DSLVDS1047

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DSLVDS1047
SNLS623 – SEPTEMBER 2018
DSLVDS1047 3.3-V LVDS Quad Channel High-Speed Differential Line Driver

1 Features 3 Description
•
1 Designed for Signaling Rates up to 400-Mbps The DSLVDS1047 device is a quad CMOS flow-
through differential line driver designed for
• 3.3-V Power Supply Design applications requiring ultra-low power dissipation and
• 300-ps Typical Differential Skew high data rates. The device is designed to support
• 400-ps Maximum Differential Skew data rates in excess of 400 Mbps (200 MHz) using
• 1.7-ns Maximum Propagation Delay Low Voltage Differential Signaling (LVDS)
technology.
• ±350-mV Differential Signaling
The DSLVDS1047 accepts low voltage TTL/CMOS
• Low Power Dissipation (13 mW at 3.3-V Static)
input levels and translates them to low voltage
• Interoperable With Existing 5-V LVDS Receivers (350 mV) differential output signals. In addition, the
• High impedance on LVDS Outputs on Power driver supports a TRI-STATE function that may be
Down used to disable the output stage, disabling the load
• Flow-Through Pinout Simplifies PCB Layout current, and thus dropping the device to an ultra low
idle power state of 13 mW typical. The DSLVDS1047
• Meets or Exceeds TIA/EIA-644 LVDS Standard has a flow-through pinout for easy PCB layout.
• Industrial Operating Temperature Range
The EN and EN* inputs are ANDed together and
(−40°C to +85°C) control the TRI-STATE outputs. The enables are
• Available in TSSOP Package common to all four drivers. The and companion line
receiver (DSLVDS1048) provide a new alternative to
2 Applications high power psuedo-ECL devices for high speed point-
to-point interface applications.
• Multifunction Printers
• Board-to-Board Communication Device Information(1)
• Test and Measurement PART NUMBER PACKAGE BODY SIZE (NOM)
• Printers DSLVDS1047 TSSOP (16) 5.00 mm × 4.40 mm
• Data Center Interconnect (1) For all available packages, see the orderable addendum at
• Lab Instrumentation the end of the data sheet.
• Ultrasound Scanners
Figure 1. Application Diagram
DSLVDS1047
DSLVDS1048
RIN1+
100
DOUT1+
DIN1 Driver Receiver ROUT1
DOUT1- RIN1-
DOUT2+
100
RIN2+
DOUT2- RIN2-
DOUT3+ RIN3+
100

DOUT3- RIN3-
DOUT4+ RIN4+
100

DOUT4- RIN4-
EN EN
EN* EN*
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
DSLVDS1047
SNLS623 – SEPTEMBER 2018 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.3 Feature Description................................................. 13
2 Applications ........................................................... 1 8.4 Device Functional Modes........................................ 14
3 Description ............................................................. 1 9 Application and Implementation ........................ 15
4 Revision History..................................................... 2 9.1 Application Information............................................ 15
9.2 Typical Application ................................................. 15
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4 10 Power Supply Recommendations ..................... 18
6.1 Absolute Maximum Ratings ...................................... 4 11 Layout................................................................... 18
6.2 ESD Ratings.............................................................. 4 11.1 Layout Guidelines ................................................. 18
6.3 Recommended Operating Conditions....................... 4 11.2 Layout Example .................................................... 19
6.4 Thermal Information .................................................. 4 12 Device and Documentation Support ................. 20
6.5 Electrical Characteristics .......................................... 5 12.1 Receiving Notification of Documentation Updates 20
6.6 Switching Characteristics ......................................... 6 12.2 Community Resources.......................................... 20
6.7 Typical Characteristics .............................................. 7 12.3 Trademarks ........................................................... 20
7 Parameter Measurement Information .................. 9 12.4 Electrostatic Discharge Caution ............................ 20
12.5 Glossary ................................................................ 20
8 Detailed Description ............................................ 12
8.1 Overview ................................................................. 12 13 Mechanical, Packaging, and Orderable
8.2 Functional Block Diagram ....................................... 13
Information ........................................................... 21
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE REVISION NOTES

