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    A 3d Ic Is A Three

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    Srujala20 Ayyanki
    3D integrated circuits are built by vertically stacking silicon chips or wafers into a single package. This provides three main advantages: reduced power consumption, improved signal timing, and the ability to integrate different types of signals. 3D ICs use techniques like wafer thinning, through-silicon vias, and oxide or metal bonding to connect the vertically stacked layers both vertically and horizontally. This helps address issues like increasing interconnect delays that arise from shrinking transistor sizes and longer wire lengths on 2D chips.

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    A 3d Ic Is A Three

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    Srujala20 Ayyanki
    15 views4 pages
    3D integrated circuits are built by vertically stacking silicon chips or wafers into a single package. This provides three main advantages: reduced power consumption, improved signal timing, and the ability to integrate different types of signals. 3D ICs use techniques like wafer thinning, through-silicon vias, and oxide or metal bonding to connect the vertically stacked layers both vertically and horizontally. This helps address issues like increasing interconnect delays that arise from shrinking transistor sizes and longer wire lengths on 2D chips.

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    A 3d Ic is a Three

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    3D integrated circuits are built by vertically stacking silicon chips or wafers into a single package. This provides three main advantages: reduced power consumption, improved signal timing, and the ability to integrate different types of signals. 3D ICs use techniques like wafer thinning, through-silicon vias, and oxide or metal bonding to connect the vertically stacked layers both vertically and horizontally. This helps address issues like increasing interconnect delays that arise from shrinking transistor sizes and longer wire lengths on 2D chips.

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    © All Rights Reserved
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    Download as docx, pdf, or txt
    15 views4 pages

    A 3d Ic Is A Three

    Uploaded by

    Srujala20 Ayyanki
    3D integrated circuits are built by vertically stacking silicon chips or wafers into a single package. This provides three main advantages: reduced power consumption, improved signal timing, and the ability to integrate different types of signals. 3D ICs use techniques like wafer thinning, through-silicon vias, and oxide or metal bonding to connect the vertically stacked layers both vertically and horizontally. This helps address issues like increasing interconnect delays that arise from shrinking transistor sizes and longer wire lengths on 2D chips.

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    3D IC Technology

    A 3d ic is a three – dimensional integrated circuit (IC) built by


    vertically stacking different chip or wafer together into a single
    package.

    Advantages
    There are three primary advantages of 3D intergrated circuit in terms
    of power consumption , signal timing and mixing – signal integration

    INCLUDES
    3D ic
    Integrated circuit design
    Through silicon via
    System on chip
    Transistor count
    Inter poser
    Wafer
    Wafer – level packaging
    3D IC Technology
    3D IC Defination
    A 3D IC composed of two or more layers of active electronic
    components , integrated both vertically and horizontally.

    3D-IC METHODS
    Aggressive wafer thinning ,through wafer /chip connectivity , back
    side metallization and patterning , oxide or metal bonding.

    MOTIVATION
    . Interconnect structure increasingly consume more of the power and
    delay budgets in modern design
    . PLAUSIBLE SOLUTION :- increases the number of “ nearest
    neighbours “ such by each transistors by using 3D IC design
    . smaller wire cross-sections , smaller wire pitch and longer lines
    traverse large chips increase RC delay.
    . RC delay is increasingly becoming the dominant factor
    . At 250nm ca was introducted alteviate the adverse effect of
    increasing interconnect delay .
    . 130nm technology node , substantial interconnect delays with result

    IMPROVEMENTS TO ACHIEVE USING 3D-IC


    Reduced interconnect delays ( R,L,C )higher clock rodes

    Reduced interconnect capacitance (I /O PADS) , lower power


    dissipation
    3D IC Technology
    Higher integration density may go heterogenous
    High bandwidth u – processors .
    Merging different process technologies , mixed materials , system
    integration .
    Advanced focal planes

    THROUGH SILICON VIAS (TSV)


    TSV is a vertical electrical connection that passes completely through
    a silicon wafer . TSVs are currently considered to be high-
    performance interconnect techniques and primary purpose of TSVs is
    to create 3D ICS .

    PERFORMANCE CHARACTERISTICS AND


    CONCERNS IN 3D CIRCUITS
    . Timing
    . Energy
    . with shorter interconnects in 3D ICs , both switching energy and
    cycle time are expected to be reduced.
    3D IC Technology

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