CASE STUDIES: GYROS

15.4.1 Background and History

Gyroscopes are used for measuring angular rotation speed. Gyroscopes used to be a high-cost,
low-volume product, intended only for high-end applications, such as guidance and military
use.There are several principles for such measurement, including optical and thermal [9]. However,
the most common method is based on the Coriolis force developed on a moving object.
Earlier MEMS gyros were made in the 1980s from quartz tuning fork architecture. The
popularity of motion sensing gaming and human–computer interface technology demands high
performance, low cost and very small gyros.
Other applications are rapidly emerging. In 2010, the digital camera OIS (Optical Image
Stabilization) market is developing. Cameras are increasingly using higher-resolution imager
chips, whereas, on the other hand, pictures taken in low-light conditions or with zoom lens are
subjected to hand movement. The OIS application requires a sensor that costs less than $5,
preferably even lower. It must measure hand jitter from 0.1 to 20 Hz with exceptional low noise
(e.g., 0.033 /s-rms).
Many companies compete in this space, including STMicroelectronics, Robert Bosch, and
Analog Devices, uses vibrating mass architecture.
Gyros are much more challenging to design and fabricate than other high volume MEMS
products such as pressure sensors and acceleration sensors.The absolute magnitude of the Coriolis
force sensed is orders of magnitude lower than any MEMS accelerometer. For example, the
signal change in gyros is on the order of 100 attofarad. Gyros are also very sensitive to any potential
manufacturing variations, packaging stresses, linear accelerations, and changes in ambient
temperature.
15.4.2 The Coriolis Force
We explain the Coriolis force measurement below. Given an object with a velocity
v in a rotational framework with a rotation speed of the magnitude of the Coriolis force is
(15.4)
where is the angle between the velocity vector and the rotational vector. In most simple design
cases, the terms and v are perpendicular and
The directions of the terms, and can be found by using the sign conventions of the
vector cross-product, diagramed in the figure below.
Æ, n Fc,
Æ sin a = 1.
a
Fc = -2 mÆv sin a,
Æ,
(mass = m)
_
The Coriolis force can be used to explain many phenomena, including swirling water
draing from a basin.The most direct experience is with a bicycle (Figure 15.10).When you are
riding a bike and you intend to turn to the right-hand side, you push on the right-hand side handle.
Consider the movement of a mass on the rim of the bicycle front wheel. A push on the right
handle sets up a rotation which causes a Coriolis force to move the front of the wheel to
the right-hand side. Exactly what the rider wants, even though he/she has no idea what the
Coriolis force is.
In MEMS, it is however very difficult to make rotating wheels. Even though such structures
can be created, it would involve friction force. However, since scaling favors surface effects,
it also means that the friction force is large relative to other body forces. For MEMS gyro,
the realistic solution is to use a vibrating structure—it simulating a rotating disc, except that the
disc oscillates back and forth, instead of in only one direction.
MEMS gyros use oscillating structures to generate the velocity component. A tuning
fork structure is a device with two tines (for symmetry), with each tine oscillating in a certain direction. For
example, in Figure 15.11, a vibrating gyro with tine velocity along the axis labeled
V is subjected to a rotational speed , applied along the direction of the tines.This produces
a Coriolis force in the perpendicular axis, A micro gyro actually consists of two parts, an
actuator that excites the tines, and a displacement sensor that measures motion along the
Coriolis force axes. 15.4.3 MEMS Gyro Design
A MEMS gyro can be constructed on a wafer serving as a frame. It is not much different in
principle from the tuning fork—a moving mass is excited and a cross-axis motion is sensed.The
magnitude of the displacement corresponds to the rotation speed. A MEMS moving block design
looks very different from a tuning fork though.The mass is anchored to the silicon wafers
through suspension beams.
A MEMS gyro can be characterized by the number of rotational axis it is sensitive to.The
three rotational axes with respect to a chip are demonstrated in Figure 15.12. The earliest
MEMS gyros were sensitive to Z-axis only and sometimes referred at yaw rate sensors. Later,
two axis gyros were developed (y and z axis or x and y axis).This is followed lately (in 2010) by
three axis gyros.
A single-axis gyro can be sensitive to an in-plane axis. Overall, there are two possible oneaxis
gyros—a yaw rate sensor or a pitch rate sensor.The various ways by which such sensors can
be configured are shown in Figure 15.13.
A schematic diagram of a Z-axis yaw rate gyro is shown in Figure 15.14.The mass block is
moved along one axis, whereas the Coriolis displacement is sensed along another. Both the
driving and sensing can be accomplished with electrostatic sensing and actuation.
A layout design of a pitch-rate gyro is shown below.A moving mass is excited to sway left
and right (in the diagram).The Coriolis force causes the mass to dip and rise, changing the capacitance
with respect to the bottom electrode.
There are even more variations of configurations for dual axis and tri-axial gyro sensors
(Figure 15.15).The design challenge lies in the fact that the moving blocks are situated side by
side, occupying more chip space than a single axis one in general. 15.4.4 Single Axis Gyro Dynamics
A gyro consists of a mass that is excited in one direction with a sinusoidal forcing function.This
creates movement and velocity, which in turn generate a Coriolis force and excited another axis.
Some major design considerations for a one-axis gyro would include:
1. The x axis would be driven sinuisoidally. The amplitude and speed must be repeatable.
Further, the amplitude must be insensitive to environmental factors;
2. The displacement in y axis should be as large as possible for sensitivity. However, since
the y-axis motion would be coupled back to the x axis through Coriolis force, the y-axis
motion can not be excessive.
3. Further, cross-sensitivity to rotation in other axis and to linear accelerations must be suppressed.
The crosstalk must be minimized using a number of ways. Over the years, researchers have
tried various techniques, including mechanical decoupling, electrostatic force compensation,
and mechanical trimming [10]. Complex computer modeling has been used for design optimization
and performance analysis [11]
The mass is determined by the area and the depth of the moving block. In principle, the
mass does not scale well with MEMS technology. It can be even argued that MEMS technology
does not work for a gyro. Fortunately, issues associated with signal detection were solved sufficiently
well. MEMS gyros have sufficient performance to survive in the market. Commercial Case: InvenSense Gyro
InvenSense was a company that started in 2003. Its gyroscope sensors have a dominant market
position in 2010. The sensors are very small and consume little power. Each chip contains sophisticated
electronics, including 16 bit analog-to-digital converter, programmable digital lowpass
filter, temperature-compensated bias adjustment, and application programming interfaces
for use in systems.
The following is a list of key technical specifications for Invensense ITG-3200 three axis
gyro. The package dimension is Within the volume are the micromechanical
parts as well as integrated 16-bit analog-to-digital conversion and user-selectable internal lowpass
filter. It also incorporates an embedded temperature sensor and an internal oscillator for
clock. It is shipped to commercial customers in reels compatible with automated assembly machinery.
Each reel contains 5000 sensors.
Unlike Knowles microphone, which use the multiple chip module package level integration
approach, InvenSense developed an integrated wafer-level integration process and produced
single-chip CMOS plus MEMS assembly. One possible reason is the noise requirement.
A second reason is perhaps patent related.
The company developed many unique processes (Figure 15.16). Its patented process
employs bulk silicon processing, wafer level packaging and hermetic encapsulation, and other
innovative integration techniques to achieve a low-cost single chip MEMS device.The CMOS
chip is bonded directly on top of the MEMS wafer using eutectic bonding to the aluminum
layer of the CMOS wafer.\\\