RTL8169S-32/RTL8169S-64

INTEGRATED GIGABIT ETHERNET CONTROLLER (NIC)

DATASHEET

Rev. 1.4
24 September 2003
Track ID: JATR-1076-21
 RTL8169S-32/RTL8169S-64
Datasheet

COPYRIGHT
©2003 Realtek Semiconductor Corp. All rights reserved. No part of this document may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language in any form or by any means without the written
permission of Realtek Semiconductor Corp.

TRADEMARKS
Realtek is a trademark of Realtek Semiconductor Corporation. Other names mentioned in this document are
trademarks/registered trademarks of their respective owners.

DISCLAIMER
Realtek provides this document “as is”, without warranty of any kind, neither expressed nor implied, including, but not limited
to, the particular purpose. Realtek may make improvements and/or changes in this document or in the product described in this
document at any time. This document could include technical inaccuracies or typographical errors.

USING THIS DOCUMENT

This document is intended for use by the software engineer when programming for Realtek RTL8169S-32 & RTL8169S-64
controller chips. Information pertaining to the hardware design of products using these chips is contained in a separate
document.
Though every effort has been made to ensure that this document is current and accurate, more information may have become
available subsequent to the production of this guide. In that event, please contact your Realtek representative for additional
information that may help in the development process.

REVISION HISTORY
Revision Release Date Summary
1.0 2003/03/20 First release.
1.1 2003/04/12 Revised pin name and pin assignments.
1.2 2003/06/24 Minor 233-pin TFBGA pin number corrections.
IEEE 802.3z changed to IEEE 802.3ab in General Description.
1.3 2003/09/23 Add the voltage variation to DC characteristics.
1.4 2003/09/24 Remove “JTAG support” from the Features section. The RTL8169S does not
support JTAG.

Integrated Gigabit Ethernet Controller ii Track ID: JATR-1076-21 Rev. 1.4

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Table of Contents
1. GENERAL DESCRIPTION ............................................................................................................................................... 1

2. FEATURES .......................................................................................................................................................................... 2

3. SYSTEM APPLICATIONS ................................................................................................................................................ 2

4. PIN ASSIGNMENTS........................................................................................................................................................... 3

4.1. 128-PIN QFP PIN ASSIGNMENTS ................................................................................................................................. 3

4.2. 233-PIN TFBGA PIN ASSIGNMENTS ............................................................................................................................ 4

5. PIN DESCRIPTIONS ......................................................................................................................................................... 5

5.1. POWER MANAGEMENT/ISOLATION .............................................................................................................................. 5

5.2. PCI INTERFACE ........................................................................................................................................................... 6
5.3. EEPROM.................................................................................................................................................................... 9
5.4. TRANSCEIVER INTERFACE ........................................................................................................................................... 9
5.5. CLOCK ....................................................................................................................................................................... 10
5.6. REGULATOR & REFERENCE ....................................................................................................................................... 10
5.7. LEDS ........................................................................................................................................................................ 10
5.8. POWER & GROUND ................................................................................................................................................... 11
5.9. NC (NOT CONNECTED) ............................................................................................................................................. 11

6. FUNCTIONAL DESCRIPTION ...................................................................................................................................... 12

6.1. TRANSCEIVER............................................................................................................................................................ 12
6.1.1. Transmitter........................................................................................................................................................... 12
6.1.2. Receiver ............................................................................................................................................................... 12
6.2. MAC ......................................................................................................................................................................... 12
6.3. NEXT PAGE ................................................................................................................................................................ 13
6.4. MII/GMII INTERFACE ............................................................................................................................................... 13
6.4.1. MII ....................................................................................................................................................................... 13
6.4.2. GMII .................................................................................................................................................................... 13

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6.5. LEDS ........................................................................................................................................................................ 14

6.5.1. Link Monitor ........................................................................................................................................................ 14
6.5.2. RX LED................................................................................................................................................................ 14
6.5.3. TX LED ................................................................................................................................................................ 15
6.5.4. TX/RX LED .......................................................................................................................................................... 16
6.5.5. LINK/ACT LED.................................................................................................................................................... 17
6.6. FLASH/EEPROM INTERFACE .................................................................................................................................... 17
6.7. POWER MANAGEMENT .............................................................................................................................................. 18

7. CHARACTERISTICS ...................................................................................................................................................... 21

7.1. ABSOLUTE MAXIMUM RATINGS ................................................................................................................................ 21

7.2. RECOMMENDED OPERATING CONDITIONS ................................................................................................................. 21
7.3. CRYSTAL REQUIREMENTS .......................................................................................................................................... 21
7.4. THERMAL CHARACTERISTICS .................................................................................................................................... 22
7.5. DC CHARACTERISTICS .............................................................................................................................................. 22
7.6. AC CHARACTERISTICS .............................................................................................................................................. 23
7.6.1. Serial EEPROM Interface Timing........................................................................................................................ 23
7.7. PCI BUS OPERATION TIMING .................................................................................................................................... 24
7.7.1. PCI Bus Timing Parameters ................................................................................................................................ 24
7.7.2. PCI Clock Specification....................................................................................................................................... 26
7.7.3. PCI Transactions ................................................................................................................................................. 27

8. MECHANICAL DIMENSIONS....................................................................................................................................... 42

8.1. 128-PIN QFP MECHANICAL DIMENSIONS ................................................................................................................. 42

8.2. 233-PIN TFBGA MECHANICAL DIMENSIONS ........................................................................................................... 44

9. ORDERING INFORMATION ......................................................................................................................................... 46

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List of Tables
TABLE 1. POWER MANAGEMENT/ISOLATION ............................................................................................................................. 5
TABLE 2. PCI INTERFACE ........................................................................................................................................................... 6
TABLE 3. EEPROM.................................................................................................................................................................... 9
TABLE 4. TRANSCEIVER INTERFACE ........................................................................................................................................... 9
TABLE 5. CLOCK ...................................................................................................................................................................... 10
TABLE 6. REGULATOR & REFERENCE ...................................................................................................................................... 10
TABLE 7. LEDS ........................................................................................................................................................................ 10
TABLE 8. POWER & GROUND ................................................................................................................................................... 11
TABLE 9. NC (NOT CONNECTED) ............................................................................................................................................. 11
TABLE 10. FLASH/EEPROM INTERFACE ................................................................................................................................... 18
TABLE 11. ABSOLUTE MAXIMUM RATINGS ............................................................................................................................... 21
TABLE 12. RECOMMENDED OPERATING CONDITIONS ................................................................................................................ 21
TABLE 13. CRYSTAL REQUIREMENTS......................................................................................................................................... 21
TABLE 14. THERMAL CHARACTERISTICS ................................................................................................................................... 22
TABLE 15. DC CHARACTERISTICS ............................................................................................................................................. 22
TABLE 16. EEPROM ACCESS TIMING PARAMETERS ................................................................................................................. 23
TABLE 17. PCI BUS TIMING PARAMETERS................................................................................................................................. 24
TABLE 18. MEASUREMENT CONDITION PARAMETERS ............................................................................................................... 25
TABLE 19. CLOCK AND RESET SPECIFICATIONS ......................................................................................................................... 26
TABLE 20. ORDERING INFORMATION ......................................................................................................................................... 46

