SPECIFICATION

AGM 1602B-818

Atualizado em 05/06/2019.
DOCUMENT REVISION HISTORY
Version DATE DESCRIPTION CHANGED BY
00 Apr-13-2012 First issue

AGM 1602B-818
2
CONTENTS
1. Functions & Features 4 1
2. Mechanical specifications 4 1
3. Block diagram 4 1
4. Dimensional Outline 5 2

5. Pin description 6 3

6. Maximum absolute limit 6 3

7. Electricalcharacteristics 7 4-6

8. Backlight characteristics 9 6

9. Electro-Optical characteristics 10 7

10. Control and display instruction 11 8

11. Font Characteristic 12 9

12. Precaution for using LCD/LCM 13 10-11

13. LCM test criteria 15 12-22

AGM 1602B-818
3
1. FUNCTIONS & FEATURES
1.1. Format : 16x2 characters
1.2. LCD mode : STN /Negative/Transmissive/Blue
1.3. Viewing direction : 6 o’clock
1.4. Driving scheme : 1/16 Duty , 1/5 Bias
1.5. Power supply voltage (VDD) : 5.0V
1.6. LCD driving voltage : 4.35V (reference voltage)
1.7. Operation temp : -20~70℃
1.8. Storage temp : -30~80℃
1.9 RoHS standard

2. MECHANICAL SPECIFICATIONS
2.1. Module size : 84.0mm(L)*44.0mm(W)*14.0 mm (H)
2.2. Viewing area : 62.0 mm(L)*18.0mm(W)
2.3. Character pitch : 3.55mm(L)*5.95mm(W)
2.4. Character size : 2.95mm(L)*5.55mm(W)
2.5. Dot pitch : 0.60mm(L)*0.70mm(W)
2.6. Dot size : 0.55mm(L)*0.65mm(W)
2.7. Weight : Approx.

3. BLOCK DIAGRAM

CONTROL DATA DRIVE LSI

SPLC100B1(or compatible)
SEG VDD(+5.0V)
COM
VSS
CONTROL LCD Panel Vo
VDD
LSI LCD
Vo VR(0~20K)
RS AIP31066L-001 MODULE
E SEG VSS(0V)
R/W or compatible

DB0−DB7
30mA
LEDA
LEDK
Backlight (Refer Voltage:5.0V)

Figure 1. Block diagram

AGM 1602B-818
4
5

4.DIMENSIONAL OUTLINE
REV DESCRIPTION DATE
A First issue JAN-25-2010
Figure 2. Dimensional outline

SCALE:
FIT

SHEET:
1 OF 1
AGM 1602B-818

GENERAL TOL: ±0.3 UNIT

mm
PART NO: PROJECTION MODULE NUMBER APPROV ALS DATE

APP:

AGM1602B-818 CHK:
DO NOT S CALE THIS DR AW ING. DWN: YZH JAN-25-2010
5. PIN DESCRIPTION

No. Symbol Function

1-8 DB7~DB0 Data Bus line
9 E Enable signal.
10 R/W Read/write selection (H: Read , L: Write)
11 RS Register selection (H: Data register , L :Instruction register)
12 V0 Power supply for LCD drive
13 VDD Power supply for Logic(+5.0V)
14 VSS Power ground (0V)
15 LEDA Power supply for Backlight( Current 30mA,reference voltage +5.0V)
16 LEDK Power supply for Backlight(0V)

6. MAXIMUM ABSOLUTE LIMIT

Item Symbol MIN MAX Unit
Supply Voltage for Logic VDD -0.3 7.0 V
Supply Voltage for LCD V0 VDD-10.0 VDD+0.3 V
Input Voltage Vin -0.3 VDD+0.3 V
Supply Current for Backlight IF(Ta = 25°C) --- 36 mA
Reverse Voltage for Backlight VR(Ta = 25°C) --- 0.8 V
Operating Temperature Top -20 70 ℃
Storage Temperature Tst -30 80 ℃

