods, such as LoRaTM and traditional GFSK. Its special LoRaTM modulation method increases the communication
distance. At the same time, SX126x owns two distribution methods, low-dropout regulator (LDO) and high-efficiency step-down
DC-DC converter, under the premise of the choice of DC-DC mode, the receiving current is extremely low to achieve Low power
consumption. Compared with SX127x series, SX126x can achieve up to 62.5kbps air data rate in Lora mode. In GFSK mode, air data
rate can support up to 300kbps; according to the application of choice of power management, in the DC/DC mode, when in the
maximum power output of 22dBm The SX126x's power consumption is only 118mA, and the efficiency is improved significantly. The
SX126x RF receiver power consumption is 4.8mA, which is less than half of the SX127x series' 10mA receiving current.
E22 series strictly stick to the design rules home and abroad of FCC, CE, CCC and meet the related RF certifications and export
standards. As hardware platform, users need to carry out secondary development.
Model Frequency Transmitting power Distance Packing Antenna
E22-400M22S 410-493MHz 22dBm 6500m SMD Stamp hole/IPEX
Copyright ©2012–2017，Chengdu Ebyte Electronic Technology Co.,Ltd.

1
Contents
Brief Introduction...........................................................................................................................................................................1
1. Technical Parameter.................................................................................................................................................................. 3
1.1. E22-400M22S..................................................................................................................................................................... 3
1.2. E22-900M20S..................................................................................................................................................................... 3
1.3. E22-400M30S/ E22-900M30S.......................................................................................................................................... 4
1.4. Parameter descriptions...................................................................................................................................................... 4
2. Mechanical characteristic..........................................................................................................................................................5
2.1 E22-400M22S/E22-900M22S............................................................................................................................................ 5
2.1.1 Dimensions....................................................................................................................................................................5
2.1.2. Pin definition................................................................................................................................................................ 5
2.2 E22-400M30S/E22-900M30S................................................................................................................................................ 6
2.2.1 Dimensions........................................................................................................................................................................6
2.2.2 Pin definition..................................................................................................................................................................... 7
3. Recommended Circuit Diagram...............................................................................................................................................8
3.1. E22-433M22S/E22-900M22S............................................................................................................................................8
3.2. E22-400M30S/E22-900M30S............................................................................................................................................8
4. Production Guidance.................................................................................................................................................................9
4.1. Reflow Soldering Temperature..........................................................................................................................................9
4.2. Reflow Curving Diagram.................................................................................................................................................... 9
5. FAQ........................................................................................................................................................................................... 10
5.1. Communication range is too short.................................................................................................................................10
5.2. Module is easy to damage.............................................................................................................................................. 10
6. Important Notes...................................................................................................................................................................... 10
7. About Us...................................................................................................................................................................................10

2
1. Technical Parameter
Operating Operating Storage

Model Core IC Size Net Weight
Temperature Humidity Temperature
E22-400M22S SX1268 20* 14*2.8 mm 1.35±0.1 g -40 ~ 85℃ 10% ~ 90% -40 ~ 125°C
E22-900M22S SX1262 20* 14*2.8 mm 1.35±0.1 g -40 ~ 85℃ 10% ~ 90% -40 ~ 125°C
E22-400M30S SX1268 38.5* 24*3.6 mm 4.8±0.1g -40 ~ 85℃ 10% ~ 90% -40 ~ 125°C
E22-900M30S SX1262 38.5* 24*3.6 mm 4.64±0.1g -40 ~ 85℃ 10% ~ 90% -40 ~ 125°C
1.1. E22-400M22S
Parameter Min Typ Max Unit
Tx current
100 105 mA
(LoRa@2.4kbps) 95
Rx current
4.6 4.8 5.7 mA
(LoRa@2.4kbps)
Turn-off current 150 180 200 nA
Tx power 21.4 21.5 22.3 dBm
Rx sensitivity -144 -146 -147 dBm
TCXO 32 32 32 MHz
TCXO voltage setting 1.8 1.8 3.3 V
Operating frequency 410 433/470/490 493 MHz
Voltage supply 1.8 3.3 3.7 V
Communication level 1.8 3.3 3.7 V
1.2. E22-900M20S
Tx current
119 124 mA
(LoRa@2.4kbps) 114
Rx current
4.8 5.0 5.9 mA
(LoRa@2.4kbps)
Tx power 21.4 21.5 22.3 dBm
TCXO 32 32 32 MHz
Operating frequency 850 868/915 930 MHz
Voltage supply 1.8 3.3 3.7 V