September 2018 * Initial release.
2 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated
Product Folder Links: DSLVDS1047

DSLVDS1047
www.ti.com SNLS623 – SEPTEMBER 2018
5 Pin Configuration and Functions
PW Package
16-Pin TSSOP
Top View
EN 1 16 DOUT1í
DIN1 2 15 DOUT1+
DIN2 3 14 DOUT2+
VCC 4 13 DOUT2í
GND 5 12 DOUT3í
DIN3 6 11 DOUT3+
DIN4 7 10 DOUT4+
EN* 8 9 DOUT4í
Not to scale
Pin Functions
PIN
I/O DESCRIPTION
NO. NAME
2 DIN1
3 DIN2
I Driver input pin, TTL/CMOS compatible
6 DIN3
7 DIN4
10 DOUT4+
11 DOUT3+
O Non-inverting driver output pin, LVDS levels
14 DOUT2+
15 DOUT1+
9 DOUT4−
12 DOUT3−
O Inverting driver output pin, LVDS levels
13 DOUT2−
16 DOUT1−
Driver enable pin: When EN is low, the driver is disabled. When EN is high and EN* is low
1 EN I or open, the driver is enabled. If both EN and EN* are open circuit, then the driver is
disabled.
Driver enable pin: When EN* is high, the driver is disabled. When EN* is low or open and
8 EN* I EN is high, the driver is enabled. If both EN and EN* are open circuit, then the driver is
disabled.
5 GND — Ground pin
4 VCC — Power supply pin, +3.3 V ± 0.3 V
Copyright © 2018, Texas Instruments Incorporated Submit Documentation Feedback 3

DSLVDS1047
6 Specifications
6.1 Absolute Maximum Ratings
(1)
See
MIN MAX UNIT
Supply voltage (VCC) −0.3 4 V
Input voltage (DIN) −0.3 VCC + 0.3 V
Enable input voltage (EN, EN*) −0.3 VCC + 0.3 V
Output voltage (DOUT+, DOUT–) −0.3 3.9 V
Short-circuit duration (DOUT+, DOUT–) Continuous
Maximum package power PW0016A package 866 mW
dissipation at +25°C Derate PW0016A package above +25°C 6.9 mW/°C
Lead temperature Soldering (4 s) 260 °C
Maximum junction temperature 150 °C
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings

VALUE UNIT
(2)
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 ±1200
(1) Charged-device model (CDM), per JEDEC specification JESD22- V
V(ESD) Electrostatic discharge ±200
C101 (3)
Machine Model ±1200
(1) ESD Ratings:

HBM (1.5 kΩ, 100 pF)
EIAJ (0 Ω, 200 pF)
(2) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
Supply voltage, VCC 3 3.3 3.6 V
Operating free air temperature, TA −40 25 85 °C
6.4 Thermal Information

DSLVDS1047
THERMAL METRIC (1) PW (TSSOP) UNIT
16 PINS
RθJA Junction-to-ambient thermal resistance 114 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51 °C/W
RθJB Junction-to-board thermal resistance 59 °C/W
ψJT Junction-to-top characterization parameter 8 °C/W
ψJB Junction-to-board characterization parameter 58 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.