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List of Figures
FIGURE 1. 128-PIN QFP PIN ASSIGNMENTS ............................................................................................................................... 3
FIGURE 2. 233-PIN TFBGA PIN ASSIGNMENTS .......................................................................................................................... 4
FIGURE 3. RX LED .................................................................................................................................................................. 14
FIGURE 4. TX LED................................................................................................................................................................... 15
FIGURE 5. TX/RX LED ............................................................................................................................................................ 16
FIGURE 6. LINK/ACT LED ..................................................................................................................................................... 17
FIGURE 7. SERIAL EEPROM INTERFACE TIMING..................................................................................................................... 23
FIGURE 8. OUTPUT TIMING MEASUREMENT CONDITIONS ........................................................................................................ 25
FIGURE 9. INPUT TIMING MEASUREMENT CONDITIONS ............................................................................................................ 25
FIGURE 10. 3.3V CLOCK WAVEFORM ........................................................................................................................................ 26
FIGURE 11. CLOCK SKEW DIAGRAM .......................................................................................................................................... 26
FIGURE 12. I/O READ ................................................................................................................................................................. 27
FIGURE 13. I/O WRITE ............................................................................................................................................................... 27
FIGURE 14. CONFIGURATION READ............................................................................................................................................ 28
FIGURE 15. CONFIGURATION WRITE .......................................................................................................................................... 28
FIGURE 16. BUS ARBITRATION................................................................................................................................................... 29
FIGURE 17. MEMORY READ BELOW 4GB (32-BIT ADDRESS, 32-BIT DATA; 32-BIT SLOT) .......................................................... 29
FIGURE 18. MEMORY WRITE BELOW 4GB (32-BIT ADDRESS, 32-BIT DATA; 32-BIT SLOT)......................................................... 30
FIGURE 19. TARGET INITIATED TERMINATION - DISCONNECT ................................................................................................... 30
FIGURE 20. TARGET INITIATED TERMINATION - ABORT ............................................................................................................ 31
FIGURE 21. MASTER INITIATED TERMINATION - ABORT ............................................................................................................ 31
FIGURE 22. PARITY OPERATION – ONE EXAMPLE ...................................................................................................................... 32
FIGURE 23. MEMORY READ BELOW 4GB (32-BIT ADDRESS, 32-BIT DATA TRANSFER GRANTED; 64-BIT SLOT)......................... 33
FIGURE 24. MEMORY WRITE BELOW 4GB (32-BIT ADDRESS, 32-BIT DATA TRANSFER GRANTED; 64-BIT SLOT)........................ 34
FIGURE 25. MEMORY READ BELOW 4GB (32-BIT ADDRESS, 64-BIT DATA TRANSFER GRANTED; 64-BIT SLOT) ......................... 35
FIGURE 26. MEMORY WRITE BELOW 4GB (32-BIT ADDRESS, 64-BIT DATA TRANSFER GRANTED; 64-BIT SLOT)........................ 36
FIGURE 27. MEMORY READ ABOVE 4GB (DAC, 64-BIT ADDRESS, 32-BIT DATA; 32-BIT SLOT) ................................................ 37
FIGURE 28. MEMORY WRITE ABOVE 4GB (DAC, 64-BIT ADDRESS, 32-BIT DATA; 32-BIT SLOT)............................................... 37
FIGURE 29. MEMORY READ ABOVE 4GB (DAC, 64-BIT ADDRESS, 32-BIT DATA TRANSFER GRANTED; 64-BIT SLOT) ............... 38
FIGURE 30. MEMORY WRITE ABOVE 4GB (DAC, 64-BIT ADDRESS, 32-BIT DATA TRANSFER GRANTED; 64-BIT SLOT) .............. 39
FIGURE 31. MEMORY READ ABOVE 4GB (DAC, 64-BIT ADDRESS, 64-BIT DATA TRANSFER GRANTED; 64-BIT SLOT) ............... 40
FIGURE 32. MEMORY WRITE ABOVE 4GB (DAC, 64-BIT ADDRESS, 64-BIT DATA TRANSFER GRANTED; 64-BIT SLOT).............. 41

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1. General Description
The Realtek RTL8169S-32 and RTL8169S-64 combine a triple-speed IEEE 802.3 compliant media access controller (MAC)
with a triple-speed Ethernet transceiver, 32(64*)-bit PCI bus controller, and embedded memory. With state-of-the-art DSP
technology and mixed-mode signal technology, they offer high-speed transmission over CAT 5 UTP cable or CAT 3 UTP
(10Mbps only) cable. Functions such as Crossover Detection & Auto-Correction, polarity correction, adaptive equalization,
cross-talk cancellation, echo cancellation, timing recovery, and error correction are implemented to provide robust
transmission and reception capability at high speeds.

The devices support the PCI v2.2 bus interface for host communications with power management and are compliant with the
IEEE 802.3 specification for 10/100Mbps Ethernet and the IEEE 802.3ab specification for 1000Mbps Ethernet. They support
an auxiliary power auto-detect function, and will auto-configure related bits of the PCI power management registers in PCI
configuration space.
They also support the Advanced Configuration and Power Interface (ACPI)--power management for modern operating systems
that are capable of Operating System directed Power Management (OSPM)--to achieve the most efficient power management
possible.

In addition to the ACPI feature, the RTL8169S-32 and RTL8169S-64 support remote wake-up (including AMD Magic Packet,
Re-LinkOk, and Microsoft® Wake-up frame) in both ACPI and APM (Advanced Power Management) environments. Also, the
LWAKE pin provides four different output signals including active high, active low, positive pulse, and negative pulse. The
versatility of the LWAKE pin provides motherboards with Wake-On-LAN (WOL) functionality. To support WOL from a deep
power down state (e.g. D3cold, i.e. main power is off and only auxiliary exists), the auxiliary power source must be able to
provide the needed power for the RTL8169S-32 and RTL8169S-64.

The RTL8169S is fully compliant with Microsoft® NDIS5 (IP, TCP, UDP) Checksum and Segmentation Task-offload features,
and supports IEEE 802.1Q Virtual bridged Local Area Network (VLAN). The above features contribute to lowering CPU
utilization, especially benefiting performance when in operation as a server network card. The devices also boost their PCI
performance by supporting PCI Memory Read Line & Memory Read Multiple when transmitting, and Memory Write and
Invalidate when receiving. To better qualify as a server card, the RTL8169S-32 and RTL8169S-64 support the PCI Dual
Address Cycle (DAC) command when the assigned buffers reside at a physical memory address higher than 4 Gigabytes.

* 233-PIN TFBGA package only.

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2. Features
Integrated 10/100/1000 transceiver Fully compliant with IEEE 802.3, IEEE 802.3u,
Auto-Negotiation with Next page capability IEEE 802.3ab
Supports PCI 2.2, 32-bit/64-bit (RTL8169S-64 only), Supports IEEE 802.1Q VLAN tagging
33/66MHz Serial EEPROM and/or Flash support
Supports pair swap/polarity/skew correction 3.3V signaling, 5V PCI I/O tolerant
Crossover Detection & Auto-Correction Transmit/Receive FIFO (8K/64K) support
Wake-on-LAN and remote wake-up support Supports power down/link down power saving
Microsoft® NDIS5 Checksum Offload (IP, TCP, UDP) 128-pin QFP/233-pin TFBGA package
and largesend offload support
Supports Full Duplex flow control (IEEE 802.3x)

3. System Applications
Gigabit Ethernet Network Interface Cards/Workstation Cards

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4. Pin Assignments
4.1. 128-Pin QFP Pin Assignments
20 AVDDL 19 MDI3-
21 VSSPST 18 MDI3+
22 GND 17 VSS
23 ISOLATEB 16 AVDDL
24 VDD18 15 MDI2-
25 INTAB 14 MDI2+
26 VDD33 13 VSS
27 PCIRSTB 12 NC
28 PCICLK 11 NC
29 GNTB 10 AVDDH
30 REQB 9 VSS
31 PMEB 8 CTRL25
32 VDD18 7 AVDDL
33 PCIAD31 6 MDI1-
34 PCIAD30 5 MDI1+
35 GND 4 VSS
36 PCIAD29 3 AVDDL
37 PCIAD28 2 MDI0-
38 VSSPST 1 MDI0+

39 PCIAD27 128 VSS

40 PCIAD26 127 RSET
41 VDD33 126 VDD18
42 PCIAD25 125 CTRL18
43 PCIAD24 124 VSS
44 CBEB3 123 VSS
45 VDD18 122 XTAL2
46 IDSEL 121 XTAL1
47 PCIAD23 120 AVDDH
48 GND 119 VSSPST
49 PCIAD22 118 GND
50 PCIAD21 117 LED0
51 VSSPST 116 VDD18
52
53
GND
PCIAD20
RTL8169S-32 115
114
LED1
LED2
54 VDD18 113 LED3
55 PCIAD19 112 GND
56 VDD33 111 EESK
57 PCIAD18 110 VDD18
58 PCIAD17 109 EEDI
59 PCIAD16 108 EEDO
60 CBEB2 107 VDD33
61 FRAMEB 106 EECS
62 GND 105 LANWAKE
63 IRDYB 104 PCIAD0
64 VDD18 103 PCIAD1

65 NC 102 PCIAD2
66 VSSPST 101 VSSPST
67 TRDYB 100 GND
68 DEVSELB 99 VDD18
69 STOPB 98 PCIAD3
70 PERRB 97 PCIAD4
71 VDD33 96 PCIAD5
72 NC 95 PCIAD6
73 GND 94 VDD33
74 NC 93 PCIAD7
75 SERRB 92 CBEB0
76 PAR 91 VSSPST
77 CBEB1 90 PCIAD8
78 VDD18 89 PCIAD9
79 PCIAD15 88 M66EN
80 GND 87 PCIAD10
81 VSSPST 86 PCIAD11
82 PCIAD14 85 PCIAD12
83 PCIAD13 84 VDD33

