1 s2.0 S0017931022005361 Main

International Journal of Heat and Mass Transfer 194 (2022) 123063
Contents lists available at ScienceDirect
International Journal of Heat and Mass Transfer

journal homepage: www.elsevier.com/locate/hmt
Heat transfer augmentation in microchannel heat sink using

secondary flows: A review
Hussam Sadique∗, Qasim Murtaza, Samsher
Department of Mechanical Engineering, Delhi Technological University, Delhi 110042, India
a r t i c l e i n f o a b s t r a c t
Article history: This paper provides an extensive overview of heat transfer augmentation through various techniques us-
Received 18 November 2021 ing microchannel heat sink (MCHS). Continuous miniaturization of electronic devices due to multifunc-
Revised 2 May 2022
tion, high heat flux over the unit area, and lower package volume has compelled researchers to find
Accepted 21 May 2022
advanced and sophisticated heat removal technologies. This review paper (with more than 300 refer-
Available online 8 June 2022
ences) covers the recent developments in the area of different cooling technologies in general and MCHS
Keywords: in particular. The focus has been paid to the research articles since 2010 because of the enormous vol-
Microchannel heat sink ume of papers published in this area in the last 10 years. Following a brief introduction to the rise of
Heat transfer enhancement micro-scale devices, as well as conventional cooling technologies and applications, the review first clas-
Microchannel design sifies flow channels, as well as the various microchannel fabrication techniques used over the years. The
Boundary layer next section provides different methods adopted for heat transfer enhancement that are broadly catego-
Fractal
rized under active and passive techniques, with the focus on passive devices. The final section provides
Review
heat transfer enhancement in MCHS by geometrical modifications. When flow inside a straight chan-
nel becomes regular and the boundary layer grows, heat transfer performance deteriorates. So, extensive
studies have been conducted on channels that inherently provide boundary layer interruption, secondary
flows, and chaotic advection that promote heat transfer without modest change in pumping power. Spe-
cial emphasis has been given to the fractal shaped MCHS due to its inherent property of reducing tem-
perature non-uniformity with an insignificant drop in pressure. Additionally, comments and perspectives
to highlight the notable contributions are presented.
© 2022 Elsevier Ltd. All rights reserved.
1. Introduction and their associated markets, and hence a large increase in heat
flux can be predicted [3,4].
Heat removal is a major challenge in nature, and it’s also vi- As a result, developing an efficient cooling solution becomes
tal in many engineering applications. The efficient removal of ever- a top priority. Traditional cooling methods are inadequate at dis-
increasing heat flux has become a critical concern for thermal en- sipating the generated surplus heat within the IC. Furthermore,
gineers as the current microelectronics industry has progressed. the proposed approach must be compatible with the ICs’ shrunk
Recent advancements in advanced very large-scale integration size. Despite significant progress over the last few decades, high-
(VLSI) technologies and MEMS micro-electromechanical systems heat-flux removal remains a difficult problem that requires ongo-
(MEMS), along with associated micro-miniaturization, have re- ing investigation and research. To deal with the heat generated,
sulted in a substantial increment in the packing densities and heat researchers are working hard to develop micro cooling systems
fluxes generation within these devices (up to 100 W/cm2 [1]). Fur- such as jet impingement, heat pipe, spray cooling, microchannel
ther miniaturization of electronic devices such as those found in heat sinks (MCHS), etc. In the 1980s, there was a surge in interest
avionics and advanced military equipment, has led to the require- in high-heat-flux electronic cooling. Microchannel initially reached
ment of heat removal exceeding 10 0 0 W/cm2 [2] and this is be- the level of 790 W/cm2 in the 1980s. Sprays took the lead in the
yond the capability of many heat removal technologies. The cur- 1990s, with 1200 W/cm2 . Jet impingement reached the ultra-heat
rent trend shows a sharp rise in ICs and semiconductor devices flux in the 20 0 0s, with a power density of 20 0 0 W/cm2 [5].
Moore’s law states that greater heat energy dissipation is re-
quired every eighteen months since the transistor density roughly
doubles [6] as depicted in Fig. 1. There are already approximately
∗
Corresponding author. 3-50 billion transistors in a chip [7–9], and research is still ongoing
E-mail address: hussam.mech@gmail.com (H. Sadique). to expand that number. It’s worth noting that the highest heat-flux
https://doi.org/10.1016/j.ijheatmasstransfer.2022.123063
0017-9310/© 2022 Elsevier Ltd. All rights reserved.
H. Sadique, Q. Murtaza and Samsher International Journal of Heat and Mass Transfer 194 (2022) 123063
1.1. The rise of micro scale devices

Nomenclature
In 2015, the market for thermal management technologies was
MEMS Micro-electro-mechanical systems assessed at 10.12 billion USD. The rapid growth of the renewable
MCHS Micro channel heat sink energy sector, nuclear industry, diode lasers, and electronic devices
HT Heat Transfer is accompanied by an increase in the amount of heat generated
PD Pressure drop and, as a result, an unwanted temperature rise Fig. 2. The gener-
THP Thermo-hydraulic performance ated heat, or more precisely, heat flux, is one of the major road-
Nu Nusselt number blocks to technological advancement. In the near future, the grow-
Pr Prandtl number ing demand for better heat removal methods in these miniaturized
q Heat flux, W/cm2 products is likely to encourage market growth.[11]
Rt Thermal resistance, K/W Individual transistor reliability is exponentially dependent on
Re Reynolds number operating temperature in many semiconductor technologies, and
V Volumetric flow ate, l/min the median time to failure in hours (MTF) may be approximated
FMCHS Fractal Micro Channel Heat Sink using the Black’s correlation [13], which takes the form:
F Frequency. Hz 1 ∅
u Velocity at the inlet, m/s MT F = exp − (1)
AJ 2 KB T
A Wave amplitude, mm
COP Coefficient of performance where A is a constant that contains film cross-sectional area fac-
CNT Carbon nano tube tor, J is the current density in Ampere (per cm2 ), ∅ is the activa-
Dh Hydraulic diameter, mm tion energy (in eV), KB is the Boltzmann constant and T is the film
PEC Performance evaluation criteria temperature (Kelvin). This equation Eq. (1) shows that even a little
TP Thermal performance rise in operating temperature can increase the device failure rate
Nu Nusselt number dramatically.
Heat fluxes of more than 100 W/cm2 are currently produced
Greek Symbols by ICs [14]. Electronic chip fabrication in the future is expected
P Pressure difference, kPa to generate the heat flux of 300 W/cm2 [15], average heat flux
Pumping power of the chip can reach 200-450 W/cm2 by the end of 2026 [16] or
ϕ Volume fraction of nanofluid even more than 10 0 0W/cm2 at hotspots which may lead to failure
λ Wavelength, μm of the chip [17,18]. Hotspot heat flux of 700 W/cm2 has been re-
ported by Feng et al. [19]. By the year 2026, IC hotspots could be
Subscripts
as high as 270 0-450 0 W/cm2 [20]. High power ICs involved in de-
in Inlet value
fense systems can generate heat flux up to 10 0 0 W/cm2 [21]. Other
out Outlet value
technologies’ high heat fluxes (HHF) can even exceed these figures.
w Wavy channel
Furthermore, the microchip surface should be kept at a tempera-
avg. Average
ture lower than 85°C to avoid chip breakdown [15]. The removal
of heat created by the ICs has become a major difficulty as the
present heat removal technologies are not efficient enough to dis-
sipate the required heat flux.
removal approach isn’t necessarily the best or most realistic option.
It is evident from Fig. 3 that temperature is the main culprit in
Indeed, the practicality of such methods might be questioned at
the failure of electronic devices. Around 55% of the failure is asso-
any time, as the goal is not only to achieve high heat flux but also
ciated with the high operating temperature, followed by vibration
to achieve greater efficiency and reliability. Pumping power reduc-
and humidity of the surrounding.
tion, hot-spot mitigation, production costs, and other special needs
emerging from various applications must all be considered while 1.2. Heat transfer technologies and applications
developing heat removal technologies.
With reference to the above paragraph, it is helpful to look
at the features of today’s most successful cooling strategies when
looking for such solutions. A new generation of thermal manage-
ment systems is required to protect electronic components, among
Fig. 2. Thermal management technologies market in North America by application,

Fig. 1. Transistors on an electronic chip over a period of time [6,10]. 2014-2024 (USD Million) [12].
2
convection with extended surfaces such as fin), latent heat stor-

age (phase change material), indirect liquid cooling (cold plates,
thermosyphon, porous media, microchannels, heat pipe, etc.), di-
rect liquid cooling (jet impingement, spray cooling, etc.)
The porous media heat removal technique is based on a
porous metallic medium insert (in the form of a matrix) that in-
creased both local mixing velocity and surface contact area-to-
volume ratio [29]. Materials with high thermal conductivity are
used as inserts, which results in efficient heat transfer to the
coolant.
Microscale coolers can maintain the cooling temperature
of electronic devices and appliances that generate intense heat.
A MCHS’s heat transfer performance is far superior to that of
Fig. 3. Major causes of failure of electronic devices [22]. ordinary heat exchangers [30-32]. For high-heat-generating elec-
tronic equipment, forced convective liquid cooling using MCHS is
one of the most promising and high-performance cooling solu-
tions [33]. This emerging cooling method is also adaptable to
on-chip integration, in addition to drastically reduced package
size [34]. These two methods are comparable in terms of the
heat transfer augmentation process, which is accomplished by
improving the heat transfer contact area and intensifying the
fluid flow within the channels.
The spray cooling approach is distinguished by high perfor-
mance and uniform heat distribution, and it is a reliable means of
cooling temperature-sensitive electronic components when com-
pared to alternative options [35]. In this, liquid droplets created
with a nozzle are sprayed to a surface, and heat is dissipated
by sensible heating of the liquid or evaporation. The heat transfer
Fig. 4. Maximum heat removal capacity of different cooling techniques [5]. is also improved by secondary nucleation, which is generated by
the entrainment of air in the thin layer [35] and it has been proved
to be one of the most efficient cooling technology [21]. Spray cool-
other things, against increased heat flux and temperature peaks ing is used to cool the computer chip and is a top contender for
while also maintaining a compact overall package volume [23]. In cooling high-voltage diode laser arrays on the ground, lasers used
terms of addressing the cooling requirements for compact space in space, and radar-based applications [35]. During laser therapy
systems, heat removal technologies such as spray cooling, Mi- for patients with port-wine stain birthmarks, spray cooling is also
crochannel heat sinks, porous media, heat pipe, jet impingement, employed to cool human skin during laser dermatologic surgery
etc., are highly promising. [36-38].
Single-phase microchannel systems outperformed traditional Due to simplicity in design MCHS has got wide area of applica-
cooling by a wide margin, but limitations such as temperature gra- tion such as in cooling of microelectronic devices [39], industrial
dients caused by sensible heating and large pressure losses in- heat exchangers [40,41], refrigeration system [42,43], automotive
side the channel encouraged the researchers to look for a better [44,45], process industries [46,47], bioengineering [48–50], renew-
solution. Two-phase systems solve many of the disadvantages of able energy [51–53], microsensors[54,55], gas turbine blade cool-
single-phase flow by utilizing latent heat exchange, but implemen- ing [56] etc. Porous media is commonly utilised in a variety of
tation has been hampered by a lack of understanding of fluidic technical applications, such as drying operations[57-59], electronic
and thermal behaviour as well as concerns with flow instabilities. cooling [54,60-62], solid matrix heat exchangers [63,64], heat pipe
Two-phase cooling, on the contrary, has the best possibility of ful- [65,66], in petroleum reservoirs [67], grain storage [68,69] etc.
filling future cooling demands. The flow boiling phenomenon re- Some applications of impingement jets are in cooling of electronic
sults in higher coolant temperatures and lower flow rates, which devices, gas turbine blades and fusion reactors, solar collector, dry-
improves efficiency and reduces cooling power consumption and ing of tissue paper, textile, annealing, etc. [68,70-77].
cost. Isothermal cooling through latent heat transfer also presents
a great opportunity to reduce stress caused by temperature non-
uniformity, hence enhancing device durability. 2. Microchannel heat sink
Fig. 4 depicts the maximum heat removal capabilities of various
technologies. Jet impingement can remove the maximum amount The rise in the research in the field of Microchannel heat sink
of heat among all the cooling technologies available and involves is depicted in Fig. 5. The number of research papers has shot up
less drop in pressure as compared to microchannels, however, it since the year 2010 and an exponential rise in the research can be
comes with many limitations. Such as, it causes substantial surface observed here. This rise in the research articles shows the impor-
temperature fluctuations outside the impingement zone. This prob- tance of it in recent years has increased due to more and more
lem can be solved by employing several impinging jets that spread miniaturization of electronic devices and their wide application in
temperature gradients over a large surface area. Microelectronic various fields.
cooling applications often deal with a small surface area, hence jet MCHS has got the wide application in various disciplines such
impingement applicability is at odds with microelectronic cooling as Engineering, Biomedical Science, nanotechnology, material sci-
[27,28]. That is the reason why microchannel has got wide appli- ence, biotechnology, physical science, etc. same has been shown in
cation area and popularity in high heat flux removal technologies. below bar chart in which paper published between 1991 and 2020
Some of the technologies use conduction (Thermal interface has been shown in Fig. 6, It is clear that MCHS has got an extensive
material, Heat Pipe, etc.), Air convection (natural and forced air range of applications from engineering to medical sciences.
3
The concept of microchannel cooling can be stated in

