 SM2Z5V1 / SM2Z200

2W ZENER DIODES

FEATURES
VOLTAGE RANGE : 5.1V to 200V
SMA PACKAGE
HIGH SURGE CAPABILITY : 40 W (10 ms)

DESCRIPTION
- 2 W Zener diodes
- Tinned copper leads. SMA
- Full compatibility with both gluing and paste (JEDEC DO-214AC)
soldering techniques.

ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C)

Symbol Parameter Value Unit

P Power dissipation on infinite heatsink Tamb = 115°C 2 W

Tstg Storage temperature range - 65 to + 175 °C

Tj Junction temperature range 175 °C

TL Maximum lead temperature for soldering 260 °C

THERMAL RESISTANCES

Symbol Parameter Value Unit

R th (j-I) Junction to lead 30 °C/W

Rth (j-a) Junction to ambient on printed circuit 120 °C/W

On recommended pad layout

September 1998 - Ed : 5A 1/4

SM2Z5V1 / SM2Z200
ELECTRICAL CHARACTERISTICS (Tamb = 25°C)

VZT @ IZT RZT IZT RZK @ IZK αVZ IR @ VR IZM IZSM

min. max. @IZT max. typ. max. max. max.
Types Marking max. Ω mA Tamb=115°C
V Ω mA 10-4/°C µA V mA A
(1) (1) (1) (2) (3)

SM2Z5V1 ZHK 4.8 5.4 5 100 350 2 1 5 1 370 7.8

SM2Z5V6 ZHL 5.2 6 2 100 250 2 2.5 5 1 330 7.1
SM2Z6V2 ZHN 5.8 6.6 2 100 200 2 3.2 5 1 300 6.4
SM2Z7V5 ZHQ 7 7.9 2 100 450 1 4.5 5 2 250 5.4
SM2Z10 ZHU 9.4 10.6 4 50 200 1 6 1 8.3 170 3.6
SM2Z12 ZHW 11.4 12.7 7 50 150 1 6.5 1 9.1 155 3.3
SM2Z15 ZHZ 13.8 15.6 10 50 150 1 7 1 11.4 130 2.7
SM2Z18 ZJF 16.8 19.1 15 25 150 1 7.5 0.5 13.7 105 2.2
SM2Z20 ZJG 18.8 21.2 15 25 180 1 7.5 0.5 15.2 94 2
SM2Z22 ZJK 20.8 23.3 15 25 180 1 8 0.5 16.7 86 1.8
SM2Z24 ZJL 22.8 25.6 15 25 180 1 8 0.5 18.2 78 1.6
SM2Z27 ZJN 25.1 28.9 15 25 200 1 8.5 0.5 20.5 69 1.4
SM2Z30 ZJQ 28 32 15 25 250 1 8.5 0.5 22.8 62 1.1
SM2Z36 ZJS 34 38 40 10 350 1 8.5 0.5 27.4 52 0.9
SM2Z39 ZJT 37 41 40 10 450 1 9 0.5 29.6 48 0.83
SM2Z43 ZJU 40.4 45.6 40 10 550 1 9 0.5 32.7 45 0.76
SM2Z47 ZJV 44 50 45 10 600 1 9 0.5 35.7 40 0.7
SM2Z62 ZKD 58.3 65.7 80 10 1000 1 9 0.5 47.1 35 0.67
SM2Z68 ZKM 64 72 80 10 1000 1 9 0.5 47.1 30 0.64
SM2Z100 ZKQ 94 106 200 5 2000 1 9 0.5 76 18 0.4
SM2Z150 ZKR 138 156 300 5 4000 0.5 9.5 0.5 114 12.8 0.15
SM2Z200 ZKW 188 212 350 5 6000 0.5 9.5 0.5 152 9.4 0.12
Note 1 : Pulse test : tp ≤ 50ms
Note 2 : Infinite heatsink
Note 3 : Rectangular waveform tp = 10ms

Fig. 1 : Power dissipation versus ambient tem- Fig. 2 : Junction to ambient thermal resistance
perature. versus copper surface under each lead.
P(W) °
2.2
2.0 Infinite heatsink
µ
1.8
1.6
1.4
1.2
Printed circuit board
1.0
0.8
0.6
0.4
0.2 Tamb(°C)
0.0
0 25 50 75 100 125 150 175

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 SM2Z5V1 / SM2Z200
Fig. 3 : Relative variation of thermal impedance Fig. 4 : Junction capacitance versus reverse
versus pulse duration (PC board FR4) for Zth(j-a) voltage applied (typical values).
only.

Zth/Rth
1.00

0.50
Zth(j-l)

0.20
Zth(j-a)

0.10

0.05

0.02
tp (s)
0.01
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2

Fig. 5 : Peak forward current versus peak forward Fig. 6 : Leakage current versus regulation voltage
voltage drop (typical values). (typical values).

IFM(A) I R(µ A)
20.0 2E+3
Tj=25°C
10.0
Tj=125°C

1E+1

1.0
1E-1

VZT(V)
VFM(V) 1E-3
1 2 5 10 20 50 100 200 500
0.1
0.0 0.5 1.0 1.5 2.0 2.5

Fig. 7 : Differential resistance versus regulation Fig. 8 : Peak pulse power versus pulse duration
voltage (typical values). (rectangular waveform, maximum values).

RZT(Ω)
1E+3

IZT=5mA
1E+2

IZT=10mA
1E+1

IZT=20mA

1E+0
IZT=100mA

VZT(V)
1E-1
1 2 5 10 20 50 100 200 500

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SM2Z5V1 / SM2Z200
ORDER CODE

SM2Z 5V1

Surface mounted
2w Zener Nominal Voltage

PACKAGE MECHANICAL DATA

SMA (Plastic)
DIMENSIONS
E1
REF. Millimeters Inches
Min. Max. Min. Max.
D
A1 1.90 2.70 0.075 0.106

A2 0.05 0.20 0.002 0.008

b 1.25 1.65 0.049 0.065
E

c 0.15 0.41 0.006 0.016

A1
E 4.80 5.60 0.189 0.220
C A2
E1 3.95 4.60 0.156 0.181
L b
D 2.25 2.95 0.089 0.116
L 0.75 1.60 0.030 0.063

FOOT PRINT DIMENSIONS (in millimeters)

SMA (Plastic)

Packaging : standard packaging is in tape and reel.

1.65 Weight = 0.068 g

1.45 2.40 1.45

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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
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