User'S Guide: Tm4C Series Tm4C129E Crypto Connected Launchpad Evaluation Kit

TM4C Series TM4C129E Crypto Connected
LaunchPad Evaluation Kit

EK-TM4C129EXL
User's Guide
Literature Number: SPMU372A

September 2015 – Revised October 2016
Contents
1 Board Overview ................................................................................................................... 5

1.1 Kit Contents................................................................................................................... 6
1.2 Using the Crypto Connected LaunchPad ................................................................................ 6
1.3 Features ....................................................................................................................... 6
1.4 BoosterPacks ................................................................................................................. 7
1.5 Energīa ........................................................................................................................ 7
1.6 Specifications ................................................................................................................. 7
2 Hardware Description ........................................................................................................... 9
2.1 Functional Description ...................................................................................................... 9
2.1.1 Microcontroller....................................................................................................... 9
2.1.2 Ethernet Connectivity ............................................................................................. 10
2.1.3 Crypto Accelerators ............................................................................................... 10
2.1.4 USB Connectivity .................................................................................................. 10
2.1.5 Motion Control ..................................................................................................... 10
2.1.6 User Switches and LED's ........................................................................................ 11
2.1.7 BoosterPacks and Headers ...................................................................................... 12
2.1.7.1 BoosterPack 1 ............................................................................................... 12
2.1.7.2 BoosterPack 2 ............................................................................................... 14
2.1.7.3 Breadboard Connection .................................................................................... 16
2.1.7.4 Other Headers and Jumpers .............................................................................. 20
2.2 Power Management........................................................................................................ 20
2.2.1 Power Supplies .................................................................................................... 20
2.2.2 Low Power Modes ................................................................................................ 21
2.2.3 Clocking ............................................................................................................ 21
2.2.4 Reset ................................................................................................................ 21
2.3 Debug Interface............................................................................................................. 21
2.3.1 In-Circuit Debug Interface (ICDI) ................................................................................ 21
2.3.2 External Debugger ................................................................................................ 22
2.3.3 Virtual COM Port .................................................................................................. 22
3 Software Development ........................................................................................................ 23
3.1 Secure IoT Demo........................................................................................................... 23
3.1.1 Software Description .............................................................................................. 23
3.1.2 Source Code Download and Build Instructions ............................................................... 23
3.2 TivaWare for C Series Software .......................................................................................... 23
3.2.1 Software Description .............................................................................................. 23
3.2.2 Source Code ....................................................................................................... 24
3.2.3 Tool Options ....................................................................................................... 24
3.3 Programming the Crypto Connected LaunchPad ...................................................................... 24
4 References ........................................................................................................................ 25
4.1 References .................................................................................................................. 25
A PCB Layout and Bill of Materials .......................................................................................... 26
A.1 Component Locations ..................................................................................................... 26
A.2 Bill of Materials ............................................................................................................. 27
B Schematic ......................................................................................................................... 30
2 Contents SPMU372A – September 2015 – Revised October 2016

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Copyright © 2015–2016, Texas Instruments Incorporated
www.ti.com
Revision History .......................................................................................................................... 31
SPMU372A – September 2015 – Revised October 2016 Contents 3

www.ti.com
List of Figures
1-1. TM4C Series Crypto Connected LaunchPad Evaluation Board ....................................................... 5
2-1. TM4C Crypto Connected LaunchPad Evaluation Board Block Diagram ............................................. 9
2-2. Default Jumper Locations ................................................................................................. 20
A-1. Crypto Connected LaunchPad Dimensions and Component Locations ............................................ 26
List of Tables
1-1. EK-TM4C129EXL Specifications .......................................................................................... 7
2-1. BoosterPack 1 GPIO and Signal Muxing ............................................................................... 12
2-2. BoosterPack 2 GPIO and Signal Muxing ............................................................................... 14
2-3. X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing .......................................... 16
2-4. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing ......................................... 18
A-1. Crypto Connected LaunchPad Bill of Materials ........................................................................ 27
4 List of Figures SPMU372A – September 2015 – Revised October 2016

Chapter 1
SPMU372A – September 2015 – Revised October 2016
Board Overview
The TM4C Series TM4C129E Crypto Connected LaunchPad™ Evaluation Board (EK-TM4C129EXL) is a
low-cost evaluation platform for ARM® Cortex®-M4F-based microcontrollers. The Crypto Connected
LaunchPad design highlights the TM4C129ENCPDT microcontroller with its on-chip crypto acceleration
hardware, 10/100 Ethernet MAC and PHY, USB 2.0, hibernation module, motion control pulse-width
modulation and a multitude of simultaneous serial connectivity. The Crypto Connected LaunchPad also
features two user switches, four user LEDs, dedicated reset and wake switches, a breadboard expansion
option and two independent BoosterPack XL expansion connectors. The pre-programmed out of the box
demo on the Crypto Connected LaunchPad also enables remote monitoring and control of the evaluation
board securely from an internet browser anywhere in the world. The web interface is provided by 3rd
party, Exosite. Each Crypto Connected LaunchPad is enabled on the Exosite platform allowing users to
create and customize their own secure Internet-of-Things (IoT) applications.
Figure 1-1 shows a photo of the Crypto Connected LaunchPad with key features highlighted.
Figure 1-1. TM4C Series Crypto Connected LaunchPad Evaluation Board
LaunchPad, TivaWare, Code Composer Studio are trademarks of Texas Instruments.

ARM, Cortex, RealView, IAR Embedded Workbench are registered trademarks of ARM Limited.
All other trademarks are the property of their respective owners.
SPMU372A – September 2015 – Revised October 2016 Board Overview 5

Kit Contents www.ti.com
1.1 Kit Contents

The Crypto Connected LaunchPad Evaluation Kit contains the following items:
• TM4C Series TM4C129E Evaluation Board (EK-TM4C129EXL)
• Retractable Ethernet cable
• USB Micro-B plug to USB-A plug cable
• 90° 49x2 breadboard header
• Meet the TM4C Series TM4C129E Crypto LaunchPad Evaluation Kit (SPMZ862)
1.2 Using the Crypto Connected LaunchPad

The recommended steps for using the Crypto Connected LaunchPad Evaluation Kit are:
1. Follow the README First document included in the kit. The README First helps you get the
Crypto Connected LaunchPad up and running in minutes. Within just a few minutes you can be
controlling and monitoring the Crypto Connected LaunchPad through the internet using Exosite and the
pre-programmed out of the box demo.
2. Experiment with BoosterPacks. This evaluation kit conforms to the latest revision of the BoosterPack
pinout standard. It has two independent BoosterPack connections to enable a multitude of expansion
opportunities.
3. Take the first step towards developing your own applications. The Crypto Connected LaunchPad
is supported by TivaWare™ for C Series. All the applications that work on TM4C series TM4C1294
Connected LaunchPad Evaluation Board (EK-TM4C1294XL) will work on the Crypto Connected
LaunchPad. After installing TivaWare, look in the installation directory for examples\boards\EK-
TM4C1294XL. You can find pre-configured example applications for the Connected LaunchPad board
as well as for with selected BoosterPacks. These examples will work on the Crypto Connected
LaunchPad board. Alternately, use Energīa for a wiring framework-based cross-platform, fast-
prototyping environment that works with this and other TI LaunchPads. For more details about software
development, see Chapter 3 of this document. TivaWare can be downloaded from the TI website at
http://www.ti.com/tool/sw-tm4c. Energīa can be found at http://energia.nu.
4. Customize and integrate the hardware to suit your end application. This evaluation kit can be
used as a reference for building your own custom circuits based on TM4C microcontrollers or as a
foundation for expansion with your custom BoosterPack or other circuit. This manual can serve as a
starting point for this endeavor.
5. Get Trained. You can also download hours of written and video training materials on this and related
LaunchPads. For more information, visit the TM4C Series LaunchPad Workshop Wiki.
6. More Resources. For more information and the available BoosterPacks, see the TI MCU LaunchPad
web page (http://www.ti.com/tiva-c-launchpad).
1.3 Features
Your Crypto Connected LaunchPad includes the following features:
• TM4C129ENCPDT microcontroller
• Ethernet connectivity with fully integrated 10/100 Ethernet MAC and PHY motion control pulse width
modulation (PWM)
• Crypto acceleration hardware blocks
• USB 2.0 Micro A/B connector
• Four user LEDs
• Two user buttons
• One independent hibernate wake switch
• One independent microcontroller reset switch
6 Board Overview SPMU372A – September 2015 – Revised October 2016

www.ti.com BoosterPacks
• Jumper for selecting power source:

– ICDI USB
– USB Device
– BoosterPack
• Preloaded secure access of Internet-of-Things product to Exosite application
• I/O brought to board edge for breadboard expansion
• Two independent BoosterPack XL standard connectors featuring stackable headers to maximize
expansion through BoosterPack ecosystem
– For a complete list of BoosterPacks, see the TI MCU LaunchPad web page:
http://www.ti.com/launchpad
1.4 BoosterPacks
The Crypto Connected LaunchPad provides an easy and inexpensive way to develop applications with the
TM4C129ENCPDT microcontroller. BoosterPacks are add-on boards that follow a pin-out standard
created by Texas Instruments. The TI and third-party ecosystem of BoosterPacks greatly expands the
peripherals and potential applications that you can easily explore with the Crypto Connected LaunchPad.
You can also build your own BoosterPack by following the design guidelines on TI’s website. Texas
Instruments even helps you promote your BoosterPack to other members of the community. TI offers a
variety of avenues for you to reach potential customers with your solutions.
1.5 Energīa
Energīa is an open-source electronics prototyping platform started in January of 2012 with the goal of
bringing the Wiring and Arduino framework to the TI LaunchPad community. Energīa includes an
integrated development environment (IDE) that is based on Processing.
Together with Energīa, LaunchPads can be used to develop interactive objects, taking inputs from a
variety of switches or sensors, and controlling a variety of lights, motors, and other physical outputs.
LaunchPad projects can be stand-alone (only run on the target board, for example, your LaunchPad), or
they can communicate with software running on your computer (Host PC). Energīa projects are highly
portable between supported LaunchPad platforms.
More information is available at http://energia.nu.
1.6 Specifications
Table 1-1 summarizes the specifications for the Crypto Connected LaunchPad.
Table 1-1. EK-TM4C129EXL Specifications

Parameter Value
4.75 VDC to 5.25 VDC from one of the following sources: See schematic symbol JP1 for
power input selection.
• Debug USB U22 (ICDI) USB Micro-B cable connected to PC or other compatible
power source.
Board Supply Voltage • Target USB (U7) USB Micro-B cable connected to PC or other compatible power
source.
• BoosterPack 1 (X8-4)
• BoosterPack 2 (X6-4)
• Breadboard expansion header (X11-2 or X11-97).
Dimensions 4.9 in x 2.2 in x .425 in (12.45 cm x 5.59 cm x 10.8 mm) (L x W x H)
• 5 VDC to BoosterPacks, current limited by TPS2052B. Nominal rating 1 Amp.
Board input power supply limitations may also apply.
Break-out Power Output • 3.3 VDC to BoosterPacks, limited by output of TPS73733 LDO. This 3.3-V plane is
shared with on-board components. Total output power limit of TPS73733 is 1
Amp.
RoHS Status Compliant
SPMU372A – September 2015 – Revised October 2016 Board Overview 7

Specifications www.ti.com
8 Board Overview SPMU372A – September 2015 – Revised October 2016

Chapter 2
Hardware Description
The Crypto Connected LaunchPad includes a TM4C129ENCPDT microcontroller with an integrated

10/100 Ethernet MAC and PHY and crypto acceleration blocks. This advanced ARM Cortex M4F MCU
has a wide range of peripherals that are made available to users via the on-board accessories and the
BoosterPack connectors. This chapter explains how those peripherals operate and interface to the
microcontroller.
Figure 2-1 provides a high-level block diagram of the Crypto Connected LaunchPad.
Debug USB
Power Select
and Generate
ICDI
JTAG IN
USB 2.0
TM4C TM4C129ENCPDT BoosterPack XL

Ethernet Target Connection 2
Breadboard User BoosterPack XL

Expansion Switches LEDs
Connection 1
Figure 2-1. TM4C Crypto Connected LaunchPad Evaluation Board Block Diagram
2.1 Functional Description
2.1.1 Microcontroller
The TM4C129ENCPDT is a 32-bit ARM Cortex-M4F based microcontroller with 1024-kB Flash memory,
256-kB SRAM, 6-kB EEPROM, and 120 MHz operation; integrated 10/100 Ethernet MAC and PHY;
integrated hardware crypto accelerators; integrated USB 2.0 connectivity with external high-speed USB
3.0 PHY capability; a hibernation module, a multitude of serial connectivity and motion control PWM; as
well as a wide range of other peripherals. For more complete details, see the TM4C129ENCPDT
microcontroller data sheet.
Most of the microcontroller’s signals are routed to 0.1-in (2.54-mm) pitch headers or through-hole solder
pads. An internal multiplexor allows different peripheral functions to be assigned to each of these general-
purpose input/output (GPIO) pads. When adding external circuitry, consider the additional load on the
evaluation board power rails.
The TM4C129ENCPDT microcontroller is factory-programmed with an out of the box demo program. The
out of the box program resides in on-chip Flash memory and runs each time power is applied, unless the
out of the box application has been replaced with a user program. The out of the box application
automatically connects to https://ti.exosite.com when an internet connection is provided through the RJ45
Ethernet jack on the evaluation board.
SPMU372A – September 2015 – Revised October 2016 Hardware Description 9

Functional Description www.ti.com
2.1.2 Ethernet Connectivity

The Crypto Connected LaunchPad is designed to connect directly to an Ethernet network using RJ45 style
connectors. The microcontroller contains a fully integrated Ethernet MAC and PHY. This integration
creates a simple, elegant and cost-saving Ethernet circuit design. Example code is available for both the
uIP and LwIP TCP/IP protocol stacks. The embedded Ethernet on this device can be programmed to act
as an HTTP server, client or both. The design and integration of the circuit and microcontroller also enable
users to synchronize events over the network using the IEEE1588 precision time protocol.
When configured for an Ethernet operation, it is recommended that the user configure LED D3 and D4 to
be controlled by the Ethernet MAC to indicate connection and transmit/receive status.
2.1.3 Crypto Accelerators

The Crypto Connected LaunchPad features the hardware acceleration blocks such as Advanced
Encryption Standard (AES), Data Encryption Standard (DES), and Secure Hash Algorithm/MD5 Message
Digest Algorithm (SHA/MD5) that offload data encryption and decryption functions from CPU. These
hardware cipher blocks support the µDMA operation and have improved performance over software cipher
blocks.
The AES block is a symmetric cipher module that supports multiple encrypt and decrypt operations,
feedback operating modes, authentication modes, key sizes (128 bit, 192 bit, or 256 bit) and key
scheduling in hardware. The DES block is also a symmetric cipher module with DES/3DES encryption and
decryption along with support for multiple feedback operating modes. The SHA/MD5 block is a hash
module that can run functions like MD5, SHA-1, SHA224, SHA256 and Hash message authentication
code (HMAC).
2.1.4 USB Connectivity

The Crypto Connected LaunchPad is designed to be USB 2.0 ready. A TPS2052B load switch is
connected to and controlled by the microcontroller USB peripheral, which manages power to the USB
micro A/B connector when functioning in a USB host. When functioning as a USB device, the entire
Crypto Connected LaunchPad can be powered directly from the USB micro A/B connector. Use JP1 to
select the desired power source.
USB 2.0 functionality is provided and supported directly out of the box with the target USB micro A/B
connector. High-speed USB 3.0 functionality can be enabled by adding an external USB PHY. The USB
external PHY control and data signals are provided on the breadboard expansion header X11.
2.1.5 Motion Control

