LM4701

LM4701 Overture Audio Power Amplifier Series 30W Audio Power Amplifier

with Mute and Standby Modes

Literature Number: SNAS023C

 30W Audio Power Amplifier with Mute and Standby Modes
LM4701 Overture Audio Power Amplifier Series
LM4701 Overture™ Audio OBSOLETE
September 23, 2011
Power Amplifier Series

30W Audio Power Amplifier with

Mute and Standby Modes
General Description Key Specifications
The LM4701 is an audio power amplifier capable of delivering ■ THD+N at 1kHz at continuous average output 0.1%
typically 30W of continuous average output power into an power of 25W into 8Ω: (max)
8Ω load with less than 0.1% THD+N. ■ THD+N from 20Hz to 20kHz at 30W of continuous 0.08%
The LM4701 has an independent smooth transition fade-in/ average output power into 8Ω: (typ)
out mute and a power conserving standby mode which can ■ Standby current: 2.1mA (typ)
be controlled by external logic.
The performance of the LM4701, utilizing its Self Peak In- Features
stantaneous Temperature (°Ke) (SPiKe™) protection circuit- ■ SPiKe Protection
ry, places it in a class above discrete and hybrid amplifiers by
providing an inherently, dynamically protected Safe Operat- ■ Minimal amount of external components necessary
ing Area (SOA). SPiKe protection means that these parts are ■ Quiet fade-in/out mute function
completely safeguarded at the output against overvoltage, ■ Power conserving standby-mode
undervoltage, overloads, including thermal runaway and in- ■ Non-Isolated 9-lead TO-220 package
stantaneous temperature peaks.
■ Wide supply range 20V - 66V

Applications
■ TVs
■ Component stereo
■ Compact stereo

Typical Application Connection Diagram

Plastic Package

10083502
Top View
Order Number LM4701T
See NS Package Number TA9A
For Staggered Lead Non-Isolated Package
Only a 9-Pin Package

10083501
*Optional components dependent upon specific design requirements. Refer
to the External Components Description section for a component functional
description.

FIGURE 1. Typical Audio Amplifier Application Circuit

SPiKe™ Protection and Overture™ are trademarks of National Semiconductor Corporation.

© 2011 National Semiconductor Corporation 100835 www.national.com

100835 Version 6 Revision 4 Print Date/Time: 2011/09/23 10:46:45

LM4701 Junction Temperature (Note
Absolute Maximum Ratings (Note 5, Note 8) 150°C
4) Thermal Resistance
If Military/Aerospace specified devices are required,  θJC 1.8°C/W
please contact the National Semiconductor Sales Office/  θJA 43°C/W
Distributors for availability and specifications.
Soldering Information
Supply Voltage |VCC| + |VEE| TF Package (10 sec.) 260°C
(No Signal) 66V Storage Temperature −40°C ≤ TA ≤
Supply Voltage |VCC| + |VEE| +150°C
(with Input and Load) 64V
Common Mode Input Voltage (VCC or VEE) and Operating Ratings (Note 4, Note 5)
|VCC| + |VEE| ≤ 60V Temperature Range
Differential Input Voltage 60V TMIN ≤ TA ≤ TMAX −20°C ≤ TA ≤
Output Current Internally Limited +85°C
Power Dissipation (Note 6) 62.5W Supply Voltage |VCC| + |VEE| (Note 1) 20V to 64V
ESD Susceptibility (Note 7) 2000V

