P3449 B01 PCB Stackup

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STACKUP CROSSECTION - 607-13449-1000-B01.

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NOTES: 1. UNLESS OTHERWISE SPECIFIED ON THE 606 FAB DRAWING: WHERE GOLD EDGE FINGERS EXIST,
TARGET THICKNESS APPLIES ONLY TO THE GOLD FINGER REGION, AND DOES NOT INCLUDE SOLDERMASK.
2. STRIPLINE LAYERS MAY BE USED FOR PLANE REFERENCES (REF). LAYERS WITHOUT TRACES SHOULD BE CONSIDERED PLANES.
3. *DESIGN USES TRACE WIDTHS WITH VARIATION OF +/- 1um COMPARED TO TARGET WIDTH. CONSIDER IMPEDANCE CONTROLLED BASED ON TARGET WIDTH.
4. DK VALUES: IMPEDANCE CALCULATIONS ASSUME A DK VALUE BASED ON THE DISTRIBUTION OF MATERIALS AVAILABLE. THE FABRICATOR IS
ALLOWED TO ADJUST TRACE WIDTHS +/- 20% FOR NOMINAL LINE WIDTHS OF >0.127mm or +/-0.0254mm FOR TRACE WIDTHS <0.127mm TO COMPENSATE FOR THE
Dk VALUE OF THE ACTUAL MATERIAL USED IN THE STACK-UP.
5. MULTI PLY CORE IS DENOTED BY x2, x3 IN THE MATERIAL NAME, e.g. EM-890K 0.006 1078(rc63.5)x2 Core
6. MATERIAL: HALOGEN FREE.

Target Thickness: 1.57


Tolerance: +0.15/-0.15

Name Negative Layer Material Thickness


Artwork Usage
Air
Soldermask 0.018
TOP Signal Layer Copper .5oz (Plated) 0.043
FR-4 0.0027 1080x1 Prepreg 0.069
L2 Plane Layer Copper 1oz 0.03
FR-4 0.051 Filler 1.295
L3 Plane Layer Copper 1oz 0.03
FR-4 0.0027 1080x1 Prepreg 0.069
BOTTOM Signal Layer Copper .5oz (Plated) 0.043
Soldermask 0.018
Air

ALL NVIDIA DESIGN SPECIFICATIONS, REFERENCE SPECIFICATIONS, REFERENCE BOARDS, FILES, DRAWINGS, DIAGNOSTICS, LISTS AND OTHER DOCUMENTS OR
INFORMATION (TOGETHER AND SEPARATELY, 'MATERIALS') ARE BEING PROVIDED 'AS IS.' THE MATERIALS MAY CONTAIN KNOWN AND UNKNOWN VIOLATIONS OR
DEVIATIONS OF INDUSTRY STANDARDS AND SPECIFICATIONS. NVIDIA MAKES NO WARRANTIES, EXPRESSED, IMPLIED, STATUTORY OR OTHERWISE WITH RESPECT
TO THE MATERIALS OR OTHERWISE, AND EXPRESSLY DISCLAIMS ALL IMPLIED WARRANTIES INCLUDING, WITHOUT LIMITATION, THE WARRANTIES OF DESIGN,
OF INFRINGEMENT, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, OR ARISING FROM A COURSE OF DEALING, TRADE USAGE, TRADE PRACTICE,
OR INDUSTRY STANDARDS.

THIS DRAWING CONTAINS INFORMATION WHICH IS THE PROPRIETARY PROPERTY OF NVIDIA CORPORATION.THIS DRAWING IS RECEIVED IN CONFIDENCE AND ITS
CONTENTS MAY NOT BE DISCLOSED WITHOUT THE PRIOR WRITTEN CONSENT OF NVIDIA CORPORATION.

©1999-2019 NVIDIA CORPORATION

LEGEND:

NVIDIA Corporation
2701 San Thomas Expressway, Santa Clara, CA 95050, USA

STACKUP DRAWING - 607-13449-1000-B01.pdf

05/08/2019 Drawing units: mm Sheet 1 of 2


STACKUP IMPEDANCES - 607-13449-1000-B01.pdf
(Impedance Tolerance = +/- 10% unless otherwise noted)
Single Ended SEZ LW Ref(above) Ref(below)
TOP 50.0 0.112 L2
L2 50.0 0.084 TOP L3
BOTTOM 50.0 0.112 L3

Differential (Edge) DEZ SEZ LW LineGap NeckLW NeckLineGap Ref(above) Ref(below)


TOP 85.0 0.106 0.102 L2
TOP 90.0 0.101 0.12 L2
TOP 95.0 0.102 0.179 L2
BOTTOM 85.0 0.106 0.102 L3
BOTTOM 90.0 0.101 0.12 L3
BOTTOM 95.0 0.102 0.179 L3

LEGEND:
SEZ = Single Ended Impedance
DEZ = Differential Edge Coupled Impedance (pair on one layer)
DBZ = Differential Broadside Coupled Impedance (pair on two layers)

NVIDIA Corporation
2701 San Thomas Expressway, Santa Clara, CA 95050, USA

STACKUP DRAWING - 607-13449-1000-B01.pdf

05/08/2019 Drawing units: mm Sheet 2 of 2

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