DSLVDS1047
6.5 Electrical Characteristics

Over supply voltage and operating temperature ranges, unless otherwise specified (1) (2) (3)
PARAMETER TEST CONDITIONS PIN MIN TYP MAX UNIT
VOD1 Differential output voltage 250 310 450 mV
Change in magnitude of VOD1 for
ΔVOD1 1 35 |mV|
complementary output states
VOS Offset voltage DOUT− 1.125 1.17 1.375 V
RL = 100 Ω (Figure 18)
Change in magnitude of VOS for DOUT+
ΔVOS 1 25 |mV|
complementary output states
VOH Output high voltage 1.33 1.6 V
VOL Output low voltage 0.9 1.02 V
VIH Input high voltage 2 VCC V
VIL Input low voltage GND 0.8 V
DIN,
IIH Input high current VIN = VCC or 2.5 V EN, 2 15 µA
EN*
IIL Input low current VIN = GND or 0.4 V 2 15 µA
VCL Input clamp voltage ICL = −18 mA −1.5 −0.8 V
ENABLED,
IOS Output short-circuit current (4) DIN = VCC, DOUT+ = 0 V or −4 −8 mA
DIN = GND, DOUT− = 0 V
Differential output short-circuit
IOSD ENABLED, VOD = 0 V DOUT− −4.2 −9 mA
current (4)
DOUT+
VOUT = 0 V or 3.6 V, VCC = 0 V or
IOFF Power-off leakage −20 ±1 20 µA
Open
EN = 0.8 V and EN* = 2.0 V
IOZ Output TRI-STATE current −10 ±1 10 µA
VOUT = 0 V or VCC
ICC No load supply current drivers enabled DIN = VCC or GND 4 8 mA
RL = 100 Ω all channels, DIN = VCC
ICCL Loaded supply current drivers enabled 20 30 mA
or GND (all inputs) VCC
No load supply current drivers DIN = VCC or GND, EN = GND,
ICCZ 2.2 6 mA
disabled EN* = VCC
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
except: VOD1 and ΔVOD1.
(2) All typicals are given for: VCC = 3.3 V, TA = +25°C.
(3) The DSLVDS1047 is a current mode device and only functions within datasheet specifications when a resistive load is applied to the
driver outputs typical range is (90 Ω to 110 Ω).
(4) Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only.

DSLVDS1047
6.6 Switching Characteristics

VCC = +3.3V ± 10%, TA = −40°C to +85°C (1) (2) (3)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Differential propagation delay high to
tPHLD 0.5 0.9 1.7 ns
low
Differential propagation delay low to
tPLHD 0.5 1.2 1.7 ns
high
tSKD1 Differential pulse skew |tPHLD − tPLHD| (4) 0.3 0.4 ns
RL = 100 Ω, CL = 15 pF
tSKD2 Channel-to-channel skew (5) (Figure 19 and Figure 20) 0.4 0.5 ns
tSKD3 Differential part-to-part skew (6) 0 1 ns
(7)
tSKD4 Differential part-to-part skew 0 1.2 ns
tTLH Rise time 0.5 1.5 ns
tTHL Fall time 0.5 1.5 ns
tPHZ Disable time high to Z 2 5 ns
tPLZ Disable time low to Z RL = 100 Ω, CL = 15 pF 2 5 ns
tPZH Enable time Z to high (Figure 21 and Figure 22) 3 7 ns
tPZL Enable time Z to low 3 7 ns
(8)
fMAX Maximum operating frequency 200 250 MHz
(1) All typicals are given for: VCC = 3.3 V, TA = +25°C.

(2) Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50 Ω, tr ≤ 1 ns, and tf ≤ 1 ns.
(3) CL includes probe and jig capacitance.
(4) tSKD1 |tPHLD – tPLHD| is the magnitude difference in differential propagation delay time between the positive going edge and the negative
going edge of the same channel.
(5) tSKD2 is the differential channel-to-channel skew of any event on the same device.
(6) tSKD3, differential part-to-part skew, is defined as the difference between the minimum and maximum specified differential propagation
delays. This specification applies to devices at the same VCC and within 5°C of each other within the operating temperature range.
(7) tSKD4, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices
over recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min|
differential propagation delay.
(8) fMAX generator input conditions: tr = tf < 1 ns (0% to 100%), 50% duty cycle, 0 V to 3 V. Output criteria: duty cycle = 45% / 55%,
VOD > 250 mV, all channels switching.

