Datasheet G16V8A
Datasheet G16V8A
Datasheet G16V8A
• Industry-standard architecture
– Emulates Many 20-pin PALs®
– Low-cost, easy to use software tools
• High speed electrically-erasable programmable logic devices (EE PLD)
– 5ns maximum pin-to-pin delay
• Low power, 100μA pin controlled power-down mode option
• CMOS and TTL compatible inputs and outputs
– I/O pin keeper circuits High Performance
• Advanced flash technology
– Reprogrammable Electrically-erasable
– 100% tested Programmable
• High reliability CMOS process
– 20 year data retention
Logic Devices
– 100 erase/write cycles
– 2,000V ESD protection Atmel ATF16V8C
– 200mA latchup immunity
• Commercial and industrial temperature ranges
• Dual-in-line and surface mount packages in standard pinouts
• PCI compliant
• Green (ROHS compliant) package options available
Description
The Atmel® ATF16V8C is a high performance EECMOS programmable logic device (PLD)
that utilizes the Atmel proven electrically-erasable (EE) Flash memory technology. Offered
options include speeds down to 5ns and a 100μA pin-controlled power-down mode. All
speed ranges are specified over the full 5V ± 10% range for industrial temperature ranges,
and 5V ± 5% for commercial range 5V devices.
The ATF16V8C incorporates a superset of the generic architectures, which allows direct
replacement of the 16R8 family and most 20-pin combinatorial PLDs. Eight outputs are
each allocated eight product terms. Three different modes of operation are configured auto-
matically with software, and allow highly complex logic functions to be realized.
The ATF16V8C can significantly reduce total system power, thereby enhancing system reli-
ability and reducing power supply costs. When pin 4 is configured as the power-down
control pin, supply current drops to less than 100μA whenever the pin is high. If the power-
down feature isn't required for a particular application, pin 4 may be used as a logic input.
Also, the pin-keeper circuits eliminate the need for internal pull-up resistors along with their
attendant power consumption.
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Figure 0-1. Block diagram
I/CLK
VCC
I/CLK 1 20 VCC
I/O
I/CLK 1 20 VCC
I2
I1
I1 2 19 I/O
I1 2 19 I/O
I2 3 18 I/O
3
2
1
20
19
I2 3 18 I/O
PD/I3 4 17 I/O PD/I3 4 18 I/O
PD/I3 4 17 I/O
I4 5 16 I/O I4 5 17 I/O
I4 5 16 I/O
I5 6 15 I/O I5 6 16 I/O
I5 6 15 I/O
I6 7 14 I/O I6 7 15 I/O
I6 7 14 I/O
I7 8 13 I/O I7 8 14 I/O
10
11
12
13
I7 8 13 I/O
9
I8 9 12 I/O
I8 9 12 I/O
GND 10 11 I9/OE
I8
GND
I9/OE
I/O
I/O
GND 10 11 I9/OE
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2. DC and AC characteristics
Table 2-1. DC and AC operating conditions
Commercial Industrial
Operating temperature (Ambient) 0C - 70C -40C - 85C
VCC power supply 5V ± 5% 5V ± 10%
3
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Figure 3. AC waveforms
Note: 1. Timing measurement reference is 1.5V. Input AC driving levels are 0.0V and 3.0V, unless otherwise specified.
-5 -7 -10
Symbol Parameter Min Max Min Max Min Max Units
tPD Input or feedback to non-registered output 1 5 3 7.5 3 10 ns
tCF Clock to feedback 3 3 6 ns
tCO Clock to output 1 4 2 5 2 7 ns
tS Input or feedback setup time 3 5 7.5 ns
tH Input hold time 0 0 0 ns
tP Clock period 6 8 12 ns
tW Clock width 3 4 6 ns
External feedback 1/(tS + tCO) 142 100 68 MHz
fMAX Internal feedback 1/(tS + tCF) 166 125 74 MHz
No feedback 1/(tP) 166 125 83 MHz
tEA Input to output enable – product term 2 6 3 9 3 10 ns
tER Input to output disable – product term 2 5 2 9 2 10 ns
tPZX OE pin to output enable 2 5 2 6 2 10 ns
tPXZ OE pin to output disable 1.5 5 1.5 6 1.5 10 ns
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-5 -7 -10
Symbol Parameter Min Max Min Max Min Max Units
tIVDH Valid Input before PD High 5.0 7.5 10 ns
tGVDH Valid OE before PD High 0 0 0 ns
tCVDH Valid Clock before PD High 0 0 0 ns
tDHIX Input Don’t Care after PD High 5.0 7.5 10 ns
tDHGX OE Don’t Care after PD High 5.0 7.5 10 ns
tDHCX Clock Don’t Care after PD High 5.0 7.5 10 ns
tDLIV PD Low to Valid Input 5.0 7.5 10 ns
tDLGV PD Low to Valid OE 15.0 20.0 25 ns
tDLCV PD Low to Valid Clock 15.0 20.0 25 ns
tDLOV PD Low to Valid Output 20.0 25.0 30 ns
Note: 1. Output data is latched and held
2. HI-Z outputs remain HI-Z
3. Clock and input transitions are ignored
R1 = 200
OUTPUT
PIN
R2 = 200 CL = 50 pF
6. Pin capacitance
Table 6-1. Pin capacitance
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7. Power-up reset
Registers of the ATF16V8C are designed to reset during power-up. At a point delayed slightly from VCC crossing VRST, all
registers will be reset to the low state. As a result, the registered output state will always be high on power-up.