Electrical Characteristics
(Note 4, Note 5) The following specifications are for VCC = +28V, VEE = −28V with RL = 8Ω, unless otherwise specified. Limits apply
for TA = 25°C.
LM4701
Units
Symbol Parameter Conditions Typical Limit
(Limits)
(Note 9) (Note 10)
|VCC| + |VEE| Power Supply Voltage GND − VEE ≥ 9V 18 20 V (min)
(Note 11) 64 V (max)
PO Output Power THD + N = 0.1% (max), f = 1 kHz
(Note 3) (Continuous Average) RL = 8Ω, |VCC| = |VEE| = 28V 30 25 W/ch (min)
RL = 4Ω, |VCC| = |VEE| = 20V (Note 13) 22 15 W/ch (min)
THD + N Total Harmonic Distortion 30W/ch, RL = 8Ω, 0.08 %
Plus Noise 20 Hz ≤ f ≤ 20 kHz, AV = 26 dB
SR (Note 3) Slew Rate VIN = 1.414 Vrms, trise = 2 ns 18 12 V/μs (min)
ITOTAL Total Quiescent Power VCM = 0V, VO = 0V, IO = 0 mA
(Note 2) Supply Current Standby: Off 25 40 mA (max)
Standby: On 2.1 mA
Standby Pin
VIL Standby Low Input Voltage Not in Standby Mode 0.8 V (max)
VIH Standby High Input Voltage In Standby Mode 2.0 2.5 V (min)
Mute Pin
VIL Mute Low Input Voltage Output Not Muted 0.8 V (max)
VIH Mute High Input Voltage Output Muted 2.0 2.5 V (min)
AM Mute Attenuation VPIN8 = 2.5V 115 80 dB (min)
VOS (Note 2) Input Offset Voltage VCM = 0V, IO = 0 mA 2.0 15 mV (max)
IB Input Bias Current VCM = 0V, IO = 0 mA 0.2 0.5 μA (max)
IOS Input Offset Current VCM = 0V, IO = 0 mA 0.002 0.2 μA (max)
IO Output Current Limit |VCC| = |VEE| = 10V, tON = 10 ms, 3.5 2.9 APK (min)
VO = 0V
VOD Output Dropout Voltage |VCC − VO|, VCC = 20V, IO = +100 mA 1.8 2.3 V (max)
(Note 2) (Note 12) |VO − VEE|, VEE = −20V, IO = −100 mA 2.5 3.2 V (max)
PSRR Power Supply Rejection Ratio VCC = 30V to 10V, VEE = −30V, 115 85 dB (min)
(Note 2) VCM = 0V, IO = 0 mA
VCC = 30V, VEE = −30V to −10V 110 85 dB (min)
VCM = 0V, IO = 0 mA

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 LM4701
LM4701
Units
Symbol Parameter Conditions Typical Limit
(Limits)
(Note 9) (Note 10)
CMRR (Note 2) Common Mode Rejection Ratio VCC = 35V to 10V, VEE = −10V to −35V, 110 80 dB (min)
VCM = 10V to −10V, IO = 0 mA
AVOL (Note 2) Open Loop Voltage Gain RL = 2 kΩ, ΔVO = 30V 110 90 dB (min)
GBWP Gain-Bandwidth Product fO = 100 kHz, VIN = 50 mVrms 7.5 5 MHz (min)
eIN Input Noise IHF—A Weighting Filter 2.0 8 μV (max)
(Note 3) RIN = 600Ω (Input Referred)
SNR Signal-to-Noise Ratio PO = 1W, A-Weighted, 98 dB
Measured at 1 kHz, RS = 25Ω
PO = 25W, A-Weighted 108 dB
Measured at 1 kHz, RS = 25Ω

