Lec01 - Introduction
Lec01 - Introduction
Lec01 - Introduction
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Assessment
Textbook
◼ William Stallings,
(2019). Computer
Organization and
Architecture, 11th
Edition, Prentice Hall
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Contents
History of Computers
First Generation: Vacuum Tubes
◼ ENIAC
◼ Electronic Numerical Integrator And Computer
◼ Its first task was to perform a series of calculations that were used to help
determine the feasibility of the hydrogen bomb
ENIAC
Vacumm tube
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ENIAC
◼ Features:
◼ Heavy - weighed 30 tons
◼ Huge - occupied 1500 square feet of floor space
◼ Contained more than 18,000 vacuum tubes
◼ High power consumption - 140 kW
◼ Capable of 5000 additions per second
◼ Decimal rather than binary machine
◼ Memory consisted of 20 accumulators, each capable of holding a
10 digit number
◼ Major drawback - the need for manual programming by setting
switches and plugging/unplugging cables
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◼ IAS computer
◼ Began in 1946 at the Princeton Institute for Advanced Studies
◼ Prototype of all subsequent general-purpose computers
◼ Completed in 1952 (7 years)
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Accumulator (AC)
• Employed to temporarily hold operands and
and multiplier results of ALU operations
quotient (MQ)
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IAS
Operations
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Table 2.1
The IAS
Instruction
Set
Commercial Computers
UNIVAC
◼ 1947 – Eckert and Mauchly formed the Eckert-Mauchly
Computer Corporation (currently Unisys) to manufacture
computers commercially
◼ Backward compatible
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18
History of Computers
Second Generation: Transistors
◼ Smaller
◼ Cheaper
◼ Introduced:
◼ Appearance of the Digital
◼ More complex arithmetic
Equipment Corporation (DEC)
and logic units and control
units in 1957
◼ The use of high-level
◼ PDP-1 was DEC’s first
programming languages
computer
◼ Provision of system software
which provided the ability ◼ This began the mini-computer
to:
phenomenon that would
◼ load programs become so prominent in the
◼ move data to peripherals third generation
and libraries
◼ perform common
computations
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History of Computers
Third Generation: Integrated Circuits
◼ Discrete component
◼ Single, self-contained transistor
◼ Manufactured separately, packaged in their own containers, and
soldered or wired together onto masonite-like circuit boards
◼ Manufacturing process was expensive and cumbersome
Microelectronics
• A gate is a device that implements a simple Boolean or
logical function, such as IF A AND B ARE TRUE, THEN C IS TRUE
(AND gate).
• The memory cell is a device that can store one bit of data;
that is, the device can be in one of two stable states at any
time.
+ ◼ A computer consists of gates,
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Wafer,
Chip,
and
Gate
Relationship
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Chip Growth
Moore’s Law 27
Generations
VLSI
Very Large
Scale
Integration
ULSI
Semiconductor Memory Ultra Large
Microprocessors Scale
Integration
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Microprocessors
◼ The density of elements on processor chips continued to rise
◼ More and more elements were placed on each chip so that fewer
and fewer chips were needed to construct a single computer
processor
Intel Microprocessors
a. 1970s Processors
b. 1980s Processors
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Intel Microprocessors
c. 1990s Processors
d. Recent Processors
Table 2.2
Computer Generations
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Computer Generations
34
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Microprocessor Speed
Techniques built into contemporary processors include:
Performance
Balance
◼ Adjust the organization and Increase the number
of bits that are
architecture to compensate retrieved at one time
by making DRAMs
for the mismatch among the “wider” rather than
“deeper” and by
capabilities of the various using wide bus data
paths
components
Reduce the
◼ Architectural examples frequency of memory
access by
include: incorporating
increasingly
complex and
efficient cache
structures between
the processor and
main memory
Increase the
Change the DRAM interconnect
interface to make it bandwidth between
more efficient by processors and
including a cache or memory by using
other buffering higher speed buses
scheme on the DRAM and a hierarchy of
chip buses to buffer and
structure data flow
Typical I/O Device Data Rates 37
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Improvements in Chip
Organization and Architecture
◼ Increase hardware speed of processor
◼ Fundamentally due to shrinking logic gate size
◼ More gates, packed more tightly, increasing clock rate
◼ Propagation time for signals reduced
◼ RC (Resistive-Capacitive) delay
◼ Speed at which electrons flow limited by resistance and
capacitance of metal wires connecting them
◼ Delay increases as RC product increases
◼ Wire interconnects thinner, increasing resistance
◼ Wires closer together, increasing capacitance
◼ Memory latency
◼ Memory speeds lag processor speeds
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40
Processor
Trends
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Overview
ARM
◼ Results of decades of design effort on
complex instruction set computers Intel
(CISCs)
◼ 8086
◼ 16-bit machine
◼ Used an instruction cache, or queue
◼ First appearance of the x86 architecture
◼ 80386
◼ Intel’s first 32-bit machine
◼ First Intel processor to support multitasking
◼ 80486
◼ More sophisticated cache technology and
instruction pipelining
◼ Built-in math coprocessor
x86 Evolution - Pentium
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44
◼ Core
◼ First Intel x86 microprocessor
Instruction set with a dual core, referring to
architecture is the implementation of two
backward
compatible with processors on a single chip
earlier versions
◼ Core 2
◼ Extends the architecture to 64
X86
architecture bits
continues to ◼ Recent Core offerings have
dominate the
processor up to 10 processors per chip
market outside
of embedded
systems
+ Summary
45
Introduction
Lec 01
◼ Performance designs
◼ First generation computers ◼ Microprocessor speed
◼ Vacuum tubes ◼ Performance balance
◼ Second generation computers ◼ Chip organization and
◼ Transistors architecture