This feature is critical for state machine initialization. However, due to the asynchronous nature of reset and the uncertainty
of how VCC actually rises in the system, the following conditions are required:
1. The VCC rise must be monotonic, from below 0.7V
2. After reset occurs, all input and feedback setup times must be met before driving the clock term high, and
3. The signals from which the clock is derived must remain stable during tPR
9. Power-down mode
The ATF16V8C includes an optional pin controlled powerdown feature. Device pin 4 may be configured as the power-
down pin. When this feature is enabled and the power-down pin is high, total current consumption drops to less than
100μA. In the power-down mode, all output data and internal logic states are latched and held. All registered and
combinatorial output data remains valid. Any outputs that were in a high-Z state at the onset of power-down will remain at
high-Z. During power-down, all input signals except the power-down pin are blocked. The input and I/O pin-keeper circuits
remain active to insure that pins do not float to indeterminate levels. This helps to further reduce system power.
Selection of the power-down option is specified in the ATF16V8C logic design file. The logic compiler will include this option
selection in the otherwise standard 16V8 JEDEC fuse file. When the power-down feature is not specified in the design file,
pin 4 is available as a logic input, and there is no power-down pin. This allows the ATF16V8C to be programmed using any
existing standard 16V8 fuse file.
Note: Some programmers list the JEDEC-compatible 16V8C (No PD used) separately from the non-JEDEC compatible 16V8CEXT.
(EXT for extended features.)
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15. Functional logic diagram description
The logic option and functional diagrams describe the ATF16V8C architecture. Eight configurable macrocells can be
configured as a registered output, combinatorial I/O, combinatorial output, or dedicated input.
The ATF16V8C can be configured in one of three different modes. Each mode makes the ATF16V8C look like a different
device. Most PLD compilers can choose the right mode automatically. The user can also force the selection by supplying
the compiler with a mode selection. The determining factors would be the usage of register versus combinatorial outputs
and dedicated outputs versus outputs with output enable control.
The ATF16V8C universal architecture can be programmed to emulate many 20-pin PAL devices. These architectural
subsets can be found in each of the configuration modes described in the following pages. The user can download the
listed subset device JEDEC programming file to the PLD programmer, and the ATF16V8C can be configured to act like the
chosen device. Check with your programmer manufacturer for this capability.
Unused product terms are automatically disabled by the compiler to decrease power consumption. A security fuse, when
programmed, protects the content of the ATF16V8C. Eight bytes (64 fuses) of user signature are accessible to the user
for purposes such as storing project name, part number, revision, or date. The user signature is accessible regardless of the
state of the security fuse.
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Atmel ATF16V8C
In simple mode, all feedback paths of the output pins are routed via the adjacent pins. In doing so, the two inner most pins
(pins 15 and 16) will not have the feedback option as these pins are always configured as dedicated combinatorial output.
Notes: 1. Pin 1 and Pin 11 are permanently configured as CLK and OE.
2. The development software configures all the architecture control bits and checks for proper pin usage automatically.
9
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Figure 19. Registered mode logic diagram
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0
1
11
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Figure 24. Complex mode logic diagram
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Package type
20J 20-lead, Plastic J-leaded Chip Carrier (PLCC)
20P3 20-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
20S 20-lead, 0.300" Wide, Plastic Gull-Wing Small Outline (SOIC)
20X 20-lead, 4.4 mm Wide, Plastic Thin Shrink Small Outline (TSSOP)
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26. Package Drawings
20J – PLCC
e
E1 E D2/E2
B1
B
A2
D1
A1
D
A
0.51(0.020)MAX
45˚ MAX (3X)
COMMON DIMENSIONS
(Unit of Measure = mm)
10/04/01
18 Atmel ATF16V8C
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Atmel ATF16V8C
20P3 – PDIP
D
PIN
1
E1
SEATING PLANE
A1
L
B
B1
e
COMMON DIMENSIONS
(Unit of Measure = mm)
C
SYMBOL MIN NOM MAX NOTE
eC
eB A – – 5.334
A1 0.381 – –
D 24.892 – 26.924 Note 2
E 7.620 – 8.255
E1 6.096 – 7.112 Note 2
B 0.356 – 0.559
Notes: 1. This package conforms to JEDEC reference MS-001, Variation AD. B1 1.270 – 1.551
2. Dimensions D and E1 do not include mold Flash or Protrusion. L 2.921 – 3.810
Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").
C 0.203 – 0.356
eB – – 10.922
eC 0.000 – 1.524
e 2.540 TYP
1/23/04
TITLE DRAWING NO. REV.
2325 Orchard Parkway
20P3, 20-lead (0.300"/7.62 mm Wide) Plastic Dual 20P3 D
R San Jose, CA 95131 Inline Package (PDIP)
19
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20S – SOIC
20 Atmel ATF16V8C
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20X – TSSOP
INDEX MARK
PIN
1
6.60 (.260)
6.40 (.252)
1.20 (0.047) MAX
0.20 (0.008)
0º ~ 8º 0.09 (0.004)
0.75 (0.030)
0.45 (0.018)
10/23/03
TITLE DRAWING NO. REV.
2325 Orchard Parkway
20X, (Formerly 20T), 20-lead, 4.4 mm Body Width, 20X C
R San Jose, CA 95131
Plastic Thin Shrink Small Outline Package (TSSOP)
21
0425H–PLD–3/11
27. Revision history
Doc. rev. Date Comments
Added green (ROHS compliant) package options
0425H 03/2011
Removed lead based packaged from ordering section
22 Atmel ATF16V8C
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