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IRF450

MECHANICAL DATA
Dimensions in mm (inches)
N–CHANNEL
39.95 (1.573)
max.
POWER MOSFET
30.40 (1.197)
30.15 (1.187)

17.15 (0.675)
16.64 (0.655)

4.09 (0.161)
3.84 (0.151)
VDSS 500V
dia.
2
ID(cont) 13A
26.67 (1.050)
11.18 (0.440)
10.67 (0.420)

2 plcs.
max.

1 RDS(on) 0.4W

20.32 (0.800)
FEATURES
18.80 (0.740)
dia.
• HERMETICALLY SEALED TO–3 METAL
7.87 (0.310)
6.99 (0.275)

PACKAGE
1.78 (0.070)
1.52 (0.060)

• SIMPLE DRIVE REQUIREMENTS


12.07 (0.475)
11.30 (0.445)

1.09 (0.043)
0.97 (0.038)
dia. • SCREENING OPTIONS AVAILABLE
2 plcs.

TO–3 Metal Package


Pin 1 – Gate Pin 2 – Source Case – Drain

ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C unless otherwise stated)


VGS Gate – Source Voltage ±20V
ID Continuous Drain Current (VGS = 0 , Tcase = 25°C) 12A
ID Continuous Drain Current (VGS = 0 , Tcase = 100°C) 7.75A
IDM Pulsed Drain Current 1 48A
PD Power Dissipation @ Tcase = 25°C 150W
Linear Derating Factor 1.2W/°C
EAS Single Pulse Avalanche Energy 2 8.0mJ
IAR Avalanche Current 2 12A
dv/dt Peak Diode Recovery 3 3.5V/ns
TJ , Tstg Operating and Storage Temperature Range -55 to +150°C
TL Lead Temperature 1.6mm (0.63”) from case for 10 sec. 300°C

Notes
1) Pulse Test: Pulse Width £ 300ms, d £ 2%
2) @ VDD = 25V , L ³ 480mH , RG = 25W , Peak IL = 28A , Starting TJ = 25°C
3) @ ISD £ 28A , di/dt £ 170A/ms , VDD £ BVDSS , TJ £ 150°C , Suggested RG = 9.1W

Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612. Prelim. 10/99
E-mail: sales@semelab.co.uk Website: http://www.semelab.co.uk
IRF450

ELECTRICAL CHARACTERISTICS (Tcase = 25°C unless otherwise stated)


Parameter Test Conditions Min. Typ. Max. Unit
STATIC ELECTRICAL RATINGS
BVDSS Drain – Source Breakdown Voltage VGS = 0 ID = 1mA 500 V
DBVDSS Temperature Coefficient of Reference to 25°C
0.78 V / °C
DTJ Breakdown Voltage ID = 1mA
Static Drain – Source On–State VGS = 10V ID = 7.75A 0.4
RDS(on) W
Resistance 1 VGS = 10V ID = 12A 0.5
VGS(th) Gate Threshold Voltage VDS = VGS ID = 250mA 2 4 V
gfs Forward Transconductance 1 VDS ³ 15V IDS = 7.75A 5.5 S (É)
VGS = 0 VDS = 0.8BVDSS 25
IDSS Zero Gate Voltage Drain Current mA
TJ = 125°C 250
IGSS Forward Gate – Source Leakage VGS = 20V 100
nA
IGSS Reverse Gate – Source Leakage VGS = –20V –100
DYNAMIC CHARACTERISTICS
Ciss Input Capacitance VGS = 0 2700
Coss Output Capacitance VDS = 25V 600 pF
Crss Reverse Transfer Capacitance f = 1MHz 240
Qg Total Gate Charge VGS = 10V 55 120
Qgs Gate – Source Charge ID = 12A 5 19 nC
Qgd Gate – Drain (“Miller”) Charge VDS = 0.5BVDSS 27 70
td(on) Turn–On Delay Time 35
VDD = 250V
tr Rise Time 190
ID = 12A ns
td(off) Turn–Off Delay Time 170
RG = 2.35W
tf Fall Time 130
SOURCE – DRAIN DIODE CHARACTERISTICS
IS Continuous Source Current 12
A
ISM Pulse Source Current 2 48
IS = 12A TJ = 25°C
VSD Diode Forward Voltage 1 1.7 V
VGS = 0
trr Reverse Recovery Time IF = 12A TJ = 25°C 1600 ns
Qrr Reverse Recovery Charge 1 di / dt £ 100A/ms VDD £ 50V 14 mC
ton Forward Turn–On Time Negligible
PACKAGE CHARACTERISTICS
LD Internal Drain Inductance (measured from 6mm down drain lead to centre of die) 5.0
nH
LS Internal Source Inductance (from 6mm down source lead to source bond pad) 13
THERMAL CHARACTERISTICS
RqJC Thermal Resistance Junction – Case 1.0
RqCS Thermal Resistance Case – Sink 0.12 °C/W
RqJA Thermal Resistance Junction – Ambient 30
Notes
1) Pulse Test: Pulse Width £ 300ms, d £ 2%
2) Repetitive Rating – Pulse width limited by maximum junction temperature.
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612. Prelim. 10/99
E-mail: sales@semelab.co.uk Website: http://www.semelab.co.uk
This datasheet has been download from:

www.datasheetcatalog.com

Datasheets for electronics components.

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