The Crypto Connected LaunchPad includes the TM4C Series Motion Control PWM technology, featuring a
PWM module capable of generating eight PWM outputs. The PWM module provides a great deal of
flexibility and can generate simple PWM signals (for example, those signals required by a simple charge
pump, as well as paired PWM signals with dead-band delays such as those required by a half-H bridge
driver). Three generator blocks can also generate the full six channels of gate controls required by a 3-
phase inverter bridge.
A quadrature encoder interface (QEI) is also available to provide motion control feedback.
For details about the availability of these signals on the BoosterPack interfaces, see the BoosterPacks
and Headers of this document.
10 Hardware Description SPMU372A – September 2015 – Revised October 2016

www.ti.com Functional Description
2.1.6 User Switches and LED's

Two user switches are provided for input and control of the TM4C129ENCPDT software. The switches are
connected to GPIO pins PJ0 and PJ1.
A reset switch and a wake switch are also provided. The reset switch initiates a system reset of the
microcontroller whenever it is pressed and released. Pressing the reset switch also asserts the reset
signal to the BoosterPack and Breadboard headers. The wake switch is one way to bring the device out of
hibernate mode.
Four user LEDs are provided on the board. D1 and D2 are connected to GPIOs PN1 and PN0. These
LEDs are dedicated for use by the software application. D3 and D4 are connected to GPIOs PF4 and
PF0, which can be controlled by user’s software or the integrated Ethernet module of the microcontroller.
A power LED is also provided to indicate that 3.3 V power is present on the board.

2.1.7 BoosterPacks and Headers
2.1.7.1 BoosterPack 1
The Crypto Connected LaunchPad features two fully independent BoosterPack XL connectors. BoosterPack 1, located around the ICDI portion of
the board, is fully compliant with the BoosterPack standard with the single exception of GPIO pin PA6 (X8-16), which does not provide analog
capability. PA6 is located near the bottom of the inner left BoosterPack XL header.
Inter-integrated circuit (I2C) is provided in both the original BoosterPack standard configuration as well as the updated standard location. Use of
I2C on the bottom left of the BoosterPack connections per the updated standard is highly encouraged whenever possible.
Motion control advanced PWM connections are provided on the inner right connector for motion control applications.
Table 2-1 provides a complete listing of the BoosterPack pins and the GPIO alternate functions available on each pin. The TM4C129ENCPDT
GPIO register GPIOPCTL values are shown for each configuration. The headers in this table are labeled from left to right in ten pin columns. ‘A’
and ‘D’ make up the outer BoosterPack standard pins, ‘B’ and ‘C’ make up the inner BoosterPack XL standard pins.
Table 2-1. BoosterPack 1 GPIO and Signal Muxing

Digital Function (GPIOPCTL Bit Encoding)
Standard MCU
Header Pin Function GPIO Pin Analog 1 2 3 5 6 7 8 11 13 14 15
A1 1 +3.3 V 3.3 V
A1 2 Analog PE4 123 AIN9 U1RI - - - - - - - - - SSI1XDAT0
A1 3 UART RX PC4 25 C1- U7Rx - - - - - - - - - EPI0S7
A1 4 UART TX PC5 24 C1+ U7Tx - - - - RTCCLK - - - - EPI0S6
A1 5 GPIO PC6 23 C0+ U5Rx - - - - - - - - - EPI0S5
A1 6 Analog PE5 124 AIN8 - - - - - - - - - - SSIXDAT1
A1 7 SPI CLK PD3 4 AIN12 - I2C8SDA T1CCP1 - - - - - - - SSI2CLk
A1 8 GPIO PC7 22 C0- U5Tx - - - - - - - - - EPI0S4
A1 9 I2C SCL PB2 91 - - I2C0SCL T5CCP0 - - - - - - USB0STP EPI0S27
A1 10 I2C SDA PB3 92 - - I2C0SDA T5CCP1 - - - - - - USB0CLK EPI0S28
B1 1 +5 volts 5V
B1 2 Ground GND
B1 3 Analog PE0 15 AIN3 U1RTS - - - - - - - - - -
B1 4 Analog PE1 14 AIN2 U1DSR - - - - - - - - - -
B1 5 Analog PE2 13 AIN1 U1DCD - - - - - - - - - -
B1 6 Analog PE3 12 AIN0 U1DTR - - - - - - - - - -
B1 7 Analog PD7 128 AIN4 U2CTS - T4CCP1 USB0PFLT - - NMI - - - SSI2XDAT2
B1 8 Analog PA6 40 - U2Rx I2C6SCL T3CCP0 USB0EPEN - - - - SSI0XDAT2 - EPI0S8
B1 9 A out PM4 74 TMPR3 U0CTS - T4CCP0 - - - - - - - -
B1 10 A out PM5 73 TMPR2 U0DCD - T4CCP1 - - - - - - - -

Table 2-1. BoosterPack 1 GPIO and Signal Muxing (continued)

Standard MCU
C1 1 PWM PF1 43 - - - - EN0LED2 M0PWM1 - - - - SSI3XDAT0 TRD1
C1 2 PWM PF2 44 - - - - - M0PWM2 - - - - SSI3Fss TRD0
C1 3 PWM PF3 45 - - - - - M0PWM3 - - - - SSI3Clk TRCLK
C1 4 PWM PG0 49 - - I2C1SCL - EN0PPS M0PWM4 - - - - - EPI0S11
C1 5 Capture PL4 85 - - - T0CCP0 - - - - - - USB0D4 EPI0S26
C1 6 Capture PL5 86 - - - T0CCP1 - - - - - - USB0D5 EPI0S33
C1 7 GPIO PL0 81 - - I2C2SDA - - M0FAULT3 - - - - USB0D0 EPI0S16
C1 8 GPIO PL1 82 - - I2C2SCL - - PhA0 - - - - USB0D1 EPI0S17
C1 9 GPIO PL2 83 - - - - C0o PhB0 - - - - USB0D2 EPI0S18
C1 10 GPIO PL3 84 - - - - C1o IDX0 - - - - USB0D3 EPI0S19
D1 1 Ground GND
D1 2 PWM PM3 75 - - - T3CCP1 - - - - - - - EPI0S12
D1 3 GPIO PH2 31 - U0DCD - - - - - - - - - EPI0S2
D1 4 GPIO PH3 32 - U0DSR - - - - - - - - - EPI0S3
D1 5 Reset RESET
D1 6 SPI MOSI PD1 2 AIN14 - I2C7SDA T0CCP1 C1o - - - - - - SSI2XDAT0
D1 7 SPI MISO PD0 1 AIN15 - I2C7SCL T0CCP0 C0o - - - - - - SSI2XDAT1
D1 8 GPIO PN2 109 - U1DCD U2RTS - - - - - - - - EPI0S29
D1 9 GPIO PN3 110 - U1DSR U2CTS - - - - - - - - EPI0S30
D1 10 GPIO PP2 103 - U0DTR - - - - - - - - USB0NXT EPI0S29

2.1.7.2 BoosterPack 2
The second BoosterPack XL interface is located near the middle of the board. This interface is fully compliant with the BoosterPack standard and
adds features not covered by the BoosterPack standard that enable operation with additional BoosterPacks.
An additional analog signal is provided on the outer left header (X6-9). This signal can be used to monitor the touch panel on the popular Kentec
EB-LM4F120-L35 BoosterPack.
Using the jumpers JP4 and JP5, Controller Area Network (CAN) digital receive and transmit signals can be optionally routed to the BoosterPack 2
interface. The location of these signals is consistent with the CAN interface on the TM4C Series TM4C123G LaunchPad and the Stellaris
LM4F120 LaunchPad. In the default configuration, UART0 is used for the ICDI virtual UART and CAN is not present on the BoosterPack headers.
In this configuration, the ROM serial bootloader can be used over the ICDI virtual UART. When the jumpers are configured for CAN on the
BoosterPack, then UART2 must be used for the ICDI virtual UART.
To comply with both the original and the new BoosterPack standard, I2C is provided on both sides of the BoosterPack connection. Use of I2C on
the bottom left of the BoosterPack connection is highly encouraged where possible, to be in compliance with the new BoosterPack standard. To
provide I2C capability on the right side of the connector, per the original standard, two zero-ohm resistors (R19 and R20) are used to combine the
SPI and I2C signals. These signals are not shared with any other pins on the LaunchPad and therefore removal of these zero-ohm resistors
should not be required. Software should be certain that unused GPIO signals are configured as inputs.
Table 2-2 provides a complete listing of the BoosterPack pins and the GPIO alternate functions available at each pin. The TM4C129ENCPDT
GPIO register GPIOPCTL values are shown for each configuration. The headers in this table are labeled from left to right in ten pin columns. ‘A’
and ‘D’ make up the outer BoosterPack standard pins, ‘B’ and ‘C’ make up the inner BoosterPack XL standard pins.
Table 2-2. BoosterPack 2 GPIO and Signal Muxing