Eq. (2) with the addition of the heat transfer coefficient.
Nu
h = kf . (2)
Dh
where h is the convective heat transfer coefficient (W/cm2 K); kf is
the thermal conductivity of the fluid (W/cmK); Nu is the Nusselt
number, Dh is the hydraulic diameter of the channel which can be
2Wch H f
defined as Dh = Wch+ H f , where Wch and H f being the width and
height of the channel respectively.
For a fully developed laminar flow, the forced convection heat
transfer coefficient h can be attained from, Eq. (2). The Nusselt
number reported here varies depending on the cross-section shape
and for the square channel under the condition of constant heat
flux is found to be 3.61. Kandlikar and Grande [116] studied the ef-
fect of hydraulic diameter on heat transfer coefficient and pressure
Fig. 5. The number of papers on microchannels since 1975(data acquired on June drop in a square channel for water and air with the same above
2021) (papers in the title containing “Microchannel” searched on search engines, mentioned conditions which are shown in Fig. 8. Fig. 8(a) depicts
Science direct & Google scholar on 10 June 2021). the variation of h with hydraulic diameter Dh and a sharp rise
in the heat transfer coeffiecient is observed with the decrease in
channel diameter. However chanenl hydraulic diameter cannot be
Great progress has been made in recent decades in combina- infineltly reduced and the primary reason being the fluid viscosity
tion with the industrial miniaturization trend, leads to sophisti- [124]. Fig. 8(b) shows the variation of pressure gradient with the
cated micro and nanoscale technologies. Fluid flows have been in- hydraulic diameter of the square channel for air and water with a
creasingly important in micro-scale applications in recent years. mass flow rate of 200 kg/m2 s and incompressible flow assumption.
The idea for microchannel research came from the pioneering work It was observed that there was a drastic increment in the frictional
of Tuckerman and Pease [124] in cooling VLSI applications. pressure gradient with the decrease in the diameter of the channel.
They created and put to the test a new water-cooled integral
heat sink for silicon integrated circuits. The heat sink has been 2.1. Different fabrication techniques
found to considerably improve the viability of complicated VLSI
circuits at high power densities. Since then, this technique has got- Microchannels generally have a hydraulic diameter in the range
ten a lot of attention in important fields including fuel cell systems of 10-200 μm. Advances in microfabrication technology have sub-
and sophisticated MCHS designs. stantially driven the evolution of MCHS.
One of the most appealing features of microchannels is the in- Various technologies have been used to develop microchannel
credibly little volume required on the bottom of the chip, which heat sinks over the last few decades. Many early investigations ex-
allows for multichip integration. Liquid maldistribution [125], large plored microchannels etching [129–133], with feature sizes of a
pressure drops along the flow direction [126], temperature nonuni- few hundreds of micrometers, driven by utilization in electronic
formity [127], and coolant leakage [128] are the key impediments systems and the possibility to use microelectronics production.
and challenges faced by the researchers seeking to functionalize MCHS with metal substrate became much easier to manufacture
microchannel cooling technology. due to the recent advances in micromachining such as Laser mi-
Fig. 6. Different subject areas where papers on MCHS are published.
4
Fig. 7. Microchannel heat sink(MCHS) as depicted in Gilmore et al. [123].
Fig. 8. Plots of (a) heat transfer coefficient and (b) pressure gradient with hydraulic diameter of a square channel [116].
cromachining [134,135], micro-milling [136], micro-Ultra Sonic Ma- 3.1. Active method
chining (μUSM) [137], abrasive water jet machining [138]. Micro-
Electro-Discharge Machining [139,140] is a mesoscale microfabri- Improving the rate of heat transfer necessitates the use of an
cation technique that uses a plasma discharge to selectively re- external power source. This external input source can be in the
move an electrically conducting substance and provides relatively form of RF signal, electricity, or pumps. Mechanical mixing, fluid
high design freedom and better accuracy. With the need for com- injection & suction, fluid vibration, surface vibration, and the addi-
plex internal geometrical features and various shapes, conventional tion of an external electrostatic or magnetic field that require ex-
manufacturing technologies are found to be inadequate in the con- ternal energy input and have been successfully used to intensify
struction of MCHS. With the use of Additive Manufacturing (AM) heat transfer [148-152]. External energy input, on the other hand,
in the construction of MCHS, the complex shaped feature can now is costly and difficult to accommodate in many circumstances and
be incorporated. Different metallic alloys with high thermal con- hence has limited application.
ductivity can be produced through AM-based technology which Further, a feedback system is essential in cooling systems to tar-
was not possible with other manufacturing techniques. Arie et al. get localized cooling. Closed-loop control of the chip’s temperature
[141] used stainless-steel (SS17-4), aluminium alloy (AlSi10Mg), is included in an adaptive cooling system. Thermal nonuniformity
and titanium alloy (Ti64) for the construction of manifold-MCHS due to varying power distribution can produce deleterious strains
using the Direct Metal Laser Sintering (DMLS) technique. Some on the IC substrate, therefore the ability to selectively cool differ-
other micro-fabrication technology includes Stereolithography and ent locations are critical. A nonadaptive cooling system is unable
LIGA [142,143] etc. to respond to hot regions because it lacks a temperature feedback
mechanism.
2.2. Microchannel classification
3.2. Passive method
Microchannels are classified in a variety of ways. Researchers
have provided different criteria for channel classification, which are Heat transfer enhancement can be performed via passive means
presented in Table 4. by creating flow disruption, altering the shape of the channel,
change in channel curvature, the introduction of secondary flows,
3. Different MCHS heat transfer enhancement techniques three-dimensional mixing, channel roughness, or attachments to
increase surface area and turbulence, altering fluid properties
Heat transfer enhancement methods are often divided into through fluid additives (using nanoparticles) [148,151-154]. Limited
three categories: active, passive, and compound methods. The com- thermal conductivity of heat transfer fluids is an intrinsic restric-
pound method has limited application due to its use in complex tion. As illustrated in Fig. 10, water has the highest thermal con-
design [147]. ductivity of all the fluids we use today, yet it is ordered lower than
5
Fig. 9. Active and passive classification of heat transfer (adapted from [157]).
most metals or metal oxides. These inherent limitations with the transfer technology that also solves the shortcoming of single-
base coolants compelled designers to look for alternate coolants layered microchannels of non-uniform flow distribution [123] and
that could remove heat more effectively. Recent advancements in this also leads to more uniform temperature at the bottom wall
nanoparticle fabrication technologies have prompted a surge in [155].
nanofluid research to create viable alternative coolants with im- Apart from that, Tao et al. [156] proposed three probable mech-
proved heat removal capabilities. anisms for improving single-phase heat transfer.
The use of a manifold microchannel, which provides higher uni- (1) Reduction in the thermal boundary layer, (2) Increase
form flow uniformity across the channel, is another passive heat flow interruptions, and (3) Increase the velocity gradient near
6
atures (Fig. 10). According to Kang et al. [165], silicon has strong
heat transfer and anticorrosive qualities, making the (1 1 0) silicon-
based micro heat sinks appropriate for high temperature and cor-
rosive environments.
3.3. Optimization schemes
As MCHS research advanced, the primary goal remained to re-

duce thermal resistance, lower the maximum base temperature,
improve temperature uniformity, and increase compactness.
Much research has been carried out to optimize the shape of
the heat sink. In a study by Türkakar and Özyurt [166], it was ob-
served that the channel with varying width, having narrow chan-
Fig. 10. Probable materials for the MCHS fabrication ( adapted from [158]). nels at the hotspot and coarser channel elsewhere can increase the
thermal performance of multi heat source device. Similarly, to im-
prove the thermal performance of MCHS channel height- or width
the heated surface are the three methods. Heat transfer en- taper was varied by [167]. The single and double-layered channel
hancement is the outcome of all possible combinations of these was optimized by [168]. The hydrothermal performance of MCHS
mechanisms. was optimized by [169]. Other optimization studies include the ar-
Copper [126,159,160], Aluminum [161,162] and Silicon [163,164] rangement of the positions of the inlet and outlet of heat sink
are the frequently used substrate material found in reviewed liter- [170–176], optimization of substrate material of heat sink [161,177].
Fig. 11. Variation of Local Nu along the wavy MCHS with increasing relative wavy amplitude (a) in streamwise direction (b) locally at Re = 300 [202].
Fig. 12. Variation of (a) Nu for water-Cu and (b) pressure drop, with volume fraction (ϕ ) at different particle size [206].
7
Fig. 13. Depiction of Mechanisms of heat transfer performance enhancement in wavy MCHS with porous fins: (a) development of Dean vortices; lengthening flow route and
forced permeation (b) qualitative schematic and (c) quantitative schematic [208].
Fig. 14. Schematic diagram of a wavy microchannel: (a) configuration of the microchannel MCH41 (b) geometric size [209].
Fig. 15. Variation of (a) Nu and (b) Thermal resistance (Rt ), different types of microchannels as a function of Re [209].
Different shapes of the pin fin in MCHS with nanofluids were op- [191,192] or heuristic algorithm based e.g., Genetic Algorithm (GA)
timized by [178-180], arrangement of pin fin in MCHS by [181], [193-196], etc., can be employed.
different orientation of fins by [182].
In order to minimize the thermal resistance associated with 4. Heat transfer enhancement through design modifications
MCHS, a Y-shaped bifurcation plate was optimized by [183], multi-
stage bifurcation also helped in achieving better thermal perfor- In the design of MCHS, the high amount of heat removal and
mance [184,185]. uniformity of substrate temperature are significant factors to con-
Shape optimization of microchannels such as wavy, circular, sider. This could be accomplished through better coolant distri-
rectangular, zig-zag, rhombus, trapezoidal [186-188] and geometric bution, heat flux distribution, or the use of working fluids with
parameters such as the number of the channel, hydraulic diame- better properties, for example, nanofluids. When using water as a
ter [189], aspect ratio, the thickness of the base [190], height and coolant and in cases where heat flux distribution is challenging,
width ratios, etc., flow parameters such as coolant flow rate, etc. the availability of low-temperature coolant to various parts of the
are also found to be crucial in determining the optimal thermal sink is critical to assure substrate temperature homogeneity. This
performance of MCHS. Optimization tools such as Taguchi method can be accomplished with a MCHS design that includes capabilities
8
Fig. 16. (a) plot of the variation of dimensionless avg. heat transfer coefficient with a different channel of MCHS at Re=600 and (b) variation of friction factor vs Re for wavy
and straight MCHS [210].
strate temperature gradient. The presence of thermally developing

