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SCT2450KE

N-channel SiC power MOSFET Datasheet

Outline
TO-247
VDSS 1200V
RDS(on) (Typ.) 450m
ID 10A
PD 85W (1) (2)
(3)

Inner circuit
(2)
Features
1) Low on-resistance (1) Gate
(2) Drain
2) Fast switching speed *1 (3) Source
(1)

3) Fast reverse recovery


*1 Body Diode
4) Easy to parallel (3)

5) Simple to drive Packaging specifications


6) Pb-free lead plating ; RoHS compliant Packaging Tube
Reel size (mm) -

Application Tape width (mm) -


Type
• Solar inverters Basic ordering unit (pcs) 30

• DC/DC converters Packing code C

• Switch mode power supplies Marking SCT2450KE

• Induction heating
• Motor drives

Absolute maximum ratings (Ta = 25°C)


Parameter Symbol Value Unit
Drain - Source voltage VDSS 1200 V
Tc = 25°C ID *1 10 A
Continuous drain current
Tc = 100°C ID *1 7 A
Pulsed drain current ID,pulse *2 25 A
Gate - Source voltage (DC) VGSS 6 to 22 V
Gate - Source surge voltage (Tsurge ˂ 300nsec) VGSS-surge
*3
10 to 26 V
Power dissipation (Tc = 25°C) PD 85 W
Junction temperature Tj 175 °C
Range of storage temperature Tstg 55 to 175 °C

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© 2013 ROHM Co., Ltd. All rights reserved. 1/12 2017.07 - Rev.D
SCT2450KE Datasheet

Thermal resistance
Values
Parameter Symbol Unit
Min. Typ. Max.

Thermal resistance, junction - case RthJC - 1.36 1.77 °C/W

Thermal resistance, junction - ambient RthJA - - 50 °C/W

Soldering temperature, wavesoldering for 10s Tsold - - 265 °C

Electrical characteristics (Ta = 25°C)


Values
Parameter Symbol Conditions Unit
Min. Typ. Max.

Drain - Source breakdown


V(BR)DSS VGS = 0V, ID = 1mA 1200 - - V
voltage

VDS = 1200V, VGS = 0V


Zero gate voltage
IDSS Tj = 25°C - 1 10 A
drain current
Tj = 150°C - 2 -

Gate - Source leakage current IGSS VGS = 22V, VDS = 0V - - 100 nA

Gate - Source leakage current IGSS VGS = 6V, VDS = 0V - - 100 nA

Gate threshold voltage VGS (th) VDS = VGS, ID = 0.9mA 1.6 2.8 4.0 V

*1 Limited only by maximum temperature allowed.


*2 PW  10s, Duty cycle  1%

*3 Example of acceptable Vgs waveform

*4 Pulsed

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© 2013 ROHM Co., Ltd. All rights reserved. 2/12 2017.07 - Rev.D
SCT2450KE Datasheet

Electrical characteristics (Ta = 25°C)


Values
Parameter Symbol Conditions Unit
Min. Typ. Max.
VGS = 18V, ID = 3A
Static drain - source
RDS(on) *4 Tj = 25°C - 450 585 m
on - state resistance
Tj = 125°C - 610 -

Gate input resistance RG f = 1MHz, open drain - 25 - 


*4
Transconductance gfs VDS = 10V, ID = 3A - 1.0 - S

Input capacitance Ciss VGS = 0V - 463 -

Output capacitance Coss VDS = 800V - 21 - pF

Reverse transfer capacitance Crss f = 1MHz - 4 -

Effective output capacitance, VGS = 0V


Co(er) - 31 - pF
energy related VDS = 0V to 500V
*4
Turn - on delay time td(on) VDD = 400V, VGS = 18V - 19 -

Rise time tr *4 ID = 3A - 17 -
ns
*4
Turn - off delay time td(off) RL = 133 - 38 -
*4
Fall time tf RG = 0 - 34 -