Digital Function (FPIOPCTL Bit Encoding)
Standard MCU
A2 1 3.3 V
A2 2 Analog PD2 3 AIN13 - I2C8SCL T1CCP0 C2o - - - - - - SSI2Fss
A2 3 UART RX PP0 118 C2+ U6Rx - - - - - - - - - SSI3XDAT2
A2 4 UART TX PP1 119 C2- U6Tx - - - - - - - - - SSI3XDAT3
GPIO PD4 125 AIN7 U2Rx - T3CCP0 - - - - - - - SSI1XDAT2
A2 5
(See JP4) PA0 33 - U0Rx I2C9SCL T0CCP0 - - CANORx - - - - -
Analog PD5 126 AIN6 U2Tx - T3CCP1 - - - - - - - SSI1XDAT3
A2 6
(See JP5) PA1 34 - U0Tx I2C9SDA T0CCP1 - - CAN0Tx - - - - -
A2 7 SPI CLK PQ0 5 - - - - - - - - - - SSI3Clk EPI0S20
A2 8 GPIO PP4 105 - U3RTS U0DSR - - - - - - - USB0D7 -
A2 9 I2C SCL PN5 112 - U1RI U3CTS I2C2SCL - - - - - - - EPIO0S35
A2 10 I2C SDA PN4 111 - U1DTR U3RTS I2C2SDA - - - - - - - EPIO0S34
B2 1 5V
B2 2 GND
B2 3 Analog PB4 121 AIN10 U0CTS I2C5SCL - - - - - - - - SSI1Fss

Table 2-2. BoosterPack 2 GPIO and Signal Muxing (continued)

Digital Function (FPIOPCTL Bit Encoding)
Standard MCU
B2 4 Analog PB5 120 AIN11 U0RTS I2C5SDA - - - - - - - - SSI1Clk
B2 5 Analog PK0 18 AIN16 U4Rx - - - - - - - - - EPI0S0
B2 6 Analog PK1 19 AIN17 U4Tx - - - - - - - - - EPI0S1
B2 7 Analog PK2 20 AIN18 U4RTS - - - - - - - - - EPI0S2
B2 8 Analog PK3 21 AIN19 u4CTS - - - - - - - - - EPI0S3
B2 9 A out PA4 37 - U3Rx I2C7SCL T2CCP0 - - - - - - - SSI0XDAT0
B2 10 A out PA5 38 - U3Tx I2C7SDA T2CCP1 - - - - - - - SSI0XDAT1
C2 1 PWM PG1 50 - - I2C1SDA - - M0PWM5 - - - - - EPI0S10
C2 2 PWM PK4 63 - - I2C3SCL - EN0LED0 M0PWM6 - - - - - EPI0S32
C2 3 PWM PK5 62 - - I2C3SDA - EN0LED2 M0PWM7 - - - - - EPI0S31
C2 4 PWM PM0 78 - - - T2CCP0 - - - - - - - EPI0S15
C2 5 Capture PM1 77 - - - T2CCP1 - - - - - - - EPI0S14
C2 6 Capture PM2 76 - - - T3CCP0 - - - - - - - EPI0S13
C2 7 GPIO PH0 29 - U0RTS - - - - - - - - - EPI0S0
C2 8 GPIO PH1 30 - U0CTS - - - - - - - - - EPI0S1
C2 9 GPIO PK6 61 - - I2C4SCL - EN0LED1 M0FAULT1 - - - - - EPI0S25
C2 10 GPIO PK7 60 - U0RI I2C4SDA - RTCCLK M0FAULT2 - - - - - EPI0S24
D2 1 GND
D2 2 PWM PM7 71 TMPR0 U0RI - T5CCP1 - - - - - - - -
D2 3 GPIO PP5 106 - U3CTS I2C2SDL - - - - - - - USB0D6 -
D2 4 GPIO PA7 41 - U2Tx I2C6SDA T3CCP1 USB0PFLT - - - USB0EPEN SSI0XDAT3 - EPI0S9
D2 5 RESET
SPI MOSI PQ2 11 - - - - - - - - - - SSI3XDAT0 EPI0S22
D2 6
I2C PA3 36 - U4Tx I2C8SDA T1CCP1 - - - - - - - SSI0Fss
SPI MISO PQ3 27 - - - - - - - - - - SSI3XDAT1 EPI0S23
D2 7
I2C PA2 35 - U4Rx I2C8SCL T1CCP0 - - - - - - - SSI0Clk
D2 8 GPIO PP3 104 - U1CTS U0DCD - - - - - - - USB0DIR EPI0S30
D2 9 GPIO PQ1 6 - - - - - - - - - - SSI3Fss EPI0S21
D2 10 GPIO PM6 72 TMPR1 U0DSR - T5CCP0 - - - - - - - -

2.1.7.3 Breadboard Connection

The breadboard adapter section of the board is a set of 98 holes on a 0.1 inch grid. Properly combined with a pair of right angle headers, the
entire Crypto Connected LaunchPad can be plugged directly into a standard 300 mil (0.3 inch) wide solder-less breadboard. The right angle
headers and breadboard are not provided with this kit. Suggested part numbers are Samtec TSW-149-09-L-S-RE and TSW-149-08-L-S-RA right
angle pin headers and Twin industries TW-E40-1020 solder-less breadboard. Samtec TSW-149-09-F-S-RE and TSW-149-09-F-S-RA may be
substituted.
A detailed explanation of how to install the headers is available on the TI LaunchPad Wiki or at
http://users.ece.utexas.edu/~valvano/EE345L/Labs/Fall2011/LM3S1968soldering.pdf.
Nearly all microcontroller signals are made available at the breadboard adapter holes (X11). These signals are grouped by function, where
possible. For example, all EPI signals are grouped on one side of the connector. Many of the analog signals are grouped near VREF, and UART,
SSI and I2C signals are grouped by peripheral to make expansion and customization simpler.
Table 2-3 and Table 2-4 show the GPIO pin and signal muxing for the X11 breadboard adapter pads.
Table 2-3. X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing
MCU
Pin Port PIN Analog 1 2 3 5 6 7 8 11 13 14 15
1 3V3
3 GND
5 PB4 121 AIN10 U0CTS I2C5SCL - - - - - - - - SSI1Fss
7 PB5 120 AIN11 U0RTS I2C5SDA - - - - - - - - SSI1Clk
9 PH0 29 - U0RTS - - - - - - - - - EPI0S0
11 PH1 30 - U0CTS - - - - - - - - - EPI0S1
13 PH2 31 - U0DCD - - - - - - - - - EPI0S2
15 PH3 32 - U0DSR - - - - - - - - - EPI0S3
17 PC7 22 C0- U5Tx - - - - - - - - - EPI0S4
19 PC6 23 C0+ U5Rx - - - - - - - - - EPI0S5
21 PC5 24 C1+ U7Tx - - - - RTCCLK - - - - EPI0S6
23 PC4 25 C1- U7Rx - - - - - - - - - EPI0S7
25 PA6 40 - U2Rx I2C6SCL T3CCP0 USB0EPEN - - - - SSI0XDAT2 - EPI0S8
27 PA7 41 - U2Tx I2C6SDA T3CCP1 USB0PFLT - - - USB0EPEN SSI0XDAT3 - EPI0S9
29 PG1 50 - - I2C1SDA - - M0PWM5 - - - - - EPI0S10
31 PG0 49 - - I2C1SCL - EN0PPS M0PWM4 - - - - - EPI0S11
33 PM3 75 - - - T3CCP1 - - - - - - - EPI0S12
35 GND
37 PM2 76 - - - T3CCP0 - - - - - - - EPI0S13
39 PM1 77 - - - T2CCP1 - - - - - - - EPI0S14