Note 1: Operation is guaranteed up to 64V, however, distortion may be introduced from SPiKe Protection Circuitry if proper thermal considerations are not taken
into account. Refer to the Application Information section for a complete explanation.
Note 2: DC Electrical Test; Refer to Test Circuit #1.
Note 3: AC Electrical Test; Refer to Test Circuit #2.
Note 4: All voltages are measured with respect to the GND (pin 7), unless otherwise specified.
Note 5: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions
which guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters
where no limit is given, however, the typical value is a good indication of device performance.
Note 6: For operating at case temperatures above 25°C, the device must be derated based on a 150°C maximum junction temperature and a thermal resistance
of θJC = 1.8 °C/W (junction to case). Refer to the section, Determining the Correct Heat Sink, in the Application Information section.
Note 7: Human body model, 100 pF discharged through a 1.5 kΩ resistor.
Note 8: The operating junction temperature maximum is 150°C, however, the instantaneous Safe Operating Area temperature is 250°C.
Note 9: Typicals are measured at 25°C and represent the parametric norm.
Note 10: Limits are guarantees that all parts are tested in production to meet the stated values.
Note 11: VEE must have at least −9V at its pin with reference to ground in order for the under-voltage protection circuitry to be disabled. In addition, the voltage
differential between VCC and VEE must be greater than 14V.
Note 12: The output dropout voltage, VOD, is the supply voltage minus the clipping voltage. Refer to the Clipping Voltage vs. Supply Voltage graph in the Typical
Performance Characteristics section.
Note 13: For a 4Ω load, and with ±20V supplies, the LM4701 can deliver typically 22 Watts of continuous average power per channel with less than 0.1% (THD
+N). With supplies above ±20V, the LM4701 cannot deliver more than 22 watts into 4Ω due to current limiting of the output transistors. Thus, increasing the power
supply above ±20V will only increase the internal power dissipation, not the possible output power. Increased power dissipation will require a larger heat sink as
explained in the Application Information section.

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LM4701 Test Circuit #1 (Note 2) (DC Electrical Test Circuit)

10083503

Test Circuit #2 (Note 3) (AC Electrical Test Circuit)

10083504

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 LM4701
Bridged Amplifier Application Circuit

10083505

FIGURE 2. Bridged Amplifier Application Circuit

Single Supply Application Circuit

10083506

FIGURE 3. Single Supply Amplifier Application Circuit

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LM4701
Auxillary Amplifier Application Circuit

10083507

FIGURE 4. Auxillary Amplifier Application Circuit

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 LM4701
Equivalent Schematic
(Excluding Active Protection Circuitry)

10083508

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LM4701
External Components Description
Components Functonal Description
1 RB Prevents currents from entering the amplifier's non-inverting input which may be passed through to the load
upon power down of the system due to the low input impedance of the circuitry when the undervoltage circuitry
is off. This phenomenon occurs when the supply voltages are below 1.5V.
2 RI Inverting input resistance to provide AC gain in conjunction with RF. Also creates a highpass filter with CI at
fC = 1/(2πRICI).
3 RF Feedback resistance to provide AC gain in conjunction with RI.
4 CI (Note 14) Feedback capacitor which ensures unity gain at DC.
5 CS Provides power supply filtering and bypassing. Refer to the Supply Bypassing application section for proper
placement and selection of bypass capacitors.
6 RV Acts as a volume control by setting the input voltage level.
(Note 14)
7 RIN Sets the amplifier's input terminals DC bias point when CIN is present in the circuit. Also works with CIN to create
(Note 14) a highpass filter at fC = 1/(2πRINCIN). Refer to Figure 4.
8 CIN Input capacitor which blocks the input signal's DC offsets from being passed onto the amplifier's inputs.
(Note 14)
9 RSN Works with CSN to stabilize the output stage by creating a pole that reduces high frequency instabilities. The
(Note 14) pole is set at fC = 1/(2πRSNCSN). Refer to Figure 4.
10 CSN Works with RSN to stabilize the output stage by creating a pole that reduces high frequency instabilities.
(Note 14)
11 L (Note 14) Provides high impedance at high frequencies so that R may decouple a highly capacitive load and reduce the
12 R (Note 14) Q of the series resonant circuit. Also provides a low impedance at low frequencies to short out R and pass
audio signals to the load. Refer to Figure 4.
13 RA Provides DC voltage biasing for the transistor Q1 in single supply operation.
14 CA Provides bias filtering for single supply operation.
15 RINP Limits the voltage difference between the amplifier's inputs for single supply operation. Refer to the Clicks and
(Note 14) Pops application section for a more detailed explanation of the function of RINP.
16 RBI Provides input bias current for single supply operation. Refer to the Clicks and Pops application section for
a more detailed explanation of the function of RBI.
17 RE Establishes a fixed DC current for the transistor Q1 in single supply operation. This resistor stabilizes the half-
supply point along with CA.

