1Smb59Xxbt3G Series, Sz1Smb59Xxt3G Series 3 Watt Plastic Surface Mount Zener Voltage Regulators

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1SMB59xxBT3G Series,

SZ1SMB59xxT3G Series

3 Watt Plastic
Surface Mount
Zener Voltage Regulators
www.onsemi.com
This complete new line of 3 W Zener diodes offers the following
advantages.
PLASTIC SURFACE MOUNT
Features ZENER VOLTAGE
• Zener Voltage Range − 3.3 V to 200 V REGULATOR DIODES
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
3.3−200 V, 3 W DC POWER
• Flat Handling Surface for Accurate Placement
• Package Design for Top Side or Bottom Circuit Board Mounting
• AEC−Q101 Qualified and PPAP Capable − SZ1SMB59xxT3G
• SZ Prefix for Automotive and Other Applications Requiring Unique
SMB
Site and Control Change Requirements CASE 403A
• These are Pb−Free Devices* PLASTIC

Mechanical Characteristics:
CASE: Void-free, transfer-molded plastic
Cathode Anode
FINISH: All external surfaces are corrosion resistant and leads are
readily solderable
MAXIMUM LEAD TEMPERATURE FOR SOLDERING PURPOSES: MARKING DIAGRAM
260°C for 10 Seconds
LEADS: Modified L−Bend providing more contact area to bond pads
POLARITY: Cathode indicated by polarity band AYWW
FLAMMABILITY RATING: UL 94 V−0 9xxB G
G

MAXIMUM RATINGS
Rating Symbol Value Unit A = Assembly Location
Y = Year
Maximum Steady State Power
WW = Work Week
Dissipation @ TL = 75°C PD 3.0 W
Measured at Zero Lead Length 9xxB = Device Code (Refer to page 3)
Derate Above 75°C 40 mW/°C G = Pb−Free Package
Thermal Resistance from Junction−to−Lead RqJL 25 °C/W (Note: Microdot may be in either location)
Maximum Steady State Power
Dissipation @ TA = 25°C (Note ) PD 550 mW
ORDERING INFORMATION
Derate Above 25°C 4.4 mW/°C
Thermal Resistance from RqJA 226 °C/W
Device Package Shipping†
Junction−to−Ambient
1SMB59xxBT3G SMB 2,500 /
Operating and Storage Temperature Range TJ, Tstg −65 to °C
(Pb−Free) Tape & Reel
+150
SZ1SMB59xxBT3G SMB 2,500 /
Stresses exceeding those listed in the Maximum Ratings table may damage the
(Pb−Free) Tape & Reel
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected. †For information on tape and reel specifications,
1. FR−4 board, using recommended footprint. including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.

*For additional information on our Pb−Free strategy and soldering details, please DEVICE MARKING INFORMATION
download the ON Semiconductor Soldering and Mounting Techniques
See specific marking information in the device marking
Reference Manual, SOLDERRM/D. column of the Electrical Characteristics table on page 3 of
this data sheet.

© Semiconductor Components Industries, LLC, 2016 1 Publication Order Number:


April, 2016 − Rev. 9 1SMB5913BT3/D
1SMB59xxBT3G Series, SZ1SMB59xxT3G Series

ELECTRICAL CHARACTERISTICS
(TL = 30°C unless otherwise noted,
VF = 1.5 V Max. @ IF = 200 mA(dc) for all types)
I
Symbol Parameter
IF
VZ Reverse Zener Voltage @ IZT
IZT Reverse Current
ZZT Maximum Zener Impedance @ IZT
IZK Reverse Current VZ VR
V
IR VF
ZZK Maximum Zener Impedance @ IZK IZT
IR Reverse Leakage Current @ VR
VR Reverse Voltage
IF Forward Current
VF Forward Voltage @ IF
IZM Maximum DC Zener Current Zener Voltage Regulator

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2
1SMB59xxBT3G Series, SZ1SMB59xxT3G Series

ELECTRICAL CHARACTERISTICS (TL = 30°C unless otherwise noted, VF = 1.5 V Max. @ IF = 200 mA(dc) for all types)
(Devices listed in bold, italic are ON Semiconductor Preferred devices.)