Figure 1. 128-Pin QFP Pin Assignments

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4.2. 233-Pin TFBGA Pin Assignments

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17

1 L2 E
A NC NC NC NC XT AL XTA NC NC NC NC EESK EEDOLANW A
K NC AD 3 NC AD6

B NC NC C TRL
18 NC NC NC NC NC NC V DD
33 EEDI EECS AD 1 NC NC AD 5 AD3 2

C + L 18 VDDH DD1 8 DD3 3 DD3 3

NC MDI0 AVDD VSS VD D A V V V LED0 LED2 A D0 NC A D2 NC AD 7 AD3 3

D - + 1 8 LED3 0
MDI0 MDI1 AVDDL RS ET VS S VS S VSS V DD LED1 G ND GND GND GND AD4 C BEB A D 34

E - H 25
MDI1 AVDD VS S C TRL G ND AD8 AD3 5 A D9

F +
RTL8169S-64 18 33 AD36 M 66EN
MDI2 NC NC VS S VD D V DD

8
G +
MDI 3 M
DI 2- AVDDL VSS GND GN D G ND GN D G ND G ND AD37 A D 10 AD3

33 D L D D 18 3 1
H VD D M DI
3-
AVD V GND GND G ND GND GN D GND VDD3 AD1 A D 39

J ATEBVDD33 VDD33 GND GND GND G ND GND GN D G ND AD12 AD4 0 A D 13

ISOL

K NC AC K
64B I NTAB G ND G ND GND GN D GND GND VD D
18
V DD
33 A D 14 A D 41

L NC 64B CIR STB VDD1 8 G ND GND GND GND V DD

33 AD15 CB EB
1
REQ P GND GND

M P CI C
LK B EB7 BEB 6
C C G ND GND AD42 P AR AD43

N 5
C BEB G
NT B NC G ND GND S ERR
B A D 44
NC

P NC REQB P ME
B G ND GND VDD1
8 GND GN D VDD
18 GND G ND VD D
18 GN D G ND NC AD4 5 P ERR
B

R CB E
B4 AR 64
P AD2 8 A D 62 AD25 3
CB EB VDD
3 3
V DD
3 3 A D 18
V DD
33 DD33
V
B
AD5 0 F RAME IRDY
B
AD49 TRDY AD46

T A D 31 A D 30 AD63 AD2 7 A D 60 AD5 9 A D 23 AD2 2 AD2 1 AD2 0 AD19 AD1 7 B2 AD5 1 NC S ELBSTOP B
CB E DEV

U NC AD2 9 AD26 A D 61 AD2 4 I DS E

L AD5 8 AD57 A D5
6 NC AD5 5 AD5 4 AD5 3 A D 16 AD5 2 AD48 AD4 7

Figure 2. 233-Pin TFBGA Pin Assignments

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5. Pin Descriptions
The following signal type codes are used in the tables:
I: Input.
O: Output
T/S: Tri-State bi-directional input/output pin.
S/T/S: Sustained Tri-State.
O/D: Open Drain.

5.1. Power Management/Isolation

Table 1. Power Management/Isolation
Symbol Type Pin No Pin No Description
(128QFP) (233BGA)
PMEB O/D 31 P3 Power Management Event: Open drain, active low.
(PME#) Used to request a change in the current power management state
and/or to indicate that a power management event has occurred.
ISOLATEB I 23 J1 Isolate Pin: Active low.
(ISOLATE#) Used to isolate the RTL8169S from the PCI bus. The RTL8169S
will not drive its PCI outputs (excluding PME#) and will not
sample its PCI input (including PCIRSTB and PCICLK) as long
as the Isolate pin is asserted.
LANWAKE O 105 A13 LAN WAKE-UP Signal (When CardB_En=0, bit2 Config3):
This signal is used to inform the motherboard to execute the
wake-up process. The motherboard must support Wake-On-LAN
(WOL). There are 4 choices of output that may be asserted from
the LANWAKE pin (active high, active low, positive pulse, and
negative pulse). We can configure the LANWAKE output via two
CONFIG bits: LWACT(Config1.4) and LWPTN(Config4.2).
LWAKE Output LWACT
0 1
LWPTN 0 Active high Active low
1 Positive pulse Negative pulse
The default output is an active high signal. Once a PME event is
received, the LANWAKE and PMEB assert at the same time
when the LWPME (bit4, CONFIG4) is set to 0. If the LWPME is
set to 1, the LANWAKE asserts only when the PMEB asserts and
ISOLATEB is low.

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5.2. PCI Interface

Table 2. PCI Interface
Symbol Type Pin No. Pin No. Description
(128QFP) (233BGA)
PCIADPIN63-32 T/S T3, R4, U4, AD63-32: High 32-bit PCI address and data
T5, T6, U7, multiplexed pins.
U8, U9, U11, Address and Data are multiplexed on the same pins and
U12, U13, provide 32 additional bits. During an address phase (when
U15, T14, using the DAC command and when REQ64B is asserted),
R12, R15, the upper 32-bits of a 64-bit address are transferred;
U16, U17, otherwise, these bits are reserved but are stable and
R17, P16, undetermined. During a data phase, an additional 32-bits
N16, M17, of data are transferred when a 64-bit transaction has been
M15, K17, negotiated by the assertion of REQ64B and ACK64B.
J16, H17,
G17, G15,
F16, E16,
D17, C17,
B17
PCIADPIN31-0 T/S 33, 34, 36, AD31-0: Low 32-bit PCI address and data multiplexed
T1, T2, U2,
37, 39, 40, pins. The address phase is the first clock cycle in which
R3, T4, U3,
42, 43, 47, FRAMEB is asserted. During the address phase, AD31-0
R5, U5, T7,
49, 50, 53, contains a physical address (32 bits). For I/O, this is a byte
T8, T9, T10,
55, 57, 58, address, and for configuration and memory, it is a
T11, R9,
59, 79, 82, double-word address. The RTL8169S supports both
T12, U14,
83, 85, 86, big-endian and little-endian byte ordering. Write data is
L16, K16,
87, 89, 90, stable and valid when IRDYB is asserted. Read data is
J17, J15,
93, 95, 96, stable and valid when TRDYB is asserted. Data I is
H16, G16,
97, 98, 102, transferred during those clocks where both IRDYB and
E17, E15,
103, 104 TRDYB are asserted.
C16, A17,
B16, D15,
AD16-0: Boot PROM Address Bus. These pins are used
A15, C14,
to access up to a 128k-byte flash memory or EPROM.
B13, C12
AD31-24: Boot PROM data bus during Boot PROM
mode.
CBEBPIN7-4 T/S M2, M3, N1, PCI bus command and byte enables multiplexed pins.
R1 During the address phase of a transaction, CBEBPIN7-4
define the bus command. During the data phase,
CBEBPIN7-4 are used as Byte Enables. The Byte Enables
are valid for the entire data phase and determine which
byte lanes carry meaningful data. CBEBPIN4 applies to
byte 4, and CBEBPIN7 applies to byte 7.
CBEBPIN3-0 T/S 44, 60, 77, R6, T13, PCI bus command and byte enables multiplexed pins.
92 L17, D16 During the address phase of a transaction, CBEBPIN3-0
define the bus command. During the data phase,
CBEBPIN3-0 are used as Byte Enables. The Byte Enables
are valid for the entire data phase and determine which
byte lanes carry meaningful data. CBEBPIN0 applies to
byte 0, and CBEBPIN3 applies to byte 3.