AGM 1602B-818
6
7. ELECTRICAL CHARACTERISTICS
7.1 DC characteristics (VDD=4.5V-5.5V,TA=25℃)

7.2 AC characteristics(VDD=4.5V-5.5V,TA=25℃)
Write mode (writing data from MPU to SPLC780D1)

AGM 1602B-818
7
Read mode (reading data from SPLC780D1 to MPU)

AGM 1602B-818
8
Interface mode with LCD driver

8. BACK LIGHT CHARACTERISTICS

LCD Module with Edge White LED Backlight
ELECTRICAL RATINGS
Ta = 25°C
Item Symbol Condition Min Typ Max Unit
Forward Voltage VF IF=30mA --- 4.0 --- V
Reverse Current IR VR=0.8V --- 20 --- mA
Luminous Intensity Lv IF=30mA 375 500 --- Cd/m2
(Without LCD )
Dominantwave length X/Y 0.25～0.30
IF=30mA
0.25～0.30
Color White

Note：
When the temperature exceed 25℃, the approved current decrease rate for the Backlight change as
the temperature increase is: -0.36mA/℃(below 25℃, the current refer to constant, which would not
change with temperature ).

AGM 1602B-818
9
9. ELECTRO-OPTICAL CHARACTERISTICS
( VDD=5.0V, Ta = 25°C )
Item Symbol Condition Min Typ Max Unit
Ta = -20°C --- --- ---
Operating Voltage Vop Ta = 25°C 4.0 4.35 4.7 V
Ta = 70°C --- --- ---
Tr --- 185 --- ms
Response time Ta = 25°C
Tf --- 200 --- ms
Contrast Cr Ta = 25°C --- 4 --- ---
x- 30 35 --- deg
x+ 30 35 --- deg
Viewing angle range Cr≥2
y- 35 45 --- deg
y+ 30 40 --- deg

AGM 1602B-818
10
10. CONTROL AND DISPLAY COMMAND

AGM 1602B-818
11
11. FONT CHARACTERISTIC

AGM 1602B-818
12
12. PRECAUTION FOR USING LCD/LCM
LCD/LCM is assembled and adjusted with a high degree of precision. Do not attempt to make any
alteration or modification. The followings should be noted.
General Precautions:
1. LCD panel is made of glass. Avoid excessive mechanical shock or applying strong pressure onto
the surface of display area.
2. The polarizer used on the display surface is easily scratched and damaged. Extreme care should
be taken when handling. To clean dust or dirt off the display surface, wipe gently with cotton, or
other soft material soaked with isoproply alcohol, ethyl alcohol or trichlorotriflorothane, do not
use water, ketone or aromatics and never scrub hard.
3. Do not tamper in any way with the tabs on the metal frame.
4. Do not make any modification on the PCB without consulting AGT.
5. When mounting a LCM, make sure that the PCB is not under any stress such as bending or
twisting. Elastomer contacts are very delicate and missing pixels could result from slight
dislocation of any of the elements.
6. Avoid pressing on the metal bezel, otherwise the elastomer connector could be deformed and
lose contact, resulting in missing pixels and also cause rainbow on the display.
7. Be careful not to touch or swallow liquid crystal that might leak from a damaged cell. Any liquid
crystal adheres to skin or clothes, wash it off immediately with soap and water.

