1Smb59Xxbt3G Series, Sz1Smb59Xxt3G Series 3 Watt Plastic Surface Mount Zener Voltage Regulators
1Smb59Xxbt3G Series, Sz1Smb59Xxt3G Series 3 Watt Plastic Surface Mount Zener Voltage Regulators
1Smb59Xxbt3G Series, Sz1Smb59Xxt3G Series 3 Watt Plastic Surface Mount Zener Voltage Regulators
SZ1SMB59xxT3G Series
3 Watt Plastic
Surface Mount
Zener Voltage Regulators
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This complete new line of 3 W Zener diodes offers the following
advantages.
PLASTIC SURFACE MOUNT
Features ZENER VOLTAGE
• Zener Voltage Range − 3.3 V to 200 V REGULATOR DIODES
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
3.3−200 V, 3 W DC POWER
• Flat Handling Surface for Accurate Placement
• Package Design for Top Side or Bottom Circuit Board Mounting
• AEC−Q101 Qualified and PPAP Capable − SZ1SMB59xxT3G
• SZ Prefix for Automotive and Other Applications Requiring Unique
SMB
Site and Control Change Requirements CASE 403A
• These are Pb−Free Devices* PLASTIC
Mechanical Characteristics:
CASE: Void-free, transfer-molded plastic
Cathode Anode
FINISH: All external surfaces are corrosion resistant and leads are
readily solderable
MAXIMUM LEAD TEMPERATURE FOR SOLDERING PURPOSES: MARKING DIAGRAM
260°C for 10 Seconds
LEADS: Modified L−Bend providing more contact area to bond pads
POLARITY: Cathode indicated by polarity band AYWW
FLAMMABILITY RATING: UL 94 V−0 9xxB G
G
MAXIMUM RATINGS
Rating Symbol Value Unit A = Assembly Location
Y = Year
Maximum Steady State Power
WW = Work Week
Dissipation @ TL = 75°C PD 3.0 W
Measured at Zero Lead Length 9xxB = Device Code (Refer to page 3)
Derate Above 75°C 40 mW/°C G = Pb−Free Package
Thermal Resistance from Junction−to−Lead RqJL 25 °C/W (Note: Microdot may be in either location)
Maximum Steady State Power
Dissipation @ TA = 25°C (Note ) PD 550 mW
ORDERING INFORMATION
Derate Above 25°C 4.4 mW/°C
Thermal Resistance from RqJA 226 °C/W
Device Package Shipping†
Junction−to−Ambient
1SMB59xxBT3G SMB 2,500 /
Operating and Storage Temperature Range TJ, Tstg −65 to °C
(Pb−Free) Tape & Reel
+150
SZ1SMB59xxBT3G SMB 2,500 /
Stresses exceeding those listed in the Maximum Ratings table may damage the
(Pb−Free) Tape & Reel
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected. †For information on tape and reel specifications,
1. FR−4 board, using recommended footprint. including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please DEVICE MARKING INFORMATION
download the ON Semiconductor Soldering and Mounting Techniques
See specific marking information in the device marking
Reference Manual, SOLDERRM/D. column of the Electrical Characteristics table on page 3 of
this data sheet.
ELECTRICAL CHARACTERISTICS
(TL = 30°C unless otherwise noted,
VF = 1.5 V Max. @ IF = 200 mA(dc) for all types)
I
Symbol Parameter
IF
VZ Reverse Zener Voltage @ IZT
IZT Reverse Current
ZZT Maximum Zener Impedance @ IZT
IZK Reverse Current VZ VR
V
IR VF
ZZK Maximum Zener Impedance @ IZK IZT
IR Reverse Leakage Current @ VR
VR Reverse Voltage
IF Forward Current
VF Forward Voltage @ IF
IZM Maximum DC Zener Current Zener Voltage Regulator
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2
1SMB59xxBT3G Series, SZ1SMB59xxT3G Series
ELECTRICAL CHARACTERISTICS (TL = 30°C unless otherwise noted, VF = 1.5 V Max. @ IF = 200 mA(dc) for all types)
(Devices listed in bold, italic are ON Semiconductor Preferred devices.)