DSLVDS1047
6.7 Typical Characteristics
Figure 2. Output High Voltage vs Power Supply Voltage Figure 3. Output Low Voltage vs Power Supply Voltage
Figure 4. Output Short Circuit Current vs Figure 5. Output TRI-STATE Current vs

Power Supply Voltage Power Supply Voltage
Figure 6. Differential Output Voltage vs Figure 7. Differential Output Voltage vs Load Resistor
Power Supply Voltage

DSLVDS1047
Typical Characteristics (continued)
Figure 8. Offset Voltage vs Power Supply Voltage Figure 9. Power Supply Current vs Power Supply Voltage
Figure 10. Power Supply Current vs Ambient Temperature Figure 11. Differential Propagation Delay vs
Power Supply Voltage
Figure 12. Differential Propagation Delay vs Figure 13. Differential Skew vs Power Supply Voltage
Ambient Temperature

DSLVDS1047
Typical Characteristics (continued)
Figure 14. Differential Skew vs Ambient Temperature Figure 15. Transition Time vs Power Supply Voltage
Figure 16. Transition Time vs Ambient Temperature Figure 17. Data Rate vs Cable Length
7 Parameter Measurement Information
Figure 18. Driver VOD and VOS Test Circuit

DSLVDS1047
Parameter Measurement Information (continued)
Figure 19. Driver Propagation Delay and Transition Time Test Circuit
Figure 20. Driver Propagation Delay and Transition Time Waveforms
Figure 21. Driver TRI-STATE Delay Test Circuit

DSLVDS1047
Parameter Measurement Information (continued)
Figure 22. Driver TRI-STATE Delay Waveform

DSLVDS1047
8 Detailed Description
8.1 Overview
LVDS drivers and receivers are intended to be primarily used in an uncomplicated point-to-point configuration as
is shown in Figure 24. This configuration provides a clean signaling environment for the fast edge rates of the
drivers. The receiver is connected to the driver through a balanced media which may be a standard twisted pair
cable, a parallel pair cable, or simply PCB traces. Typically, the characteristic differential impedance of the media
is in the range of 100 Ω. A termination resistor of 100 Ω (selected to match the media), and is located as close to
the receiver input pins as possible. The termination resistor converts the driver output current (current mode) into
a voltage that is detected by the receiver. Other configurations are possible such as a multi-receiver
configuration, but the effects of a mid-stream connector(s), cable stub(s), and other impedance discontinuities as
well as ground shifting, noise margin limits, and total termination loading must be taken into account.
The DSLVDS1047 differential line driver is a balanced current source design. A current mode driver, generally
speaking has a high output impedance and supplies a constant current for a range of loads (a voltage mode
driver on the other hand supplies a constant voltage for a range of loads). Current is switched through the load in
one direction to produce a logic state and in the other direction to produce the other logic state. The output
current is typically 3.1 mA, a minimum of 2.5 mA, and a maximum of 4.5 mA. The current mode driver requires
that a resistive termination be employed to terminate the signal and to complete the loop as shown in Figure 24.
AC or unterminated configurations are not allowed. The 3.1-mA loop current develops a differential voltage of
310 mV across the 100-Ω termination resistor which the receiver detects with a 250-mV minimum differential
noise margin, (driven signal minus receiver threshold (250 mV – 100 mV = 150 mV). The signal is centered
around +1.2 V (Driver Offset, VOS) with respect to ground as shown in Figure 23.
NOTE
The steady-state voltage (VSS) peak-to-peak swing is twice the differential voltage (VOD)
and is typically 620 mV.
The current mode driver provides substantial benefits over voltage mode drivers, such as an RS-422 driver. Its
quiescent current remains relatively flat versus switching frequency. Whereas the RS-422 voltage mode driver
increases exponentially in most case from 20 MHz to 50 MHz. This is due to the overlap current that flows
between the rails of the device when the internal gates switch. Whereas the current mode driver switches a fixed
current between its output without any substantial overlap current. This is similar to some ECL and PECL
devices, but without the heavy static ICC requirements of the ECL/PECL designs. LVDS requires > 80% less
current than similar PECL devices. AC specifications for the driver are a tenfold improvement over other existing
RS-422 drivers.
The TRI-STATE function allows the driver outputs to be disabled, thus obtaining an even lower power state when
the transmission of data is not required.