Zener Voltage (Note 3) Zener Impedance (Note 4) Leakage Current


VZ (Volts) @ IZT ZZT @ IZT ZZK @ IZK IR @ VR IZM
Device* Device
(Note 2) Marking Min Nom Max mA W W mA mA Volts mA(dc)
1SMB5913BT3G 913B 3.13 3.3 3.47 113.6 10 500 1 100 1 454
1SMB5914BT3G 914B 3.42 3.6 3.78 104.2 9 500 1 75 1 416
1SMB5915BT3G 915B 3.70 3.9 4.10 96.1 7.5 500 1 25 1 384
1SMB5916BT3G 916B 4.08 4.3 4.52 87.2 6 500 1 5 1 348
1SMB5917BT3G 917B 4.46 4.7 4.94 79.8 5 500 1 5 1.5 319
1SMB5918BT3G 918B 4.84 5.1 5.36 73.5 4 350 1 5 2 294
1SMB5919BT3G 919B 5.32 5.6 5.88 66.9 2 250 1 5 3 267
1SMB5920BT3G 920B 5.89 6.2 6.51 60.5 2 200 1 5 4 241
1SMB5921BT3G 921B 6.46 6.8 7.14 55.1 2.5 200 1 5 5.2 220
1SMB5922BT3G 922B 7.12 7.5 7.88 50 3 400 0.5 5 6 200
1SMB5923BT3G 923B 7.79 8.2 8.61 45.7 3.5 400 0.5 5 6.5 182
1SMB5924BT3G 924B 8.64 9.1 9.56 41.2 4 500 0.5 5 7 164
1SMB5925BT3G 925B 9.5 10 10.5 37.5 4.5 500 0.25 5 8 150
1SMB5926BT3G 926B 10.45 11 11.55 34.1 5.5 550 0.25 1 8.4 136
1SMB5927BT3G 927B 11.4 12 12.6 31.2 6.5 550 0.25 1 9.1 125
1SMB5928BT3G 928B 12.35 13 13.65 28.8 7 550 0.25 1 9.9 115
1SMB5929BT3G 929B 14.25 15 15.75 25 9 600 0.25 1 11.4 100
1SMB5930BT3G 930B 15.2 16 16.8 23.4 10 600 0.25 1 12.2 93
1SMB5931BT3G 931B 17.1 18 18.9 20.8 12 650 0.25 1 13.7 83
1SMB5932BT3G 932B 19 20 21 18.7 14 650 0.25 1 15.2 75
1SMB5933BT3G 933B 20.9 22 23.1 17 17.5 650 0.25 1 16.7 68
1SMB5934BT3G 934B 22.8 24 25.2 15.6 19 700 0.25 1 18.2 62
1SMB5935BT3G 935B 25.65 27 28.35 13.9 23 700 0.25 1 20.6 55
1SMB5936BT3G 936B 28.5 30 31.5 12.5 28 750 0.25 1 22.8 50
1SMB5937BT3G 937B 31.35 33 34.65 11.4 33 800 0.25 1 25.1 45
1SMB5938BT3G 938B 34.2 36 37.8 10.4 38 850 0.25 1 27.4 41
1SMB5939BT3G 939B 37.05 39 40.95 9.6 45 900 0.25 1 29.7 38
1SMB5940BT3G 940B 40.85 43 45.15 8.7 53 950 0.25 1 32.7 34
1SMB5941BT3G 941B 44.65 47 49.35 8 67 1000 0.25 1 35.8 31
1SMB5942BT3G 942B 48.45 51 53.55 7.3 70 1100 0.25 1 38.8 29
1SMB5943BT3G 943B 53.2 56 58.8 6.7 86 1300 0.25 1 42.6 26
1SMB5944BT3G 944B 58.9 62 65.1 6 100 1500 0.25 1 47.1 24
1SMB5945BT3G 945B 64.6 68 71.4 5.5 120 1700 0.25 1 51.7 22
1SMB5946BT3G 946B 71.25 75 78.75 5 140 2000 0.25 1 56 20
1SMB5947BT3G 947B 77.9 82 86.1 4.6 160 2500 0.25 1 62.2 18
1SMB5948BT3G 948B 86.45 91 95.55 4.1 200 3000 0.25 1 69.2 16
1SMB5949BT3G 949B 95 100 105 3.7 250 3100 0.25 1 76 15
1SMB5951BT3G 951B 114 120 126 3.1 380 4500 0.25 1 91.2 12
1SMB5952BT3G 952B 123.5 130 136.5 2.9 450 5000 0.25 1 98.8 11
1SMB5953BT3G 953B 142.5 150 157.5 2.5 600 6000 0.25 1 114 10
1SMB5954BT3G 954B 152 160 168 2.3 700 6500 0.25 1 121.6 9
1SMB5955BT3G 955B 171 180 189 2.1 900 7000 0.25 1 136.8 8
1SMB5956BT3G 956B 190 200 210 1.9 1200 8000 0.25 1 152 7
2. TOLERANCE AND TYPE NUMBER DESIGNATION The type numbers listed indicate a tolerance of ±5%.
3. ZENER VOLTAGE (VZ) MEASUREMENT
Nominal Zener voltage is measured with the device junction in thermal equilibrium with ambient temperature at 25°C.
4. ZENER IMPEDANCE (ZZ) DERIVATION ZZT and ZZK are measured by dividing the ac voltage drop across the device by the ac current
applied. The specified limits are for IZ(ac) = 0.1 IZ(dc) with the ac frequency = 60 Hz.
*Include SZ-prefix devices where applicable.