*4 VDD = 600V, ID=3A


Turn - on switching loss Eon - 47 -
VGS = 18V/0V
RG = 0, L=500H J
*4 *Eon includes diode
Turn - off switching loss Eoff - 17 -
reverse recovery

Gate Charge characteristics (Ta = 25°C)


Values
Parameter Symbol Conditions Unit
Min. Typ. Max.
*4
Total gate charge Qg VDD = 400V - 27 -
*4
Gate - Source charge Qgs ID = 3A - 7 - nC
*4
Gate - Drain charge Qgd VGS = 18V - 9 -

Gate plateau voltage V(plateau) VDD = 400V, ID = 3A - 10.5 - V

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© 2013 ROHM Co., Ltd. All rights reserved. 3/12 2017.07 - Rev.D
SCT2450KE Datasheet

Body diode electrical characteristics (Source-Drain) (Ta = 25°C)


Values
Parameter Symbol Conditions Unit
Min. Typ. Max.

Inverse diode continuous, *1


IS - - 10 A
forward current
Tc = 25°C
Inverse diode direct current,
ISM *2 - - 25 A
pulsed
*4
Forward voltage VSD VGS = 0V, IS = 3A - 4.3 - V
*4
Reverse recovery time trr - 19 - ns
*4 IF = 3A, VR = 400V
Reverse recovery charge Qrr - 13 - nC
di/dt = 110A/s
*4
Peak reverse recovery current Irrm - 1.4 - A

Typical Transient Thermal Characteristics


Symbol Value Unit Symbol Value Unit
Rth1 230m Cth1 219
Rth2 687m K/W Cth2 1.29m Ws/K
Rth3 441m Cth3 13.1m

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© 2013 ROHM Co., Ltd. All rights reserved. 4/12 2017.07 - Rev.D
SCT2450KE Datasheet

Electrical characteristic curves

Fig.1 Power Dissipation Derating Curve Fig.2 Maximum Safe Operating Area

90 100
PW = 100s
80
Power Dissipation : PD [W]

70 PW = 1ms
10

Drain Current : ID [A]


PW = 10ms
60
PW = 100ms
50
1
40

30 Operation in this area


is limited by RDS(on)
0.1
20

10 Ta=25ºC
Single Pulse
0 0.01
0 50 100 150 200 0.1 1 10 100 1000 10000

Junction Temperature : Tj [°C] Drain - Source Voltage : VDS [V]

Fig.3 Typical Transient Thermal


Resistance vs. Pulse Width
10
Transient Thermal Resistance : Rth [K/W]

Ta=25ºC
Single Pulse

0.1

0.01
0.0001 0.001 0.01 0.1 1 10

Pulse Width : PW [s]

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© 2013 ROHM Co., Ltd. All rights reserved. 5/12 2017.07 - Rev.D
SCT2450KE Datasheet

Electrical characteristic curves

Fig.4 Typical Output Characteristics(I) Fig.5 Typical Output Characteristics(II)

10 5
20V 20V 14V
18V 18V
8 4
16V 14V 16V

Drain Current : ID [A]


12V
Drain Current : ID [A]

Ta=25ºC
6 Pulsed 3

12V
4 2 10V

VGS= 8V
10V
2 1
Ta=25ºC
VGS= 8V Pulsed
0 0
0 2 4 6 8 10 0 1 2 3 4 5

Drain - Source Voltage : VDS [V] Drain - Source Voltage : VDS [V]

Fig.6 Tj = 150°C Typical Output Fig.7 Tj = 150°C Typical Output


Characteristics(I) Characteristics(II)
10 5
Ta=150ºC 20V 20V
Pulsed
18V 18V
8 4
16V 12V
16V
Drain Current : ID [A]
Drain Current : ID [A]

14V
14V 12V 10V
6 3

4 10V
2
VGS= 8V

2 VGS= 8V 1
Ta=150ºC
Pulsed
0 0
0 2 4 6 8 10 0 1 2 3 4 5

Drain - Source Voltage : VDS [V] Drain - Source Voltage : VDS [V]