zones and coolant mixing is predicted to help microchannel heat
sinks transport heat more efficiently.
The following are the primary causes for increased heat trans-
fer in enhanced MCHSs [197]: (1) the extension of heat trans-
fer area due to microchannel surface modified by microstructures
(such as ribs and cavities) results in heat transfer performance en-
hancement [198]; (2) Due to the existence of flow disrupting el-
ements (ribs, fins, and cavities), the thermal and hydrodynamic
boundary layers are interrupted and redeveloped frequently or the
change of stream-wise direction [199]; (3) the vortexes generated
by secondary flow due to the presence of flow disturbing elements
or the change of stream-wise direction, intensify the flow distur-
bance, thereby reducing temperature gradient and disarranging the
boundary layers [200].
Corrugated channels are undoubtedly one of the most signifi-
Fig. 17. Depiction of Flow streamlines and velocity vectors in a complex-wavy sur- cant applications in the area of passive heat transfer enhancement.
face microchannel with a wave amplitude = 0.2 for (a) pure electroosmotic flow (b) The flow mixing between higher temperature fluid layers along the
pure pressure-driven flow (c) favourable pressure gradient combined flow, and (d)
channel wall and lower temperature fluid layers in the core region
adverse pressure gradient combined flow [211].
is significantly improved using this technique. Dean vortices and
Chaotic advection are thought to be responsible for inducing high
for improved coolant distribution and shape optimization. This el- flow mixing [201].
ement of coolant distribution, however, has been extensively stud-
ied to increase the heat removal rate while minimizing the sub-
Fig. 18. Variation of the Nu along a complex-wavy surface with Joule number=2.1 for (a) pure EOF for various wave amplitudes (b) different flow conditions and velocity
ratios [211].
9
Fig. 19. Depiction of progression of secondary flow structure with superimposed temperature field streamline in twisted wavy MCHS [212].
Fig. 20. Plots of Thermal resistance R vs (a) wavelength difference (λ) and (b) amplitude difference (A) [214].
Fig. 21. Velocity distribution and velocity vectors for the Single path serpentine channel design at flow rate of 0.15 l/min and input power of 100 W [227].
4.1. Secondary flow have been seen to form rapidly along the flow direction and dis-
rupt the boundary layer [170,204]. As a result, wavy microchannels
As the flow becomes regular and the boundary layers grow, the can perform better in terms of heat transfer. The thickness of the
heat transfer performance in straight channels degrades in the flow thermal boundary layer can be reduced and the velocity gradient
direction. Secondary flows (Dean vortices) can be formed when liq- near a HT wall can be increased to improve convective HT [156].
uid flows through curved passageways, which improve fluid mixing Sui et al. [202] investigated the fluid flow and HT in a 3-D wavy
and hence heat transfer [202]. MCHS with a rectangular cross-section numerically. The features
of fluid mixing are evaluated using the Poincare section technique.
The findings demonstrated that a secondary flow (Dean vortices)
4.1.1. Wavy microchannel heat sink
for liquid flow through wavy MCHS emerged. Meanwhile, the num-
Straight MCHS suffer from a problem where the flow becomes
ber and position of vortices were discovered to change along the
regular and the boundary layer thickens [202,203], resulting in
flow direction, resulting in chaotic advection (CA) and improved
poor heat transfer performance along the stream-wise direction. In
convective fluid mixing. As a result, the HT performance of wavy
wavy microchannels with a low Reynolds number, Dean vortices
10
Fig. 22. Heat transfer coefficients in different serpentine microchannels at different conditions of Re and heat flux [228].
Fig. 23. Stagnation zones are indicated by velocity profiles at the bends of various serpentine MCHS [228].
Fig. 24. (a) Geometric parameters of serpentine MCHS with fan-shaped re-entrant cavities and (b) flow streamline at the mid plane for Re=480 [229].
11
Fig. 25. Plots of relative Nu vs Re (a) Effects of Sc/Wc and (b) Effects of Hc/Wc [229].
Fig. 26. Effect of channel geometry on Nusselt number (a) Re= 900 and (b) Re= 1800 for different volume fractions of nanoparticle [232].
Fig. 27. Variation in the Nu with Re as a function of “ϕ ” (a) data for CZ-HS and (b) data for CCZ-HS [233].
MCHS has improved. With increasing wall waviness, the HT in- Conjugate HT in wavy microchannels has been studied numeri-
creases, whereas the PD penalty appears to be considerably smaller cally by Rostami et al. [205,206] using Eulerian-Lagrangian method,
than the heat transfer enhancement. Waviness is increased in the the nanofluid was simulated as a two-phase model, in the first
streamwise direction in the first design and locally increased in study, Water-Al2 O3 nanofluid has a diameter of 120 nm and a vol-
high heat flux regions in the second design. The fluctuation of the ume fraction (ϕ ) ranging from 0% to 2%. SIMPLE technique was
local Nusselt number along the wavy microchannel is depicted in used to solve three-dimensional governing equations. Nusselt num-
Fig. 11. Both designs, interestingly, had excellent thermal perfor- ber increases because of the secondary flows and presence of recir-
mance, with HT enhancement factors ranging from 1.71-2.95 and culation zone in wavy microchannel walls as compared to straight
PD penalty factors ranging from 1.38-2. microchannel walls by 162.6% at the cost of 195.7 % of PD. If
nanofluid is used instead of pure water as nanofluid then Nus-
12
Wavy MCHS design with porous fins is studied by Lu et al.

[208], to lower pressure drop and thermal resistance at the same
time as compared to conventional wavy MCHS. Improved heat
transfer performance (as shown in Fig. 13) is attributed to im-
proved coolant mixing through Dean vortices, the elongated flow
path by enhancing channel length, and the forced permeation by
jet-like impingement, whereas the reduction in PD is attributed to
the permeation and the slip effect of the coolants combined.
Non-uniform wavy microchannels were constructed to increase
the thermal performance of MCHS, and their heat and mass trans-
fer performance was evaluated numerically using Fluent by Yuan
et al. [209]. Different configurations of wavy MCHS can be under-
stood with the help of Fig. 14. λ1 and λ2 are the half-wave lengths
and λ being the total wavelength where λ= λ1 + λ2 and are kept
5 mm for all wavy MCHS. λ1 and λ2 were equal in uniform wavy
MCHS whereas unequal in non-uniform wavy MCHS. The smooth
Fig. 28. Variation of thermal resistance (Rt ) with pumping power (P) for different microchannel was designated as MCH-00, whereas uniform mi-
configurations [233].
crochannels with wavelengths of 1 mm, 2.5 mm, and 5.0 mm were
designated as MCH-01, MCH-02.5, and MCH-05, respectively. MCH-
14 refers to a non-uniform convergent wavy microchannel with di-
selt number increases by 11.6 % at ϕ =0.02 without significant
mensions of λ = 1.0 mm and λ = 4.0 mm. MCH-41 was given to
PD(<2.4%) [205]. In another study, Rostami et al. [206] observed
the non-uniform divergent wavy microchannel with λ = 4.0 mm
that the two-phase model based on Eulerian-Lagrangian method
and λ =1.0 mm. According to the numerical study, the heat trans-
makes better agreement than the homogenous single-phase model
fer performance of MCH-41 was superior to that of MCH-05 and
for the numerical analysis of nanofluid. Water-Cu and water-Al2 O3
MCH-14 microchannels. MCH-41 had a lower thermal resistance
nanofluid was adopted for this study. They also discovered that
and generated less entropy than MCH-05 and MCH-14.
when the volume fraction and particle diameter of nanoparticles
Because of the presence of wavy grooves that led to fine mixing
decreased, the Nu increased. The HT rate and PD in a wavy MCHS
and redevelopment of the boundary layer near the wavy groove,
are enhanced by 174 % and 195.7 %, respectively, as compared to
the Nu value of the wavy MCHS was much greater than that of the
a straight MCHS. When compared to pure water, the Nu for water-
smooth MCHS at the same Re value, as shown in Fig. 15. Due to
Cu with ϕ =0.02 increased by roughly 33.2%, while the PD increases
its divergent structure and tendency of a fluid to reflux at higher
by less than 10.6 %, Fig. 12. As a result, utilizing nanofluid to boost
Re, enhancing hot and cold convection, heat transfer increase was
the heat transfer rate in wavy microchannels without significantly
particularly visible in MCH-41 at Re>693. It is clear from Fig. 15b
increasing the pressure drop is an appealing option.
that the thermal resistance value decreased faster at low Re val-
Sakanova et al. [207] numerically examined the effects of wave-
ues than it did at high Re values. The temperature distribution in
length, wavy amplitude, volumetric flow rate, and volume fraction
the non-uniform wavy MCHS was more uniform than in the uni-
of different types of nanofluids. Diamond-water, CuO-water, and
form wavy MCHS. The pulsing flow carried heat from the heating
SiO2 -water nanofluid are used for the nanoparticle volume frac-
surface to the top of the microchannel, reducing local overheating
tion in the range of 1%-5%. The findings show that the wavy MCHS
and resulting in lower thermal resistance.
outperforms the typical rectangular MCHS when using pure wa-
Mohammed et al.[210] investigated the rectangular-shaped
ter and nanofluids as coolants, however, at high volume fraction
wavy MCHS having a wavy amplitude in the range of 125 - 500
of 5% difference between wavy and rectangular MCHS became in-
μm and Re in the range of 100 - 10 0 0. The HT performance
significant. Lower thermal resistance is provided by higher ampli-
of wavy microchannels is found to be significantly superior to
tude and shorter wavelength. Increases in amplitude and volumet-
that of straight MCHS with an identical cross-section. The PD
ric flow rate, as well as decreases in wavelength, resulting in sig-
penalty of wavy MCHS is substantially lower than the heat trans-
nificant pressure drop. The impact of nanofluids in wavy channels,
fer increase achieved. As the amplitude of wavy microchannels in-
on the other hand, deteriorates as the amplitude and wavelength
creases, both friction factor and wall shear stress increase propor-
decrease. As per this study diamond-water, nanofluid exhibited the
tionately (Fig. 16b). As the wave amplitude increases, the mag-
highest HT coefficient and least thermal resistance.
Fig. 29. Schematic of Secondary flow channels (adapted from [237]).
13
Table 1
single-phase and two-phase flow advantages and disadvantages.
Range of Heat
Advantages Disadvantage Fluxes
Single-phase Single-phase devices are used to be lightweight and High heat flux is achieved with the trade-off of large PD. 1000W/cm2 [24]
compact. Very high heat flux can be obtained by reducing Large temperature gradients are usually encountered in
the diameter. the flow direction.
Rely on sensible heat for cooling and hence unable to
achieve a large heat transfer coefficient.
1700 W/cm2 [25]
Two-phase higher forced convective heat transfer coefficient Hydraulic instabilities 3000 W/cm2 [26]
increased temperature uniformity, and Existence of periodic dry zone
smaller coolant mass flow rates and hence reduced Sometimes unpredictable, difficult to control, and leads to
coolant reservoir. instability and local overheating.
Choking may occur at a very small diameter, and this
hampers heat transfer capability
Fig. 30. Schematic of Transverse microchannel [243]. Fig. 32. Schematic used in ref. [247] to describe double layered MCHS.
Cho et al. [211] investigated numerically, the flow properties of

