Information Requirements For Manufacturing Printed Boards and Other Electronic Assemblies

IPC-D-326A
ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES ®
Information Requirements
for Manufacturing Printed
Boards and Other
Electronic Assemblies
Developed by the IPC-D-326A Task Group (2-11A) of the Data

Generation and Transfer Committee (2-10) of IPC
Supersedes: Users of this publication are encouraged to participate in the

IPC-D-326 - April 1991 development of future revisions.
Contact:
IPC
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel 847 509.9700
Fax 847 509.9798
IPC-D-326A January 2003
Table of Contents
1 SCOPE ....................................................................... 1 5 THE BILL OF MATERIAL ........................................ 2
1.1 Purpose .................................................................. 1 5.1 Component Detail ................................................. 3
1.2 Classification ......................................................... 1 5.2 Panelization Documentation ................................. 3
5.3 Qualified Parts List ............................................... 3
2 APPLICABLE AND REFERENCE DOCUMENTS ... 1
2.1 Applicable Documents .......................................... 1 5.4 Component History Records ................................ 3
2.1.1 IPC ......................................................................... 1 5.5 Component Traceability Record ........................... 3
5.6 Defective Material Record .................................... 3
2.2 Reference Documents ........................................... 1
6 THE ASSEMBLY DOCUMENTATION ...................... 3
3 DOCUMENTATION CONSIDERATIONS .................. 1
6.1 The Assembly Drawing ........................................ 3
3.1 Terms and Definitions ........................................... 1
6.2 Product Process Routing ....................................... 3
4 THE STATEMENT OF WORK .................................. 1
6.3 Operation Instructions ........................................... 3
4.1 Bill of Materials .................................................... 1
7 TEST DOCUMENTATION ......................................... 5
4.2 Assembly Identification ........................................ 1
4.3 Documentation Listing .......................................... 1 7.1 Test Procedure ....................................................... 5
4.4 Test Requirements ................................................. 2 7.2 Schematics ............................................................. 5
4.5 Programmable Devices ......................................... 2 8 ENVIRONMENTAL STRESS SCREENING

(ESS) ......................................................................... 5
4.6 Packaging for Shipment ........................................ 2
4.7 Marking Requirements .......................................... 2
Figures
4.8 Quality System Requirements .............................. 2
4.9 ESS Requirements ................................................ 2 Figure 6-1 Mixed Technology Board .................................. 4
4.10 Workmanship and Acceptance Standards ............. 2

4.11 Models or Illustrations .......................................... 2 Tables
4.12 Quantity and Delivery .......................................... 2 Table 4-1 Statement of Work Check List ............................ 2
4.13 Tooling .................................................................. 2 Table 6-1 Assembly Checklist ............................................. 3
4.14 Other Relevant Business Practices for Table 7-1 Electrical Test Checklist ...................................... 5
Assembly Services ................................................ 2 Table 8–1 Burn-In/ESS Requirements ................................. 5
iv
January 2004 IPC-D-326A
Information Requirements for Manufacturing

Printed Boards and Other Electronic Assemblies
1 SCOPE 2.2 Reference Documents The following documents are

This document covers the information requirements for the listed as reference documents only. These documents con-
procurement of material, box build, assembly, system inte- tain information relevant to this specification.
gration, inspection, test, burn-in, and delivery and/or distri-
J-STD-001 General Requirements for Soldering Electronic
bution of electronic assemblies.
Interconnections
1.1 Purpose The purpose of this document is to outline MIL-C-45662 Calibration

an effective method of transferring product assembly infor-
mation intercompany or from OEM to the assembler. 3 DOCUMENTATION CONSIDERATIONS
The information contained in the document describes sys-
1.2 Classification The level of assembly documentation tems of communicating product information required to
that is required is dependent on both the overall complex- effectively produce or procure material, assemble, inspect,
ity of the product and whether the assembly process must test, burn-in, and deliver varying complexities of electronic
meet government, military or other regulatory agency assemblies.
requirements. The success or failure of the utilization of independent
assemblers depends largely on communicating product and
2 APPLICABLE AND REFERENCE DOCUMENTS acceptability requirements.
All documentation shall be in the English language. All
2.1 Applicable Documents The following documents of
documentation for BOMs, drawings, tooling, test nodes,
the issue currently in effect form a part of this document to
etc., should be such provided in electronic format.
the extent specified herein. Subsequent issues of, or amend-
Examples of electronic formats are spreadsheets, Gen-
ments to, these documents shall become a part of this
CAM, Gerber, CAD, SRFF, etc.
specification unless otherwise stated.
3.1 Terms and Definitions Definitions of all terms used
2.1.1 IPC1
herein shall be as specified in IPC-T-50.
IPC-T-50 Terms and Definitions for Interconnecting and 4 THE STATEMENT OF WORK
Packaging Electronic Circuits
There is certain basic information required for all products
independent of their complexity or end use. These docu-
IPC-D-325 End Product Documentation for Printed Board
ments are listed in Table 4-1, and are detailed in the fol-
and Assemblies
lowing sections.
IPC-A-610 Acceptability of Printed Board Assemblies A Statement of Work should be generated that specifically
identifies the services to be performed. Statement of work
IPC-CM-770 Component Mounting Guidelines for Printed includes but is not limited to the following items.
Boards
4.1 Bill of Materials Material procurement requirements
IPC-7711 Rework of Electronic Assemblies shall be specified in detail. State if all material is to be pur-
chased by the assembler or identify that material which is
IPC-7721 Repair and Modification of Printed Boards and to be supplied by the OEM.
Electronic Assemblies
4.2 Assembly Identification Identify the product to be
IPC-9191 General Guidelines for Implementation of Sta- assembled making reference to part number and revision
tistical Process Control level.
IPC-EMSI-TC2 IPC Sample Master Ordering Agreement 4.3 Documentation Listing A listing of all drawings and
for EMS Companies and OEMs documents that are under your configuration control.
1. www.ipc.org

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IPC-D-326A

Developed by the IPC-D-326A Task Group (2-11A) of the Data

Supersedes: Users of this publication are encouraged to participate in the

4.5 Programmable Devices ......................................... 2 8 ENVIRONMENTAL STRESS SCREENING

4.10 Workmanship and Acceptance Standards ............. 2

Information Requirements for Manufacturing

1 SCOPE 2.2 Reference Documents The following documents are

1.1 Purpose The purpose of this document is to outline MIL-C-45662 Calibration

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