Table 2-3. X11 Breadboard Adapter Odd-Numbered Pad GPIO and Signal Muxing (continued)
MCU
41 PM0 78 - - - T2CCP0 - - - - - - - EPI0S15
43 PL0 81 - - I2C2SDA - - M0FAULT3 - - - - USB0D0 EPI0S16
45 PL1 82 - - I2C2SCL - - PhA0 - - - - USB0D1 EPI0S17
47 PL2 83 - - - - C0o PhB0 - - - - USB0D2 EPI0S18
49 PL3 84 - - - - C1o IDX0 - - - - USB0D3 EPI0S19
51 PQ0 5 - - - - - - - - - - SSI3Clk EPI0S20
53 PQ1 6 - - - - - - - - - - SSI3Fss EPI0S21
55 PQ2 11 - - - - - - - - - - SSI3XDAT0 EPI0S22
57 PQ3 27 - - - - - - - - - - SSI3XDAT1 EPI0S23
59 PK7 60 - U0RI I2C4SDA - - - - - - EPI0S24
61 GND
63 PK6 61 - - I2C4SCL - EN0LED1 M0FAULT1 - - - - - EPI0S25
65 PL4 85 - - - T0CCP0 - - - - - - USB0D4 EPI0S26
67 PB2 91 - - I2C0SCL T5CCP0 - - - - - - USB0STP EPI0S27
69 PB3 92 - - I2C0SDA T5CCP1 - - - - - - USB0CLK EPI0S28
71 PP2 103 - U0DTR - - - - - - - - USB0NXT EPI0S29
73 PP3 104 - U1CTS U0DCD - - - RTCCLK - - - USB0DIR EPI0S30
75 PK5 62 - - I2C3SDA - EN0LED2 M0PWM7 - - - - - EPI0S31
77 PK4 63 - - I2C3SCL - EN0LED0 M0PWM6 - - - - - EPI0S32
79 PL5 86 - - - T0CCP1 - - - - - - USB0D5 EPI0S33
81 PN4 111 - U1DTR U3RTS I2C2SDA - - - - - - - EPI0S34
83 PN5 112 - U1RI U3CTS I2C2SCL - - - - - - - EPI0S35
85 PN0 107 - U1RTS - - - - - - - - - -
87 PN1 108 - U1CTS - - - - - - - - - -
89 PN2 109 - U1DCD U2RTS - - - - - - - - EPI0S29
91 PN3 110 - U1DSR U2CTS - - - - - - - - EPI0S30
93 PQ4 102 - U1Rx - - - - - DIVSCLK - - - -
95 WAKE
97 5V

Table 2-4. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing
MCU
2 5V
4 GND
6 PA2 35 - U4Rx I2C8SCL T1CCP0 - - - - - - - SSI0Clk
8 PA3 36 - U4Tx I2C8SDA T1CCP1 - - - - - - - SSI0Fss
10 PA4 37 - U3Rx I2C7SCL T2CCP0 - - - - - - - SSI0XDAT0
12 PA5 38 - U3Tx I2C7SDA T2CCP1 - - - - - - - SSI0XDAT1
14 PE0 15 AIN3 U1RTS - - - - - - - - - -
16 PE1 14 AIN2 U1DSR - - - - - - - - - -
18 PE2 13 AIN1 U1DCD - - - - - - - - - -
20 PE3 12 AIN0 U1DTR - - - - - - - - - -
22 PE4 123 AIN9 U1RI - - - - - - - - - SSI1XDAT0
24 PE5 124 AIN8 - - - - - - - - - - SSI1XDAT1
26 PK0 18 AIN16 U4Rx - - - - - - - - - EPI0S0
28 PK1 19 AIN17 U4Tx - - - - - - - - - EPI0S1
30 PK2 20 AIN18 U4RTS - - - - - - - - - EPI0S2
32 PK3 21 AIN19 U4CTS - - - - - - - - - EPI0S3
34 VREF
36 GND
38 PD5 126 AIN6 U2Tx - T3CCP1 - - - - - - - SSI1XDAT3
40 PD4 125 AIN7 U2Rx - T3CCP0 - - - - - - - SSI1XDAT2
42 PD7 128 AIN4 U2CTS - T4CCP1 USB0PFLT - - NMI - - - SSI2XDAT2
44 PD6 127 AIN5 U2RTS - T4CCP0 USB0EPEN - - - - - - SSI2XDAT3
46 PD3 4 AIN12 - I2C8SDA T1CCP1 - - - - - - - SSI2Clk
48 PD1 2 AIN14 - I2C7SDA T0CCP1 C1o - - - - - - SSI2XDAT0
50 PD0 1 AIN15 - I2C7SCL T0CCP0 C0o - - - - - - SSI2XDAT1
52 PD2 3 AIN13 - I2C8SCL T1CCP0 C2o - - - - - - SSI2Fss
54 PP0 118 C2+ U6Rx - - - - - - - - - SSI3XDAT2
56 PP1 119 C2- U6Tx - - - - - - - - - SSI3XDAT3
58 PB0 95 USB0ID U1Rx I2C5SCL T4CCP0 - - CAN1Rx - - - - -
60 PB1 96 USB0VBUS U1Tx I2C5SDA T4CCP1 - - CAN1Tx - - - - -
62 GND
64 PF4 46 - - - - EN0LED1 M0FAULT0 - - - - SSI3XDAT2 TRD3
66 PF0 42 - - - - EN0LED0 M0PWM0 - - - - SSI3XDAT1 TRD2

Table 2-4. X11 Breadboard Adapter Even-Numbered Pad GPIO and Signal Muxing (continued)
MCU
68 PF1 43 - - - - EN0LED2 M0PWM1 - - - - SSI3XDAT0 TRD1
70 PF2 44 - - - - - M0PWM2 - - - - SSI3Fss TRD0
72 PF3 45 - - - - - M0PWM3 - - - - SSI3Clk TRCLK
74 PA0 33 - U0Rx I2C9SCL T0CCP0 - - CAN0Rx - - - - -
76 PA1 34 - U0Tx I2C9SDA T0CCP1 - - CAN0Tx - - - - -
78 PP4 105 - U3RTS U0DSR - - - - - - - USB0D7 -
80 PP5 106 - U3CTS I2C2SCL - - - - - - - USB0D6 -
82 PJ0 116 - U3Rx - - - - - - - - -
84 PJ1 117 - U3Tx - - - - - - - - - -
86 PM7 71 TMPR0 U0RI - T5CCP1 - - - - - - - -
88 PM6 72 TMPR1 U0DSR - T5CCP0 - - - - - - - -
90 PM5 73 TMPR2 U0DCD - T4CCP1 - - - - - - - -
92 PM4 74 TMPR3 U0CTS - T4CCP0 - - - - - - - -
94 RESET
96 GND
98 3V3

Power Management www.ti.com
2.1.7.4 Other Headers and Jumpers

JP1 is provided to select the power input source for the Crypto Connected LaunchPad. The top position is
for BoosterPack power; this position also disconnects both USB voltages from the board’s primary 5-V
input. In the top position, the TPS2052B does not limit current so additional care should be exercised. The
middle position draws power from the USB connector on the left side of the board near the Ethernet jack.
The bottom position is the default, in which power is drawn from the ICDI (Debug) USB connection.
JP2 separates the MCU 3.3-V power domain from the rest of the 3.3-V power on the board allowing an
ammeter to be used to obtain more accurate measurements of microcontroller power consumption.
JP3 isolates the output of the TPS73733 LDO from the board’s 3.3-V power domain.
JP4 and JP5 are used to configure CAN signals to the BoosterPack 2 interface. In the default horizontal
configuration, CAN is not present on the BoosterPack. UART2 goes to the BoosterPack and UART 0 goes
to the ICDI virtual serial port to provide ROM serial bootloader capability. In the vertical CAN-enabled
configuration, UART2 goes to the ICDI virtual serial port and CAN signals are available on the
BoosterPack. The ROM serial bootloader is not available to the ICDI virtual serial port while the jumpers
are in the CAN position.
Figure 2-2 shows the default configuration and relative location of the jumpers on the board.
Figure 2-2. Default Jumper Locations
2.2 Power Management
2.2.1 Power Supplies