DSLVDS1047
8.2 Functional Block Diagram
8.3 Feature Description

8.3.1 LVDS Fail-Safe
This section addresses the common concern of fail-safe biasing of LVDS interconnects, specifically looking at the
DSLVDS1047 driver outputs and the DSLVDS1048 receiver inputs.
The LVDS receiver is a high-gain, high-speed device that amplifies a small differential signal (20 mV) to CMOS
logic levels. Due to the high gain and tight threshold of the receiver, take care to prevent noise from appearing as
a valid signal.
The internal fail-safe circuitry of the receiver is designed to source or sink a small amount of current, providing
fail-safe protection (a stable known state of HIGH output voltage) for floating, terminated, or shorted receiver
inputs.
1. Open Input Pins. The DSLVDS1048 is a quad receiver device, and if an application requires only 1, 2, or 3
receivers, the unused channel(s) inputs must be left OPEN. Do not tie unused receiver inputs to ground or
any other voltages. The input is biased by internal high value pullup and pulldown resistors to set the output
to a HIGH state. This internal circuitry ensures a HIGH, stable output state for open inputs.
2. Terminated Input. If the DSLVDS1047 driver is disconnected (cable unplugged), or if the DSLVDS1047
driver is in a TRI-STATE or power-off condition, the receiver output is again in a HIGH state, even with the
end of cable 100-Ω termination resistor across the input pins. The unplugged cable can become a floating
antenna which can pick up noise. If the cable picks up more than 10 mV of differential noise, the receiver
may see the noise as a valid signal and switch. To insure that any noise is seen as common-mode and not
differential, a balanced interconnect must be used. Twisted pair cable offers better balance than flat ribbon
cable.
3. Shorted Inputs. If a fault condition occurs that shorts the receiver inputs together, thus resulting in a 0-V
differential input voltage, the receiver output remains in a HIGH state. Shorted input fail-safe is not supported
across the common-mode range of the device (GND to 2.4 V). It is only supported with inputs shorted and no
external common-mode voltage applied.

DSLVDS1047
Feature Description (continued)

External lower value pullup and pulldown resistors (for a stronger bias) may be used to boost fail-safe in the
presence of higher noise levels. The pullup and pulldown resistors should be in the 5-kΩ to 15-kΩ range to
minimize loading and waveform distortion to the driver. The common-mode bias point should be set to
approximately 1.2 V (less than 1.75 V) to be compatible with the internal circuitry.
Figure 23. Driver Output Levels
8.4 Device Functional Modes

Table 1 lists the functional modes DSLVDS1047.
Table 1. Truth Table

ENABLES INPUT OUTPUTS
EN EN* DIN DOUT+ DOUT−
L L H
H L or Open
H H L
All other combinations of ENABLE inputs X Z Z

DSLVDS1047
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information

The DSLVDS1047 has a flow-through pinout that allows for easy PCB layout. The LVDS signals on one side of
the device easily allows for matching electrical lengths of the differential pair trace lines between the driver and
the receiver as well as allowing the trace lines to be close together to couple noise as common-mode. Noise
isolation is achieved with the LVDS signals on one side of the device and the TTL signals on the other side.
9.2 Typical Application
DSLVDS1047
DSLVDS1048
100
DOUT1+ RIN1+
DOUT1- RIN1-
DOUT2+
100
RIN2+
DOUT2- RIN2-
DOUT3+ RIN3+
100

DOUT3- RIN3-
DOUT4+ RIN4+
100

DOUT4- RIN4-
EN EN
EN* EN*
Figure 24. Point-to-Point Application

DSLVDS1047
Typical Application (continued)

