IV Semester Scheme Syllabus 2023 Manufacturing
IV Semester Scheme Syllabus 2023 Manufacturing
IV Semester Scheme Syllabus 2023 Manufacturing
TOTAL CREDITS
TOTAL MARKS
HRS PER WEEK
LAB WORK
PAPER SUBJECT
CREDITS
CREDITS
S.N.
DURATION
DURATION
CODE CODE
TERM
MARKS
MARKS
TOTAL
TEST*
I II
1 7461 401 MICROCONTROLLERS & APPLICA. 4 4 10 10 10 30 70 03 Hrs. 2 1 20 30 03 Hrs. 5 150
2 7462 402 ANALOG & DIGITAL COMM.SYSTEM 4 4 10 10 10 30 70 03 Hrs. 4 2 20 30 03 Hrs. 6 150
3 7562 403 CLEAN ROOM TECHNOLOGY 4 4 10 10 10 30 70 03 Hrs. 0 0 0 0 0 4 100
SEMICONDUCTOR TECHNOLOGY
4 7563 404 3 3 10 10 10 30 70 03 Hrs. 0 0 0 0 0 3 100
EQUIPMENT MAINTENANCE
5 7465 405 LINEAR INTEGRATED CIRCUITS 3 3 10 10 10 30 70 03 Hrs. 4 2 20 30 03 Hrs. 5 150
6 MINOR PROJECT 0 0 0 0 0 0 0 0 4 2 20 30 03 Hrs. 2 50
ESSENCE OF INDIAN KNOWLEDGE &
7 2 0 0 0 0 0 0 0 0 0 0 0 0 0 0
TRADITION
8 LIBERARY /SEMINAR/VISITS etc. 0 0 0 0 0 0 0 0 2 0 0 0 0 0 0
TOTAL 20 18 150 350 16 7 80 120 25 700
NOTE - (1)* Two Best,out of Three Mid Term Tests (Progressive Tests) Marks should be entered here.
GRAND TOTAL OF CREDITS GRAND TOTAL OF MARKS
25 700
DIPLOMA WING
RAJIV GANDHI PROUDYOGIKI VISHWAVIDYALAYA, BHOPAL
DIPLOMA IN IC MANUFACTURING (I05)
SEMESTER IV
Course Content:
Unit I: Introduction
Introduction to Microprocessors and Microcontrollers, Architectures [8085,8086] Intel MCS-
51 family features – 8051 -organization and architecture
Unit III
MCS51 and external Interfaces 8 User interface – keyboard, LCD, LED, Real world interface
-
ADC, DAC, SENSORS Communication interface.
Unit V: ARM processor core based microcontrollers 14 Need for RISC Processor-ARM
processor fundamentals, ARM core based controller [LPC214X], IO ports, ADC/DAC,
Timers.
References:
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MICROCONTROLLERS AND APPLICATION LAB
Course Content:
1. Programming 8051 Micro controller using ASM and C, and implementation in flash
8051 microcontroller.
2. Programming with Arithmetic logic instructions [Assembly]
3. Program using constructs (Sorting an array) [Assembly]
4. Programming using Ports [Assembly and C]
5. Delay generation using Timer [Assembly and C]
6. Programming Interrupts [Assembly and C]
7. Implementation of standard UART communication (using hyper terminal) [Assembly
and C].
8. Interfacing LCD Display. [Assembly and C]
9. Interfacing with Keypad [Assembly and C]
10. Programming ADC/DAC [Assembly and C]
11. Interfacing with stepper motor. [Assembly and C]
12. Pulse Width Modulation. [Assembly and C] Programming ARM Micro controller
using ASM and C using simulator. 11.Programming with Arithmetic logic
instructions[Assembly]
13. GPIO programming in ARM microcontroller. [ C Programming].
14. Timers programing in ARM Microcontroller. [C Programming].
References:
******
DIPLOMA WING
RAJIV GANDHI PROUDYOGIKI VISHWAVIDYALAYA, BHOPAL
DIPLOMA IN IC MANUFACTURING (I05)
SEMESTER IV
Course Content:
UNIT 1
UNIT 2
Block diagram and sub-system description of a digital communication system. Sampling of
low-pass and band-pass signals, PAM , PCM, signal to quantization noise ratio analysis of
linear and nonlinear quantizers, Line codes and bandwidth considerations; PCM TDM
hierarchies, frame structures,
frame synchronization and bit stuffing.
UNIT 3
Quantization noise analysis of DM and ADM; DPCM and ADPCM; Low bit rate coding of
speech and video signals. Baseband transmission, matched filter, performance in additive
Gaussian noise; Intersymbol interference (ISI), Nyquist criterion for zero ISI, sinusoidal roll-
off filtering, correlative coding, equalizers and adaptive equalizers; Digital subscriber lines.
UNIT 4
Geometric representation of signals, maximum likelihood decoding; Correlation receiver,
equivalence with matched filter. Generation, detection and probability of error analysis of
OOK, BPSK, coherent and non-coherent FSK, QPSK and DPSK; QAM, MSK and multicarrier
modulation; Comparison of bandwidth and bit rate of digital modulation schemes.
UNIT 5
Introduction to Information and Coding Theories: Information Theory: information measures,
Shan- non entropy, differential entropy, mutual information, capacity theorem for point-to-
point channels with discrete and continuous alphabets. Coding Theory: linear block codes –
definitions, properties, bounds on minimum distance (singleton, Hamming, GV, MRRW), soft
versus hard decision decoding, some specific codes (Hamming, RS, Concatenated);
Convolutional codes – structure, decoding (the Viterbi and BCJR algorithms); Turbo codes,
LDPC codes.