Note 14: Optional components dependent upon specific design requirements.

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 LM4701
Typical Performance Characteristics

THD + N vs Frequency THD + N vs Frequency

10083510 10083511

THD + N vs Frequency THD + N vs Output Power

10083512 10083513

THD + N vs Output Power THD + N vs Output Power

10083514 10083515

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LM4701
THD + N vs Output Power THD + N vs Output Power

10083516 10083517

THD + N vs Output Power Clipping Voltage vs

Supply Voltage

10083518
10083519

Clipping Voltage vs Clipping Voltage vs

Supply Voltage Supply Voltage

10083520 10083521

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 LM4701
Power Dissipation vs Power Dissipation vs
Output Power Ouput Power

10083522 10083523

Power Dissipation vs Output Power vs

Output Power Load Resistance

10083524 10083525

Output Power vs Output Mute vs

Supply Voltage Mute Pin Voltage

10083526 10083527

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LM4701
Pulse Response Large Signal Response

10083528
10083529

Output Mute vs Power Supply

Mute Pin Voltage Rejection Ratio

10083530
10083531

Common-Mode Open Loop

Rejection Ratio Frequency Response

10083532 10083533

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 LM4701
Safe Area Spike Protection Response

10083534 10083535

Supply Current vs Pulse Thermal

Supply Voltage Resistance

10083536 10083537

Pulse Thermal Supply Current vs

Resistance Output Voltage

10083539
10083538

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LM4701
Pulse Power Limit Pulse Power Limit