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3
1SMB59xxBT3G Series, SZ1SMB59xxT3G Series
6
P D, MAXIMUM POWER DISSIPATION (WATTS) 1K
RECTANGULAR
2 50
30
1
20
TA
0 10
0 25 50 75 100 125 150 0.1 0.2 0.3 0.5 1 2 3 5 10 20 30 50 100
T, TEMPERATURE (°C) PW, PULSE WIDTH (ms)
10 200
θVZ , TEMPERATURE COEFFICIENT (mV/ °C)
2
30
0
20
-2
-4 10
2 4 6 8 10 12 10 20 30 50 70 100 200
VZ, ZENER VOLTAGE (VOLTS) VZ, ZENER VOLTAGE (VOLTS)
100 100
50 50
IZT, REVERSE CURRENT (mA)
30 30
20 20
10 10
5 5
3 3
2 2
1 1
0.5 0.5
0.3 0.3
0.2 0.2
0.1 0.1
0 1 2 3 4 5 6 7 8 9 10 0 10 20 30 40 50 60 70 80 90 100
VZ, ZENER VOLTAGE (VOLTS) VZ, ZENER VOLTAGE (VOLTS)
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4
1SMB59xxBT3G Series, SZ1SMB59xxT3G Series
200 1k
IZ(dc) = 1mA TJ = 25°C
500
100 iZ(rms) = 0.1 IZ(dc)
Z Z , DYNAMIC IMPEDANCE (OHMS)
1000 10
NONREPETITIVE, EXPONENTIAL
MEASURED @ PULSE WAVEFORM, TJ = 25°C
Ppk , PEAK POWER (kW)
ZERO BIAS
C, CAPACITANCE (pF)
1
MEASURED @
100 VZ/2
0.1
TJ = 25°C
10 0.01
10 100 0.01 0.1 1 10
BREAKDOWN VOLTAGE (VOLTS) TP, PULSE WIDTH (ms)
120 120
TA = 25°C
≤ 10 ms 8/20 ms WAVEFORM
PW (ID) IS DEFINED AS THE
Ippm, PEAK PULSE CURRENT (%)
80 Ippm 80
CURRENT (%)
40 40
10/1000 ms WAVEFORM
AS DEFINED BY R.E.A.
20 20
td
0.1 IPEAK T = 8 ms
0 0
0 1 2 3 4 5 0 0.02 0.04 0.06 0.08 0.1
t, TIME (ms) T t, TIME (ms)
20 ms
Figure 11. Pulse Waveform Figure 12. Pulse Waveform
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SMB
CASE 403A−03
ISSUE J
SCALE 1:1 SCALE 1:1 DATE 19 JUL 2012
Polarity Band Non−Polarity Band
HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
E 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.
MILLIMETERS INCHES
DIM MIN NOM MAX MIN NOM MAX
A 1.95 2.30 2.47 0.077 0.091 0.097
b D A1 0.05 0.10 0.20 0.002 0.004 0.008
b 1.96 2.03 2.20 0.077 0.080 0.087
c 0.15 0.23 0.31 0.006 0.009 0.012
D 3.30 3.56 3.95 0.130 0.140 0.156
E 4.06 4.32 4.60 0.160 0.170 0.181
POLARITY INDICATOR HE 5.21 5.44 5.60 0.205 0.214 0.220
OPTIONAL AS NEEDED
L 0.76 1.02 1.60 0.030 0.040 0.063
L1 0.51 REF 0.020 REF
A GENERIC
MARKING DIAGRAM*
A1
L L1 c
AYWW AYWW
XXXXXG XXXXXG
G G
SOLDERING FOOTPRINT*
Polarity Band Non−Polarity Band
2.261
0.089 XXXXX = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
2.743
(Note: Microdot may be in either location)
0.108
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
2.159 may or may not be present.
0.085 SCALE 8:1 ǒinches
mm Ǔ
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
DOCUMENT NUMBER: 98ASB42669B Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
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