diverse electrokinetic and pressure-driven flows within microchan-
nels for four dissimilar flow conditions viz., pure electroosmotic
flow (EOF), pure pressure driven flow (PDF), combined EOF/PDF
with a favorable pressure gradient, and combined EOF/PDF with
adverse pressure gradient. Flow streamlines for the same are rep-
resented in Fig. 17. The findings reveal that, In PDF, flow recircu-
lation is generated, while it is absent in EOF. It is demonstrated
that electrokinetically induced velocity is more sensitive to wave-
form geometry than pressure-induced velocity. The momentum of
the combined flow is adequate to inhibit the creation of flow re-
circulations in combined EOF/PDF with a favorable pressure gra-
dient. Flow recirculation is induced around the wave crest when
the ratio of the EOF velocity to the PDF velocity falls below a par-
ticular threshold value for coupled EOF/PDF with an unfavourable
pressure gradient. Under pure PDF circumstances, the recirculation
structures appear to be longer and thinner than those that form
Fig. 31. Variation of the Nu vs Re for different channel height and number (dimen-
near the wave trough. In the thermally developing region, fast de-
sional parameter enclosed with this plot) [243]. cay of Nu was observed because of the fast growth of boundary
layer whereas Nu variation has constant oscillation in fully devel-
oped region, Fig. 18a. The results reveal that the ratio of EOF ve-
nitude of the heat transfer coefficient increases, and the trends locity to PDF velocity has a considerable impact on the thermal
are identical for all Re (Fig. 16a). As expected, the middle channel entrance length. The longest thermal entrance length is found in
(channel 14) has the highest mean heat transfer coefficient value the favourable pressure gradient combined flow (EOF+PDF), while
for each type of heat sink. Except for the MCHS with a dimen- the shortest length is found in the adverse pressure gradient com-
sionless wavy amplitude(α ) of 0.25, wavy MCHS gives higher heat bined flow (EOF-PDF), as shown in Fig. 18b. The heat transfer per-
transfer coefficients than typical straight microchannels. Overall, α formance in a thermally fully formed region is determined by the
in the range of 0.0625 to 0.21875 had the best overall thermal per- degree of Joule heating and the geometrical structure and is unaf-
formance. fected by flow scenarios.
14
Fig. 33. Schematic diagram for (a) a typical fractal treelike network (n=2, m=4, and =60o ) and (b) kth branching structure [262].
Hasis et al. [212] presented a numerical simulation of fully de- site rotating Dean vortices, which improves coolant mixing and, as
veloped laminar fluid flow and HT in a twisted sinusoidal rectan- a result, heat sink performance. Dean vortices are created along the
gular wavy microchannel with the continuous rotation of cross- sidewalls of channels in the up-down wavy design, while they are
section geometry along the streamline. For Re in the 30 0-70 0 created close to the top and bottom walls of channels in the left-
range, the extent of twist (δ ), waviness(γ ) and channel aspect ra- right wavy design. Up-down wavy MCHS had better performance
tio (β ), thermo-hydraulic performance was investigated by apply- than left-right wavy MCHS irrespective of the design parameters,
ing constant heat flux (H2) and constant temperature (T) bound- however, they gave the same performance at larger wavelengths.
ary conditions. When compared to sinusoidal microchannels, the
twisted wavy MCHS significantly improve heat transfer perfor- 4.1.2. Serpentine MCHS
mance while causing negligible PD in the low Re number domain Al-Neama et al. [227] did an experimental and numerical study
at higher AR and waviness heat transfer was increased by 30%. Nu of serpentine rectangular MCHS with four different configurations,
increases linearly as the flow rate and channel waviness increase. straight rectangular MCHS (SRMs), single (SPSMs), double (DPSMs),
Heat transfer performance was shown to be reduced as the de- and triple path serpentine rectangular MCHS(TPSMs). When com-
gree of twist was reduced. At greater Re and waviness, however, pared to the typical SRMs, SPSM achieves 35% gain in Nuavg and 19
channel twisting did not result in considerable heat transfer en- % drop in total thermal resistance (Rth ) at a volumetric flow rate of
hancement. The periodic creation of an asymmetric corner vortex 0.5 l/min, but at the cost of 10 times drop in pressure.
and its intensification helps to achieve a better heat transfer coef- The velocity distribution and velocity vectors for the SPSM heat
ficient, according to a study of flow structures and their impacts sink are shown in Fig. 21. The SPSM design has higher velocities
(Fig. 19). than the DPSMs and TPSMs designs because of flow continuity, and
Sui et al. [213] analysed numerically fully developed flow and the presence of a small region of flow recirculating near the inner
HT in periodic rectangular wavy MCHS for the value of Re ranging surface of the bend, which aids in disrupting the hydrodynamic
from laminar to transitional region. Results reveal that formation of and thermal boundary layers and the transportation of heat from
secondary flows or dean vortices when liquid flows through bends the walls into the water, thus improving convective heat transfer
lead to the chaotic advection that greatly enhanced fluid mixing but at the cost of significant PD.
and heat transfer performance in a steady flow regime. As Re in- Sreehari et al. [228] used three different shapes of serpentine
creased, flow underwent some unsteady regimes that leads to tem- MCHS (Rectangular, U, and V) for the experimental and numeri-
poral and spatial evolution of Dean vortices along the flow direc- cal investigation. Silicon was chosen as substrate material whereas
tion and hence the loss of flow symmetry. Further increment in Re water as coolant for the Re in the range of 100 to 400 and at differ-
resulted in chaotic flow. It has been discovered that the heat trans- ent heat fluxes (10, 20, and 30 kW/m2 ). Fluid-substrate interaction
fer performance of wavy channels is usually much better than that area, as described by the Sink Area Factor (SAF), determines the
of straight channels with the same cross-sections without signifi- entire thermal performance of the MCHS. A greater SAF resulted in
cant PD. superior thermal performance. U-serpentine microchannel exhib-
Lin et al. [214] designed to improve the performance of wavy ited the best thermal performance in terms of low substrate tem-
MCHS by adjusting the wavelength or/and amplitude along the perature, high heat transfer coefficient, and minimum PD followed
streamwise direction. When the wavelength of wavy units reduces by rectangular and V-serpentine. The overall thermal performance
or the amplitude increases, the new design performance improves of the microchannels is affected by the sharp bends of the mi-
dramatically with a reduced thermal resistance (R) and smaller crochannel patterns and the surface roughness of the MCHS walls.
bottom wall temperature difference Tb,max and this is more re- Fig. 22 shows that the heat transfer coefficient increases with the
markable when wavelength difference λ and amplitude differ- increase in the Re due to better mixing of liquids at higher veloc-
ence A between two wavy units increases. The newly proposed ities. The heat transfer coefficient of U-serpentine microchannels
channel with lower aspect ratios show a reduced value of R and is higher than that of Rectangular and V-serpentine microchan-
Tb ,max compared to straight and wavy MCHS which is shown in nels. This is due to the large stagnation portion found in the V-
Fig. 20. serpentine microchannel (Fig. 23) that leads to the inefficient mix-
Zhu et al. [215] investigated the TP of up-down and left-right ing of the liquid at sharp corners of V-bends and hence low heat
wavy MCHS and concluded that wavy MCHS enhanced heat trans- transfer coefficient.
fer performance without much PD penalty. In the channel cross- A numerical study of fluid flow and HT in serpentine MCHS
section plane, each wavy channel creates symmetric pair of oppo- with fan-shaped reentrant cavities was conducted by Liu et al.
15
Table 2
Various cooling Techniques.
Various cooling techniques Advantages Disadvantages
Spray cooling Offers uniform cooling, a wide range of applications, can required proper adjustment, large parameters such as
use a wide range of cooling media, ease of droplet size, droplet velocity, volumetric flux, spray angle,
manufacturing, low coolant flow rates, low thermal etc. are difficult to control.
resistance at the contact, relatively quick cooling rate Filters, pumps, and the transportation of excess liquid
high heat dissipation capacity, low superheat degree, no and vapor to a condenser are all required for the
temperature overshoot, low droplet impact velocity, and functioning of spray cooling.
Microchannels Compact and lightweight As the number of flow pathways decreases, the pressure
Provide better heat transfer performance loss along the flow direction grows exponentially
Reduced coolant flow requirement Clogging, temperature gradient.
Maintain good temperature uniformity in a two-phase instabilities, as well as backflows, may occur in a
system two-phase flow
Porous media compact size and high heat transfer area, high effective large pumping power requirement
thermal conductivity, easy manufacturing.
Jet Impingement pressure drop is comparatively modest. Heat transfer is greatly affected by radially outward
Dissipates high heat flux densities, offers localized movement of fluid (liquid separation)
cooling. Potential temperature uniformity issues for the single jet.
Can be used in compact space, with No thermal Additional component cost and maintenance requirement
interference
No manufacturing complexity
Heat Pipe With a low-temperature difference over the length of the Operating conditions are constrained, and there are some
pipe and passive operation, the PD is comparatively low instabilities associated with it.
and the heat transfer is efficient. Small heat loads, gravity dependence.
High heat transfer rates over a long distance
Thermoelectric Efficient, silent, no mechanical moving parts, low Poor efficiencies lead to power consumption
maintenance, compact, high reliability, no working fluid, Limited heat removal capacity
large cooling density
Fig. 34. Various fractal shaped configuration [262,288,295,315–320].
16
Fig. 35. Plots of the variations of flow rates with (a) drop in pressure and (b) thermal resistance [321].
Fig. 36. (a) Schematic of a fractal-like MCHS, Velocity distributions with an AR of 0.333 and Re=810 (b) L bend (c) diffluent flow at T joint and (d) confluent flow at T joint
[293].
[229] for Re=150-980. The geometrical parameter of fan-shaped However, as the flow deflects to the cavities, it creates a stagna-
reentrant cavities examined includes width (Wc), height (Hc), and tion zone, which substantially hinders heat transfer. The hydro-
spacing (Sc) as depicted in Fig. 24a. Fan-shaped cavities can lower dynamic boundary layer is periodically broken up by the cavities
flow resistance while also improving temperature distribution uni- along the serpentine channel. As a result of the boundary layer re-
formity. Fig. 24b shows the creation of Dean’s vortices in the fan- development caused by the interruption of streamlines, heat trans-
shaped re-entrant cavities along the flow channel. Sidewall cav- fer is enhanced, but recirculation causes heat transfer to increase
ities can enhance heat transfer surface area, regenerate thermal or deteriorate, depending on the intensity of the secondary flow
and hydraulic boundary layers, and cause jet and throttling effects. formed here. Except for Re=980 and Hc/Wc =0.2887, heat trans-
17
Fig. 37. Temperature difference on the base of the heat source in the case of double-layered and truncated double-layered Channel [322].
Fig. 38. Schematic of fractal MCHS embedded with hydrogels and variation of maximum temperature increment of heat sink vs heat flux of hotspot depicting hotspot
thermal management [327].
fer is improved in all circumstances and flow resistance is re- ated in this study for Re value of 50-150. The channel with the left-
duced as compared to a rectangular serpentine channel. Sc/Wc pointing triangular cross-section gave a larger mean HT enhance-
=3 and Hc/Wc=0.2887, yield the best performance of serpentine ment than the channel with the upward-pointing cross-section for
MCHS with fan-shaped reentrant cavities as depicted in Fig. 25. all Re studied, while the pressure drop remained the same. Twisted
Rahimi et al. [196] used an artificial neural network (ANN) and sections lead to enhancement in mean heat transfer with insignifi-
genetic algorithm (GA) tool for the optimization of data obtained cant PD compared to non-twisted configurations overall range of
from experimental and numerical investigations of serpentine mi- Re, while the degree of twist did not play a significant role in
crochannels. Results show that the ANN model has better accuracy heat transfer enhancement. Due to the swirling flow triggered by
than GA-based correlation, but the application of empirical corre- the twisted geometry, stronger twisting resulted in a significant in-
lation is easier in GA. crease in heat transfer in downstream bends.
Filimonov and Sorvari [230] did CFD modeling using Fluent to A unique experimental technique employing molecule-based
examine the effects of cross-section orientation on the thermo- temperature sensors was used to evaluate segmented microchan-
hydraulic performance of periodic serpentine equilateral triangle nel flows and heat transfer enhancements in serpentine MCHS
MCHS. Serpentine channels with upward- and left-pointing equi- by Huang et al. [231]. Liquid-gas segments of ethanol and air at
lateral triangular cross-sections and twisted sections were evalu- various flow rates were produced inside serpentine MCHS. Fluid
18
Fig. 39. Schematic of different optimal model and plot of thermal resistance vs pumping power [328].
shaped MCHS with zig-zag shaped MCHS being more appropriate

compared to sinusoidal MCHS.
Duangthongsuk et al. [233] experimentally examined the ther-
mal performance of two types of multiple zigzag flow channels
namely continuous zigzag flow channel (CZ-HS) and the single
cross-cutting zigzag flow channel (CCZ-HS). Nanofluid (DI water-
SiO2 ) with ϕ =0.3, 0.6, and 0.8 vol.% was used as working fluid and
copper as substrate material. Results indicate that the 3-15% incre-
ment in TP was observed when nanofluid was used as a working
medium. The CCZ-HS outperforms the CZ-HS by an average of 2-
6% in terms of thermal performance. This could be because CCZ-HS
Fig. 40. Schematic of honeycomb-shaped microchannel [11]. divides the flow area into two parts when a single cross-cutting of
the flow channel is used. Direct impingement of the fluid stream
on the channel wall of the following region happens when the
and surface temperature data were measured using Tris (2, 2’- fluid flows past the first region. As a result, larger turbulent inten-
bipyridyl) ruthenium molecule-based temperature sensor. Three sities are achieved, leading to improved HT performance (Fig. 27).
cases with different gas (Qg ) and liquid (Ql ) flow rates were stud- The pressure drop is moderately affected by particle concentration
ied where liquid flow rate was taken as 10 ml/hr and the gas flow and flow channel cross-cutting.
rate was varied from 8 to 14 ml/hr at Re=11. With high gas low
rate and short liquid segment stronger circulation occurred, that 4.1.4. Converging-diverging channels
lead to 30% enhancement in Nu. Another growing research area is a converging flow channel in
the stream-wise direction. The convective heat transfer coefficient
4.1.3. Zigzag MCHS increases as the fluid velocity increases in the stream-wise direc-
Toghraie et al. [232] investigated the thermohydraulic perfor- tion of a converging channel. The MCHS’s overall temperature dis-
mance of smooth, sinusoidal, and zig-zag shaped MCHS using tribution and thermal resistance improve as a result of the reduced
nanofluids (water-CuO with ϕ =2% and 4%) for Re=10 0, 30 0, 90 0, local wall temperature [234].
and 1800. Effects of wavelength and amplitude, ϕ , and Re of sinu- Hung and Yan [167] designed a tapered MCHS to investigate the
soidal and zig-zag MCHS on heat transfer performance were evalu- effects of height (Ʌy )- and width (Ʌz )-tapered ratio on the ther-
ated. Results show that with the increase in “ϕ ” of CuO nanoparti- mal performance. The correlations between overall thermal resis-
cle Nu increased. Effects of nanoparticles on the rate of heat trans- tance and width-or height-tapered ratios are not monotonic. With
fer increment were more effective at Re=900 and 1800 than the rising width-tapered ratios or height-tapered ratios, overall ther-
Re= 100 and 300 (Fig. 26). Effects of nanofluid were more pro- mal resistance (Rth ) initially dropped and subsequently increased
nounced in smooth microchannel than sinusoidal MCHS. Nu in- with the lowest Rth occurring at Ʌz =0.6 or Ʌy =0.8. for width-
creased with the decrease in wavelengths of sinusoidal and zig-zag or height-tapered channel configurations, respectively. When com-
19
Table 3
Reviewed papers in respective cooling technologies.
Cooling Author, Year Highlights