10083540
10083541

Supply Current vs Standby Current (ICC) vs

Case Temperature Standby Pin Voltage

10083542
10083543

Supply Current (IEE) vs Input Bias Current vs

Standby Pin Voltage Case Temperature

10083544 10083545

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 LM4701
any power semiconductor device, as discussed in the Deter-
Application Information mining the Correct Heat Sink Section.
MUTE MODE DETERMINING MAXIMUM POWER DISSIPATION
By placing a logic-high voltage on the mute pin, the signal Power dissipation within the integrated circuit package is a
going into the amplifiers will be muted. If the mute pin is left very important parameter requiring a thorough understanding
floating or connected to a logic-low level, the amplifier will be if optimum power output is to be obtained. An incorrect max-
in a non-muted state. Refer to the Typical Performance imum power dissipation calculation may result in inadequate
Characteristics section for curves concerning Mute Attenu- heat sinking causing thermal shutdown and thus limiting the
ation vs Mute Pin Voltage. output power.
STANDBY MODE Equation (1) exemplifies the theoretical maximum power dis-
The standby mode of the LM4701 allows the user to drasti- sipation point of each amplifier where VCC is the total supply
cally reduce power consumption when the amplifier is idle. By voltage.
placing a logic-high voltage on the standby pin, the amplifier PDMAX = VCC2/2π2RL (1)
will go into Standby Mode. In this mode, the current drawn
from the VCC supply is typically less than 10 μA total for both Thus by knowing the total supply voltage and rated output
amplifiers. The current drawn from the VEE supply is typically load, the maximum power dissipation point can be calculated.
2.1 mA. Clearly, there is a significant reduction in idle power Refer to the graphs of Power Dissipation vs Output Power in
consumption when using the standby mode. Refer to the the Typical Performance Characteristics section which
Typical Performance Characteristics section for curves show the actual full range of power dissipation not just the
showing Supply Current vs Standby Pin Voltage for both sup- maximum theoretical point that results from equation (1).
plies. DETERMINING THE CORRECT HEAT SINK
UNDER-VOLTAGE PROTECTION The choice of a heat sink for a high-power audio amplifier is
Upon system power-up, the under-voltage protection circuitry made entirely to keep the die temperature at a level such that
allows the power supplies and their corresponding capacitors the thermal protection circuitry does not operate under normal
to come up close to their full values before turning on the circumstances.
LM4701 such that no DC output spikes occur. Upon turn-off, The thermal resistance from the die (junction) to the outside
the output of the LM4701 is brought to ground before the air (ambient) is a combination of three thermal resistances,
power supplies such that no transients occur at power-down. θJC, θCS and θSA. The thermal resistance, θJC (junction to
case), of the LM4701 is 2°C/W. Using Thermalloy Therma-
OVER-VOLTAGE PROTECTION cote thermal compound, the thermal resistance, θCS (case to
The LM4701 contains over-voltage protection circuitry that sink), is about 0.2°C/W. Since convection heat flow (power
limits the output current to approximately 3.5 Apk while also dissipation) is analogous to current flow, thermal resistance
providing voltage clamping, though not through internal is analogous to electrical resistance, and temperature drops
clamping diodes. The clamping effect is quite the same, how- are analogous to voltage drops, the power dissipation out of
ever, the output transistors are designed to work alternately the LM4701 is equal to the following:
by sinking large current spikes.
PDMAX = (TJMAX − TAMB)/θJA (2)
SPiKe PROTECTION where TJMAX = 150°C, TAMB is the system ambient tempera-
The LM4701 is protected from instantaneous peak-tempera- ture and θJA = θJC + θCS + θSA.
ture stressing of the power transistor array. The Safe Oper- Once the maximum package power dissipation has been cal-
ating Area graph in the Typical Performance Characteris- culated using equation (1), the maximum thermal resistance,
tics section shows the area of device operation where θSA, (in °C/W) for a heat sink can be calculated. This calcu-
SPiKe Protection Circuitry is not enabled. The waveform to lation is made using equation (3) which is derived by solving
the right of the SOA graph exemplifies how the dynamic pro- for θSA in equation (2).
tection will cause waveform distortion when enabled.
   θSA=[(TJMAX−TAMB)−PDMAX(θJC+θCS)]/PDMAX (3)
THERMAL PROTECTION Again it must be noted that the value of θSA is dependent upon
The LM4701 has a sophisticated thermal protection scheme the system designer's amplifier requirements. If the ambient
to prevent long-term thermal stress of the device. When the temperature that the audio amplifier is to be working under is
temperature on the die reaches 165°C, the LM4701 shuts higher than 25°C, then the thermal resistance for the heat
down. It starts operating again when the die temperature sink, given all other things are equal, will need to be smaller.
drops to about 155°C, but if the temperature again begins to
rise, shutdown will occur again at 165°C. Therefore, the de- SUPPLY BYPASSING
vice is allowed to heat up to a relatively high temperature if The LM4701 has excellent power supply rejection and does
the fault condition is temporary, but a sustained fault will not require a regulated supply. However, to improve system
cause the device to cycle in a Schmitt Trigger fashion be- performance as well as eliminate possible oscillations, the
tween the thermal shutdown temperature limits of 165°C and LM4701 should have its supply leads bypassed with low-in-
155°C. This greatly reduces the stress imposed on the IC by ductance capacitors having short leads that are located close
thermal cycling, which in turn improves its reliability under to the package terminals. Inadequate power supply bypass-
sustained fault conditions. ing will manifest itself by a low frequency oscillation known as
Since the die temperature is directly dependent upon the heat “motorboating” or by high frequency instabilities. These in-
sink used, the heat sink should be chosen such that thermal stabilities can be eliminated through multiple bypassing uti-
shutdown will not be reached during normal operation. Using lizing a large tantalum or electrolytic capacitor (10 μF or
the best heat sink possible within the cost and space con- larger) which is used to absorb low frequency variations and
straints of the system will improve the long-term reliability of

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LM4701 a small ceramic capacitor (0.1 μF) to prevent any high fre-
quency feedback through the power supply lines.
If adequate bypassing is not provided, the current in the sup-
ply leads which is a rectified component of the load current
may be fed back into internal circuitry. This signal causes dis-
tortion at high frequencies requiring that the supplies be by-
passed at the package terminals with an electrolytic capacitor
of 470 μF or more.