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3
1SMB59xxBT3G Series, SZ1SMB59xxT3G Series

6
P D, MAXIMUM POWER DISSIPATION (WATTS) 1K
RECTANGULAR

PPK , PEAK SURGE POWER (WATTS)


5 NONREPETITIVE
500
WAVEFORM
300 TJ=25°C PRIOR
4
200 TO INITIAL PULSE
TL
3
100

2 50
30
1
20
TA
0 10
0 25 50 75 100 125 150 0.1 0.2 0.3 0.5 1 2 3 5 10 20 30 50 100
T, TEMPERATURE (°C) PW, PULSE WIDTH (ms)

Figure 1. Steady State Power Derating Figure 2. Maximum Surge Power

10 200
θVZ , TEMPERATURE COEFFICIENT (mV/ °C)

θVZ , TEMPERATURE COEFFICIENT (mV/ °C)


8 VZ @ IZT VZ @ IZT
100
6
70
4 50

2
30
0
20
-2

-4 10
2 4 6 8 10 12 10 20 30 50 70 100 200
VZ, ZENER VOLTAGE (VOLTS) VZ, ZENER VOLTAGE (VOLTS)

Figure 3. Zener Voltage − To 12 Volts Figure 4. Zener Voltage − 14 To 200 Volts

100 100
50 50
IZT, REVERSE CURRENT (mA)

IZT, REVERSE CURRENT (mA)

30 30
20 20
10 10
5 5
3 3
2 2
1 1
0.5 0.5
0.3 0.3
0.2 0.2
0.1 0.1
0 1 2 3 4 5 6 7 8 9 10 0 10 20 30 40 50 60 70 80 90 100
VZ, ZENER VOLTAGE (VOLTS) VZ, ZENER VOLTAGE (VOLTS)

Figure 5. VZ = 3.3 thru 10 Volts Figure 6. VZ = 12 thru 82 Volts

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4
1SMB59xxBT3G Series, SZ1SMB59xxT3G Series