technology
Thermosyphon Zhang et al. [78](2018) Reviewed the thermosyphon state of the art. Integrated systems of thermosyphon were
overviewed. Existing design feature was studied
Loop thermosyphon finds more suitability, integrated system of vapor compression and
thermosyphon (ISVT) is more reliable
Franco and Filippeschi [79] (2012) A review of the experimental result of Closed Loop Two-Phase Thermosyphons (CLTPT) was
done
Due to differences in experimental apparatus, there was a mismatch between experimental
results and conventional theory, and it was proposed that more research be done for
practical applications.
Ramezanizadeh et al. [80] (2018) A detailed review was conducted on the use of nanofluids in thermosyphons which
significantly improved heat transfer performance, however, this improvement was
dependent on the type of nanoparticle, base fluid, concentration, etc.
Heat pipe Cao et al. [81] (2020) Review on the latest advancement in two-phase loop thermosyphon technology.
Anand et al. [82] (2020) Conducted detailed review of experimental studies on two-phase closed thermosyphon.
Jafari et al. [83] (2016) The review was conducted on Two-phase closed thermosyphons.
Wang et al. [84] (2014) A review of the loop heat pipe (LHP) for use in solar water heating was conducted.
Zhang et al. [85] (2020) Review on pulsating heat pipe and the effects of cross-sectional shape, physical parameters
and externally applied magnetic fields, etc.
Shafieian et al. [86] (2019) Reviewed utilization of heat pipe solar system in various thermal applications.
Hussein et al. [87] (2017) Highlighted the nanofluid application in heat pipe solar collector.
Naghavi et al. [88] (2015) The use of heat pipes in phase-change thermal energy storage systems was examined.
Yan et al. [89] (2020) Review on micro heat pipe reactors.
Han et al. [90] (2016) Pulsating heat pipe was reviewed in detail with the focus on its operational mechanism.
Srimuang et al. [91], Chaudhry et al. [92] The focus of the study was on the usage of heat pipe in waste heat recovery systems.
(2012)
Launay et al. [93] (2007) Reviewed the effects of various parameters on loop heat pipe characteristics.
Thermoelectric Zhao et al. [94] (2014) Focus the review on the latest development in thermoelectric materials, modeling
cooler techniques, and applications.
Enescu and Virjoghe [95] (2014) Reviewed the performance parameters of thermoelectric coolers.
Cai et al. [96] (2019) Focused on the thermoelectric application in electronic cooling
He et al. [97] (2015) The review was focused on the structural optimization and application of thermoelectric
cooler.
Pourkiaei et al. [98] (2019) Presented a review on thermoelectric cooler and generator with future promising materials.
Siddique et al. [99] (2018) Review on the thermoelectric cooler application in battery thermal management system.
PCM based cooling Sajan Preet [100] (2021) Conducted review on thermal management of photovoltaic panels using PCM.
Yadav et al. [101] (2021) Thermal conductivity enhancement of PCM with the addition of nanoparticles.
Jet impingement Nadda et al. [102] (2018) Application of jet impingement for efficiency improvement of solar photovoltaics.
Jones-Jackson et al. [103] (2021) Review on application of jet impingement on the thermal management of power electronics
of the electric vehicle.
Qiu et al. [104] (2015) Study Focused on the jet impingement boiling heat transfer.
Han et al. [105] (2001) Presented a detailed review on gas turbine heat transfer using jet impingement.
Tyagi et al. [106] (2020) Nanofluid jet/spray cooling was reviewed.
Maghrabie and Hussein [107] (2021) Discussed heat transfer enhancement using jet impingement with different exciting jets
Mohammadpour et al. [108] (2020) The influence of nanoparticles on jet impingement heat transfer was examined.
Spray cooling Benther et al. [109] (2021) The review focused on the improvement in spray cooling by heated surface modification.
Xu et al. [110] (2022) Detailed review on the surface-enhanced spray cooling
Breitenbach et al. [111] (2018) Recent advancement in spray cooling technologies with heated surface droplet interaction.
Wang et al. [112] (2020) Review on aerospace-oriented spray cooling.
Liang and Mudawar [113,114] (2017) On low and high-temperature heat transfer in different regimes in spray cooling
Kim [35] (2007) Review was conducted on the Spray cooling heat transfer mechanism.
Microchannels Mudawar [21] (2001) The focus of the review was on microchannel and mini-channel heat sinks, as well as sprays
and jet-impingement.
Kandlikar and Bopat [115] (2007) High Heat Flux Removal Options for Spray, Microchannel Chip Cooling, and Jet Impingement.
Kandlikar and Grande [116] MCHS manufacturing method and thermohydraulic performance.
Mohammed et al. [117], (2011), Chamkha Application of nanofluid in MCHS
et al. [118] ‘(2018)
Rosa et al. [119] (2009) Review focused on the importance of scaling effects on the heat transfer performance of
MCHS.
Prajapati et al. [120] (2017) Detailed study related to the instabilities associated with two-phase heat transfer in MCHS.
Adham et al. [121] (2013) Review on thermohydraulic performance of MCHS
Morini and Luca [122] (2004 The experimental findings on single-phase heat transfer in MCHS were reviewed.
Gilmore et al. [123] (2018) Focused on the application of MCHS in solar photovoltaic concentrators.
pared to a parallel-channel design, a width-tapered channel pro- channel but at the cost of increased PD penalty. Maximum heat
duces a lower temperature rise and a more uniform temperature transfer occurred at the tapering factor (TF=height of the chan-
distribution along the channel centreline. Maximum THP enhance- nel at outlet/height of channel at the inlet) of 0.32 for Re in the
ment of 16.7% was observed in the case of the channel with width- range of 100 to 200. Higher heat transfer and lower PD are pre-
tapered, compared to parallel-channel design at pumping power dicted by temperature-dependent fluid characteristics. Even though
greater than 0.4 Watt. nanofluid has better overall performance than water but using it
Kumar et al. [235] used Water-Al2 O3 nanofluid for the THP in DL-MCHS is not advantageous from an overall performance per-
analysis of double-layered tapered MCHS (DL-MCHS). DL-MCHS spective.
was found to have better HT performance than the conventional
20
4.1.6. Oblique finned channels

The purpose of employing an oblique fin in place of the con-
tinuous fin in MCHS is to modulate the flow. These oblique fins
help to initialize the thermal and hydraulic boundary layer at the
leading edge of the oblique fin and effectively thinning the bound-
ary layer [238]. Because of these entrance effects, the flow is al-
ways in a developing state. Moreover, oblique fins also lead to di-
version of a small fraction of flow from the main channel, thus cre-
ating secondary flows. These secondary flows provide better fluid
mixing and hence enhancement in the heat transfer [239]. In an-
other study, Law and Lee [240,241] revealed that the oblique fins
inside MCHS helped to mitigate the instabilities related to two-
phase flow along with the significant enhancement in heat trans-
fer compared to straight finned MCHS. Far et al. [242] used Nano-
Encapsulated Phase Change Material (NEPCM) as a coolant inside
sectional oblique finned MCHS to analyze the pin tip-clearance ef-
fects on its thermal performance. NEPCM slurry enhanced the cool-
ing performance of MCHS with increased pumping power com-
Fig. 41. Ring shaped microchannel produced by turning process [339].
pared to pure water.
4.2. Transverse/Intersecting MCHS

Cheng et al. [234] in their experimental study, evaluated the
THP of four different types of tapered MCHS for Re in the range of As shown in Fig. 30, In transverse MCHS, short and small mi-
130 0-340 0 with 53.0 W/cm2 of heat flux and hydraulic diameter of crochannels join two or larger microchannels in transverse direc-
0.6 mm. Highly-tapered MCHS promoted early turbulence at lower tions. These short channels divide the main flow into multiple
Re, resulting in better heat transfer with significant PD. All the ta- paths and hence not letting the boundary layer grow in a thermally
pered MCHS were found to have THP less than one which implies developing region by disrupting it which leads to high heat trans-
that tapered MCHS has lower heat transfer capability than straight fer than conventional microchannel. Moreover, the surface area to
MCHS at the same pumping power. Straight MCHS required less volume ratio is larger in the case of transverse MCHS than conven-
pumping power compared to tapered MCHS for the removal of the tional MCHS. It has also been found to have a high heat transfer
same amount of heat for a given average Dh . rate and low PD.
Chai et al. [133] examined heat transfer enhancement in MCHS Heat transfer enhancement using transverse MCHS was numer-
with periodic expansion-constriction cross-section. They validated ically investigated by Soleimanikutanaei et al. [243]. The number
the Navier-stokes equation by considering entrance effects, tem- and size of transverse MCHS at different Re determine the temper-
perature dependent properties, and viscous heating. Three types of ature distribution and hotspot location.
MCHS with rectangular channel (R), fan-shaped repentant cavity Nu increased with increase in number and decrease in height
(F), and triangular re-entrant cavity (T) were studied. Compared to transverse microchannels at the expense of PD due to entrance ef-
channel R, PD of MCHS with the periodic expansion-constriction fect (increased velocity) caused by the addition of transverse sec-
channel was lower at Re less than 300 but increased rapidly with tion as shown in Fig. 31. For narrower transverse microchannels,
the increase in Re, however, heat transfer increased significantly both heat transfer improvement and pressure drop were more ev-
with the 1.8 times increment in average Nu. With a rise in volu- ident. The Fig. of merit (ratio of HT to PD increase) increased with
metric flow rate, the capacitive term reduces while the conductive the increase in height and decrease in the number of transverse
term remains unchanged; as a result, the overall thermal resistance microchannel.
falls as pumping power increases (Fig. 28). Wong and Lee [244] studied the thermal and hydraulic perfor-
mance of MCHS by varying the geometrical parameters (length,
width, and height) of the triangular rib of the transverse mi-
4.1.5. Secondary flow channels crochamber. The rate of heat transfer decreases with rib length but
Secondary flows inside the flow field have been considered by increases with rib width and height. The mean Nusselt number ra-
many researchers to improve heat transfer. The geometry of MCHS tio demonstrates a 56 % boost when compared to non-interrupted
can be altered by adding smaller channels in between the primary MCHS.
flow channel to create secondary flows. Kuppusamy et al. [236] de- Chai and Wang [245] investigated the THP of interrupted trans-
signed a MCHS with slanted passage in the channel wall between verse MCHS with ribs by considering viscous heating, entrance ef-
the adjacent channels in alternating orientation. These passages fect, and temperature-dependent thermophysical properties. Rect-
cause flow disruption and decrement in thermal boundary layer. angular, backward triangular, diamond, forward triangular, and el-
Overall performance of MCHS was reported to be increased by lipsoidal rib configurations were used, and the rib geometry pa-
146% and thermal resistance decreased by 76.8% as compared to rameters comprised expansion-constriction profile length and ra-
conventional MCHS. In contrary to the general research outcome, tio. When compared to straight MCHS, the interrupted MCHS with
pressure drop decreased by 6% compared to its conventional coun- ribs in the transverse microchannel displays a 4-31% reduction in
terpart. Thermal performance increment was more prominent at total thermal resistance, a 4-26% reduction in total entropy gener-
increased width of the secondary passage. The ratio of secondary ation rate, and a PEC of a maximum of 1.39.
channel width to MCHS width (α ) was found to have a greater
influence on the thermal resistance and pumping power [237]. 4.3. Double layered MCHS
Pumping power decreased by 13.7% and thermal resistance in-
creased by 17.2% as the value of α increased from 1 to 2. Opti- The considerable temperature fluctuation within the heat sink
mization of structural parameters played a significant role on the between the inlet and outlet is one of the disadvantages of the
performance of MCHS with secondary flows. single-layer channel layout. The resulting thermal stresses due to
21
Table 4
various classifications of channels based on the different criteria.
Authors, year Type of channel
Mehendale et al. [144], 2000 Microchannels: Dh =1-100 μm

Meso Heat Exchanger: Dh =100 μm-1 mm
compact HE: Dh =1 -6 mm
Conventional Channel: Dh > 6mm
Kandlikar and Grande [116], 2002 Microchannel heat sink:200 μm ≥Dh > 10 μm
Minichannel: 3 mm≥Dh > 6mm
Conventional channels: Dh > 3mm
Transitional Channels: 10 μm ≥ Dh > 0.1 μm
Kew and Cornwell [145], 1997 Microchannel if Co ≥0.5, where Co is confinement number.
Cheng and Wu [146], 2006 Microchannel: if Bo<0.05
Minichannel: 0.05<Bo<3.0
Macro-channels: if Bo>3.0
Where, Bo is bond number and is given by, Bo=(Dh /lc)2 = g(ρ l - ρ v )D2h /σ also Bo=1/Co2
a high temperature rise cause thermal instability, as well as lower 4.4. Fractal shaped MCHS
device performance and longevity, and hence, it is highly undesir-
able. While a single-layer MCHS with a high depth-to-width ra- The presence of a formal pattern that repeats itself even when
tio can address this issue, it comes at a cost in terms of pump- the scale changes, characterize fractal structures, which are com-
ing power and fabrication complexity [234]. With this background, mon in nature. This feature is known as ’self-similarity’ [255]. Mur-
Vafai and Zhu [246] developed a double-layered heat sink struc- ray’s law [256] is an important optimization principle in the con-
ture to address these difficulties. They proposed that heat trans- struction of fractal-like branched systems with a wide range of
ferred to a double layered MCHS (DLMCHS) can be dissipated in functions and it states that the optimal network branching is at-
two ways. One is the "direct path," in which heat from the base tained when the cube of the parent channel radius equals the sum
fin is first transferred to the lower layer through the bottom hori- of the cubes of the daughter channel radii. it estimates the op-
zontal fin, and then dissipated by convection in the lower channels. timal diameter of branches in transportation networks to mini-
The other is the "indirect path," in which heat is transferred to the mize the flow resistance and maintenance of the transport medium
upper layer via the vertical and middle horizontal fins, and then [256-262].
dissipated by convection in the upper channels. Here, the “indi- The study of fractal geometry further accelerated after the pio-
rect” path present in double-layered MCHS provides an extra ben- neering work of Mandelbrot [263]. Further, researchers have found
efit over single-layered MCHS. the existence of fractal geometry in all elements of nature like in
In this work by Li et al. [248], an improved design (two layers the respiratory and cardiovascular system of animals such as blood
of rectangular channels are stacked one on top of the other with vessels, bronchial tree and vascular systems [264-269], leaf of the
porous ribs in the upper layer and solid ribs in the lower layer) plant [270,271], coastline, river channels, plant root, snowflakes,
of MCHS with a combination of high TP and low PD was pro- etc. [272-275], where Murray’s law has been proven to be a fair
posed, taking into account the advantages of the double-layered estimation. The main aim of hierarchically branched or fractal-
and the porous-ribs design. For performance comparison, four shaped channels is to maximize heat transfer while reducing the
more heat sinks with different structures (solid-ribs single-layered, fluid flow and PD in a system [276,277].
porous-ribs single-layered, solid-ribs double-layered, and porous- Bejan [278-280] has made the most significant contributions to
ribs double-layered) have been constructed. The results show that the theories and literature on heat transfer in fractal and hierarchi-
the revised model has the lowest thermal resistance (decreased by cal systems, as well as methods for the synthesis and optimization
14.98%, 10.85%, 9.27%, and 11.44%) and the best temperature unifor- of hierarchical networks. Bejan coined the term “constructal the-
mity (enhanced by 52.44%, 58.04%,14.57%, and 56.54%) on the bot- ory”, in which scaling rules are allowed to change at each branch
tom wall compared to other four design, at a fixed Re or pumping level. Fractal-like networks are a subset of feasible constructal net-
power (0.05 W). This is accredited to the better thermal conductiv- works [273,279-287]. Flow networks, as opposed to parallel flow
ity and low PD in the double-layered heat sink. Thermal resistance configurations or serpentines, have been shown to have higher ef-
monotonically decreased with increasing AR at a fixed channel-to- ficiency [129,272,274,277,288-293] and better temperature unifor-
pitch width ratio and channel number. mity [294-296]
Truncated DLMCHS was employed by Arani et al. [249] with To give the optimized branching structure, minimum surface
water/single-wall CNT nanofluid as a coolant for Re in the range area, minimum flow resistance, minimum volume, and minimum
of 50 0, 10 0 0, and 20 0 0. Results show that this configuration led power, were optimized using Murray’s law. Based on early inves-
to better temperature uniformity and lower thermal resistance due tigations, generalized Murray’s law can be represented as follows
to the use of water-CNT nanofluid. Up to 14% increment in ther- [256,259-262,270]:
mal performance was observed for water-CNT nanofluid with non-