9.2.1 Design Requirements
When using LVDS devices, it is important to remember to specify controlled impedance PCB traces, cable
assemblies, and connectors. All components of the transmission media should have a matched differential
impedance of about 100 Ω. They should not introduce major impedance discontinuities.
Balanced cables (for example, twisted pair) are usually better than unbalanced cables (ribbon cable) for noise
reduction and signal quality. Balanced cables tend to generate less EMI due to field canceling effects and also
tend to pick up electromagnetic radiation as common-mode (not differential mode) noise which is rejected by the
LVDS receiver.
For cable distances < 0.5 M, most cables can be made to work effectively. For distances 0.5 M ≤ d ≤ 10 M,
CAT5 (Category 5) twisted pair cable works well, is readily available and relatively inexpensive.
Table 2. Design Requirements

DESIGN PARAMETERS EXAMPLE VALUE
Driver Supply Voltage (VCC) 3.0 to 3.6 V
Driver Input Voltage 0 to 3.6 V
Driver Signaling Rate DC to 400 Mbps
Interconnect Characteristic Impedance 100 Ω
Termination Resistance 100 Ω
Number of Receiver Nodes 1
Ground shift between driver and receiver ±1 V
9.2.2 Detailed Design Procedure
9.2.2.1 Probing LVDS Transmission Lines

Always use high impedance (> 100 kΩ), low capacitance (< 2 pF) scope probes with a wide bandwidth (1 GHz)
scope. Improper probing gives deceiving results.
9.2.2.2 Data Rate vs Cable Length Graph Test Procedure

A pseudo-random bit sequence (PRBS) of 29−1 bits was programmed into a function generator (Tektronix
HFS9009) and connected to the driver inputs through 50-Ω cables and SMB connectors. An oscilloscope
(Tektronix 11801B) was used to probe the resulting eye pattern, measured differentially at the input to the
receiver. A 100-Ω resistor was used to terminate the pair at the far end of the cable. The measurements were
taken at the far end of the cable, at the input of the receiver, and used for the jitter analysis for this graph
(Figure 17). The frequency of the input signal was increased until the measured jitter (ttcs) equaled 20% with
respect to the unit interval (ttui) for the particular cable length under test. Twenty percent jitter is a reasonable
place to start with many system designs. The data used was NRZ. Jitter was measured at the 0-V differential
voltage of the differential eye pattern. The DSLVDS1047 and DSLVDS1048 can be evaluated using the new
DS90LV047-048AEVM.
Figure 25 shows very good typical performance that can be used as a design guideline for data rate vs cable
length. Increasing the jitter percentage increases the curve respectively, allowing the device to transmit faster
over longer cable lengths. This relaxes the jitter tolerance of the system allowing more jitter into the system,
which could reduce the reliability and efficiency of the system. Alternatively, decreasing the jitter percentage has
the opposite effect on the system. The area under the curve is considered the safe operating area based on the
above signal quality criteria. For more information on eye pattern testing, please see AN-808 Long Transmission
Lines and Data Signal Quality (SNLA028).

DSLVDS1047
9.2.3 Application Curve
Figure 25. Power Supply Current vs Frequency

DSLVDS1047
10 Power Supply Recommendations

Although the DSLVDS1047 draws very little power while at rest. At higher switching frequencies there is a
dynamic current component which increases the overall power consumption. The DSLVDS1047 power supply
connection must take this additional current consumption into consideration for maximum power requirements.
11 Layout
11.1 Layout Guidelines

• Use at least 4 PCB layers (top to bottom); LVDS signals, ground, power, TTL signals.
• Isolate TTL signals from LVDS signals, otherwise the TTL may couple onto the LVDS lines. It is best to put
TTL and LVDS signals on different layers which are isolated by a power/ground plane(s).
• Keep drivers and receivers as close to the (LVDS port side) connectors as possible.
11.1.1 Power Decoupling Recommendations