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© 2013 ROHM Co., Ltd. All rights reserved. 6/12 2017.07 - Rev.D
SCT2450KE Datasheet

Electrical characteristic curves

Fig.8 Typical Transfer Characteristics (I) Fig.9 Typical Transfer Characteristics (II)

10 10
VDS= 10V VDS= 10V
Plused 9
Plused
8
1

Drain Current : ID [A]


Drain Current : ID [A]

6
Ta=150ºC
0.1 Ta=75ºC 5
Ta=25ºC 4
Ta= 25ºC Ta=150ºC
3 Ta=75ºC
0.01 Ta=25ºC
2 Ta= 25ºC
1

0.001 0
0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 18 20

Gate - Source Voltage : VGS [V] Gate - Source Voltage : VGS [V]

Fig.10 Gate Threshold Voltage Fig.11 Transconductance vs. Drain Current


vs. Junction Temperature
5 10
VDS = 10V VDS= 10V
Gate Threshold Voltage : VGS(th) [V]

4.5
ID = 1mA Plused
4
Transconductance : gfs [S]

3.5
1
3

2.5

2
0.1
1.5 Ta=150ºC
Ta=75ºC
1 Ta=25ºC
0.5 Ta= 25ºC

0 0.01
-50 0 50 100 150 200 0.01 0.1 1 10

Junction Temperature : Tj [°C] Drain Current : ID [A]

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© 2013 ROHM Co., Ltd. All rights reserved. 7/12 2017.07 - Rev.D
SCT2450KE Datasheet

Electrical characteristic curves

Fig.12 Static Drain - Source On - State Fig.13 Static Drain - Source On - State
Resistance vs. Gate Source Voltage Resistance vs. Junction Temperature
1.4 1
Static Drain - Source On-State Resistance

Static Drain - Source On-State Resistance


Ta=25ºC VGS= 18V
Pulsed 0.9
1.2 Plused
0.8
1 0.7 ID = 6A
: RDS(on) []

: RDS(on) []
ID = 6A 0.6
0.8
0.5
0.6 ID = 3A
ID = 3A 0.4

0.4 0.3

0.2
0.2
0.1

0 0
6 8 10 12 14 16 18 20 22 -50 0 50 100 150 200

Gate - Source Voltage : VGS [V] Junction Temperature : Tj [ºC]

Fig.14 Static Drain - Source On - State


Resistance vs. Drain Current
10
Static Drain - Source On-State Resistance

VGS= 18V
Plused
: RDS(on) []

Ta=150ºC
Ta=125ºC
Ta=75ºC
Ta=25ºC
Ta= 25ºC
0.1
0.1 1 10 100

Drain Current : ID [A]

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© 2013 ROHM Co., Ltd. All rights reserved. 8/12 2017.07 - Rev.D
SCT2450KE Datasheet

Electrical characteristic curves

Fig.15 Typical Capacitance Fig.16 Coss Stored Energy


vs. Drain - Source Voltage
10000 10

9 Ta=25ºC

Coss Stored Energy : EOSS [J]


8
1000
Capacitance : C [pF]

Ciss
7

100 5
Coss
4

3
10 Crss
Ta=25ºC 2
f = 1MHz 1
VGS = 0V
1 0
0.1 1 10 100 1000 0 200 400 600 800

Drain - Source Voltage : VDS [V] Drain - Source Voltage : VDS [V]

Fig.17 Switching Characteristics Fig.18 Dynamic Input Characteristics

10000 20
Ta = 25ºC Ta = 25ºC
VDD = 400V VDD= 400V
Gate - Source Voltage : VGS [V]

tf VGS = 18V ID= 3A


RG= 0 Pulsed
Switching Time : t [ns]

1000 15
Pulsed
td(off)

100 10

td(on)

10 5
tr

1 0
0.1 1 10 100 0 5 10 15 20 25 30

Drain Current : ID [A] Total Gate Charge : Qg [nC]

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© 2013 ROHM Co., Ltd. All rights reserved. 9/12 2017.07 - Rev.D
SCT2450KE Datasheet

