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Sige HBT Type: Transistors

This document provides specifications for a SiGe HBT transistor called MSG33001. It is intended for use in low-noise RF amplifiers. Key specifications include: - Compatible for high breakdown voltage and high cutoff frequency applications. Intended for use in high-density and ultraminiature equipment. - Low-noise and high-gain characteristics make it suitable for amplification applications. - Dimensions of 0.8mm x 1.2mm x 0.52mm, intended for mounting in small spaces. - Electrical characteristics include cutoff currents below 1nA/μA, forward current transfer ratio of 100-220, transition frequency of 19GHz, and noise figure below 2dB.

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0% found this document useful (0 votes)
37 views4 pages

Sige HBT Type: Transistors

This document provides specifications for a SiGe HBT transistor called MSG33001. It is intended for use in low-noise RF amplifiers. Key specifications include: - Compatible for high breakdown voltage and high cutoff frequency applications. Intended for use in high-density and ultraminiature equipment. - Low-noise and high-gain characteristics make it suitable for amplification applications. - Dimensions of 0.8mm x 1.2mm x 0.52mm, intended for mounting in small spaces. - Electrical characteristics include cutoff currents below 1nA/μA, forward current transfer ratio of 100-220, transition frequency of 19GHz, and noise figure below 2dB.

Uploaded by

Phong Do
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Transistors

MSG33001
SiGe HBT type

For low-noise RF amplifier Unit: mm

0.33+0.05
–0.02 0.10+0.05
–0.02

■ Features 3

• Compatible between high breakdown voltage and high cutoff fre-

0.15 min.
0.80±0.05
1.20±0.05
quency


• Low-noise, high-gain amplification 0.23+0.05
–0.02
1 2

0.15 min.
• Suitable for high-density mounting and downsizing of the equip- (0.40) (0.40)
0.80±0.05
ment for Ultraminiature package 1.20±0.05
0.8 mm × 1.2 mm (height 0.52 mm) 5˚

0.52±0.03
■ Absolute Maximum Ratings Ta = 25°C

0 to 0.01

0.15 max.
Parameter Symbol Rating Unit
Collector-base voltage (Emitter open) VCBO 9 V 1: Base
2: Emitter
Collector-emitter voltage (Base open) VCEO 6 V 3: Collector
Emitter-base voltage (Collector open) VEBO 1 V SSSMini3-F1 Package

Collector current IC 30 mA Marking Symbol: 5S


Collector power dissipation * PC 100 mW
Junction temperature Tj 125 °C
Storage temperature Tstg −55 to +125 °C
Note) *: Copper plate at the collector is 5.0 mm2 on substrate at 10 mm × 12
mm × 0.8 mm.

■ Electrical Characteristics Ta = 25°C ± 3°C


Parameter Symbol Conditions Min Typ Max Unit
Collector-base cutoff current (Emitter open) ICBO VCB = 9 V, IE = 0 1 nA
Collector-emitter cutoff current (Base open) ICEO VCE = 6 V, IB = 0 1 µA
Emitter-base cutoff current (Collector open) IEBO VEB = 1 V, IC = 0 1 µA
Forward current transfer ratio hFE VCE = 3 V, IC = 3 mA 100 220 
Transition frequency fT VCE = 3 V, IC = 10 mA, f = 2 GHz 19 GHz
Forward transfer gain S21e2 VCE = 3 V, IC = 10 mA, f = 2 GHz 9.0 11.0 dB
Noise figure NF VCE = 3 V, IC = 3 mA, f = 2 GHz 1.4 2.0 dB
Collector output capacitance Cob VCB = 3 V, IE = 0, f = 1 MHz 0.3 0.6 pF
(Common base, input open circuited)
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.

Publication date: October 2004 SJC00299BED 1


MSG33001

PC  Ta IC  VCE hFE  IC
120
VCE = 3 V
IB = 80 µA 160
Collector power dissipation PC (mW)

12

Forward current transfer ratio hFE


70 µA

Collector current IC (mA)


80 60 µA 120

8 50 µA

40 µA 80

40 30 µA
4
20 µA 40

10 µA

0 0 0
0 40 80 120 0 2 4 6 0.01 0.1 1 10 100

Ambient temperature Ta (°C) Collector-emitter voltage VCE (V) Collector current IC (mA)

fT  I C Cob  VCB GP  I C
25 0.8 15
C (pF)

VCE = 3 V f = 1 MHz VCE = 3 V


f = 2 GHz f = 2 GHz
(Common base, input open circuited) ob

0.7
20
Transition frequency fT (GHz)

10
0.6

Power gain GP (dB)


15 5
Collector output capacitance

0.5

0.4
10 0

0.3
5 –5
0.2

0 0.1 –10
1 10 100 0 2 4 6 0.1 1 10 100

Collector current IC (mA) Collector-base voltage VCB (V) Collector current IC (mA)

S21e2  IC NF  IC S11 , S22


1.0 VCE = 3 V
VCE = 3 V VCE = 3 V IC = 10 mA
f = 2 GHz f = 2 GHz
6 0.5 2.0
12
Forward transfer gain S21e (dB)
2

Noise figure NF (dB)

8 4

0
1

S11

4 2
S22

− 0.5 −2.0
0 0
1 10 100 0.1 1 10 100 −1.0

Collector current IC (mA) Collector current IC (mA)

2 SJC00299BED
MSG33001

S21e2, S12e2  f
40
Reverse transfer gain S12e2 (dB)
Forward transfer gain S21e2,

20

S21e2
0

–20
S12e2

–40
0 1 2 3

Frequency f (GHz)

SJC00299BED 3
Request for your special attention and precautions in using the technical information
and semiconductors described in this material

(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
and Foreign Trade Law" is to be exported or taken out of Japan.

(2) The technical information described in this material is limited to showing representative characteristics and
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.

(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.

(4) The products described in this material are intended to be used for standard applications or general elec-
tronic equipment (such as office equipment, communications equipment, measuring instruments and house-
hold appliances).
Consult our sales staff in advance for information on the following applications:
• Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus-
tion equipment, life support systems and safety devices) in which exceptional quality and reliability are
required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
• Any applications other than the standard applications intended.

(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifica-
tions satisfy your requirements.

(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rat-
ing, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
physical injury, fire, social damages, for example, by using the products.

(7) When using products for which damp-proof packing is required, observe the conditions (including shelf life
and amount of time let standing of unsealed items) agreed upon when specification sheets are individually
exchanged.

(8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.

2003 SEP

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