The Crypto Connected LaunchPad can be powered from three different input options:
• On-board ICDI USB cable (Debug, Default)
• Target USB cable
• BoosterPack or Breadboard adapter connection
The JP1 power-select jumper is used to select one of the power sources.
In addition, the JP3 power jumper can be used to isolate the 3.3-V output of the TPS73733 from the
board’s 3.3-V rail.
A TPS2052B load switch is used to regulate and control power to the Target USB connector when the
microcontroller is acting in USB host mode. This load switch also limits current to the BoosterPack and
Breadboard adapter headers when the JP1 jumper is in the ICDI position.

www.ti.com Power Management
2.2.2 Low Power Modes

The Crypto Connected LaunchPad demonstrates several low power microcontroller modes. In run mode,
the microcontroller can be clocked from several sources such as the internal precision oscillator or an
external crystal oscillator. Either of these sources can then optionally drive an internal PLL to increase the
effective frequency of the system up to 120 MHz. In this way, the run mode clock speed can be used to
manage run mode current consumption.
The microcontroller also provides sleep and deep sleep modes and internal voltage adjustments to the
flash and SRAM to further refine power consumption when the processor is not in use but peripherals
must remain active. Each peripheral can be individually clock gated in these modes so that current
consumption by unused peripherals is minimized. A wide variety of conditions from internal and external
sources can trigger a return to run mode.
The lowest power setting of the microcontroller is hibernation, which requires a small amount of supporting
external circuitry available on the Crypto Connected LaunchPad. The Crypto Connected LaunchPad can
achieve microcontroller current consumption modes under 2 micro-Amps using hibernate VDD3ON mode.
Hibernation with VDD3ON mode is not supported on this board. The Crypto Connected LaunchPad can
be woken from hibernate by several triggers including the dedicated wake button, the reset button, an
internal RTC timer and a subset of the device GPIO pins. The hibernation module provides a small area of
internal SRAM that can preserve data through a hibernate cycle.
2.2.3 Clocking
The Crypto Connected LaunchPad uses a 25 MHz crystal (Y1) to drive the main TM4C129ENCPDT
internal clock circuit. Most software examples use the internal PLL to multiply this clock to higher
frequencies up to 120 MHz for core and peripheral timing. The 25-MHz crystal is required when using the
integrated Ethernet MAC and PHY.
The Hibernation module is clocked from an external 32.768-KHz crystal (Y3).
2.2.4 Reset
The RESET signal to the TM4C129ENCPDT microcontroller connects to the RESET switch, BoosterPack
connectors, Breadboard adapter and to the ICDI circuit for a debugger-controller reset.
External reset is asserted (active low) under the following conditions:
• Power-on reset (filtered by and R-C network)
• RESET switch is held down.
• By the ICDI circuit when instructed by the debugger (this capability is optional, and may not be
supported by all debuggers)
• By an external circuit attached to the BoosterPack or Breadboard connectors.
2.3 Debug Interface
2.3.1 In-Circuit Debug Interface (ICDI)

The Crypto Connected LaunchPad comes with an on-board ICDI. The ICDI allows for the programming
and debugging of the TM4C129ENCPDT using LM Flash Programmer and/or any of the supported tool
chains. Note that ICDI only supports JTAG debugging at this time. It is possible to use other JTAG
emulators instead of the on board ICDI, by connecting to U6. When the ICDI detects an external debug
adapter connection on the JTAG connector U6 and disables the ICDI outputs to allow the external debug
adapter to drive the debug circuit. For more information, see Section 2.3.2.
Debug out of the ICDI is possible by removing resistors R6, R7, R8, R10, R11, R15, R16 and R40 from
the Crypto Connected LaunchPad and use the ICDI to drive JTAG signals out on U6 for the purpose of
programming or debugging other boards. To restore the connection to the on-board TM4C129ENCPDT
microcontroller, install jumpers from the odd to even pins of X1 or re-install the resistors. Removal of R40
disables the detection of an attached external debugger. R40 must be installed to use an external debug
adapter to program or debug the Crypto Connected LaunchPad.

Debug Interface www.ti.com
2.3.2 External Debugger

The connector U6 is provided for the attachment of an external debug adapter such as the IAR J-Link or
Keil ULINK. This connector follows the ARM standard 10-pin JTAG pinout. This interface can use either
JTAG or SWD if supported by the external debug adapter.
2.3.3 Virtual COM Port

When plugged into a USB host, the ICDI enumerates as both a debugger and a virtual COM port. JP4 and
JP5 control the selection of which UART from the TM4C129ENCPDT is connected to the virtual COM
port. In the default configuration, UART0 maps to the virtual COM port of the ICDI. In the CAN jumper
configuration, UART2 maps to the virtual COM port of the ICDI.

Chapter 3
Software Development
This chapter provides general information on software development as well as instructions for flash
memory programming.
3.1 Secure IoT Demo
3.1.1 Software Description

The out-of-box “Secure IoT” application demonstrates the use of Transport Layer Security/Secure Sockets
Layer (TLS/SSL) protocol to connect an IoT product to a cloud server securely. This application runs on
TI-RTOS and uses WolfSSL library for TLS/SSL support. The WolfSSL library uses the hardware
encryption accelerators, available on the Crypto Connected LaunchPad board, which enables the
development of connected applications with data encryption (for secure communication) at relatively
higher performance. This application connects to Exosite’s cloud server using HTTPS protocol.
The “Secure IoT” application records information about the Crypto Connected LaunchPad and user activity
on this board, which is securely reported to Exosite cloud server. A command-line interface is provided to
interact with the application. With the command-line interface one can control the eval board like changing
the state of the LED or play a game of tic-tac-toe either locally or with a remote user.
For more details about example usage, see the “Readme.txt” file available with the “Secure IoT”
application.
3.1.2 Source Code Download and Build Instructions

The source code and binary files for the “Secure IoT” application are provided as part of an installer at
http://www.ti.com/lit/zip/spmc022.
Instructions for downloading and installing TI-RTOS and WolfSSL along with detailed instructions on
building WolfSSL libraries for TI-RTOS are provided at
http://processors.wiki.ti.com/index.php/Using_wolfSSL_with_TI-RTOS. This application works with TI-
RTOS v2.14.00.10 or later and WolfSSL v3.6.6 or later.
After building the WolfSSL libraries for TI-RTOS with support for TM4C hardware ciphers, follow the
instructions under “Build Details - Application” in the “Readme.txt” file available with the “Secure IoT”
application’s installation.
3.2 TivaWare for C Series Software
3.2.1 Software Description

The TivaWare software provides drivers for all of the peripheral devices supplied in the design. The TM4C
Series Peripheral Driver Library is used to operate the on-chip peripherals as part of TivaWare.
TivaWare includes a set of example applications that use the TivaWare Peripheral Driver Library. These
applications demonstrate the capabilities of the TM4C129ENCPDT microcontroller, as well as provide a
starting point for the development of the final application for use on the Crypto Connected LaunchPad
evaluation board. Example applications provided for the TM4C Series TM4C1294 Connected LaunchPad
and examples paired with selected BoosterPacks will work with the Crypto Connected LaunchPad.
SPMU372A – September 2015 – Revised October 2016 Software Development 23

TivaWare for C Series Software www.ti.com
3.2.2 Source Code

The complete source code including the source code installation instructions are provided at
http://www.ti.com/tool/sw-tm4c. The source code and binary files are installed in the TivaWare software
tree.
3.2.3 Tool Options

The source code installation includes directories containing projects, makefiles, and binaries for the
following tool-chains:
• Keil ARM RealView® Microcontroller Development System
• IAR Embedded Workbench® for ARM
• Generic GNU C Compiler
• Texas Instruments' Code Composer Studio™ IDE
Download evaluation versions of these tools from the Tools & Software section of www.ti.com/tiva. Due to
code size restrictions, the evaluation tools may not build all example programs. A full license is necessary
to re-build or debug all examples.
For detailed information on using the tools, see the documentation included in the tool chain installation or
visit the website of the tools supplier.
3.3 Programming the Crypto Connected LaunchPad