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Symbol Type Pin No. Pin No. Description
(128QFP) (233BGA)
PCICLK I 28 M1 PCI clock: This clock input provides timing for all PCI
transactions and is input for the PCI device. Supports up
to a 66MHz PCI clock.
DEVSELB S/T/S 68 T16 Device Select: As a bus master, the RTL8169S samples
this signal to insure that a PCI target recognizes the
destination address for the data transfer. As a target, the
RTL8169S asserts this signal low when it recognizes its
target address after FRAMEB is asserted.
FRAMEB S/T/S 61 R13 Cycle Frame: As a bus master, this pin indicates the
beginning and duration of an access. FRAMEB is asserted
low to indicate the start of a bus transaction. While
FRAMEB is asserted, data transfer continues. When
FRAMEB is de-asserted, the transaction is in the final
data phase.
As a target, the device monitors this signal before
decoding the address to check if the current transaction is
addressed to it.
GNTB I 29 N2 Grant: This signal is asserted low to indicate to the
RTL8169S that the central arbiter has granted the
ownership of the bus to the RTL8169S. This input is used
when the device is acting as a bus master.
REQB T/S 30 P2 Request: The RTL8169S will assert this signal low to
request the ownership of the bus from the central arbiter.
IDSEL I 46 U6 Initialization Device Select: This pin allows the device to
identify when configuration read/write transactions are
intended for it.
INTAB O/D 25 K3 Interrupt A: Used to request an interrupt. It is asserted
low when an interrupt condition occurs, as defined by the
Interrupt Status, Interrupt Mask.
IRDYB S/T/S 63 R14 Initiator Ready: This indicates the initiating agent’s
ability to complete the current data phase of the
transaction.
As a bus master, this signal will be asserted low when the
device is ready to complete the current data phase
transaction. This signal is used in conjunction with the
TRDYB signal. Data transaction takes place at the rising
edge of CLK when both IRDYB and TRDYB are asserted
low. As a target, this signal indicates that the master has
put data on the bus.
TRDYB S/T/S 67 R16 Target Ready: This indicates the target agent’s ability to
complete the current phase of the transaction.
As a bus master, this signal indicates that the target is
ready for the data during write operations and with the
data during read operations. As a target, this signal will be
asserted low when the (slave) device is ready to complete
the current data phase transaction. This signal is used in
conjunction with the IRDYB signal. Data transaction
takes place at the rising edge of CLK when both IRDYB
and TRDYB are asserted low.

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Symbol Type Pin No. Pin No. Description
(128QFP) (233BGA)
PAR T/S 76 M16 Parity: This signal indicates even parity across
PCIADPIN31-0 and CBEB3-0 including the PAR pin.
PAR is stable and valid one clock after each address
phase. For data phase, PAR is stable and valid one clock
after either IRDYB is asserted on a write transaction or
TRDYB is asserted on a read transaction. Once PAR is
valid, it remains valid until one clock after the completion
of the current data phase. As a bus master, PAR is asserted
during address and write data phases. As a target, PAR is
asserted during read data phases.
M66EN I 88 F17 66MHZ_ENABLE: This pin indicates to the device
whether the bus segment is operating at 66 or 33MHz.
When this pin (active high) is asserted, the current PCI
bus segment that the device resides on operates in
66-MHz mode. If this pin is de-asserted, the current PCI
bus segment operates in 33-MHz mode.
PERRB S/T/S 70 P17 Parity Error: This pin is used to report data parity errors
during all PCI transactions except a Special Cycle.
PERRB is driven active (low) two clocks after a data
parity error is detected by the device receiving data, and
the minimum duration of PERRB is one clock for each
data phase with parity error detected.
SERRB O/D 75 N15 System Error: If an address parity error is detected and
Configuration Space Status register bit 15 (detected parity
error) is enabled, the device asserts the SERRB pin low
and bit 14 of the Status register in Configuration Space.
STOPB S/T/S 69 T17 Stop: Indicates that the current target is requesting the
master to stop the current transaction.
PCIRSTB I 27 L3 Reset: When PCIRSTB is asserted low, the device
performs an internal system hardware reset. PCIRSTB
must be held for a minimum period of 120 ns.
ACK64B S/T/S K2 Acknowledge 64-bit Transfer: When actively driven by
a device that has positively decoded its address as the
target of the current access, indicates the target is willing
to transfer data using 64 bits. ACK64B has the same
timing as DEVSELB.
REQ64B S/T/S L2 Request 64-bit Transfer: When asserted by the current
bus master, indicates it desires to transfer data using 64
bits. REQ64B also has the same timing as FRAMEB.
PAR64 T/S R2 Parity Upper DWORD is an even parity bit that protects
AD[64:32] and C/BE[7:4]. PAR64 must be valid one
clock after each address phase on any transaction in which
REQ64B is asserted.

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5.3. EEPROM
Table 3. EEPROM
Symbol Type Pin No Pin No Description
(128QFP) (233BGA)
EESK O 111 A11 Serial data clock
EEDI/AUX I 109 B11 EEDI: Serial data input
AUX: Input pin to detect if Aux. Power exists or not on initial
power-on.
This pin should be connected to Boot PROM. To support wakeup
from ACPI D3cold or APM power-down, this pin must be pulled
high to aux. power via a resistor. If this pin is not pulled high to
Aux. Power, the RTL8169S assumes that no Aux. Power exists.
EEDO O 108 A12 Serial data output
EECS/BRO O 106 B12 EECS: EEPROM chip select
MCSB BROMCSB: This is the chip select signal of the Boot PROM.

5.4. Transceiver Interface

Table 4. Transceiver Interface
Symbol Type Pin No Pin No Description
(128QFP) (233BGA)
MDI[0]+ I/O 1 C2 In MDI mode, this is the first pair in 1000Base-T, i.e. the
BI_DA+/- pair, and is the transmit pair in 10Base-T and
MDI[0]− I/O 2 D1
100Base-TX.
In MDI crossover mode, this pair acts as the BI_DB+/- pair,
and is the receive pair in 10Base-T and 100Base-TX.
MDI[1]+ I/O 5 D2 In MDI mode, this is the second pair in 1000Base-T, i.e. the
BI_DB+/- pair, and is the transmit pair in 10Base-T and
MDI[1]− I/O 6 E1
100Base-TX.
In MDI crossover mode, this pair acts as the BI_DA+/- pair,
and is the transmit pair in 10Base-T and 100Base-TX.
MDI[2]+ I/O 14 F1 In MDI mode, this is the third pair in 1000Base-T, i.e. the
BI_DC+/- pair.
MDI[2]− I/O 15 G2
In MDI crossover mode, this pair acts as the BI_DD+/- pair.
MDI[3]+ I/O 18 G1 In MDI mode, this is the fourth pair in 1000Base-T, i.e. the
BI_DD+/- pair.
MDI[3]− I/O 19 H2
In MDI crossover mode, this pair acts as the BI_DC+/- pair.

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5.5. Clock
Table 5. Clock
Symbol Type Pin No Pin No Description
(128QFP) (233BGA)
Xtal1 I 121 A5 Input of 25MHz clock reference.
Xtal2 O 122 A6 output of 25MHz clock reference.

5.6. Regulator & Reference

Table 6. Regulator & Reference
Symbol Type Pin No Pin No Description
(128QFP) (233BGA)
CTRL25 O 8 E4 Regulator Control. Voltage control to external 2.5V regulator.
CTRL18 O 125 B3 Regulator Control. Voltage control to external 1.8V regulator.
RSET I 127 D4 Reference. External Resistor Reference.

5.7. LEDs
Table 7. LEDs
Symbol Type Pin No Pin No Description
(128QFP) (233BGA)
LED0/ O 117 C10 LEDS1-0 00 01 10 11
BROMO LED0 Tx/Rx ACT(Tx/Rx) Tx LINK10/
EB ACT
LED1 O 115 D10 LED1 LINK LINK10/100 LINK10/100 LINK100/
LED2 O 114 C11 100 /1000 /1000 ACT
LED3 O 113 D9 LED2 LINK FULL Rx FULL
10
LED3 LINK - FULL LINK1000/
1000 ACT
BROMOEB: This enables the output buffer of the Boot PROM or Flash
memory during a read operation.
Note 1: During power down mode, the LED signals are logic high.
Note 2: LEDS1-0’s initial value comes from 93C46/93C56.

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5.8. Power & Ground

Table 8. Power & Ground
Symbol Type Pin No Pin No Description
(128QFP) (233BGA)
VDD18 Power 24, 32, 45, 54, C5, C7, D8, F14, Digital 1.8V power supply.
64, 78, 99, 110, H4, K14, L4, P6, P9,
116,126 P12
VDD33 Power 26, 41, 56, 71, B10, C8, C9, F15, Digital 3.3V power supply.
84, 94, 107 H1, H15, J2, J3, K15,
L15, R7, R8, R10,
R11
GND/VSSPST Power 21, 22, 35, 38, D11, D12, D13, D14, Digital Ground
48, 51, 52, 62, E14, G7, G8, G9,
66, 73, 80, 81, G10, G11, G14, H7,
91, 100, 101, H8, H9, H10, H11,
112, 118, 119 H14, J4, J7, J8, J9,
J10, J11, J14, K4, K7,
K8, K9, K10, K11,
L7, L8, L9, L10, L11,
L14, M4, M14, N4,
N14, P4, P5, P7, P8,
P10, P11, P13, P14
AVDDL Power 3, 7, 16, 20 C3, D3, G3, H3 Analog 2.5V power supply.
AVDDH Power 10, 120 E2, C6 Analog 3.3V power supply.
VSS Power 4, 9, 13, 17, 123, F4, G4, C4, D5, D6, Analog Ground
124, 128 D7, E3