Bypass capacitors must be used on power pins. Use high frequency ceramic (surface mount is recommended)
0.1-µF and 0.001-µF capacitors in parallel at the power supply pin with the smallest value capacitor closest to the
device supply pin. Additional scattered capacitors over the printed-circuit board improves decoupling. Multiple
vias must be used to connect the decoupling capacitors to the power planes. A 10-µF (35-V) or greater solid
tantalum capacitor must be connected at the power entry point on the printed-circuit board between the supply
and ground.
11.1.2 Differential Traces

Use controlled impedance traces which match the differential impedance of your transmission medium (that is,
cable) and termination resistor. Run the differential pair trace lines as close together as possible as soon as they
leave the IC (stubs must be < 10 mm long). This helps eliminate reflections and ensure noise is coupled as
common-mode. In fact, we have seen that differential signals which are 1 mm apart radiate far less noise than
traces 3 mm apart since magnetic field cancellation is much better with the closer traces. In addition, noise
induced on the differential lines is much more likely to appear as common-mode which is rejected by the
receiver.
Match electrical lengths between traces to reduce skew. Skew between the signals of a pair means a phase
difference between signals, which destroys the magnetic field cancellation benefits of differential signals and
EMI, results.
NOTE
The velocity of propagation, v = c/Er where c (the speed of light) = 0.2997mm/ps or
0.0118 in/ps
Do not rely solely on the autoroute function for differential traces. Carefully review dimensions to match
differential impedance and provide isolation for the differential lines. Minimize the number or vias and other
discontinuities on the line.
Avoid 90° turns (these cause impedance discontinuities). Use arcs or 45° bevels.
Within a pair of traces, the distance between the two traces must be minimized to maintain common-mode
rejection of the receivers. On the printed-circuit board, this distance must remain constant to avoid discontinuities
in differential impedance. Minor violations at connection points are allowable.
11.1.3 Termination
Use a termination resistor which best matches the differential impedance or your transmission line. The resistor
must be between 90 Ω and 130 Ω. Remember that the current mode outputs need the termination resistor to
generate the differential voltage. LVDS does not work without resistor termination. Typically, connecting a single
resistor across the pair at the receiver end will suffice.

DSLVDS1047
Layout Guidelines (continued)

Surface mount 1% to 2% resistors are best. PCB stubs, component lead, and the distance from the termination
to the receiver inputs must be minimized. The distance between the termination resistor and the receiver should
be < 10 mm (12 mm maximum).
11.2 Layout Example

DS90LV047A DS90LV048A
1 EN DOUT1- 16 1 RIN1- EN 16 Series Termination (optional)
2 DIN1 DOUT1+ 15 2 RIN1+ ROUT1 15

LVCMOS LVCMOS
Inputs 3 DIN2 DOUT2+ 14 3 RIN2+ ROUT2 14 Outputs
DOUT2- 4 RIN2- 13 Decoupling Cap
4 VCC 13 VCC
5 GND DOUT3- 12 5 RIN3- GND 12

Decoupling Cap
8 EN* DOUT4- 9 8 RIN4- EN* 9 Series Termination (optional)
Input Termination
(Required)
Figure 26. Layout Recommendation

DSLVDS1047
12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

DSLVDS1047
13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
DSLVDS1047PWR ACTIVE TSSOP PW 16 2500 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DSLVDS
1047
DSLVDS1047PWT ACTIVE TSSOP PW 16 250 RoHS & Green SN Level-1-260C-UNLIM -40 to 85 DSLVDS
1047
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Aug-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS TAPE DIMENSIONS