BRIDGED AMPLIFIER APPLICATION

10083509
One common power amplifier configuration is shown in Figure
2 and is referred to as “bridged mode” operation. Bridged FIGURE 5. Level Shift Circuit
mode operation is different from the classical single-ended
amplifier configuration where one side of the output load is When the voltage at the Logic Input node is 0V, the 2N3904
connected to ground. is “off” and thus resistor RC pulls up mute or standby input to
A bridge amplifier design has a distinct advantage over the the supply. This enables the mute or standby function. When
single-ended configuration, as it provides differential drive to the Logic Input is 5V, the 2N3904 is “on” and consequently,
the load, thus doubling output swing for a specified supply the voltage at the collector is essentially 0V. This will disable
voltage. Consequently, theoretically four times the output the mute or standby function, and thus the amplifier will be in
power is possible as compared to a single-ended amplifier its normal mode of operation. RSHIFT, along with CSHIFT, cre-
under the same conditions. This increase in attainable output ates an RC time constant that reduces transients when the
power assumes that the amplifier is not current limited or mute or standby functions are enabled or disabled. Addition-
clipped. ally, RSHIFT limits the current supplied by the internal logic
A direct consequence of the increased power delivered to the gates of the LM4701 which insures device reliability. Refer to
load by a bridge amplifier is an increase in internal power dis- the Mute Mode and Standby Mode sections in the Applica-
sipation. For each operational amplifier in a bridge configu- tion Information section for a more detailed description of
ration, the internal power dissipation will increase by a factor these functions.
of two over the single ended dissipation. Since there are two
amplifiers used in a bridge configuration, the maximum sys- CLICKS AND POPS
tem power dissipation point will increase by a factor of four In the typical application of the LM4701 as a split-supply audio
over the figure obtained by equation (1). power amplifier, the IC exhibits excellent “click” and “pop”
This value of PDMAX can be used to calculate the correct size performance when utilizing the mute and standby functions.
heat sink for a bridged amplifier application, assuming that In addition, the device employs Under-Voltage Protection,
both IC's are mounted on the same heatsink. Since the inter- which eliminates unwanted power-up and power-down tran-
nal dissipation for a given power supply and load is increased sients. The basis for these functions are a stable and constant
by using bridged-mode, the heatsink's θSA will have to de- half-supply potential. In a split-supply application, ground is
crease accordingly as shown by equation (3). Refer to the the stable half-supply potential. But in a single-supply appli-
section, Determining the Correct Heat Sink, for a more de- cation, the half-supply needs to charge up just like the supply
tailed discussion of proper heat sinking for a given application. rail, VCC.
This makes the task of attaining a clickless and popless turn-
SINGLE-SUPPLY AMPLIFIER APPLICATION on more challenging. Any uneven charging of the amplifier
The typical application of the LM4701 is a split supply ampli- inputs will result in output clicks and pops due to the differen-
fier. But as shown in Figure 3, the LM4701 can also be used tial input topology of the LM4701.
in a single power supply configuration. This involves using To achieve a transient free power-up and power-down, the
some external components to create a half-supply bias which voltage seen at the input terminals should be ideally the same.
is used as the reference for the inputs and outputs. Thus, the Such a signal will be common-mode in nature, and will be
signal will swing around half-supply much like it swings rejected by the LM4701. In Figure 3, the resistor RINP serves
around ground in a split-supply application. Along with proper to keep the inputs at the same potential by limiting the voltage
circuit biasing, a few other considerations must be accounted difference possible between the two nodes. This should sig-
for to take advantage of all of the LM4701 functions. nificantly reduce any type of turn-on pop, due to an uneven
The LM4701 possesses a mute and standby function with in- charging of the amplifier inputs. This charging is based upon
ternal logic gates that are half-supply referenced. Thus, to a specific application loading and thus, the system designer
enable either the mute or standby function, the voltage at may need to adjust these values for optimum performance.
these pins must be a minimum of 2.5V above half-supply. In As shown in Figure 3, the resistors labeled RBI help bias up
single-supply systems, devices such as microprocessors and the LM4701 off the half-supply node at the emitter of the
simple logic circuits used to control the mute and standby 2N3904. But due to the input and output coupling capacitors
functions, are usually referenced to ground, not half-supply. in the circuit, along with the negative feedback, there are two
Thus, to use these devices to control the logic circuitry of the different values of RBI, namely 10 kΩ and 200 kΩ. These re-
LM4701, a “level shifter”, like the one shown in Figure 5, must sistors bring up the inputs at the same rate resulting in a
be employed. A level shifter is not needed in a split-supply popless turn-on. Adjusting these resistors values slightly may
configuration since ground is also half-supply. reduce pops resulting from power supplies that ramp ex-
tremely quick or exhibit overshoot during system turn-on.

