TRIACS Catálogo
TRIACS Catálogo
TRIACS Catálogo
DATA SHEET
MAC223 series
Triacs
Product specification July 2001
Philips Semiconductors Product specification
1 main terminal 1
T2 T1
2 main terminal 2
3 gate
tab main terminal 2 1 23 G
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
MAC223 A6 A8
VDRM Repetitive peak off-state - 4001 6001 V
voltages
IT(RMS) RMS on-state current full sine wave; Tmb ≤ 91 ˚C - 25 A
ITSM Non-repetitive peak full sine wave; Tj = 25 ˚C prior to
on-state current surge
t = 20 ms - 190 A
t = 16.7 ms - 230 A
I2t I2t for fusing t = 10 ms - 180 A2s
dIT/dt Repetitive rate of rise of ITM = 30 A; IG = 0.2 A;
on-state current after dIG/dt = 0.2 A/µs
triggering T2+ G+ - 50 A/µs
T2+ G- - 50 A/µs
T2- G- - 50 A/µs
T2- G+ - 10 A/µs
IGM Peak gate current - 2 A
VGM Peak gate voltage - 5 V
PGM Peak gate power - 5 W
PG(AV) Average gate power over any 20 ms period - 0.5 W
Tstg Storage temperature -40 150 ˚C
Tj Operating junction - 125 ˚C
temperature
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may
switch to the on-state. The rate of rise of current should not exceed 15 A/µs.
THERMAL RESISTANCES
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Rth j-mb Thermal resistance full cycle - - 1.0 K/W
junction to mounting base half cycle - - 1.4 K/W
Rth j-a Thermal resistance in free air - 60 - K/W
junction to ambient
STATIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
IGT Gate trigger current VD = 12 V; IT = 0.1 A
T2+ G+ - 6 50 mA
T2+ G- - 10 50 mA
T2- G- - 11 50 mA
T2- G+ - 23 75 mA
IL Latching current VD = 12 V; IGT = 0.1 A
T2+ G+ - 8 40 mA
T2+ G- - 30 60 mA
T2- G- - 18 40 mA
T2- G+ - 15 60 mA
IH Holding current VD = 12 V; IGT = 0.1 A
T2+ - 7 30 mA
T2- - 12 30 mA
VT On-state voltage IT = 30 A - 1.3 1.55 V
VGT Gate trigger voltage VD = 12 V; IT = 0.1 A - 0.7 1.5 V
VD = 400 V; IT = 0.1 A; Tj = 125 ˚C 0.25 0.4 - V
ID Off-state leakage current VD = VDRM(max); Tj = 125 ˚C - 0.1 0.5 mA
DYNAMIC CHARACTERISTICS
Tj = 25 ˚C unless otherwise stated
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
dVD/dt Critical rate of rise of VDM = 67% VDRM(max); Tj = 125 ˚C; 100 300 - V/µs
off-state voltage exponential waveform; gate open circuit
dVcom/dt Critical rate of change of VDM = 400 V; Tj = 95 ˚C; IT(RMS) = 25 A; - 10 - V/µs
commutating voltage dIcom/dt = 9 A/ms; gate open circuit
tgt Gate controlled turn-on ITM = 30 A; VD = VDRM(max); IG = 0.1 A; - 2 - µs
time dIG/dt = 5 A/µs
91 C
= 180 25
30 1
95
120
90 20
60
20 105 15
30
10
10 115
5
0 125 0
0 5 10 15 20 25 30 -50 0 50 100 150
IT(RMS) / A Tmb / C
Fig.1. Maximum on-state dissipation, Ptot, versus rms Fig.4. Maximum permissible rms current IT(RMS) ,
on-state current, IT(RMS), where α = conduction angle. versus mounting base temperature Tmb.
ITSM / A IT(RMS) / A
1000 50
40
30
100
dI T /dt limit
20
IT I TSM
T2- G+ quadrant
T time 10
Tj initial = 25 C max
10 0
10us 100us 1ms 10ms 100ms 0.01 0.1 1 10
T/s surge duration / s
Fig.2. Maximum permissible non-repetitive peak Fig.5. Maximum permissible repetitive rms on-state
on-state current ITSM, versus pulse width tp, for current IT(RMS), versus surge duration, for sinusoidal
sinusoidal currents, tp ≤ 20ms. currents, f = 50 Hz; Tmb ≤ 91˚C.
ITSM / A VGT(Tj)
200
VGT(25 C)
1.6
IT ITSM
T time 1.4
150
Tj initial = 25 C max
1.2
100
1
0.8
50
0.6
0 0.4
1 10 100 1000 -50 0 50 100 150
Number of cycles at 50Hz Tj / C
Fig.3. Maximum permissible non-repetitive peak Fig.6. Normalised gate trigger voltage
on-state current ITSM, versus number of cycles, for VGT(Tj)/ VGT(25˚C), versus junction temperature Tj.
sinusoidal currents, f = 50 Hz.
IGT(Tj) IT / A BTA140
IGT(25 C) 80
5 Tj = 125 C
T2+ G+ Tj = 25 C
70
T2+ G- typ max
4 T2- G- 60 Vo = 1.073 V
T2- G+ Rs = 0.015 ohms
50
3
40
2 30
20
1
10
0 0
-50 0 50 100 150 0 0.5 1 1.5 2 2.5 3
Tj / C VT / V
Fig.7. Normalised gate trigger current Fig.10. Typical and maximum on-state characteristic.
IGT(Tj)/ IGT(25˚C), versus junction temperature Tj.
2.5 1
unidirectional
2 bidirectional
0.1
1.5
P tp
1 D
0.01
0.5 t
0 0.001
-50 0 50 100 150 10us 0.1ms 1ms 10ms 0.1s 1s 10s
Tj / C tp / s
Fig.8. Normalised latching current IL(Tj)/ IL(25˚C), Fig.11. Transient thermal impedance Zth j-mb, versus
versus junction temperature Tj. pulse width tp.
100
2
1.5 dIcom/dt =
25 A/ms 20 15 12 9.0 7.0
1 10
0.5
0 1
-50 0 50 100 150 0 50 100 150
Tj / C Tj / C
Fig.9. Normalised holding current IH(Tj)/ IH(25˚C), Fig.12. Typical commutation dV/dt versus junction
versus junction temperature Tj. temperature, parameter commutation dIT/dt. The triac
should commutate when the dV/dt is below the value
on the appropriate curve for pre-commutation dIT/dt.
Dimensions in mm
4,5
Net Mass: 2 g max
10,3
max
1,3
3,7
2,8 5,9
min
15,8
max
3,0 max
3,0
not tinned
13,5
min
1,3
max 1 2 3
(2x) 0,9 max (3x)
0,6
2,54 2,54 2,4
Notes
1. Refer to mounting instructions for SOT78 (TO220) envelopes.
2. Epoxy meets UL94 V0 at 1/8".
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Philips Electronics N.V. 2001
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Contact information
Printed in The Netherlands XXXXXX/700/02/pp8 Date of release: July 2001 Document order number: 9397 750 08942