K0 P1
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2 Q1 Q2
Q3 Q4 Q3 Q4 User Direction of Feed
Pocket Quadrants
*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
DSLVDS1047PWR TSSOP PW 16 2500 330.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1
DSLVDS1047PWT TSSOP PW 16 250 178.0 12.4 6.95 5.6 1.6 8.0 12.0 Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DSLVDS1047PWR TSSOP PW 16 2500 367.0 367.0 35.0
DSLVDS1047PWT TSSOP PW 16 250 210.0 185.0 35.0
Pack Materials-Page 2
PACKAGE OUTLINE
PW0016A SCALE 2.500
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
SEATING
PLANE
6.6 C
TYP
A 6.2
0.1 C
PIN 1 INDEX AREA
14X 0.65
16
1
2X
5.1 4.55
4.9
NOTE 3
8
9
0.30
4.5 16X 1.2 MAX
B 0.19
4.3
NOTE 4 0.1 C A B
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.75
0.50
0 -8
DETAIL A
A 20
TYPICAL
4220204/A 02/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0016A TSSOP - 1.2 mm max height
16X (1.5) SYMM

(R0.05) TYP
1
16X (0.45) 16
SYMM
14X (0.65)
8 9
(5.8)
LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE: 10X
SOLDER MASK METAL UNDER SOLDER MASK

METAL SOLDER MASK OPENING
OPENING
EXPOSED METAL EXPOSED METAL
0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND
NON-SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED) SOLDER MASK DETAILS
15.000
4220204/A 02/2017
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0016A TSSOP - 1.2 mm max height
16X (1.5) SYMM

(R0.05) TYP
1
16X (0.45) 16
SYMM
14X (0.65)
8 9
(5.8)
SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
4220204/A 02/2017
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022, Texas Instruments Incorporated

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DSLVDS1047 3.3-V LVDS Quad Channel High-Speed Differential Line Driver

DIN3 Driver Receiver ROUT3

DIN4 Driver Receiver ROUT4

DATE REVISION NOTES

2 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated

Product Folder Links: DSLVDS1047

5 Pin Configuration and Functions

Copyright © 2018, Texas Instruments Incorporated Submit Documentation Feedback 3

6.2 ESD Ratings

(1) ESD Ratings:

6.3 Recommended Operating Conditions

6.4 Thermal Information

4 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated

Product Folder Links: DSLVDS1047

6.5 Electrical Characteristics

Copyright © 2018, Texas Instruments Incorporated Submit Documentation Feedback 5

6.6 Switching Characteristics

(1) All typicals are given for: VCC = 3.3 V, TA = +25°C.

6 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated

Product Folder Links: DSLVDS1047

6.7 Typical Characteristics

Figure 4. Output Short Circuit Current vs Figure 5. Output TRI-STATE Current vs

Copyright © 2018, Texas Instruments Incorporated Submit Documentation Feedback 7

Typical Characteristics (continued)

8 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated

Product Folder Links: DSLVDS1047

Typical Characteristics (continued)

7 Parameter Measurement Information

Figure 18. Driver VOD and VOS Test Circuit

Copyright © 2018, Texas Instruments Incorporated Submit Documentation Feedback 9

Parameter Measurement Information (continued)

Figure 20. Driver Propagation Delay and Transition Time Waveforms

Figure 21. Driver TRI-STATE Delay Test Circuit

10 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated

Product Folder Links: DSLVDS1047

Parameter Measurement Information (continued)

Figure 22. Driver TRI-STATE Delay Waveform

Copyright © 2018, Texas Instruments Incorporated Submit Documentation Feedback 11

12 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated

Product Folder Links: DSLVDS1047

8.2 Functional Block Diagram

8.3 Feature Description

Copyright © 2018, Texas Instruments Incorporated Submit Documentation Feedback 13

Feature Description (continued)

Figure 23. Driver Output Levels

8.4 Device Functional Modes

Table 1. Truth Table

14 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated

Product Folder Links: DSLVDS1047

9 Application and Implementation

9.1 Application Information

9.2 Typical Application

DIN3 Driver Receiver ROUT3

DIN4 Driver Receiver ROUT4

Figure 24. Point-to-Point Application

Copyright © 2018, Texas Instruments Incorporated Submit Documentation Feedback 15

Typical Application (continued)

Table 2. Design Requirements