3
1.3. E22-400M30S/ E22-900M30S
Tx current
650 700 mA
(LoRa@2.4kbps) 600
Rx current
12 14 16 mA
(LoRa@2.4kbps)
Tx power 29.5 30.0 31 dBm
TCXO 32 32 32 MHz
Operating frequency 410 433/470/490 493 MHz
Voltage supply 2.5 5 5.5 V
1.4. Parameter descriptions
 When designing the power supply circuit for the module, it is recommended to reserve more than 30% margin, and the whole machine is conducive
to long-term and stable operation.
 The current required to launch at the moment is large but often because of the very short launch time, the total energy consumed may be smaller;
 When users use an external antenna, the impedance matching between the antenna and the module at different frequency points will affect the
emission current to a different extent.
 The current consumed when the radio frequency chip is in the pure receiving state is called the receiving current. Some radio frequency chips with
communication protocols or developers have loaded some of the self-developed protocols on the entire unit. This may cause the received current
to be large. ;
 The currents in pure receiving state are often of the mA level, and for μA-level “receiving current”, developer need to process the software.
 Shutdown current is often much less than the current consumed by the entire power supply when it is in no-load condition, and it is not excessively
demanding;
 Because the material itself has a certain error, a single LRC component has an error of ±0.1%, but due to the use of multiple LRC components in the
entire RF loop, there will be an accumulation of errors, resulting in different emission current and receiving current of different modules. ;
 Lowering the transmit power can reduce the power consumption to some extent, but reducing the transmit power emission due to many reasons
will reduce the efficiency of the internal PA.

4
2. Mechanical characteristic
2.1 E22-400M22S/E22-900M22S
2.1.1 Dimensions
2.1.2. Pin definition
Pin No. Pin item Pin direction Pin application
1 GND Ground
2 GND Ground
3 GND Ground
4 GND Ground
5 GND Ground
6 RXEN Input RF switch RX control，connecting external MCU IO, valid in high level
7 TXEN Input RF switch TX control，connecting external MCU IO or DIO2, valid in high level
8 DIO2 Input /output Configurable IO port（see more in SX126x datasheet）
9 VCC Power supply, 1.8V~3.7V（external ceramic filter capacitor is recommended）
10 GND Ground
11 GND Ground

5
12 GND Ground
13 DIO1 Input /output Configurable IO port（see more in SX126x datasheet）
14 BUSY output State indicator（see more in SX126x datasheet）
15 NRST Input Chip reset initiation, valid in low level
16 MISO output SPI master input slave output
17 MOSI Input SPI master output slave input
18 SCK Input SPI clock
19 NSS Input Chip select，for starting a SPI communication
20 GND Ground
21 ANT Stamp hole（50 ohm impedance）
22 GND Ground
★ Find more details on《SX126x Datasheet》from Semtech ★
2.2 E22-400M30S/E22-900M30S
2.2.1 Dimensions

6
2.2.2 Pin definition
Pin No. Pin item Pin direction Pin application
1 GND
Ground
2 GND
Ground
3 GND
Ground
4 GND
Ground
5 GND
Ground
6 RXEN Input
RF switch RX control，connecting external MCU IO, valid in high level
7 TXEN Input
RF switch TX control，connecting external MCU IO or DIO2, valid in high level
8 DIO2 Input /Output Configurable IO port（see more in SX126x datasheet）
11 GND Ground
12 GND Ground
13 DIO1 Input /Output

Configurable IO port（see more in SX126x datasheet）
14 BUSY Output
State indicator（see more in SX126x datasheet）
15 NRST Input
Chip reset initiation, valid in low level
16 MISO Output
SPI master input slave output
17 MOSI Input
SPI master output slave input
18 SCK Input
SPI clock
19 NSS Input
Chip select，for starting a SPI communication
20 GND Ground
21 ANT Stamp hole（50 ohm impedance）
22 GND Ground
★ Find more details on《SX126x Datasheet》from Semtech ★

7
3. Recommended Circuit Diagram
3.1. E22-433M22S/E22-900M22S
3.2. E22-400M30S/E22-900M30S

8
NO. Instruction for connection between module and MCU
1 IO0, IO1, IO2, IO3 means IO ports of MCU.
DIO1、DIO2 are GPIO，configurable for multiple functions；DIO2 can connect to TXEN，without connecting to IO of MCU，for controlling RF switch TX, Please
2
see more in SX126x datasheet, can be floated when free.
3 E22(433M22S) uses DIO3 internally to power 32MHz TCXO.
4 Well grounded with large area for grounding，small power ripple, filter capacitor should be installed and near to VCC and GND.
5 E22(400M30S)：It is recommended to add a 200R protection resistor to the RXD/TXD of the external MCU.
4. Production Guidance
4.1. Reflow Soldering Temperature
Profile Feature Sn-Pb Assembly Pb-Free Assembly
Solder Paste Sn63/Pb37 Sn96.5/Ag3/Cu0.5
Preheat Temperature min （Tsmin） 100℃ 150℃
Preheat temperature max (Tsmax) 150℃ 200℃
Preheat Time (Tsmin to Tsmax)(ts) 60-120 sec 60-120 sec
Average ramp-up rate(Tsmax to Tp) 3℃/second max 3℃/second max
Liquidous Temperature (TL) 183℃ 217℃
Time（tL）Maintained Above（TL） 60-90 sec 30-90 sec
Peak temperature（Tp） 220-235℃ 230-250℃
Aveage ramp-down rate（Tp to Tsmax） 6℃/second max 6℃/second max
Time 25℃ to peak temperature 6 minutes max 8 minutes max
4.2. Reflow Curving Diagram

9
5. FAQ
5.1. Communication range is too short
 The communication distance will be affected when obstacle exists.