5.9. NC (Not Connected)

Table 9. NC (Not Connected)
Symbol Type Pin No Pin No Description
(128QFP) (233BGA)
NC 11, 12, 65, 72, A1, A2, A3, A4, A7, Not Connected.
74 A8, A9, A10, A14, A16,
B1, B2, B4, B5, B6,
B7, B8, B9, B14, B15,
C1, C13, C15, F2, F3,
K1, L1, N3, N17, P1,
P15, T15, U1, U10

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6. Functional Description

6.1. Transceiver
6.1.1. Transmitter
In 10M mode, the Tx MAC retrieves packet data from the Tx Buffer Manager and sends it out through the transmitting
physical layer interface. The transmit 4-bit nibbles (TXD[3:0]) clocked at 2.5Mhz (TXC), are serialized into 10Mbps serial
data. Then, the 10Mbps serial data is converted into a Manchester-encoded data stream and is transmitted onto the media by
the DAC converter.
In 100M mode, the transmitted 4-bit nibbles (TXD[3:0]) from the MAC, clocked at 25Mhz (TXC), are converted into 5B
symbol code via 4B/5B coding technology, scrambling, and serializing before being converted to 125Mhz NRZ and NRZI
signals. After that, the NRZI signal is passed to the MLT3 encoder, then to the DAC converter for transmission onto the media.
In 1000M mode, the RTL8169S’s PCS layer receives data bytes from the MAC through the GMII interface and performs the
generation of continuous code-groups through 4D-PAM5 coding technology. Then, those code groups are passed through
waveform shaping filter to minimize EMI effect, and are transmitted onto the 4-pair CAT5 cable at 125MBaud/s through DAC
converter.

6.1.2. Receiver
In MII (10Mbps) mode, the received differential signal is converted into a Manchester-encoded data stream. The stream is
processed with a Manchester decoder, and is de-serialized into 4-bit wide nibbles. The 4-bit nibbles are presented to the MII
interface at a clock speed of 2.5MHz. In 100Mbps mode, the MLT3 signal is processed with an ADC, equalizer, BLW
(Baseline Wander) correction, timing recovery, MLT3 and NRZI decoder, descrambler, 4B/5B decoder, and then is presented
to the MII interface in 4-bit wide nibbles at a clock speed of 25MHz.

In GMII mode, the input signal from the media first passes through the on-chip sophisticated hybrid circuit to subtract the
transmitted signal from the input signal for effective reduction of near-end echo. Afterwards, the received signal is processed
with adaptive equalization, BLW (Baseline Wander) correction, cross-talk cancellation, echo cancellation, timing recovery,
error correction, and 4D-PAM5 decoding. Then, the 8-bit wide data is recovered and is sent to the GMII interface at a clock
speed of 125MHz. The Rx MAC retrieves the packet data from the receive MII/GMII interface and sends it to the Rx Buffer
Manager.

6.2. MAC
The RTL8169S supports new descriptor-based buffer management that significantly reduces host CPU utilization and is
particularly effective in server applications. The new buffer management algorithm provides Microsoft Large-Send offload, IP
checksum offload, TCP checksum offload, UDP checksum offload, and IEEE 802.1P, 802.1Q VLAN tagging capabilities. The
device supports up to 1024 consecutive descriptors in memory for transmit and receive separately, which means there might be
3 descriptor rings, one a high priority transmit descriptor ring, another a normal priority transmit descriptor ring, and the other
a receive descriptor ring. Each descriptor ring may consist of up to 1024 consecutive descriptors. Each descriptor consists of
4 consecutive double words. The start address of each descriptor ring should be 256-byte aligned. Software must pre-allocate
enough buffers and configure all descriptor rings before transmitting and/or receiving packets. Descriptors can be chained to
form a packet in both Tx and Rx. Refer to the Realtek RTL8169S Programming Guide for detailed information. Any Tx
buffers pointed to by the Tx descriptors should be at least 4 bytes.
The RTL8169S will automatically pad any packets less than 64 bytes to 64-bytes long (including a 4-byte CRC) before
transmitting that packet onto the network medium. If a packet consists of two or more descriptors, then the descriptors in
command mode should have the same configuration, except EOR, FS, LS bits.

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6.3. Next Page

If 1000Base-T mode is advertised, three additional Next Pages are automatically exchanged between the two link partners.
Users can set Reg4.15 to 1 to exchange extra Next Pages via Reg7 and Reg8 as defined in IEEE 802.3ab.

6.4. MII/GMII Interface

6.4.1. MII
The RTL8169S supports 10Mbps and 100Mbps link operation. During the operation, the PHY communicates with the MAC
through the MII as defined in the IEEE 802.3 (clause 22) specifications. The MII consists of a transmit data interface (TxEN,
TxER, TXD[3:0], and TxCLK), a receive data interface (RxDV, RxER, RXD[3:0], and RxCLK), two status signals (CRS and
COL) and a management interface (MDC and MDIO). In this mode of operation, both Transmit and Receive clocks are
supplied by the PHY.

6.4.2. GMII
In 1000Base-T mode, the GMII interface is selected, the 125MHz transmit clock is expected on GTXCLK, TXCLK sources
25MHz, 2.5MHz, or 0MHz clock depending on the operation mode, and RXCLK sources the 125MHz receive clock.

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6.5. LEDs
The RTL8169S supports four LED signals in four different configurable operation modes. The modes are shown in Pin
Descriptions, page 5.

6.5.1. Link Monitor

The Link Monitor senses a link, such as LINK10, LINK100, LINK1000, LINK10/100/1000. Whenever a link is established,
the specific link LED pin is driven low. Once disconnected, the link LED pin is driven high indicating that no network
connection exists.

6.5.2. RX LED
In 10/100/1000Mbps mode, blinking of the Rx LED indicates that receive activity is occurring.

Power On

LED = High

Receiving No
Packet?

Yes

LED = High for (100 +- 10) ms

LED = Low for (12 +- 2) ms

Figure 3. RX LED

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6.5.3. TX LED
In 10/100/1000Mbps mode, blinking of the Tx LED indicates that transmit activity is occurring.

Power On

LED = High

Transmitting No
Packet?

Yes

LED = High for (100 +- 10) ms

LED = Low for (12 +- 2) ms

Figure 4. TX LED

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6.5.4. TX/RX LED

In 10/100/1000Mbps mode, blinking of the Tx/Rx LED indicates that both transmit and receive activity is occurring.

Power On

LED = High

No
Tx/Rx Packet?

Yes

LED = High for (100 +- 10) ms

LED = Low for (12 +- 2) ms

Figure 5. TX/RX LED

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6.5.5. LINK/ACT LED

In 10/100/1000Mbps mode, blinking of the LINK/ACT LED indicates that the RTL8169S is linked and operating properly.
When this LED is high for extended periods, it indicates that a link problem exists.

Power On

LED = High

No
Link?

Yes

LED = Low

No
Tx/Rx packet?

Yes

LED = High for (100 +- 10) ms

LED = Low for (12 +- 2) ms

Figure 6. LINK/ACT LED

6.6. Flash/EEPROM Interface

The Flash interface consists of address bus MA(16:0) and data bus MD(7:0) which share the pin with PCI interface AD(16:0)
and AD(32:24), respectively. It also consists of several control signals: WEB, OEB(LED0), CSB(EECS). The RTL8169S
supports the attachment of an external EEPROM. The 93C46 is a 1K-bit EEPROM (the 93C56 is a 2K-bit EEPROM).

The EEPROM interface provides the ability for the RTL8169S to read from and write data to an external serial EEPROM
device. Values in the external EEPROM allow default fields in PCI configuration space and I/O space to be overridden
following a reboot or software EEPROM auto load command. The RTL8169S will auto load values from the EEPROM. If the
EEPROM is not present, the RTL8169S initialization uses default values for the appropriate Configuration and Operational

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Registers. Software can read and write to the EEPROM using “bit-bang” accesses via the 9346CR Register. The interface
consists of EESK, EECS, EEDO, and EEDI.