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 LM4701
AUDIO POWER AMPLlFIER DESIGN vs Supply Voltage to ensure that the required output power is
obtainable from the device while maintaining low THD+N. In
Design a 25W/8Ω Audio Amplifier addition, the designer should verify that with the required
Given: power supply voltage and load impedance, that the required
heatsink value θSA is feasible given system cost and size
Power Output 25 Wrms
constraints. Once the heatsink issues have been addressed,
Load Impedance 8Ω the required gain can be determined from equation (6).
Input Level 1 Vrms(max)
Input Impedance 47 kΩ (6)
Bandwidth 20 Hz to 20 kHz ± 0.25 dB From equation (6), the minimum AV is AV ≥ 14.14.
By selecting a gain of 21, and with a feedback resistor, RF =
A designer must first determine the power supply require-
20 kΩ, the value of RI follows from equation (7).
ments in terms of both voltage and current needed to obtain
the specified output power. VOPEAK can be determined from RI = RF (AV − 1) (7)
equation (4) and IOPEAK from equation (5). Thus with RJ = 1 kΩ a non-inverting gain of 21 will result. Since
the desired input impedance was 47 kΩ, a value of 47 kΩ was
(4) selected for RIN. The final design step is to address the band-
width requirements which must be stated as a pair of −3 dB
(5) frequency points. Five times away from a −3 dB point is 0.17
To determine the maximum supply voltage, the following con- dB down from passband response which is better than the
ditions must be considered. Add the dropout voltage to the required ±0.25 dB specified. This fact results in a low and high
peak output swing VOPEAK, to get the supply rail at a current frequency pole of 4 Hz and 100 kHz respectively. As stated
of IOPEAK. The regulation of the supply determines the un- in the External Components section, RI in conjunction with
loaded voltage which is usually about 15% higher. The supply CI create a high-pass filter.
voltage will also rise 10% during high line conditions. There- CI ≥ 1/(2π * 1 kΩ * 4 Hz) = 39.8 μF; use 39 μF.
fore the maximum supply voltage is obtained from the follow-
ing equation: The high frequency pole is determined by the product of the
desired high frequency pole, fH, and the gain, AV. With a AV
Max Supplies ≈ ± (VOPEAK + VOD) (1 + Regulation) (1.1)
= 21 and fH = 100 kHz, the resulting GBWP of 2.1 MHz is less
For 25W of output power into an 8Ω load, the required than the minimum GBWP of 5 MHz for the LM4701. This will
VOPEAK is 20V. A minimum supply rail of ±25V results from ensure that the high frequency response of the amplifier will
adding V OPEAK and VOD. With regulation, the maximum sup- be no worse than 0.17 dB down at 20 kHz which is well within
plies are ±31.7V and the required IOPEAK is 2.5A from equation the bandwidth requirements of the design.
(5). At this point it is a good idea to check the Power Output

17 www.national.com

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LM4701
Physical Dimensions inches (millimeters) unless otherwise noted

For Staggered Lead Non-Isolated Package

Only a 9-Pin Package
Order Number LM4701T
NS Package Number TA9A

www.national.com 18

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 LM4701
Notes

19 www.national.com

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30W Audio Power Amplifier with Mute and Standby Modes
LM4701 Overture Audio Power Amplifier Series
Notes

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