The TivaWare software package includes pre-built binaries for each of the example applications. If you
installed the TivaWare software to the default installation path of C:\ti\TivaWare_C_Series_<version>, you
can find the example applications in C:\ti\TivaWare_C_Series-<version>\examples\boards\ek-tm4c1294xl.
The on-board ICDI is used with the LM Flash Programmer tool to program applications on the Crypto
Connected LaunchPad.
Follow these steps to program example applications into the Crypto Connected LaunchPad evaulation
board using the ICDI:
1. Install LM Flash Programmer on a PC running Microsoft Windows.
2. Place JP1 into the ICDI position on the Crypto Connected LaunchPad.
3. Connect the USB-A cable plug in to an available USB port on the PC and plug the Micro-B plug to the
Debug USB port (U22) on the Crypto Connected LaunchPad.
4. Verify that LED D0 at the top of the board is illuminated.
5. Install Windows ICDI and Virtual COM Port drivers if prompted. Installation instructions can be found in
the Stellaris® In-Circuit Debug Interface (ICDI) and Virtual COM Port Driver Installation Instructions
(SPMU287).
6. Run the LM Flash Programmer application on the PC.
7. In the Configuration tap, use the Quick Set control to select “TM4C1294XL LaunchPad”.
8. Move to the Program tab and click the Browse button. Navigate to the example applications directory
(the default location is C:\ti\TivaWare_C_Series_<version>\examples\boards\EK-TM4C1294XL\).
9. Each example application has its own directory. Navigate to the example directory that you want to
load and then into the sub-directory for one of the supported tool chains that contains the binary (*.bin)
file. Select the binary file and click Open.
10. Set the Erase Method to Erase Necessary Pages, check the Verify After Program box, and check
Reset MCU After Program. The example program starts execution once the verify process is complete.
24 Software Development SPMU372A – September 2015 – Revised October 2016

Chapter 4
References
4.1 References
In addition to this document the following references are available for download at www.ti.com.
• TivaWare for C Series (http://www.ti.com/tool/sw-tm4c)
• TivaWare Peripheral Driver Library Users' Guide (SPMU298)
• Quick Start Guide: Crypto Connected LaunchPad Evaluation Kit (EK-TM4C129EXL) (SPMZ862)
• LM Flash Programmer Tool (http://www.ti.com/lmflashprogrammer)
• TPS73733 Low-Dropout Regulator with Reverse Current Protection
(http://www.ti.com/product/tps79733)
• Texas Instruments Code Composer Studio website (http://www.ti.com/ccs)
• Tiva TM4C129ENCPDT Microcontroller Data Sheet (SPMS441)
• Build Your Own BoosterPack information regarding the BoosterPack standard (http://www.ti.com/byob)
• Stellaris® In-Circuit Debug Interface (ICDI) and Virtual COM Port Driver Installation Instructions
(SPMU287)
• TI-RTOS (http://www.ti.com/tool/TI-RTOS)
Additional Support:
• Keil RealView MDK-ARM (http://www.keil.com/arm/mdk.asp)
• IAR Embedded Workbench for ARM (http://iar.com/ewarm/)
• Sourcery CodeBench development tools (http://www.mentor.com/embedded-software/sourcery-
tools/sourcery-codebench/overview)
• Exosite (http://ti.exosite.com)
• WolfSSL (http://wolfssl.com)
SPMU372A – September 2015 – Revised October 2016 References 25

Appendix A
PCB Layout and Bill of Materials
A.1 Component Locations

Figure A-1 is a dimensioned drawing of the Crypto Connected LaunchPad that shows the location of
selected features of the board, as well as the component locations.
Figure A-1. Crypto Connected LaunchPad Dimensions and Component Locations
26 PCB Layout and Bill of Materials SPMU372A – September 2015 – Revised October 2016
www.ti.com Bill of Materials
A.2 Bill of Materials

Table A-1 is the Crypto Connected LaunchPad bill of materials list.
Table A-1. Crypto Connected LaunchPad Bill of Materials

Item Ref Qty Description Mfg Part Number
Capacitor, 1000 pF, 2kV,
1 C1 1 Kemet C1210C102MGRACTU
20%, X7R, 1210
C3, C4, C5, C10, C11, C12,
C13, C16, C17, C18, C19,
Capacitor, 0.1 µF 16 V,
2 C21, C22, C23, C24, C25, 26 Taiyo Yuden EMK105B7104KV-F
10%, 0402 X7R
C26, C27, C28, C29, C30,
C40, C41, C42, C43, C46
Capacitor, 4700 pF, 2kV,
3 C31 1 AVX 1812GC472KAT1A
10%, X7R, 1812
Capacitor, 3300 pF, 50 V,
4 C32, C33 2 TDK C1608X7R1H332K
10%, X7R, 0603
Capacitor, 1 µF, X5R, 10 V, Johanson
5 C6, C14 2 100R07X105KV4T
low ESR, 0402 Dielectrics Inc
Capacitor, 2.2 µF, 16 V,
6 C7, C15, C20 3 Murata GRM188R61C225KE15D
10%, 0603, X5R
C8, C9, C44, Capacitor, 12 pF, 50 V,
7 6 Murata GRM1555C1H120JZ01D
C45, C47, C48 5%, 0402, COG
8 D0, D1, D2, D3, D4 5 Green LED 0603 Everlight 19-217/G7C-AL1M2B/3T
J1, J2, J3, Jumper, 0.100, Gold, 3M 969102-0000-DA
9 7
J4, J5, J6, J7 Black, Open Kobiconn 151-8000-E
Header, 2x3, 0.100, T-hole,
10 JP1 1 vertical unshrouded, FCI 67996-206HLF
0.230 mate, gold
3M 961102-6404-AR
11 JP2, JP3 2 FCI 68001-102HLF
vertical unshrouded, 0.220 mate
Anyone 1x2-head
Header, 2x2, 0.100, T-hole, FCI 67997-104HLF
12 JP4, JP5 2
vertical unshrouded, 0.230 mate 4UCON 00998
R1, R2, R3, R4, Resistor, 10k Ω, 1/10W,
13 8 Yageo RC0402FR-0710KL
R5, R29, R35, R44 5%, 0402 thick film
14 R17, R26, R36 3 100k 5% 0402 resistor SMD Rohm MCR01MRTJ104
15 R18, R51 2 Resistor 0402 100 Ω 5% Rohm MCR1MRTJ101
16 R23, R21, R22, R24 4 Resistor 49.9 Ω 0402. 1 % Rohm MCR01MRTF49R9
17 R25 1 Resistor 4.87k 1% 0402 SMD Rohm MCR01MRTF4871
Resistor, 5.6k Ω,
18 R28 1 Panasonic ERJ-2GEJ562X
1/10W, 5%, 0402
19 R32, R43, R45, R46 4 Resistor 75 Ω 0402 5% Rohm MCR01MRTJ750
Resistor, 1M OH,
20 R34, R52 2 Panasonic ERJ-3GEYJ105V
1/10W, 5% 0603 SMD
Resistor, 51 Ω,
21 R38 1 Panasonic ERJ-2GEJ510X
1/10W, 5%, 0402
SPMU372A – September 2015 – Revised October 2016 PCB Layout and Bill of Materials 27
Bill of Materials www.ti.com
Table A-1. Crypto Connected LaunchPad Bill of Materials (continued)