References:
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ANALOG AND DIGITAL COMMUNICATION LAB
Course Content:
References:
******
DIPLOMA WING
RAJIV GANDHI PROUDYOGIKI VISHWAVIDYALAYA, BHOPAL
DIPLOMA IN IC MANUFACTURING (I05)
SEMESTER IV
Unit 1
Cleanroom Technology: construction technology Cleanroom design; heating, ventilation, air
conditioning and refrigeration equipment; lighting, cleanroom components Safety cabinets,
air locks and air showers, floor systems, garments Fundamentals of hygiene cleaning,
disinfection and sterilization; decontamination: garment basics, Performance Requirements
for Clean-Room Garments, Clean-Room garment materials.
Unit 2
Introduction to particle technology, Defects Caused by Particles & lts Probability of
Defect Formation, Quantitative Effect of Particle Defects on Yield, Particle characterization,
particle size distributions, Properties of Particles, Ways to Express Particle Size, Properties of
Aerosols, Particle Statics and Dynamics.
Unit 3
Fundamentals of sedimentation, Filtration technology Introduction to Filtration Mechanisms,
Filter Properties, Pressure Drop, Particle Collection, Filter types and their applications,
Measurement and Minimization of Particles in Process Gases and Process Liquids, ultra-pure
water systems and distribution.
Unit 4
Cleanroom operation Professional behaviour in cleanrooms, air locks and air showers;
measurement exercises; regulations and personnel training, Equipment Cleaning to Minimize
Particle Deposition, Equipment Cleaning Methods.
Unit 5
Clean Equipment Design Rules and the SMIF Isolation Concept, Cleanroom Qualification
and validation, User requirements, quality management, Cleanroom Quality management by
Design methodology and tools Cleanroom Monitoring Measurement techniques for the online
monitoring of cleanrooms Regulations and audits Standards and legal regulations;
References:
SEMESTER IV
Course Content:
Unit 1
Fundamental Troubleshooting Procedures Inside An Electronic Equipment: Reading
Drawings And Diagrams – Block Diagram, Circuit Diagram, Wiring Diagram; Dis-assembly
and re-assembly of equipment, Equipment Failures and causes such as poor design, production
deficiencies, careless storage and transport, inappropriate operating conditions, Nature of
faults, Fault location procedure, Fault finding aids – Service and maintenance manuals and
instruction manuals, Test and Measuring instruments, special tools Troubleshooting
techniques, Approaching components for tests, Grounding systems in Electronic Equipment,
Temperature sensitive Intermittent problems Corrective actions, Situations where repairs
should not be attempted.
Unit 2
Passive Components and Their Testing Passive Components- Resistors, Capacitors, Inductors
Failures in fixed resistors, testing of resistors, variable resistors, variable resistors as
potentiometers, failures in potentiometers, testing of potentiometers, servicing potentiometers,
LDRs and Thermistors Types of capacitors and their performance, Failures in capacitors,
testing of capacitors and precautions therein, variable capacitor types, Testing of inductors and
inductance measurement
Unit 3
Testing of Semiconductor Devices Types of semiconductor devices, Causes of failure in
Semiconductor Devices, Types of failure Test procedures for Diodes, special types of Diodes,
Bipolar Junction Transistors, Field Effect Transistors, Thyristors Operational Amplifiers, Fault
diagnosis in op-amp circuits
Unit 4
Logic IC families, Packages in Digital ICs, IC identification, IC pin-outs, Handling ICs, Digital
troubleshooting methods – typical faults, testing digital ICs with pulse generators Logic clip,
Logic Probe, Logic Pulser, Logic Current Tracer, Logic Comparator Special consideration for
fault diagnosis in digital circuits Handling precautions for ICs sensitive to static electricity
Testing flip-flops, counters, registers, multiplexers and de-multiplexers, encoders and
decoders; Tri-state logic.
Unit 5
Rework and Repair of Surface Mount Assemblies Surface Mount Technology and surface
mount devices Surface Mount Semiconductor packages – SOIC, SOT, LCCC, LGA, BGA,
COB, Flatpacks and Quad Packs, Cylindrical Diode Packages, Packaging of Passive
Components as SMDs Repairing Surface Mount PCBs, Rework Stations.
Textbook/ References:
SEMESTER IV
Course Contents:
******
LINEAR INTEGRATED CIRCUITS LAB
List of Practicals/Experiments:
Learning resources:
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DIPLOMA WING
RAJIV GANDHI PROUDYOGIKI VISHWAVIDYALAYA, BHOPAL
DIPLOMA IN IC MANUFACTURING (I05)
SEMESTER - IV
MINOR PROJECT –
Evaluation is based on work done, quality of report
performance in viva-voce, presentation etc.
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DIPLOMA WING
RAJIV GANDHI PROUDYOGIKI VISHWAVIDYALAYA,BHOPAL
DIPLOMA IN IC MANUFACTURING (I05)
SEMESTER - IV
Course Content:
Basic Structure of Indian Knowledge System:
(i) osद, (ii) उऩosद (आयosद, /kuqosn xU/kosn LFkkऩR; आदद) (iii) osnkax (f’k{kk dYu
uu:r O;kdj.k T;ksur"k Nkan ),
(iv) उऩTइग (/keZ j~hj~kl
a k, ऩqjk.k, rdfeL=)
Modern Science and Indian Knowledge System
Yoga and Holistic Health care
Case Studies.
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