Static Electricity Precautions:

1. CMOS-LSI is used for the module circuit; therefore operators should be grounded whenever
he/she comes into contact with the module.
2. Do not touch any of the conductive parts such as the LSI pads; the copper leads on the PCBand
the interface terminals with any parts of the human body.
3. Do not touch the connection terminals of the display with bare hand; it will cause disconnection
or defective insulation of terminals.
4. The modules should be kept in anti-static bags or other containers resistant to static for storage.
5. Only properly grounded soldering irons should be used.
6. If an electric screwdriver is used, it should be grounded and shielded to prevent sparks.
7. The normal static prevention measures should be observed for work clothes and working
benches.
8. Since dry air is inductive to static, a relative humidity of 50-60% is recommended.
Soldering Precautions:
1. Soldering should be performed only on the I/O terminals.
2. Use soldering irons with proper grounding and no leakage.
3. Soldering temperature: 270~300C
4. Soldering time: 2 to 3 second.
5. Use eutectic solder with resin flux filling.
6. If flux is used, the LCD surface should be protected to avoid

AGM 1602B-818
13
 7. Flux residue should be removed.
Operation Precautions:
1. The viewing angle can be adjusted by varying the LCD driving voltage Vo.
2. Since applied DC voltage causes electro-chemical reactions, which deteriorate the display, the
applied pulse waveform should be a symmetric waveform such that no DC component remains.
Be sure to use the specified operating voltage.
3. Driving voltage should be kept within specified range; excess voltage will shorten display life.
4. Response time increases with decrease in temperature.
5. Display color may be affected at temperatures above its operational range.
6. Keep the temperature within the specified range usage and storage. Excessive temperature
and humidity could cause polarization degradation, polarizer peel-off or generatebubbles.
7. For long-term storage over 40C is required, the relative humidity should be kept below 60%,
and avoid direct sunlight.

Limited Warranty

AGT LCDs and modules are not consumer products, but may be incorporated by AGT customers
into consumer products or components thereof, AGT does not warrant that its LCDs and
components are fit for any such particular purpose.
1. The liability of AGT is limited to repair or replacement on the terms set forth below. AGT will
not be responsible for any subsequent or consequential events or injury or damage to any
personnel or user including third party personnel and/or user. Unless otherwise agreed in writing
between AGT and the customer, AGT will only replace or repair any of its LCD which is found
defective electrically or visually when inspected in accordance with AGT general LCD
inspection standard . (Copies available on request)
2. No warranty can be granted if any of the precautions state in handling liquid crystal display
above has been disregarded. Broken glass, scratches on polarizer mechanical damages as well as
defects that are caused accelerated environment tests are excluded from warranty.
3. In returning the LCD/LCM, they must be properly packaged; there should be detailed description
of the failures or defect.

AGM 1602B-818
14
13. LCM test criteria
1. Objective
The LCM test criteria are set to formalize AGT quality standards with reference to those
of the customer for inspection, release and acceptance of finished LCM products in order to
guarantee the quality required by the customer.
2. Scope
The criteria are applicable to all the LCM products manufactured by AGT, either supplied alone
or embedded in or integrated with other components.
3. Inspection Apparatuses
Function testers, vernier calipers, microscopes, magnifiers, ESD wrist straps, finger cots, labels,
ovens for high-low temperature tests, refrigerators, constant voltage power supply（DC），
desk lamps, etc.
4. Sampling Plan and Reference Standards
4.1.1 According to GB/T 2828.1---2003/ISO2859-1:1999，single sampling under formal
inspection and the general inspection level II applies.

Item of
Sampling Rate AQL Assessment
Inspection
Cosmetic II Single Sampling MA=0.4 MI=1.5
Mechanical N=3 C=0
Functional II Single Sampling MA=0.4 MI=1.5

4.1.2 GB/T 2828.1---2003/ISO2859-1:1999, sampling procedures and tables for batch inspection.
4.1.3 GB/T 1619.96 Test Methods for TN LCD.
4.1.4 GB/T 12848.91 General Specifications for STN LCD.
4.1.5 GB2421-89 Basic Environmental Test Procedures for Electrical and Electronic Products
4.1.6 IPC-A-610C Acceptance Condition for Electrical Assemblies.