 Data lose rate will be affected by temperature, humidity and co-channel interference.
 The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
 Seawater has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
 The signal will be affected when the antenna is near metal object or put in a metal case.
 Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance).
 The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the transmitting power.
 Due to antenna quality or poor matching between antenna and module.
5.2. Module is easy to damage
 Please check the power supply source, ensure it is within the recommended value, voltage higher than that will damage the module.
 Please check the stability of power source, the voltage cannot fluctuate too much.
 Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic susceptibility.
 Please ensure the humidity is within limited range, some parts are sensitive to humidity.
 Please avoid using modules under too high or too low temperature.
6. Important Notes
 All rights to interpret and modify this manual belong to Ebyte.

 This manual will be updated based on the upgrade of firmware and hardware, please refer to the latest version.
 Please refer to our website for new product information
7. About Us
Technical support: support@cdebyte.com

Documents and RF Setting download link: www.cdebyte.com/en/
Tel：+86-28-61399028 Ext. 812

Fax：028-64146160
Web：www.cdebyte.com/en/
Address：Innovation Center D347, 4# XI-XIN Road,Chengdu, Sichuan, China

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SX1262/SX1268 Wireless Module

Version Date Description Issued by

1.00 2018/04/27 Initial version huaa

1.10 2018/08/06 Modified version 01 Huaa

Model Frequency Transmitting power Distance Packing Antenna

E22-400M22S 410-493MHz 22dBm 6500m SMD Stamp hole/IPEX

E22-900M22S 850-930MHz 22dBm 6500m SMD Stamp hole/IPEX

E22-400M30S 410-493MHz 30dBm 12000m SMD Stamp hole/IPEX

E22-900M30S 850-930MHz 30dBm 12000m SMD Stamp hole/IPEX

Copyright ©2012–2017，Chengdu Ebyte Electronic Technology Co.,Ltd.

1.3. E22-400M30S/ E22-900M30S.......................................................................................................................................... 4

1.4. Parameter descriptions...................................................................................................................................................... 4

2.1.2. Pin definition................................................................................................................................................................ 5

2.2.2 Pin definition..................................................................................................................................................................... 7

3. Recommended Circuit Diagram...............................................................................................................................................8

4.1. Reflow Soldering Temperature..........................................................................................................................................9

4.2. Reflow Curving Diagram.................................................................................................................................................... 9

5.1. Communication range is too short.................................................................................................................................10

5.2. Module is easy to damage.............................................................................................................................................. 10

Copyright ©2012–2017，Chengdu Ebyte Electronic Technology Co.,Ltd.

Operating Operating Storage

Parameter Min Typ Max Unit

Turn-off current 150 180 200 nA

Tx power 21.4 21.5 22.3 dBm

Rx sensitivity -144 -146 -147 dBm

TCXO voltage setting 1.8 1.8 3.3 V

Operating frequency 410 433/470/490 493 MHz

Voltage supply 1.8 3.3 3.7 V

Communication level 1.8 3.3 3.7 V

Parameter Min Typ Max Unit

Turn-off current 150 185 200 nA

Tx power 21.4 21.5 22.3 dBm

Rx sensitivity -144 -146 -147 dBm

TCXO voltage setting 1.8 1.8 3.3 V

Operating frequency 850 868/915 930 MHz

Voltage supply 1.8 3.3 3.7 V

Communication level 1.8 3.3 3.7 V

Copyright ©2012–2017，Chengdu Ebyte Electronic Technology Co.,Ltd.

1.3. E22-400M30S/ E22-900M30S

Parameter Min Typ Max Unit

Tx power 29.5 30.0 31 dBm

Rx sensitivity -149 -150 -151 dBm

TCXO voltage setting 1.8 1.8 1.8 V

Operating frequency 410 433/470/490 493 MHz

Voltage supply 2.5 5 5.5 V

Communication level 1.8 3.3 3.7 V

1.4. Parameter descriptions

Copyright ©2012–2017，Chengdu Ebyte Electronic Technology Co.,Ltd.

2.1.2. Pin definition

Pin No. Pin item Pin direction Pin application

8 DIO2 Input /output Configurable IO port（see more in SX126x datasheet）

9 VCC Power supply, 1.8V~3.7V（external ceramic filter capacitor is recommended）

Copyright ©2012–2017，Chengdu Ebyte Electronic Technology Co.,Ltd.

13 DIO1 Input /output Configurable IO port（see more in SX126x datasheet）

14 BUSY output State indicator（see more in SX126x datasheet）

15 NRST Input Chip reset initiation, valid in low level

16 MISO output SPI master input slave output

17 MOSI Input SPI master output slave input

18 SCK Input SPI clock