Resistor, 1M Ω,
22 R42 1 Rohm MCR01MRTF1004
1/10W, 5%, 0402
23 R47 1 RES 1M Ω 5% 1206 TF Panasonic ERJ-8GEYJ105V
Resistor, 2.0k Ω,
24 R49, R50 2 Panasonic ERJ-3GEYJ202V
1/10W, 5%, 0402
R6, R7, R8, R10, R11,
Resistor, 0 Ω,
25 R15, R16, R19, R20, R39, 12 Panasonic ERJ-2GE0R00X
1/10W, 5%, 0402
R40, R41
Resistor, 330 Ω,
26 R9, R27, R30, R31, R33 5 Yageo RC0402FR-07330RL
1/10W, 5%, 0402
RESET, USR_SW1,
27 4 Switch, Tact 6mm SMT, 160gf Omron B3S-1000
USR_SW2, WAKE
TM4C, MCU
TM4C129ENCPDT 128 QFP
28 U1 1 Texas Instruments TM4C129ENCPDT
with cryptographic modules and
Ethernet MAC + PHY
Transformer, Ethernet, 1 to 1.
29 U10 1 Pulse Electronics HX1198FNL
SOIC 16
Diode, 8 chan, ±15KV, ESD
30 U13 1 Semtech SLVU2.8-4.TBT
protection array, SO-8
Connector, RJ45 NO MAG,
31 U14 1 TE Connectivity 1-406541-5
shielded THRU HOLE
IC 4CH ESD solution w/clamp
32 U2, U3 2 Texas Instruments TPD4S012DRYR
6SON
Stellaris TM4C MCU
33 U20 1 Texas Instruments TM4C123GH6PMI
TM4C123GH6PMI
USB Micro B receptacle
34 U22 1 FCI 10118194-0001LF
right angle with guides
Fault protected power switch,
35 U4 1 Texas Instruments TPS2052BDRBR
dual channel, 8-SON
3.3 V LDO TI TPS73733DRV
36 U5 1 Texas Instruments TPS73733DRV
fixed out 5 V in
Samtec SHF-105-01-S-D-SM
Header 2x5, 0.050, SM,
37 U6 1 Don Connex
vertical shrouded C44-10BSA1-G
Electronics
USB Micro AB receptacle. Right
38 U7 1 Hirose ZX62D-AB-5P8
angle with through guides
Samtec SSW-110-23-S-D
Header, 2x10, T-hole vertical
39 X6, X7, X8, X9 4 Major League
unshrouded stacking SSHQ-110-D-08-F-LF
Electronics
40 Y1 1 Crystal 25 MHz 3.2 x 2.5 mm NDK nx3225ga-25.000m-std-crg-2
Crystal 16 MHz 3.2 x 2.5 mm
41 Y2 1 NDK NX3225GA-16.000M-STD-CRG-2
4 pin
Citizen Finetech
42 Y3 1 Crystal, 32.768 KHz radial CAN CMR200T-32.768KDZY-UT
Miyota
28 PCB Layout and Bill of Materials SPMU372A – September 2015 – Revised October 2016
www.ti.com Bill of Materials
Table A-1. Crypto Connected LaunchPad Bill of Materials (continued)

PCB Do Not Populate List (Shown for information only)
Capacitor, 0.1 µF 16 V,
43 C2 1 Taiyo Yuden EMK105B7104KV-F
10%, 0402 X7R
Screw, #4 x 0.625" Pan head,
44 H1, H4, H6 3 sheet metal, Phillips/slotted McMaster 90077A112
(for fan)
Resistor, 5.6k Ω,
45 R12, R13, R14 3 Panasonic ERJ-2GEJ562X
1/10W, 5%, 0402
46 R48 1 Resistor 0402 1% 52.3k Rohm TRR01MZPF5232
TP1, TP2, TP3, TP4, TP5,
TP6, TP7, TP8, TP9, Terminal, test point miniature
47 17 Keystone 5000
TP10, TP11, TP12, TP13, loop, red, T-hole
TP14, TP15, TP16, TP17
48 X1 1 vertical, unshrouded, 0.230 FCI 67997-114HLF
mate
Valvano style bread board
49 X11A 1 connect. Right angle extended, Samtec TSW-149-09-F-S-RE
1 x 49 0.100 pitch.
Valvano style breadboard
50 X11B 1 Samtec TSW-149-08-F-S-RA
header
SPMU372A – September 2015 – Revised October 2016 PCB Layout and Bill of Materials 29
Appendix B
Schematic
This section contains the complete schematics for the TM4C Series TM4C129E Crypto Connected
LaunchPad.
• Microcontroller, USB, Buttons, and LED's
• BoosterPack connectors
• Breadboard connector
• Ethernet and Ethernet LED's
• Power
• In-Circuit Debug Interface
30 Schematic SPMU372A – September 2015 – Revised October 2016

www.ti.com Revision History
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (September 2015) to A Revision ............................................................................................... Page
• GLOBAL: Updated/Changed all instances of "UART4" to "UART2"................................................................ 5
SPMU372A – September 2015 – Revised October 2016 Revision History 31

STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2 Limited Warranty and Related Remedies/Disclaimers:

2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3 Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices

NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and receiver.
• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】開発キットの中には技術基準適合証明を受けて
いないものがあります。技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union

3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
4 EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8. Limitations on Damages and Liability:

8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2017, Texas Instruments Incorporated
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TM4C Series TM4C129E Crypto Connected

LaunchPad Evaluation Kit

Literature Number: SPMU372A

1 Board Overview ................................................................................................................... 5

2 Contents SPMU372A – September 2015 – Revised October 2016

Revision History .......................................................................................................................... 31

SPMU372A – September 2015 – Revised October 2016 Contents 3

4 List of Figures SPMU372A – September 2015 – Revised October 2016

Figure 1-1. TM4C Series Crypto Connected LaunchPad Evaluation Board

LaunchPad, TivaWare, Code Composer Studio are trademarks of Texas Instruments.

SPMU372A – September 2015 – Revised October 2016 Board Overview 5

1.1 Kit Contents

1.2 Using the Crypto Connected LaunchPad

6 Board Overview SPMU372A – September 2015 – Revised October 2016

• Jumper for selecting power source:

Table 1-1. EK-TM4C129EXL Specifications

SPMU372A – September 2015 – Revised October 2016 Board Overview 7

8 Board Overview SPMU372A – September 2015 – Revised October 2016

The Crypto Connected LaunchPad includes a TM4C129ENCPDT microcontroller with an integrated

TM4C TM4C129ENCPDT BoosterPack XL

Breadboard User BoosterPack XL

2.1 Functional Description

SPMU372A – September 2015 – Revised October 2016 Hardware Description 9

2.1.2 Ethernet Connectivity

2.1.3 Crypto Accelerators

2.1.4 USB Connectivity

2.1.5 Motion Control

10 Hardware Description SPMU372A – September 2015 – Revised October 2016

2.1.6 User Switches and LED's

SPMU372A – September 2015 – Revised October 2016 Hardware Description 11

2.1.7 BoosterPacks and Headers

Table 2-1. BoosterPack 1 GPIO and Signal Muxing

12 Hardware Description SPMU372A – September 2015 – Revised October 2016

Table 2-1. BoosterPack 1 GPIO and Signal Muxing (continued)

SPMU372A – September 2015 – Revised October 2016 Hardware Description 13

Table 2-2. BoosterPack 2 GPIO and Signal Muxing

14 Hardware Description SPMU372A – September 2015 – Revised October 2016

Table 2-2. BoosterPack 2 GPIO and Signal Muxing (continued)

SPMU372A – September 2015 – Revised October 2016 Hardware Description 15

2.1.7.3 Breadboard Connection

16 Hardware Description SPMU372A – September 2015 – Revised October 2016

SPMU372A – September 2015 – Revised October 2016 Hardware Description 17

18 Hardware Description SPMU372A – September 2015 – Revised October 2016

SPMU372A – September 2015 – Revised October 2016 Hardware Description 19

2.1.7.4 Other Headers and Jumpers

Figure 2-2. Default Jumper Locations

2.2 Power Management

2.2.1 Power Supplies

20 Hardware Description SPMU372A – September 2015 – Revised October 2016

2.2.2 Low Power Modes

2.3 Debug Interface

2.3.1 In-Circuit Debug Interface (ICDI)

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2.3.2 External Debugger

2.3.3 Virtual COM Port

22 Hardware Description SPMU372A – September 2015 – Revised October 2016

3.1 Secure IoT Demo

3.1.1 Software Description

3.1.2 Source Code Download and Build Instructions