200 1k
IZ(dc) = 1mA TJ = 25°C
500
100 iZ(rms) = 0.1 IZ(dc)
Z Z , DYNAMIC IMPEDANCE (OHMS)

Z Z , DYNAMIC IMPEDANCE (OHMS)


70 200 VZ =150V
50
100
91V
30 50
20 62V
20
10mA
10 10
7
5 22V
5
3 20mA iZ(rms) = 0.1 IZ(dc) 2 12V
6.8V
2 1
5 7 10 20 30 50 70 100 0.5 1 2 5 10 20 50 100 200 500
VZ, ZENER VOLTAGE (VOLTS) IZ, ZENER TEST CURRENT (mA)

Figure 7. Effect of Zener Voltage Figure 8. Effect of Zener Current

Rating and Typical Characteristic Curves (TA = 25°C)

1000 10

NONREPETITIVE, EXPONENTIAL
MEASURED @ PULSE WAVEFORM, TJ = 25°C
Ppk , PEAK POWER (kW)

ZERO BIAS
C, CAPACITANCE (pF)

1
MEASURED @
100 VZ/2

0.1

TJ = 25°C
10 0.01
10 100 0.01 0.1 1 10
BREAKDOWN VOLTAGE (VOLTS) TP, PULSE WIDTH (ms)

Figure 9. Capacitance Curve Figure 10. Typical Pulse Rating Curve

120 120
TA = 25°C
≤ 10 ms 8/20 ms WAVEFORM
PW (ID) IS DEFINED AS THE
Ippm, PEAK PULSE CURRENT (%)

100 100 AS DEFINED BY ANSI C62.1


POINT WHERE THE PEAK CURRENT
PEAK VALUE 0.9 IPEAK AND IEC 801-5.
DECAYS TO 50% OF Ipp.
Ippm, PEAK PULSE

80 Ippm 80
CURRENT (%)

60 HALF VALUE - Ipp/2 60


0.5 IPEAK

40 40
10/1000 ms WAVEFORM
AS DEFINED BY R.E.A.
20 20
td
0.1 IPEAK T = 8 ms
0 0
0 1 2 3 4 5 0 0.02 0.04 0.06 0.08 0.1
t, TIME (ms) T t, TIME (ms)
20 ms
Figure 11. Pulse Waveform Figure 12. Pulse Waveform

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5
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS

SMB
CASE 403A−03
ISSUE J
SCALE 1:1 SCALE 1:1 DATE 19 JUL 2012
Polarity Band Non−Polarity Band

HE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
E 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1.

MILLIMETERS INCHES
DIM MIN NOM MAX MIN NOM MAX
A 1.95 2.30 2.47 0.077 0.091 0.097
b D A1 0.05 0.10 0.20 0.002 0.004 0.008
b 1.96 2.03 2.20 0.077 0.080 0.087
c 0.15 0.23 0.31 0.006 0.009 0.012
D 3.30 3.56 3.95 0.130 0.140 0.156
E 4.06 4.32 4.60 0.160 0.170 0.181
POLARITY INDICATOR HE 5.21 5.44 5.60 0.205 0.214 0.220
OPTIONAL AS NEEDED
L 0.76 1.02 1.60 0.030 0.040 0.063
L1 0.51 REF 0.020 REF

A GENERIC
MARKING DIAGRAM*

A1
L L1 c
AYWW AYWW
XXXXXG XXXXXG
G G
SOLDERING FOOTPRINT*
Polarity Band Non−Polarity Band
2.261
0.089 XXXXX = Specific Device Code
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
2.743
(Note: Microdot may be in either location)
0.108
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
2.159 may or may not be present.
0.085 SCALE 8:1 ǒinches
mm Ǔ

*For additional information on our Pb−Free strategy and soldering


details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

Electronic versions are uncontrolled except when accessed directly from the Document Repository.
DOCUMENT NUMBER: 98ASB42669B Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

DESCRIPTION: SMB PAGE 1 OF 1

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