Table 10. Flash/EEPROM Interface

Flash Description
MA[16:0] Boot PROM Address Bus. These pins are used to access up to a 128k-byte flash
(PCIAD16:0) memory or EEPROM.
MD7-0(PCIAD31:24) Boot PROM data bus when in Boot PROM mode.
CSB(EECS/BROMCSB) The chip select signal of the Boot PROM.
OEB(LED0/BROMOEB) Enables the output buffer of the Boot PROM or Flash memory during a read
operation.
EEPROM Description
EECS 93C46 (93C56) chip select
EESK EEPROM serial data clock
EEDI/Aux Input data bus/Input pin to detect if Aux. Power exists or not on initial power-on.
This pin should be connected to Boot PROM. To support wakeup from ACPI
D3cold or APM power-down, this pin must be pulled high to aux. power via a
resistor. If this pin is not pulled high to Aux. Power, the RTL8169S assumes that no
Aux. Power exists.
EEDO Output data bus

6.7. Power Management

The RTL8169S is compliant with ACPI (Rev 1.0, 1.0b, 2.0), PCI Power Management (Rev 1.1), and Network Device Class
Power Management Reference Specification (V1.0a), such as to support an OS-directed Power Management (OSPM)
environment.

The RTL8169S can monitor the network for a Wakeup Frame, a Magic Packet, or a Re-LinkOk, and notify the system via
PME# when such a packet or event occurs. Then, the whole system can be restored to a normal state to process incoming jobs.

When the RTL8169S is in power down mode (D1 ~ D3):

• The Rx state machine is stopped, and the RTL8169S monitors the network for wakeup events such as a Magic Packet,
Wakeup Frame, and/or Re-LinkOk, in order to wake up the system. When in power down mode, the RTL8169S will not
reflect the status of any incoming packets in the ISR register and will not receive any packets into the Rx FIFO buffer.
• The FIFO status and packets that have already been received into the Rx FIFO before entering power down mode are held
by the RTL8169S.
• Transmission is stopped. PCI bus master mode is stopped. The Tx FIFO buffer is held.
• After restoration to a D0 state, the RTL8169S transfers data that was not moved into the Tx FIFO buffer during power down
mode. Packets that were not transmitted completely last time are re-transmitted.

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The D3cold_support_PME bit (bit15, PMC register) and the Aux_I_b2:0 bits (bit8:6, PMC register) in PCI configuration space
depend on the existence of Aux power (bit15, PMC) = 1.
If EEPROM D3cold_support_PME bit (bit15, PMC) = 0, the above 4 bits are all 0's.
Example:
If EEPROM D3c_support_PME = 1:
• If Aux. power exists, then PMC in PCI config space is the same as EEPROM PMC
(if EEPROM PMC = C2 F7, then PCI PMC = C2 F7)
• If Aux. power is absent, then PMC in PCI config space is the same as EEPROM PMC except the above 4 bits are all 0’s
(if EEPROM PMC = C2 F7, the PCI PMC = 02 76)
In the above case, if wakeup support is desired when main power is off, it is suggested that the EEPROM PMC be
set to C2 F7 (Realtek EEPROM default value).

If EEPROM D3c_support_PME = 0:
• If Aux. power exists, then PMC in PCI config space is the same as EEPROM PMC
(if EEPROM PMC = C2 77, then PCI PMC = C2 77)
• If Aux. power is absent, then PMC in PCI config space is the same as EEPROM PMC except the above 4 bits are all 0’s.
(if EEPROM PMC = C2 77, then PCI PMC = 02 76)
In the above case, if wakeup support is not desired when main power is off, it is suggested that the EEPROM PMC be
set to 02 76.

Link Wakeup occurs only when the following conditions are met:
• The LinkUp bit (CONFIG3#4) is set to 1, the PMEn bit (CONFIG1#0) is set to 1, and the PME# can be asserted in the
current power state.
• The Link status is re-established.

Magic Packet Wakeup occurs only when the following conditions are met:
• The destination address of the received Magic Packet is acceptable to the RTL8169S, e.g. a broadcast, multicast, or unicast
packet addressed to the current RTL8169S adapter.
• The received Magic Packet does not contain a CRC error.
• The Magic bit (CONFIG3#5) is set to 1, the PMEn bit (CONFIG1#0) is set to 1, and the PME# can be asserted in the current
power state.
• The Magic Packet pattern matches, i.e. 6 * FFh + MISC (can be none) + 16 * DID(Destination ID) in any part of a valid
(Fast) Ethernet packet.

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A Wakeup Frame event occurs only when the following conditions are met:
• The destination address of the received Wakeup Frame is acceptable to the RTL8110S, e.g. a broadcast, multicast, or unicast
address to the current RTL8110S adapter.
• The received Wakeup Frame does not contain a CRC error.
• The PMEn bit (CONFIG1#0) is set to 1.
• The 16-bit CRC* of the received Wakeup Frame matches with the 16-bit CRC* of the sample Wakeup Frame pattern given
by the local machine’s OS. Or, the RTL8169S is configured to allow direct packet wakeup, e.g. a broadcast, multicast, or
unicast network packet.
*16-bit CRC: The RTL8169S supports two normal wakeup frames (covering 64 mask bytes from offset 0 to 63 of any
incoming network packet) and three long wakeup frames (covering 128 mask bytes from offset 0 to 127 of any incoming
network packet).

The PME# signal is asserted only when the following conditions are met:
1. The PMEn bit (bit0, CONFIG1) is set to 1.
2. The PME_En bit (bit8, PMCSR) in PCI Configuration Space is set to 1.
3. The RTL8169S may assert PME# in the current power state or in isolation state, depending on the PME_Support
(bit15-11) setting of the PMC register in PCI Configuration Space.
4. A Magic Packet, LinkUp, or Wakeup Frame been received.
5. Writing a 1 to the PME_Status (bit15) of the PMCSR register in the PCI Configuration Space clears this bit and causes the
RTL8169S to stop asserting a PME# (if enabled).

When the device is in power down mode, e.g. D1-D3, the IO, MEM, and Boot ROM spaces are all disabled. After a RST#
assertion, the device’s power state is restored to D0 automatically if the original power state was D3cold. There is no hardware
delay at the device’s power state transition. When in ACPI mode, the device does not support PME (Power Management
Enable) from D0 (this is the Realtek default setting of the PMC register auto loaded from EEPROM). The setting may be
changed from the EEPROM, if required). The RTL8169S also supports the legacy LAN WAKE-UP function. The LWAKE
pin is used to notify legacy motherboards to execute the wake-up process whenever the device receives a wakeup event, such
as Magic Packet.

The LWAKE signal is asserted according to the following settings:

1. LWPME bit (bit4, CONFIG4):
• LWAKE can only be asserted when the PMEB is asserted and the ISOLATEB is low.
• LWAKE is asserted whenever a wakeup event occurs.

2. Bit1 of DELAY byte (offset 1Fh, EEPROM):

• LWAKE signal is enabled.
• LWAKE signal is disabled.

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7. Characteristics
7.1. Absolute Maximum Ratings
WARNING: Absolute maximum ratings are limits beyond which permanent damage may be caused to the device, or device
reliability will be affected. All voltages are specified reference to GND unless otherwise specified.
Table 11. Absolute Maximum Ratings
Description/Symbol Minimum Maximum Unit
Supply Voltage (VDD33, AVDDH) -0.5 4 V
Supply Voltage (VDD25) -0.5 3 V
Supply Voltage (VDD18) -0.5 2 V
Input Voltage (DCinput) -0.5 VDD33 + 0.5 V
Output Voltage (DCoutput) -0.5 VDD33 + 0.5 V
Storage Temperature -55 +125 °C

7.2. Recommended Operating Conditions

Table 12. Recommended Operating Conditions
Description Pins Minimum Typical Maximum Unit
Supply Voltage VDD VDD33, 3.0 3.3 3.6 V
AVDDH
VDD25 2.25 2.5 2.75 V
VDD18 1.67 1.8 1.92 V
Ambient Temperature TA 0 70 °C
Maximum Junction 125 °C
Temperature

7.3. Crystal Requirements

Table 13. Crystal Requirements
Symbol Description/Condition Minimum Typical Maximum Unit
Fref Parallel resonant crystal reference frequency, 25 MHz
fundamental mode, AT-cut type.
Fref Parallel resonant crystal frequency stability, -50 +50 ppm
Stability fundamental mode, AT-cut type. Ta=25℃.
Fref Parallel resonant crystal frequency tolerance, -30 +30 ppm
Tolerance fundamental mode, AT-cut type.
Ta=-20℃~+70℃.
Fref Reference clock input duty cycle 40 60 %
Duty Cycle
CL Load Capacitance pF
ESR Equivalent Series Resistance Ω
DL Drive Level 0.5 mW
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7.4. Thermal Characteristics

Table 14. Thermal Characteristics
Parameter Minimum Maximum Units
Storage temperature -55 +125 °C
Operating temperature 0 70 °C