5. Inspection Conditions and Inspection Reference

5.1 Cosmetic inspection: shall be done normally at 25±5℃ of the ambient temperature and
45±20%RH of relative humidity, under the ambient luminance greater than
300cd/cm²and at the distance of 30cm apart between the inspector’s eyes and
the LCD panel and normally in reflected light. For back-lit LCMs, cosmetic
inspection shall be done under the ambient luminance less than 100cd/cm² with
the backlight on.

AGM 1602B-818
15
 5.2 The LCM shall be tested at the angle of 45°, left and right, and 0-45°, top and bottom (for
STN LCM, at 20⁰-55°）.

45
45

5.3 Definition of VA

VA：Viewing area

Non-VA：Non-viewing area

5.4 Inspection with naked eyes（exclusive of the inspection of the physical

dimensions of defects carried out with magnifiers）.
5.5 Electrical properties
Inspection with the test jigs against the product specifications or drawings; display
contents and parameters shall conform to those of the product specifications and the
display effect to the sample.
5.5.1 Test voltage（V）：
5.5.1.1 (Determined) according to the operating instruction of test jigs assuming the external
circuit can be adjusted unless the customer otherwise specifies driving voltage(s).
(Display) effects are controlled within the specified range of voltage variation (If no
specific requirements, display effects are controlled at Vop = 9V or Vop ±0.3V when
Vop is below 9V; if Vop is above 9V, display effects are controlled at Vop ±0.3% at
least).For display products with the customer-specified fixed Vop, display effects are
controlled by adjusting the internal circuit; if necessary, acceptable limit samples shall
be built.
5.5.2 Current Consumption（I）：refer to approved product specifications or drawings.

AGM 1602B-818
16
6. Defects and Acceptance Standards
6.1Dimensions：the outline dimensions and the dimensions that could influence the assembly at
the customer’s side shall conform to those on the approved drawings.
6.2 Main Defects – Functionality Tests:
Acceptance
No. Item Description MAJ MIN
Criteria
Missing segments or dots caused by
broken contact(s), loose connection or
Missing an internal open circuit.
6.2.1 √ Rejected
Segments

No segments, icons or graphics are

No display
6.2.3 displayed when the LCM is connected √ Rejected
/Inaction correctly.
Display pattern is deformed or
6.2.4 Mis-Display jumbled-up under the normal scanning √ Rejected
procedure.
When powered up, the viewing angle at
Wrong
6.2.5 viewing which the display is at its clearest is √ Rejected
angle different from the required viewing
angle or that of the approved samples. )
If out of the
Dim or Dark Overall contrast is either too dark or too voltage
6.2.6 √
Display dim under normal operation. tolerance,
Rejected

Slow Local response time varies when LCM

6.2.7 √ Rejected
response is turned on or off.

Extra Icons, traces, rows or columns that Refer to

6.2.8 segments, should not appear on the LCD screen √ dot/line
rows, or and caused by LCD panel misalignment standard
columns or insufficient corrosion.
Under the normal voltage, the contrast Reject or refer
6.2.9 Dim segment of vertical and horizontal segments is √
to samples
uneven.

AGM 1602B-818
17
 refer to the
spot/line
PI Partial black and white spots visible criteria for the
6.2.10 black/white when changing display contents due to √ visible spots
spots defective PI layer. when display
image remains
still; others OK.
Deformed patterns appearing when
LCD is turned on caused by missing refer to
pinhole/white ITO.
6.2.11 √ spot/line
spots
Y standard
X
d = (X+Y)/2
Segment is either wider , narrower or
deformed than the specified, caused by Acceptable
panel misalignment, resulting in
unwanted heave(s) or missing: |Ia- |Ia-Ib|>1/4W,
Pattern
6.2.12 Ib|≤1/4W(W is the normal width) √ rejected
distortion