N
Newtonian properties was observed by [250]. Leng et al. [251] ob- R3k = R3k+1,i (3)
served that, apart from maintaining temperature uniformity at the
i=1
base of the channel, truncated DLMCHS improved cooling perfor-
mance at constant pumping power and volume flow rate of the Where k and k + 1 are parent and daughter branches respec-
coolant [252]. The average Nusselt number increased with de- tively, R is the radius of branch pipe, N refers to the branching
creased height and increased width of DLMCHS [253]. Mashayekhi number in each bifurcation. The ratio of the parent branch to the
et al. [254] used hybrid nanofluid in DLMCHS with sinusoidal daughter branch (i.e. Rk+1 /Rk ) in a symmetrical and dichotomous
walls. Hybrid Cu-Al2O3/water nanofluid was used for ϕ =0-2%. Nu structure is 2−1/3 .
was increased by 23%, 22%, 19% and 13% corresponding to Re=50, Further development of Murray’s law has been done by many
30 0, 70 0 and 120 0 at ϕ =2%. researchers. For the turbulent flow regime, the optimized the
branching structure by minimizing the pumping power and the ex-
22
pression is as follows [297]: and T joints, the vorticity rose as the Re grew and the AR de-
creased. As a result, a reduced AR of 0.333 was shown to have

N
R7k /3 = /3
R7k+1 ,i
(4) lower PD and higher HT performance in fractal MCHS than all of
i=1 the other microchannel networks.
Heymann et al. [316] used a 1-D model to optimize the struc-
Then in this case consecutive branching ratio Rk+1 /Rk is 2−3/7 ture of fractal microchannels for the lowest PD and pumping
for a symmetrical and dichotomous branching structure in turbu- power utilizing a direct numerical search and GA. Fewer branch
lent flow regime and for the heat conduction to attain minimum levels with several channels originating from the input plenum
thermal resistance, Rk+1 /Rk is 2−1/2 [262]. Kuo et al. [261] give were suitable for higher heat flux removal applications.
the optimal ratio of turbulent flow through the rough pipe and In another study, a truncated double-layered (TDL) heat sink
is found to be -7/17 and this differs from smooth pipe flow condi- along with Y-shaped fractal MCHS was investigated by [322]. TDL
tions which are -3/7. heat sink showed 24-30% improved temperature uniformity at inlet
Murray’s law can also be reduced for a symmetric branched than the simple double-layered (DL) channel with less requirement
tree-like network as follows [262]: of pumping power (Fig. 37).
βk = dk+1/dk = n−1/Dd (5) Table 7 summarises key findings from several studies related to
fractal microchannel networks.
and Zhang et al. [323,324] did a numerical and experimental
study to investigate the THP of fractal microchannel networks us-
αk = lk+1/lk = n−1/Dl (6)
ing the subsectional integral method. The results of the subsec-
Where Dd and Dl are fractal dimension of diameter and length tional integral method had smaller deviations when compared
respectively. to the standard equivalent approach, and a microchannel with a
Now from Fig. 33, the treelike network consists of N branches smaller AR, higher fillet bend, and branching level could attain
from 0 to m level. lk and dk are length and diameter at arbitrary higher performance. Then, starting at the bifurcations and bends
branching level k (0, 1, 2, ... to m). “n” shows the number of daugh- with two branching levels, they investigated the secondary and re-
ter branches at next level i.e. at k + 1. From Fig. 33, it is evident circulation flow, concluding that the flow rates and aspect ratios
that n is 2 and m is 4. have great effects on the development of the vortices, greatly pro-
Keeping in mind the importance of the fractal network in the moting fluid mixing and enhancing heat transfer. The impact of as-
thermal management of devices, optimal studies have been con- pect ratio on THP of fractal shaped MCHS was experimentally in-
ducted by many researchers. Bejan et al. [259] optimized the T- vestigated and compared with straight MCHS by Yu et al. [292] for
and Y- shaped fractal structure by minimizing the flow resis- Re in the range of 150 to 1200. The result showed that fractal
tance. Emerson et al. [298] applied Murray’s law for the non- MCHS had a much higher heat transfer coefficient due to the for-
circular branching structures. Following the research of fractal mation of vortices in the fractal tree-like MCHS at the expense of
shaped MCHS H-shaped [280,283,291,296,299-301] and Y-shaped large pumping power. AR of MCHS had a great impact on both the
[302,303] networks was proposed by many researchers. heat transfer and PD. PD was more prominent at higher Re due to
Jing and co-workers [300,312-314] performed a comprehensive pressure loss at the bifurcation of fractal tree network and hence
study for the optimization of a fractal tree-like network to ob- it was recommended to use a semi-circular shape at the bend and
tain minimum thermal resistance. For electrokinetic flow under the bifurcation locations. A similar observation was made by Senn and
constant channel, volume constraints they found that the surface Poulikakos [289]. They compared tree-like fractal MCHS with ser-
charge at the solid-liquid interface can significantly affect the op- pentine flow patterns for the same surface area. Their study re-
timal fractal network. In another study, they considered slip flow vealed that a tree net with 6 branching levels yields 50% of the
conditions for the investigation of Murray’s law for laminar flow in PD than the corresponding serpentine network and this PD was
a fractal tree-like network. The optimal diameter ratio for achiev- prominent at bends and bifurcations. The tree net also provided
ing minimum flow resistance was found to be dependent on slip better thermal performance than the serpentine channel. Higher
length. PD at bends and bifurcation was also observed by Haller et al.
In their experimental and numerical study of THP of fractal-like [290] for L-bends and T-joints in branching microchannels and sug-
multilayer silicon MCHS. Xu et al. [321] discovered that layer num- gested design modification at the bends but at the cost of reduced
ber was an important factor in determining the Nu, pressure loss, heat transfer. Shape and aspect ratios also have been found to have
and thermal resistance of the multilayer FMCHS. The use of a mul- a great impact on PD.
tilayer fractal MCHS results in lower thermal resistance and pump- Lu et al. [325] evaluated the heat transfer performance of var-
ing power. MCHS performed best overall when the layer number ious branching levels of fractal-shaped heat sinks. With the in-
was 5, with a small volume thermal resistance of 2.5 Kcm3 /W and crease in branching level, the average and peak temperature both
pumping power of 0.07 Watt at 400 mL/min, which is shown in reduced. The heat sink size would limit the improvement in heat
Fig. 35. removal performance after the branching level was higher than 4.
The work of Ghodoossi [319] discovered that the thermal per- As a result, 4 was indicated as the ideal branching level.
formance of fractal MCHS was unaffected, whereas hydraulic per- Because of the structural limitations of the right-angled bifurca-
formance increased in the case of turbulent flow and decreased for tion in the fractal networks, the formation of hotspots occurred at
laminar flow compared to parallel MCHS. Zhang et al. [293] ex- the wall of the channel heat sink [295]. This issue was addressed
amined the formation of recirculation flow motions and secondary by the design modification of the fractal network and this modified
flows at the bends and bifurcation of fractal-like MCHS (Fig. 36a). channel exhibited better temperature uniformity, lower thermal re-
These motions, initiated at the L bend and T joints tend to sub- sistance, and much lower PD. Farzaneh et al. [326] scrutinized the
stitute the slower moving fluid near the wall with faster-moving bifurcating MCHS with and without loops and found that increas-
fluid as depicted in Fig. 36(c-d), causing a great enhancement in ing the number of branches reduced both maximum dimension-
viscous friction at the walls of the MCHS with large PD and en- less temperature (by 10% and 20%) and pressure drop (by 25% and
abling more convective thermal transport between fluid and walls 30%) for one and two branch reverting microchannels compared to
of MCHS that led to better heat transfer. These mixing at the bifur- without branch.
cation and bends kept flows in the developing regions. At L bends
23
H. Sadique, Q. Murtaza and Samsher
Table 5
Brief summary of work in wavy MCHS.
HT en-
Author/Year Wavy pattern Working fluid and input parameter hancement PD penalty Remarks
Ji-Feng Zhu ∼35% —

et al. [215]
• Working fluid: Water • At small wavelengths, the up-down wavy design outperforms
(2019)
• Substrate Material: Silicon the left-right one regardless of channel aspect ratio,
• Investigation type: CFDRC amplitude, or width ratio of the channel to pitch; however,
software when large wavelengths are used, the two designs perform
• Tin = 300K, nearly identically.
• q =100 W/cm2
Al-Rashed — —
24
et al. (2019)
• Working Fluid: Biologically • To make silver nano additives, the green tea leaf extract is
[216]
synthesized water-silver nanofluid used.
• Investigation type: • Enhancing the Re and nano additives fraction increases the
Numerical/Ansys Fluent performance of the heat sink
• Q= 50 w/cm2 • Increases in Re have a detrimental effect on both the
• Tin =300K pumping power and the system’s frictional irreversibility.
• In comparison to pure water, nano-fluid always has a better
cooling performance.

Hamidreza 47.3% 64.8%
Ermagan
• Re= 100 to 250 • WMCHS with superhydrophobic walls was studied.
et al[217]
• uin = 0.6 to 1.4 m/s • Overall performance is improved by 47.3%.
(2018)
• q= 100W/cm2 • Due to the prolonged flow path and the resulting increase in
• Working Fluid: DI water trapped layers of air, thermal performance decreased as
• Tin =293 K channel waviness increased.
• Substrate Material: Silicon
• Investigation type: Numerical/
Ansys Fluent
• A= 15, 30, and 60 μm
• λ= 250, 500 and 1000 μm
(continued on next page)

Table 5 (continued)

Author/Year Wavy pattern Working fluid and input parameter HT en- PD penalty Remarks
hancement
Javad Rostami 174% 195.7%

et al. [206]
• Working Fluid: Water-Cu/Al2 O3 • Two-phase models using an Eulerian approach for the base
(2018)
nanofluid fluid and a Lagrangian description for the suspended
• Dh =90 μm particles were used.
• Investigation Type: Numerical/ • Area-HT rate and PD are increased in a WMCHS as compared
Fluent to a straight MCHS by 174% and 195.7%.
• λ=200 μm • In contrast with pure water, the area-Nu increased by about
33.2% for water-Cu, whereas the increase in PD is less than
10.6%.
Zi Hao Foo 51% —

et al.[218](2018)
• Re= 1300-4600 • On the inner cylinder’s surface, sinusoidal wave geometrical
• Working Fluid: Distilled water profiles were incorporated to improve convective heat
• Tin =321 K transfer.
• Q=Volumetric heat • In terms of heat transfer, MCHS with higher wave amplitudes
25
generation=1000W/cm3 and shorter wavelengths fared better.