7.5. DC Characteristics
Table 15. DC Characteristics
Symbol Parameter Conditions Minimum Typical Maximum Units
3.3V Supply
VDD33 3.0 3.3 3.6 V
Voltage
1.8V Supply
VDD18 1.67 1.8 1.92 V
Voltage
2.5V Supply 2.25 2.5 2.75
VDD25 V
Voltage
Minimum High
Voh Level Output Ioh = -8mA 0.9 * Vcc Vcc V
Voltage
Maximum Low
Vol Level Output Iol = 8mA 0.1 * Vcc V
Voltage
Vih Minimum High
0.5 * Vcc Vcc+0.5 V
Level Input Voltage
Vil Maximum Low
-0.5 0.3 * Vcc V
Level Input Voltage
Vin =Vcc or
Iin Input Current -1.0 1.0 uA
GND

Tri-State Output Vout =Vcc or

Ioz -10 10 uA
Leakage Current GND
Average Operating
Icc33 Supply Current mA
from 3.3V
Average Operating
Icc18 Supply Current mA
from 1.8V

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7.6. AC Characteristics
7.6.1. Serial EEPROM Interface Timing
93C46(64*16)/93C56(128*16)

EESK

EECS tcs

EEDI (Read) 1 1 0 An A2 A1 A0
(Read)
EEDO High Impedance 0 Dn D1 D0

EESK

EECS tcs

EEDI (Write) 1 0 1 An ... A0 Dn ... D0

(Write)
EEDO High Impedance BUSY READY
twp

tsk
EESK
tskh tskl tcsh
EECS tcss
tdis tdih
EEDI
tdos tdoh
EEDO (Read)
tsv
EEDO STATUS VALID
(Program)

Figure 7. Serial EEPROM Interface Timing

Table 16. EEPROM Access Timing Parameters

Symbol Parameter EEPROM Type Min. Max. Unit
tcs Minimum CS Low Time 9346/9356 1000/250 ns

twp Write Cycle Time 9346/9356 10/10 ms

tsk SK Clock Cycle Time 9346/9356 4/1 us
tskh SK High Time 9346/9356 1000/500 ns
tskl SK Low Time 9346/9356 1000/250 ns
tcss CS Setup Time 9346/9356 200/50 ns
tcsh CS Hold Time 9346/9356 0/0 ns

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Symbol Parameter EEPROM Type Min. Max. Unit
tdis DI Setup Time 9346/9356 400/50 ns
tdih DI Hold Time 9346/9356 400/100 ns
tdos DO Setup Time 9346/9356 2000/500 ns
tdoh DO Hold Time 9346/9356 2000/500 ns
tsv CS to Status Valid 9346/9356 1000/500 ns

7.7. PCI Bus Operation Timing

7.7.1. PCI Bus Timing Parameters
Table 17. PCI Bus Timing Parameters
66MHz 33MHz
Symbol Parameter Min Max Min Symbol Parameter
T val CLK to Signal Valid 2 6 2 11 ns
Delay-bused signals
T val CLK to Signal Valid 2 6 2 12 ns
(ptp) Delay-point to point
T on Float to Active Delay 2 2 ns
T off Active to Float Delay 14 28 ns
T su Input Setup Time to 3 7 ns
CLK-bused signals
T su Input Setup Time to 5 10 ns
(ptp) CLK-point to point
Th Input Hold Time from 0 0 ns
CLK
T rst Reset active time after 1 1 ms
power stable
T rst-clk Reset active time after 100 100 us
CLK STABLE
T rst-off Reset Active to Output 40 40 ns
Float delay
T rrsu REQB to REQ64B 10*Tcyc 10*Tcyc ns
Setup Time
T rrh RSTB to REQ64B 0 50 0 50 ns
Hold Time
T rhfa RSTB High to First 2^25 2^25 clocks
configuration Access
T rhff RSTB High to First 5 5 clocks
FRAMEB assertion

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V_th
CLK V_test
V_tl
T_val
OUTPUT
V_trise, V_tfall
DELAY

Tri-State
V_test V_test
OUTPUT
T_on
T_off

Figure 8. Output Timing Measurement Conditions

V_th
CLK V_test
V_tl
T_su T_h
V_th
INPUT V_test inputs valid V_test V_max
V_tl

Figure 9. Input Timing Measurement Conditions

Table 18. Measurement Condition Parameters

Symbol Level Units
Vth 0.6Vcc V
Vtf 0.2Vcc V
Vtest 0.4Vcc V
Vtrise 0.285Vcc V
Vtfall 0.615Vcc V
Vmax 0.4Vcc V
Input Signal Edge Rate 1 V/ns

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7.7.2. PCI Clock Specification

T_high T_low

0.6Vcc
0.5Vcc
0.4Vcc 0.4Vcc, peak-to-peak
(minimum)
0.3Vcc
0.2Vcc
T_cyc

Figure 10. 3.3V Clock Waveform

V_ih
V_test
CLK (@ Device #1) T_skew
V_il

T_skew

V_ih
T_skew
V_test
CLK (@ Device #2)
V_il

Figure 11. Clock Skew Diagram

Table 19. Clock and Reset Specifications

66MHz 33MHz
Symbol Parameter Min Max Min Symbol Parameter
Tcyc CLK Cycle Time 15 30 30 ∞ ns
Thigh CLK High Time 6 11 ns
Tlow CLK Low Time 6 11 ns
-- CLK Slew Rate 1.5 4 1 4 V/ns
-- RST# Slew Rate 50 - 50 - mV/ns
Tskew CLK Skew 1 2 ns

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7.7.3. PCI Transactions

CLK
1 2 3 4 5 6 7 8 9 10

FRAMEB

AD31-0 ADDRESS DATA

C/BE3-0B BUS CMD BE3-0B

IRDYB

TRDYB

DEVSELB

Figure 12. I/O Read

CLK
1 2 3 4 5 6 7 8 9 10

FRAMEB

AD31-0 ADDRESS DATA

C/BE3-0B BUS CMD BE3-0B

IRDYB

TRDYB

DEVSELB

Figure 13. I/O Write

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CLK
1 2 3 4 5 6 7 8 9 10

FRAMEB

IDSEL

AD31-0 ADDRESS DATA

C/BE3-0B BUS CMD BE3-0B

IRDYB

TRDYB

DEVSELB

Figure 14. Configuration Read

CLK
1 2 3 4 5 6 7 8 9 10

FRAMEB

IDSEL

AD31-0 ADDRESS DATA

C/BE3-0B BUS CMD BE3-0B

IRDYB

TRDYB

DEVSELB

Figure 15. Configuration Write

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CLK
1 2 3 4 5 6 7 8 9 10

REQB-A

REQB-B

GNTB-A

GNTB-B

FRAMEB

AD ADDRESS DATA ADDRESS DATA

Figure 16. Bus Arbitration

CLK
1 2 3 4 5 6 7 8 9

FRAMEB

AD31-0 ADDRESS DATA-1 DATA-2 DATA-3

C/BE3-0B BUS CMD BE3-0B

WAIT
DATA TRANSFER

DATA TRANSFER

DATA TRANSFER

IRDYB
WAIT

WAIT

TRDYB

DEVSELB

Figure 17. Memory Read below 4GB (32-bit address, 32-bit data; 32-bit slot)

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CLK
1 2 3 4 5 6 7 8 9

FRAMEB

AD31-0 ADDRESS DATA-1 DATA-2 DATA-3

C/BE3-0B BUS CMD BE3-0B-1 BE3-0B-2 BE3-0B-3

DATA TRANSFER

DATA TRANSFER

DATA TRANSFER
IRDYB

WAIT

WAIT

WAIT
TRDYB

DEVSELB

Figure 18. Memory Write below 4GB (32-bit address, 32-bit data; 32-bit slot)

CLK
1 2 3 4 5 6 7 8 9

FRAMEB

IRDYB

TRDYB

STOPB

DEVSELB

Figure 19. Target Initiated Termination - Disconnect

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CLK
1 2 3 4 5 6 7 8 9

FRAMEB

IRDYB

TRDYB

STOPB

DEVSELB

Figure 20. Target Initiated Termination - Abort

CLK
1 2 3 4 5 6 7 8 9

FRAMEB

IRDYB

TRDYB

NO RESPONSE
DEVSELB FAST MED SLOW SUB ACKNOWLEDGE

Figure 21. Master Initiated Termination - Abort

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CLK
1 2 3 4 5 6 7 8 9 10

FRAMEB

AD ADDRESS DATA ADDRESS DATA

C/BE# BUS CMD BE# BUS CMD BE#

PAR/PAR64

SERR#

PERR#

Figure 22. Parity Operation – One Example

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CLK
1 2 3 4 5 6 7 8 9

FRAMEB

REQ64B

AD31-0 ADDRESS DATA-1 DATA-2 DATA-3

AD63-32

C/BE3-0B BUS CMD BE3-0B

C/BE7-4B BE7-4B

WAIT
DATA TRANSFER

DATA TRANSFER

DATA TRANSFER
IRDYB
WAIT

WAIT

TRDYB

DEVSELB

ACK64B

Figure 23. Memory Read Below 4GB (32-bit address, 32-bit data transfer granted; 64-bit slot)