6.2.13 High current LCM current is larger than the designed √ Rejected
value.
6.3 LCD Visual Defects
6.3.1 Spot defect (defined within VA, spots out of VA do not count.)
Average diameter
Defect Acceptable quantity MAJ MIN
（d）
Spot defect d≤0.2 3
（black spot, foreign matter, 0.2<d≤0.25 2
√
nick, scratches, including LC
0.25<d≤0.30 1
mis-orientation.）
6.3.2 Line defects (defined within VA; those out of VA do not count.)
Acceptable
Defect Length(L) Width(W) MAJ MIN
quantity
line defects (scratches, linear ≤5.0 ≤0.02 3
foreign matter) ≤3.0 ≤0.03 3
√
≤3.0 ≤0.05 1

note： 1.If the width is bigger than 0.1mm, it shall be treated as spot defect.
6.3.3 Polarizer air bubble (defined within VA; those out of VA do not count.)

AGM 1602B-818
18
 Average diameter Acceptable
Defect MAJ MIN
（d） quantity
Polarizer air bubble, d≤0.3 3
Concave-Convex dot.
0.3<d≤0.5 2
√
W
0.5<d≤0.8
1
L d=(w+l)/2
6.3.4 Glass Damages (for LCMs without bezels and whose LCD edges exposed and for LCMs with
bezels, including COG and H/S LCMs)
No. Item Acceptance Standard MAJ MIN
（mm）
Chip on lead
X ≤1/8L
Y ≤1/3W √
6.3.4.1 Z ≤1/2t
Acceptable
quantity 2
When Y≤0.2mm, the length of X doesn’t count; for chip
neither on lead nor through, when X≤1/10L，Y≤1/2W
max, it doesn’t count.
（mm） MAJ MIN
chip on corner(ITO lead)
X Not entering
into frame and
not contacting
Y with conductive
6.3.4.2 position √
Z ≤t
Acceptable
2
Quantity
For chips on corners, refer to 6.3.4.3 and they must be out
of the frame epoxy. For chips on lead, refer to 6.3.4.1
Chip on sealed area (outer chip) （mm） MAJ MIN
X ≤1/8 L
Y ≤1/2H
√
z ≤ 1/2t
6.3.4.3
Accept
2
numbers
The standard for inner chip on sealed area is the same as
the standard for outer. For chip on the reverse of ITO
contact pad ledge, refer to 6.3.4.1 for chip on the reverse
of ITO contact pad ledge for the value of Y.
Notes: T=Glass Thickness, L=Length, H=Distance between LCD Edge to Inside Edge of LCD Frame
Epoxy and W=Width of Contact Pad Ledge.

AGM 1602B-818
19
6.3.5 Others
Acceptance
No. Item Description MAJ MIN
standard
Newton
More than one color on the same LCD Reject or refer
Ring
6.3.5.1 panel or different colors on different LCDs √ to limit
/Background from the same batch. sample
color
6.3.5.2 LC Leakage / √ Rejected
Missing
6.3.5.3 protective / √ Rejected
film
6.4 Backlight

No. Item Description MAJ MIN Accept

standard
Backlight
not
6.4.1 / √ Rejected
working,
wrong color
When powered on, the LCD color differs Refer to
Color
6.4.2 from that of the sample and is found after √ sample and
deviation
testing not conforming to the drawing. drawing
When powered on, the LCD brightness
differs from that of the sample and is found Refer to
Brightness
6.4.3 after testing not conforming to the drawing; √ sample and
deviation
or if conforming to the drawing but drawing
over±30%.
When powered on, the LCD brightness is Refer to
Uneven
6.4.4 uneven on the same LCD and out of the √ sample and
brightness
specification of the drawing. drawing
6.4.5 Spot/line Appearance of spot or line scratches on the √ Refer to
scratch LCD when turned on. 6.3.1/6.3.2
6.5 Metal frame (Metal Bezel)
Accept
No. Item Description MAJ MIN
standard
Material/sur Metal frame/surface treatment do not conform
6.5.1 face √ Rejected
to the specifications.
treatment
Tab twist
inconformit Wrong twist method or direction and twist tabs
6.5.2 √ Rejected
y/ Tab not are not twisted as required.
twisted