• Investigation type: Exp and • At the same pumping power, the highest performing
numerical (Ansys CFX) improved microchannel can remove 51% more heat than the
• λ= 3, 6 and 10 mm simple annular channel.
• A= 0.05, 0.10, and 0.15 mm • Wavy profiles improve heat transfer efficiency by disrupting
the flow and reinitializing boundary layers along the peaks
while minimizing pressure losses.
• The highest performance factor achieved is 1.51

• An optimal number of waveforms is required to improve heat
removal capabilities per unit pumping power while avoiding
needless pressure loss.
Han Shen 10%

et al.[219](2018) —
• Working Fluid: DI water • Counter-Flow Wavy Double-Layer Microchannel Heat Sinks
• Substrate Material: Silicon (DMHSs) were studied.
• q=100 W/cm2 • Heat transfer enhancement of staggered wavy DMHSs with
• uin = 1.32-2.6 m/s opposing amplitude is preferable.
• Re= 175-345 • The staggered arrangement of DMHS has a better thermal
• Investigation type: performance against the straight parallel DMHS without
numerical/Fluent appreciable pressure drop penalty.
• λ= 2.5 mm • Among the counter flows of straight parallel DMHS, the
• A= 0-205 μm counter flow of straight staggered DMHS has the best overall
thermal performance.

Table 5 (continued)

hancement
Lin et al. — —
[214](2017)
• Working Fluid: Water • WMCHS with varying amplitude/wavelength was
• Substate Material Silicon investigated.
• Ansys Fluent • The performance improvement is due to the formation of
• q=50 W/cm2 vortices in the channel cross-sections, which improves not
• Re=300-800 only coolant mixing but also convective heat transfer
• Pumping power=0.1W between coolant and channel walls through Dean vortices.
• Investigation type: Numerical
• λ= 2000 μm with λ=300 or
-300 μm
• A= 30 μm.
Gui Lu — —
et al.[208](2017)
• water and silicon • WMCHS with porous fins was proposed.
• q= 100 w/cm2 • When compared to standard WMCHS with solid fins, WMCHS
• T =300 K with porous fins decreased both PD and thermal resistance.
• Investigation type: Numerical • The combined effect of greater coolant mixing by Dean
• λ = 1000 μm and A =30 μm vortices, the longer flow pathway by increasing equivalent
26
channel length, and the forced permeation by jet-like

impingement is credited with improved heat transfer
performance.
Xie et al. 27.3% 149.2%

[220](2017)
• q=100 W/cm2 • Straight MCHS having a rectangular cross-section,
• uin = 0.6-1.4 m/s longitudinal-WMCHS, and transversal MCHS were designed.
• Re= 96-223 • Transversal WMCHS has a much smaller pressure drop
• Tin =293.15 k penalty.
• Investigation type: • overall thermal performance of Longitudinal WMCHS
Numerical/Fluent deteriorated.
• λ = 0.5 mm and A =25 μm and
30 μm
Y. Sui et al. 53% 154%

[202](2010)
• Investigation type: • Three-dimensional wavy MCHS with rectangular
Numerical/Fluent cross-section was studied.
• Re= 100-800 • The fluid mixing is studied using the dynamical system
• γ = 0.05 to 0.2, where γ =A/L technique (Poincaré section).
• q=300 W/cm2 • Secondary flow (Dean vortices), chaotic advection, greatly
enhance the convective fluid mixing.
• Increased relative waviness along the flow direction, resulted
in higher heat transfer performance.

Table 5 (continued)
hancement
H.A. 0.6% —
Mohammed
• A= 125 to 500 μm • The temperature of the WMCHS rises as the wavy amplitude
et al. [210]
• Re=100 to 1000 decreases, and it is always lower than the temperature of the
(2011)
• Working Fluid: Water straight microchannel.
• Substrate Material: Aluminium • As the amplitude of the WMCHS increases, so does the heat
• Dh = 339.15 μm transfer coefficient and wall shear stress.
• Tin =293K
• Q= 100W/cm2
• Investigation type: numerical
Y. Sui et al. 278.6% 51.8%

[213] (2011)
• Working fluid: water • Periodic WMCHS with rectangular cross-sections were
• Investigation type: studied.
Numerical/Fluent • Dean vortices developed along the flow direction, resulting in
• Re=50-175 chaotic advection, which improve convective fluid mixing
27
and heat transfer significantly.

• Dean vortices patterns evolved temporally and spatially along
the flow direction in these unsteady regimes, and flow
symmetry might be lost.
• Straight channels with the same cross-section can always
perform much better in terms of heat transfer.

Tapas K. Nandi 50% —
et al.[221]
• Re= 0.1 to 100 • Flow within sinusoidal WMCHS was both thermally and
(2013)
• Apulsation = 0.2, 0.5, 0.8 hydrodynamically developing.
• 0.1 < A<1 • At various amplitudes, a sinusoidal velocity at the inlet can
• Working Fluid: Water increase heat transfer performance.
• Tin =330K • When a sinusoidal velocity component at the inlet was
• Investigation type: Numerical superimposed on the mean flow entering the channel, then
• Inlet velocity profile: pulsation at the inlet improved heat transfer while lowering
uin =um (1+Asin(2π ft)) PD even at low Re.
• Wavy profile equation:
y = Aw sin( 2λπ X )

Table 5 (continued)

hancement
Chiam et al. 15% 115%

[222] (2016)
• Re=50-200 • An increment in heat transfer performance was observed on
• Substrate: Copper the addition of secondary branches with PD penalty.
• Working fluid: DI Water • Benefits of secondary branches were more noticeable at
• Investigation type: Re<100 but performance factor suffered due to large PD
Numerical/Ansys fluent • Lower waviness amplitude led to superior HT performance
• λ=3 mm without much PD penalty
• A=450 μm • WMCHS with secondary branches with a lower amplitude
• V=0.1-1 l/min design showed a more consistent rate of heat removal
Rostami and 162.6% 195.7%

Abbasi [205]
• Working fluid: Water-Al2 O3 • The two-phase model gave a better approximation to the
(2016)
nanofluid experimental result compared to the single-phase model
28
• ϕ = 0%-2% • Nu increased due to the wavy walls of MCHS and the use of
• λ =200 μm nanofluid.
• Dh =90 μm • Nu increased with increase in ϕ without significant PD
• For ϕ =0.02, the Nu increases by about 11.6 % compared to
pure water, whereas the PD increases by less than 2.4 %.

Sakanova et al. 13.9% —
[223] (2015)
• A= 25, 50 and 75 μm • Higher the amplitude and the shorter the wavelength of
• λ= 250 and 500 μm WMCHS, the lesser is thermal resistance.
• V= 0.152 l/min-0.354 l/min • In comparison to low Re, the overall improvement owing to
• ϕ =1%-5% WMCHS is more visible at high Re.
• q=100 W/cm2 • Additional pressure drop is created by increasing the
• Investigation type: amplitude and decreasing the wavelength.
Numerical/Ansys Fluent • When nanofluids are utilized as a coolant, the effect of wavy
channels is reduced, and the cooling performance of both
wavy and rectangular MCHS is identical.
• Diamond-water nanofluid exhibits the best performance

Table 5 (continued)
hancement
Rostami et al. 11.6% 102.4%

[224] (2015)
• Substrate material: Silicon • Nu in wavy wall MCHS is greater than the flat walls MCHS
• Working fluid: Water • In wavy walls microchannels, there is an optimum shape
• Re=50-200 with the highest Nusselt number, in contrast to flat walls
• Dh =90 μm microchannels due to the presence of secondary flows and
• λ = 200 μm recirculation zones in wavy all MCHS.
• Pitch of MCHS= 100 μm
Xie et al. [225] 15.6% 185 %

(2013)
• A= 25 μm to 30 μm (for LWC) • They designed transversal microchannel (TWC) and
• A= 200 μm and 237.5 μm (for longitudinal-wavy microchannel (LWC) based on rectangular
TWC) microchannel (SRC)
• λ=350 μm, 500 μm • SRC has better thermal performance than LWC for the given
29
• Re=100-230 geometries and flow conditions

• Dh =160 μm • TWC, on the other hand, offers a greater potential for
• Investigation type: reducing pressure drop than SRC.
Numerical/Fluent • TWC has better Thermal Performance compared to SRC.
• q=100 W/cm2
• uin =0.6-1.4 m/s

Gong et al. 55% 216.67%
[226] (2011)
• Re= 50-150 • Configuration with crest and troughs facing alternatively gave
• q=47 W/cm2 better performance than the crests and troughs facing
• Dh =500 μm directly to each other.
• Investigation type: • The best configuration provided 55% increment in overall
Numerical/Fluent performance.
• A=50-200 μm • Nu increased with the increase of wavy Amplitude but the
• λ=1.3-4 mm PD penalty also increased.
• Nu and PD decreased with the increase in wavelength for all
ranges of Re
• Performance factor improved with Re (with a peak at
Re=150), wave amplitude (Peak at A=200 μm), wavelength
(peak at λ=2 mm) and at channel; aspect ratio (peak at
AR=1.3)
Table 6
Timeline of the development of fractal theory, inspired by [304].
Researchers Year(s) Major findings
Murray [256] 1926 Developed Murray’s law for optimal network

branching.
Mandelbrot [263] 1967 Their research made fractal geometry a lot more
accessible.
Sherman [260] 1981 Observed that the Murray’s law is a functional
link between vessel radius and volumetric flow,
Re, vessel-wall shear stress, velocity profile, the
average linear velocity of flow, and pressure
gradient in individual vessels.
Mandelbrot [275] 1982 Natural fractal structures such as leaves,
coastlines, and clouds are described.
West et al. [305] 1997 To reduce flow work, scaling principles (diameter
ratio and length ratio) were developed for a bulk
fluid transport phenomenon.
Bejan et al. [306]; Bejan [281,285,307] 1997-2008 Developed Constructal Theory: It explains the
phenomenon of evolution (configuration, shape,
and design) in nature, combining inanimate flow
systems and living systems.
Xu and Yu [308] 2006 The scaling exponents of the transport properties
in the networks were derived after analyzing the
transport properties in the networks.
Chen and Chang [272,309] 2002,2005 Examined heat transfer in layered networks of
Mandelbrot trees
Pence and co-workers [288,310,311] 2003,2004 They developed novel numerical approaches for
heat transfer optimization.
Yan et al. [327] presented a fractal MCHS with thermosensi- shaped MCHS with rectangular cross-sections helped in decreasing
tive hydrogels that dissipated heat from the hotspots by automatic thermal resistance and increasing thermal performance.
adaptive flow rate redistribution in the respective channel. As de- Studies on removing high heat fluxes from GaN-on-SiC and
picted in Fig. 38, the SFMHS 1+2 (FMCHS fixed with hydrogels in BeO ceramic semiconductor die with hierarchically branched MCHS
both the first and second level branches at the same time) dis- were carried out by Calame et al. [129]. Single crystal silicon was
played the least temperature rise at the hotspot, after that the used for manufacturing the microchannel by contact photolithogra-
SFMHS 1 and SFMHS 2 (FMCHS fixed with hydrogels in first-level phy and DRIE. The topside patterned resistive metal coating on the
branch and FMCHS fixed with hydrogels in second-level branch). BeO-based dies and the AlGaN/GaN heterostructure on the SiC dies
This is mainly due to the better flow modulation in SFMHS 1+2 were both used as direct current resistors, producing a localized
than others. SFMHS 1+2 had the highest pumping power required heat source in each case. Three levels of branched-channel size
following that SFMHS 2 and SFMHS 1. They also discovered that gave an optimal performance with heat transfer coefficient in the
SFMHS 1+2 can handle a broader range of heat flux as well as range of 12.2-13.4 W/cm2 K which was 2 times higher than one-
identify and cool hotspots. The positions of the hotspots have a channel configuration.
significant impact on the deformation of hydrogels, which has an Temperature uniformity is also essential for maintaining the re-
impact on the automatic adaptive cooling of the hotspot. liability of microelectronic devices. Stepwise varying channels are
Yan et al. [328] used single and multi-objective evolutionary al- found to have increased thermal performance along with more
gorithms to optimize the topologies of Y-shaped fractal MCHS that temperature uniformity than the conventional channel without
took into account a number of geometrical characteristics. The plot causing a significant pressure drop. With the same objective of
of optimum thermal resistance (Rt ) vs pumping power was said enhancing the temperature uniformity Riera et al. [338] designed
to be separated into two zones: effective zone of pumping power stepwise varying width microchannel. The thermal resistance coef-
where the structure of bionic microchannels is determined by the ficient of the stepwise microchannel increased three times for the
pumping power and ineffective zone of pumping power where the same mass flow rate. The thermal interface material (TIM) layer
structure of bionic microchannels remains unchanged. Further, the caused uniformity in temperature distribution with an increase
effective zone can be categorized into three categories: parabolic, in its average temperature, prompting the design modification by
exponential, and linear decline as depicted in Fig. 39. They discov- considering the effects of TIM layer.
ered that the hydraulically optimal model used 54.5-67.2 % less Luo et al. [11] studied brass Honeycomb porous MCHS (as
energy and had lower pumping powers than the thermally opti- shown in Fig. 40) to understand HT characteristics and cooling
mal model, with flow rates of the coolant in the range of 200 to performance. Metal etching was used for the fabrication. The re-
400 ml/min, although it had a poor thermal performance. The hy- sult show that it removed 18.2 W/cm2 of heat flux at 2.4 Watt of
draulically optimal model has 50% more thermal resistance than pumping power.
this optimal model but at the expense of more power input. Tang et al. [339] designed a ring-shaped MCHS by turning pro-
cess with added guide vanes to enhance uniformity in flow distri-
4.5. Other modifications in shape bution in microchannels. Flow distribution uniformity was evalu-
ated with the help of parameter σ which is defined as:

Apart from above-mentioned modification, some other tech- 2
1
N
v( j )
niques are being used for the thermal performance enhancement
σ = −1 (j = 1, 2, . . . ., N) (7)
of MCHS. However, these are very uncommon and have not been N−1 vavg
j=1
studied by many researchers.
Brinda et al. [130] investigated ladder-shaped MCHS for enhanc- j= microchannel number from one side to other, v=flow velocity
ing contact area with the flowing coolant. By employing ladder- corresponding to each microchannels, vavg = average flow velocity
30
Table 7
Summary of important studies in fractal shaped MCHS.
% Increase in TP/
Paper Year Configuration RA C/S material Flow conditions P Remarks
[329] 2018 FMCHS with pores E+N DI water/ Al Laminar ∼17.27% (w.r.t. no
pores)/-
• Fractal Microreactor with a porous surface
and made with large NaCl particle had better
heat transfer performance.
[330] 2015 FMCH N+E DI water /Si Laminar 25-40% w.r.t.

f= 0-40Hz steady flow/-
• increase in heat transfer at low and high
Re=1800-2800
q=40 W/cm2 frequencies is higher than at moderate
frequencies.
• The pulsatile flow results in lower maximum
temperature.
[331] Y-FMCHS E+N Water/Cu Turbulent -/-

q=1-2.5 W/cm2
• Better temperature uniformity was obtained.
Vi =0.6-1 l/min
[332] 2020 leaf vein-shaped N+E Water/Al alloy Laminar -/-

MCHS Vi =0.4 L/min
• The third-order assembly provides better
q=100 W/cm2
temperature uniformity.
[318] 2019 Tree-shaped MCHS N+T Water/Cu Laminar ∼10.5%/14.2 KPa

q= 10 W/cm2
• Trees-shaped MCHS with ribs showed the
Re=200-1000
highest heat transfer performance with the
highest PD penalty.
• Cavities promote whereas, ribs suppress the
branching effect, results in a more uniform
temperature distribution.
[333] 2020 Rhombus-FMCHS E+N Water/Cu Laminar 14.6%-29.4%/-

uin =0.25-2 m/s
• Rhombus FMCHS may increase the COP by
q=100 W/cm2
Re=80-400 7.9%- 68.7%, with increased cooling efficiency.
[334] FMCHS N CNT Laminar 108%/-

+Water& Re=1500-3000
• Nu of SWCNT nanoparticles is significantly
Kerosene/Si ϕ =0-8 vol. %
q= 40 W/cm2 higher than that of MWCNT nanoparticles.
• The water-based nanofluid’s performance
evaluation criterion is four times higher than
that of the kerosene-based nanofluid.
[335] 2019 FMCHS N Al2O3-water and Laminar 8.3%/327.29 kPa

SiO2-water/- q= 50 W/cm2
• Al2O3-water has a higher mean heat transfer
uin = 4-9 m/sϕ
= 0% to 4% coefficient and pressure drop than that of
SiO2-water, lower base temperature, thermal
resistance, friction factor, and COP.
[336] 2017 T-Y-shaped FMCHS N+E liquid GaInSn/Cu q=100 W/cm2 271.46% compared
Re=1021-6126 to water for
• The optimal bifurcation angle was found to
uin =0.4-2.4 m/s GaInSn/22.1 kPa
Laminar and be 60o where Nu is highest with the least PD.
• Use of GaInSn as coolant enhanced heat
turbulent
transfer performance.
[296] 2009 Tree-shaped MCHS N+E DI Water/Al Dh =4mm, 110.38% increase

q=2.5W/cm2 in COP compared
• Uniform temperature distribution and less PD
Re=600-1500 to serpentine
MCHS at compared to serpentine MCHS.
• local PD owing to confluence flow is greater
Re=600/3.3 kPa
than that due to diffluence flow
[337] 2015 Tree-shaped N+E Water/Steel q=25 W/cm2 132.98% more COP
FMCHS Re=600-1000 than helical net at
• Fractal tree-like channels net heat sink has
laminar Re=600/1.3 kPa
lower pressure drop, more uniform
temperature field distribution, and larger
coefficient of performance than that of the
traditional helical channel net heat sink
∗
Note:- RA-Research Approach, E-experimental, N-numerical, C/S material: coolant and substrate material, TP: thermal performance, Al-Aluminium, Si-Silicon, Cu-Copper,
f-pulsation frequency(Hz), SWCNT-single walled CNT, MWCNT-multi-walled CNT.
31
in all the microchannels and is defined as: layer growth in thermally developing region which leads to

N high heat transfer than conventional microchannel.
1
vavg = v( j ) (8) • A study on DLMCHS shows that it exhibited low-pressure drop
N and low rise in temperature in a streamwise direction.
j=1
• Other modifications in shape, such as ladder-shaped, hierarchi-
Smaller σ signifies a more uniform flow. The result shows that
cally branched, stepwise varying, honeycomb, and ring-shaped
the performance of MCHS was greatly improved by using guide
microchannels, were also considered in this research.
vanes in both co- and counter-current flow. Installation of guide
vanes in ring-shaped microchannels leads to more flow uniformity 5.1. Future Recommendations
compared to the channel without guide vanes.
Microchannels with oblique fins [340], dimpled or protruded As electronic devices have evolved so quickly, heat management
surfaces [341,342] have also been shown to improve heat trans- has always been a significant concern. As a result, the following
fer across the channel by generating secondary flows Eq.3-(8), investigations should be pursued in the future:
(Fig.7, Fig.9, Fig.29, Fig.32, Fig.34, Fig.41), (Table 1, Table 2, Table 3,
Table 4, Table 5, Table 6)
• Optimizations of the different wavy designs could be carried
out in parallel to find their optimal geometry and improve heat
5. Conclusions and future recommendations transfer performance.
• There is future scope for incorporating magnetohydrodynamic
The current research provides a complete review of the liter- and electrohydrodynamic effects into the secondary flow chan-
ature on the influence of channel geometrical parameters on the nels.
heat transfer performance of Microchannel Heat Sink (MCHS). The
• The majority of fractal channels design approaches are based
benefits and limitations of emerging high heat flux cooling sys- on scaling laws; hence, further research is needed to investigate
tems are also highlighted. The critical review of the fluid flow and other methods.
heat transfer in MCHS, along with their usage, fabrication tech-
• The feasibility of fabricating a heat sink is still questionable;
niques, classification, parametric optimization, heat transfer en- microfeatures smaller than 100 μm are still difficult to fabricate
hancement techniques, as well as thermophysical properties of the using conventional methods [134]. Because of the limitations
material/coolant employed in the heat sink, are also explored in and complexity of MCHS production, the distinct and compli-
this paper. cated structures of MCHS cannot be realised. So, the develop-
When it comes to improving the performance of a cooling sys- ment of a suitable fabrication method remains a future chal-
tem, the geometry of the heat sink is crucial. Average temperature, lenge for engineers.
Nusselt number, flow and temperature uniformity, heat transfer co-
• It is necessary to handle effective system integration, such as
efficient, and pressure drop are all important factors that can be micropump on ICs and direct heat sink integration on chips.
impacted by thermo-hydraulic efficiency. This may address the thermal management of hotspots.
The following are the results and future work ideas based on a
• Effective cooling of hotspots, which are randomly present in
brief critical review of the literature relevant to microchannel heat ICs and microelectronic devices, still remains a major challenge,
sinks subjected to various design modifications. as there is no effective method available for the cooling of
hotspots.
• Heat transfer performance in straight channels diminishes in • Hybrid cooling schemes, which combine the benefits of mi-
the flow direction as the flow becomes regular and the bound- crochannel with those of other cooling schemes such as spray
ary layers develop. The enhanced heat transfer performance cooling, jet impingement, etc., can be a very effective way to
of a sinusoidal wavy channel and the serpentine channel is achieve cooling performance. Moreover, active and passive cool-
highlighted with reasonable pressure drop. Although the zigzag ing techniques can also be combined for further heat transfer
channel has a higher HT rate, it also has a higher pressure drop. augmentation.
• Meanwhile, at low Re, the convergent-divergent channel dis- • One of the most promising fluids for improving the thermal
played considerable HT enhancement. Convective heat trans- performance of micro heat sinks is nanofluids. As a result, en-
fer coefficient increases as the fluid velocity increases in the hancing the stability of nanoparticle dispersion in the base fluid
stream-wise direction of a converging channel leading to the is a promising research area.
improved overall temperature distribution. • Dispersion and random motion of particles, clustering, and
• Furthermore, the secondary flow through the oblique finned other factors should all be considered while developing a flow
channel significantly contributes to increased flow mixing and model for nanofluids flow and thermal properties in micro heat
continuous interruption of the thermal boundary layer, result- sinks.
ing in improved heat transfer. As a result, MCHS with oblique • In future research, other nanofluids with different volume frac-
fins has attained excellent thermo-hydraulic performance with tions can be examined in the study of Double layered MCHS, as
a high HT rate and small PD. well as the effect of magnetic and electric fields on the cooling
• Mitigation of non-uniform temperature distribution, such as performance of the Double layered MCHS.
temperature rises in the streamwise direction and hotspots, has
become a concern for thermal engineers. Changing the shape Declaration of Competing Interest
and structure of the MCHS has made significant progress in
terms of temperature rise along the streamwise direction and Please check the following as appropriate: (CHECKED), All au-
hotspots. However, developing an efficient and cost-effective thors have participated in (a) conception and design, or analysis
process for cooling random hotspots is critical. Fractal MCHS and interpretation of the data; (b) drafting the article or revising it
addresses the issue with decreased temperature variation, how- critically for important intellectual content; and (c) approval of the
ever at the cost of significant pressure drop. The need for adap- final version.
tive cooling and research associated with it have been studied
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International Journal of Heat and Mass Transfer 194 (2022) 123063

Contents lists available at ScienceDirect

International Journal of Heat and Mass Transfer

Heat transfer augmentation in microchannel heat sink using

1.1. The rise of micro scale devices

Fig. 2. Thermal management technologies market in North America by application,

convection with extended surfaces such as ﬁn), latent heat stor-

The concept of microchannel cooling can be stated in

Fig. 6. Different subject areas where papers on MCHS are published.

Fig. 7. Microchannel heat sink(MCHS) as depicted in Gilmore et al. [123].

3.3. Optimization schemes

As MCHS research advanced, the primary goal remained to re-

strate temperature gradient. The presence of thermally developing

Wavy MCHS design with porous ﬁns is studied by Lu et al.

Fig. 29. Schematic of Secondary ﬂow channels (adapted from [237]).

Cho et al. [211] investigated numerically, the ﬂow properties of

Various cooling techniques Advantages Disadvantages

Fig. 34. Various fractal shaped conﬁguration [262,288,295,315–320].

shaped MCHS with zig-zag shaped MCHS being more appropriate

Cooling Author, Year Highlights

4.1.6. Oblique ﬁnned channels

4.2. Transverse/Intersecting MCHS

Authors, year Type of channel

Mehendale et al. [144], 2000 Microchannels: Dh =1-100 μm

Ji-Feng Zhu ∼35% —

International Journal of Heat and Mass Transfer 194 (2022) 123063

(continued on next page)

H. Sadique, Q. Murtaza and Samsher

Javad Rostami 174% 195.7%

Zi Hao Foo 51% —

generation=1000W/cm3 and shorter wavelengths fared better.

International Journal of Heat and Mass Transfer 194 (2022) 123063

Han Shen 10%

(continued on next page)

H. Sadique, Q. Murtaza and Samsher

channel length, and the forced permeation by jet-like

Xie et al. 27.3% 149.2%

International Journal of Heat and Mass Transfer 194 (2022) 123063

Y. Sui et al. 53% 154%

(continued on next page)

Y. Sui et al. 278.6% 51.8%

and heat transfer signiﬁcantly.

International Journal of Heat and Mass Transfer 194 (2022) 123063

(continued on next page)

H. Sadique, Q. Murtaza and Samsher

Chiam et al. 15% 115%

Rostami and 162.6% 195.7%

International Journal of Heat and Mass Transfer 194 (2022) 123063

(continued on next page)

Rostami et al. 11.6% 102.4%

Xie et al. [225] 15.6% 185 %

• Re=100-230 geometries and ﬂow conditions

International Journal of Heat and Mass Transfer 194 (2022) 123063

Researchers Year(s) Major ﬁndings

Murray [256] 1926 Developed Murray’s law for optimal network

[330] 2015 FMCH N+E DI water /Si Laminar 25-40% w.r.t.

[331] Y-FMCHS E+N Water/Cu Turbulent -/-

[332] 2020 leaf vein-shaped N+E Water/Al alloy Laminar -/-

[318] 2019 Tree-shaped MCHS N+T Water/Cu Laminar ∼10.5%/14.2 KPa