Electrical characteristic curves

Fig.19 Typical Switching Loss Fig.20 Typical Switching Loss


vs. Drain - Source Voltage vs. Drain Current
100 300
Ta = 25ºC Ta = 25ºC
90 ID= 3A VDD= 600V
VGS = 18V/0V 250 VGS = 18V/0V
80

Switching Energy : E [J]


Switching Energy : E [J]

RG= 0 RG= 0
70 L=500H L=500H
200
Eon
60
Eon
50 150

40
100
30
Eoff
20 Eoff
50
10

0 0
0 200 400 600 800 1000 0 2 4 6 8 10 12

Drain - Source Voltage : VDS [V] Drain Current : ID [A]

Fig.21 Typical Switching Loss


vs. External Gate Resistance
120
110 Ta = 25ºC
VDD= 600V
100 ID= 3A
Switching Energy : E [J]

90 VGS = 18V/0V Eon


L=500H
80
70
60
50
40
30 Eoff
20
10
0
0 5 10 15 20 25 30

External Gate Resistance : RG []

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© 2013 ROHM Co., Ltd. All rights reserved. 10/12 2017.07 - Rev.D
SCT2450KE Datasheet

Electrical characteristic curves

Fig.22 Inverse Diode Forward Current Fig.23 Reverse Recovery Time


vs. Source - Drain Voltage vs.Inverse Diode Forward Current
10 1000
Inverse Diode Forward Current : IS [A]

VGS=0V Ta=25ºC
di / dt = 110A / s

Reverse Recovery Time : trr [ns]


Pulsed
VR = 400V
VGS = 0V
Pulsed
1

100

0.1 Ta=150ºC
Ta=75ºC
Ta=25ºC
Ta= 25ºC

0.01 10
0 1 2 3 4 5 6 7 8 1 10

Source - Drain Voltage : VSD [V] Inverse Diode Forward Current : IS [A]

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© 2013 ROHM Co., Ltd. All rights reserved. 11/12 2017.07 - Rev.D
SCT2450KE Datasheet

Measurement circuits
Fig.1-1 Switching Time Measurement Circuit Fig.1-2 Switching Waveforms

VGS Pulse width


ID
VDS
RL 50% 90% 50%
VGS 10%
D.U.T.
VDS
10% 10%
RG VDD

90% 90%
td(on) tr td(off) tf

ton toff

Fig.2-1 Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform

VGS VG
ID
VDS
RL Qg

IG(Const.) D.U.T. VGS

VDD Qgs Qgd

Charge

Fig.3-1 Switching Energy Measurement Circuit Fig.3-2 Switching Waveforms

Eon = ID×VDS Eoff = ID×VDS


Same type
D.U.T. L Vsurge
device as
IF Irr
D.U.T. VDS
VDD
DRIVER
D.U.T.
MOSFET
RG

ID
ID

Fig.4-1 Reverse Recovery Time Measurement Circuit Fig.4-2 Reverse Recovery Waveform

IF
D.U.T. L trr
D.U.T.
IF
0
VDD Irr 10%
DRIVER
MOSFET Irr
RG drr / dt

Irr 90%
Irr 100%

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© 2013 ROHM Co., Ltd. All rights reserved. 12/12 2017.07 - Rev.D
Notice

Notes
1) The information contained herein is subject to change without notice.

2) Before you use our Products, please contact our sales representative and verify the latest specifica-
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3) Although ROHM is continuously working to improve product reliability and quality, semicon-
ductors can break down and malfunction due to various factors.
Therefore, in order to prevent personal injury or fire arising from failure, please take safety
measures such as complying with the derating characteristics, implementing redundant and
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4) Examples of application circuits, circuit constants and any other information contained herein are
provided only to illustrate the standard usage and operations of the Products. The peripheral
conditions must be taken into account when designing circuits for mass production.

5) The technical information specified herein is intended only to show the typical functions of and
examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly,
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© 2015 ROHM Co., Ltd. All rights reserved.
R1102S
Datasheet

General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.

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