AGM 1602B-818
20
 Oxidation on the surface of the metal bezel；
the quantity of spot defect (chapped front
Oxidization, surface paint and substrate-exposing scratches)
chapped ≤0.8mm exceeds 3; the quantity of linear
paint, defects with the length ≤5.0mm and width
6.5.3 ≤0.05mm exceeds 2; the quantity of spot √ Rejected
discoloratio
n, dents, and defect (front dent, bubble, side surface
scratches chapped paint and substrate-exposing
scratches)≤1.0mm exceeds 3; the quantity of
linear defects with the width ≤0.05mm
exceeds 3.
Burr(s) on metal bezel is so long as to get into
6.5.4 Burr √ Rejected
viewing area.
6.6 PCB/COB
Accept
No. Item Description MAJ MIN
standard
1. Contacts exposure within the white
circle for COB chip bonding.
2. The height of epoxy cover is out of the
product specifications and drawing.
3. The epoxy cover over the COB chip
exceeds the circle by more than 2mm in
Improper diameter, which is the maximum
6.6.1 Epoxy distance the epoxy cover is allowed to √ Rejected
Cover exceed the circle.
4. Existence of obvious linear mark(s) or
chip-exposing pinhole on the epoxy
cover.
5. The pinhole diameter on the epoxy over
exceeds 0.25mm and there is foreign
matter in the pinhole.
1. Oxidized or contaminated gold fingers
on PCB.
2. Bubbles on PCB after reflow-soldering.
3. Exposure of conductive copper foil
caused by chapped or scratched solder-
resist coating.
PCB For the conductive area of PCB repaired
6.6.2 cosmeti √ Rejected
with the solder resist coating material ,
c defect
the diameter ψof the repaired area on the
circuit must not exceed 1.3mm while for
the non-conductive area of PCB
repaired with the solder resist coating
material, the diameterψ must not exceed
2.6mm; the total number of repaired

AGM 1602B-818
21
 areas on PCB must be less than 10;
otherwise, the PCB must be rejected.
1. Components on PCB are not the same as
defined by drawing such as wrong,
excessive, missing, or mis-polarized
components. (The bias circuit of LCD
voltage or the backlight current limiting
resistance is not adjusted unless
Wrong or specified by the customer.）
missing 2. The JUMP short on PCB shall conform
6.6.3 to the mechanical drawing. If excessive √ Rejected
Components
on PCB or missing soldering occurs, the PCB
shall be rejected.
3. For components particularly required by
the customer and specified in the
mechanical drawing and/or component
specifications, their specifications must
conform to those of the suppliers;
otherwise they shall be rejected.
6.7 SMT (Refer to IPC-A-610C if not specified)
Accept
No. Item Description MAJ MIN
standard
Soldering
Cold, false and missing soldering, solder
6.7.1 solder √ Rejected
crack and insufficient solder dissolution.
defects
6.7.2 Solder Solder ball/tin dross causing short at the √ Rejected
ball/splash solder point.
Floated or tilted DIP parts，keypad，
6.7.3 DIP parts √ Rejected
connectors.
The welded spot should be concave and
Solder
6.7.4 excessive or insufficient solder or solder √ Rejected
shape
burr on the welded spot must be rejected.
For the DIP type components, 0.5~2mm
Component component pin must be remained after
cutting the soldered pin, and the solder
6.7.5 pin √ Reject
surface should not be damaged nor should
exposure
the component pin is fully covered with
solder; otherwise rejected.
Caused by yellow-brown or black solder
Poor
6.7.6 √ reject
Appearance flux or resin or the white mist at the solder
point caused by PCB cleaning.
6.8 Heat Pressing (including H/S，FPC, etc.）