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CLK
1 2 3 4 5 6 7 8 9

FRAMEB

REQ64B

AD31-0 ADDRESS DATA-1 DATA-2 DATA-3

AD63-32 DATA-2

C/BE3-0B BUS CMD BE3-0B-1 BE3-0B-2 BE3-0B-3

C/BE7-4B BE7-4B-1
DATA TRANSFER

DATA TRANSFER

DATA TRANSFER
IRDYB
WAIT

WAIT

WAIT

TRDYB

DEVSELB

ACK64B

Figure 24. Memory Write below 4GB (32-bit address, 32-bit data transfer granted; 64-bit slot)

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CLK
1 2 3 4 5 6 7 8 9

FRAMEB

REQ64B

AD31-0 ADDRESS DATA-1 DATA-3 DATA-5

AD63-32 DATA-2 DATA-4 DATA-6

C/BE3-0B BUS CMD BE3-0B

C/BE7-4B BE7-4B

WAIT
DATA TRANSFER

DATA TRANSFER

DATA TRANSFER
IRDYB
WAIT

WAIT

TRDYB

DEVSELB

ACK64B

Figure 25. Memory Read below 4GB (32-bit address, 64-bit data transfer granted; 64-bit slot)

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CLK
1 2 3 4 5 6 7 8 9

FRAMEB

REQ64B

AD31-0 ADDRESS DATA-1 DATA-3 DATA-5

AD63-32 DATA-2 DATA-4 DATA-6

C/BE3-0B BUS CMD BE3-0B-1 BE3-0B-2 BE3-0B-3

C/BE7-4B BE7-4B-1 BE7-4B-2 BE7-4B-3

DATA TRANSFER

DATA TRANSFER

DATA TRANSFER
IRDYB
WAIT

WAIT

WAIT

TRDYB

DEVSELB

ACK64B

Figure 26. Memory Write below 4GB (32-bit address, 64-bit data transfer granted; 64-bit slot)

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CLK
1 2 3 4 5 6 7 8 9 10

FRAMEB

AD31-0 LO-ADDR HI-ADDR DATA-1 DATA-2 DATA-3

C/BE3-0B DAC CMD BUS CMD BE3-0B

WAIT
DATA TRANSFER

DATA TRANSFER

DATA TRANSFER
IRDYB
WAIT

WAIT
TRDYB

DEVSELB

Figure 27. Memory Read above 4GB (DAC, 64-bit address, 32-bit data; 32-bit slot)

CLK
1 2 3 4 5 6 7 8 9 10

FRAMEB

AD31-0 LO-ADDR HI-ADDR DATA-1 DATA-2 DATA-3

C/BE3-0B DAC CMD BUS CMD BE3-0B-1 BE3-0B-2 BE3-0B-3

DATA TRANSFER

DATA TRANSFER

DATA TRANSFER

IRDYB
WAIT

WAIT

WAIT

TRDYB

DEVSELB

Figure 28. Memory Write above 4GB (DAC, 64-bit address, 32-bit data; 32-bit slot)

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CLK
1 2 3 4 5 6 7 8 9 10

FRAMEB

REQ64B

AD31-0 LO-ADDR HI-ADDR DATA-1 DATA-2 DATA-3

AD63-32 HI-ADDR

C/BE3-0B DAC CMD BUS CMD BE3-0B

C/BE7-4B BUS CMD BE7-4B

WAIT
DATA TRANSFER

DATA TRANSFER

DATA TRANSFER
IRDYB
WAIT

WAIT

TRDYB

DEVSELB

ACK64B

Figure 29. Memory Read above 4GB (DAC, 64-bit address, 32-bit data transfer granted; 64-bit slot)

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CLK
1 2 3 4 5 6 7 8 9 10

FRAMEB

REQ64B

AD31-0 LO-ADDR HI-ADDR DATA-1 DATA-2 DATA-3

AD63-32 HI-ADDR DATA-2

C/BE3-0B DAC CMD BUS CMD BE3-0B-1 BE3-0B-2 BE3-0B-3

C/BE7-4B BUS CMD BE7-4B-1

DATA TRANSFER

DATA TRANSFER

DATA TRANSFER
IRDYB
WAIT

WAIT

WAIT
TRDYB

DEVSELB

ACK64B

Figure 30. Memory Write above 4GB (DAC, 64-bit address, 32-bit data transfer granted; 64-bit slot)

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CLK
1 2 3 4 5 6 7 8 9 10

FRAMEB

REQ64B

AD31-0 LO-ADDR HI-ADDR DATA-1 DATA-3 DATA-5

AD63-32 HI-ADDR DATA-2 DATA-4 DATA-6

C/BE3-0B DAC CMD BUS CMD BE3-0B

C/BE7-4B BUS CMD BE7-4B

WAIT
DATA TRANSFER

DATA TRANSFER

DATA TRANSFER
IRDYB
WAIT

WAIT

TRDYB

DEVSELB

ACK64B

Figure 31. Memory Read above 4GB (DAC, 64-bit address, 64-bit data transfer granted; 64-bit slot)

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CLK
1 2 3 4 5 6 7 8 9 10

FRAMEB

REQ64B

AD31-0 LO-ADDR HI-ADDR DATA-1 DATA-3 DATA-5

AD63-32 HI-ADDR DATA-2 DATA-4 DATA-6

C/BE3-0B DAC CMD BUS CMD BE3-0B-1 BE3-0B-2 BE3-0B-3

C/BE7-4B BUS CMD BE7-4B-1 BE7-4B-2 BE7-4B-3

DATA TRANSFER

DATA TRANSFER

DATA TRANSFER
IRDYB
WAIT

WAIT

WAIT
TRDYB

DEVSELB

ACK64B

Figure 32. Memory Write above 4GB (DAC, 64-bit address, 64-bit data transfer granted; 64-bit slot)

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8. Mechanical Dimensions

8.1. 128-Pin QFP Mechanical Dimensions

See the Mechanical Dimensions notes on the next page.

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8.2. Notes for 128-Pin QFP Dimensions

Symbol Dimensions in inches Dimensions in mm Notes:

Min Typical Max Min Typical Max 1. Dimensions D & E do not include interlead flash.

A - - 0.134 - - 3.40 2. Dimension b does not include dambar

rotrusion/intrusion.
A1 0.004 0.010 0.036 0.10 0.25 0.91 3. Controlling dimension: Millimeter

A2 0.102 0.112 0.122 2.60 2.85 3.10 4. General appearance spec. Should be based on final
visual inspection.
c 0.002 0.006 0.010 0.05 0.15 0.25

D 0.541 0.551 0.561 13.75 14.00 14.25 TITLE:

E 0.778 0.787 0.797 19.75 20.00 20.25 -CU L/F, FOOTPRINT 3.2 mm

e 0.010 0.020 0.030 0.25 0.5 0.75 LEADFRAME MATERIAL:

HD 0.665 0.677 0.689 16.90 17.20 17.50 APPROVE DOC. NO.

HE 0.902 0.913 0.925 22.90 23.20 23.50 VERSION

L 0.027 0.035 0.043 0.68 0.88 1.08 PAGE

L1 0.053 0.063 0.073 1.35 1.60 1.85 CHECK DWG NO. Q128 - 1

y - - 0.004 - - 0.10 DATE

θ 0° - 12° 0° - 12° REALTEK SEMICONDUCTOR CO., LTD

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8.3. 233-PIN TFBGA Mechanical Dimensions

See the Mechanical Dimensions notes on the next page.

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8.4. Notes for 233-Pin TFBGA Dimensions

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9. Ordering Information
Table 20. Ordering Information
Part number Package Status
RTL8169S-32 128-pin QFP
RTL8169S-64 233-pin TFBGA

Realtek Semiconductor Corp.

Headquarters
1F, No. 2, Industry East Road IX, Science-based
Industrial Park, Hsinchu, 300, Taiwan, R.O.C.
Tel: 886-3-5780211 Fax: 886-3-5776047
www.realtek.com.tw

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