No. Item Description MAJ MIN Acceptance

standard

AGM 1602B-818
22
 H/S or FPC
out of
6.8.1 √ Rejected
specification

Dimensions of heat compression material

should be within the specification of the
Dimensions drawing and the contact of conductive
6.8.2 √ Acceptable
/position material should cover more than 1/2 of ITO,
PDA, etc and the dimensions of dislocation
shall be within the tolerance.
Foreign If foreign matter in conductive heat
Matter in compression area shall not cause short, it is
6.8.3 Heat OK. If foreign matter in non-conductive √ Acceptable
pressure heat compression area does not exceed 50%
area of the heat pressure area, it is OK.
Refer to
6.8.4 Folds √ limited
sample
6.9 Connectors and other components
Accept
No. Item Description MAJ MIN
standard
Out of The specification of connector and other
6.9.1 √ Rejected
Specification components do not conform to the drawing.
6.9.2 Position and Solder position and Pin# 1 should be in the √ Rejected
order positions specified by the drawing.

1. Flux on PCB components and pins.

6.9.3 Cosmetic 2. The pin width of a PIN connector √ Rejected
exceeds ½ of the specified pin width.

6.10 General Appearance

No. Item Description MAJ MIN Accept

standard
1. Damaged or contaminated FPC or
H/S gold fingers or FFC contacts.
2. Sharp folds on FPC, FFC, COF, H/S
(unless designed for).
Connection
6.10.1 3. Solder paste larger than 2/3 of pin √ Rejected
material
width on the gold finger of FPC and
PCB.
4. Pierced or folded FPC/FFC
exceeding limit sample.
Defective Stiffener not fully covering H/S，FFC，or
6.10.2 FPC and or not pasted on or glued on output √ Rejected
stiffener
pins.

AGM 1602B-818
23
 Smears, residual glue, finger prints, etc. on
the surface of finished LCMs; solder
6.10.3 Surface dirt spatters or solder balls on non-soldered √ Rejected
area of PCB/COB.
Non-removed defect mark or label on
LCMs.
6.10.4 Assembly Smears or black spots found on LCMs after √ Refer to 6.3.1
black spot backlight or diffuser are assembled.
Product Missing, unclear, incorrect, or misplaced
6.10.5 √ Rejected
mark part numbers and/or batch marks.
Packing being inconsistent with quantity
Inner and part number on packing label,
6.10.6 √ Rejected
packing specifications or the customer order - either
short-packed or over-packed.

7. Reliability test

Test item Condition Time(hrs) Acceptance standard

High Storage Temp. 80C 120
High Operating Temp. 70C 120
Low Storage Temp. - 30C 120
Functions and appearance are
Low Operating Temp. - 20C 120
qualified before and after test
Temp& Humidity Test 40C/ 90%RH 120
- 30C  25C +80C
Storage Thermal Shock 10 cycles
(30 min  5 min  30min)

Notes：① Reliability tests shall be done as required by the customer if they inform AGT of their
special requirements when starting a project.
②Storage test at high-low temperature and functionality test shall be done with reference to
the specified temperature range.
③Test conditions shall be controlled at the permissible tolerance of ±5℃.
8. Packing
8.1 Product packing shall be checked and qualified in accordance with design requirements for
packing. The product packaging label shall bear not only product name, part number,
quantity, product date code but also QA’s qualifying stamp for each production stage.
Incomplete or wrong label shall be unacceptable.

AGM 1602B-818
24
 8.2 When there are problems with packing safety conformity such as shock resistance, moisture
resistance, anti ESD and pressure resistance, packing shall be disqualified.
8.3 When confirmed and accepted by AGT, packing shall be inspected and released according to
the customer’s special requirements for packing.
8.4 RoHS and non-RoHS compliant products shall be labeled clearly and separately. Unless
otherwise specified by the customer, “RoHS” labels shall be used for all RoHS compliant
products.
9. Others
9.1 Items not specified in this document or released on compromise should be inspected with
reference to the mutual agreement and limit samples.

AGM 1602B-818
25