Tim Sensor
Tim Sensor
Tim Sensor
TiM3xx
2D LiDAR sensors
Product described
TiM3xx
Manufacturer
SICK AG
Erwin-Sick-Str. 1
79183 Waldkirch
Germany
Legal information
This work is protected by copyright. Any rights derived from the copyright shall be
reserved for SICK AG. Reproduction of this document or parts of this document is
only permissible within the limits of the legal determination of Copyright Law. Any modi‐
fication, abridgment or translation of this document is prohibited without the express
written permission of SICK AG.
The trademarks stated in this document are the property of their respective owner.
© SICK AG. All rights reserved.
Original document
This document is an original document of SICK AG.
25
Contents
1 About this document........................................................................ 5
1.1 Information on the operating instructions.............................................. 5
1.2 Explanation of symbols............................................................................ 5
1.3 Further information................................................................................... 6
2 Safety information............................................................................ 7
2.1 Intended use............................................................................................. 7
2.2 Improper use............................................................................................. 7
2.3 Cybersecurity............................................................................................ 7
2.4 Limitation of liability................................................................................. 8
2.5 Modifications and conversions................................................................ 8
2.6 Requirements for skilled persons and operating personnel.................. 8
2.7 Operational safety and specific hazards................................................. 9
3 Product description........................................................................... 10
3.1 Scope of delivery....................................................................................... 10
3.2 Setup and dimensions............................................................................. 11
3.3 Display and operating elements.............................................................. 14
3.4 Type code.................................................................................................. 14
3.5 Product identification............................................................................... 15
3.6 Principle of operation............................................................................... 15
3.6.1 Measurement principle........................................................... 15
3.6.2 Distance measurement........................................................... 16
3.6.3 Direction measurement.......................................................... 16
3.6.4 Object sizes.............................................................................. 17
3.6.5 Scan field flatness (conical error and tilt).............................. 18
3.6.6 Impact of object surfaces on the measurement................... 18
3.6.7 Scanning range........................................................................ 20
3.6.8 Filter.......................................................................................... 21
3.6.9 Calculation of the field size for mobile applications.............. 23
5 Mounting............................................................................................. 27
5.1 Mounting instructions............................................................................... 27
5.2 Mounting device....................................................................................... 27
5.3 Mutual interference.................................................................................. 28
6 Electrical installation........................................................................ 29
6.1 Prerequisites for safe operation of the device........................................ 29
6.2 Electrical block diagram for commissioning........................................... 33
7 Operation............................................................................................ 43
7.1 SOPAS ET................................................................................................... 43
7.1.1 Parameter - network................................................................ 45
7.1.2 Parameter - filters.................................................................... 45
7.2 Field evaluation......................................................................................... 45
7.2.1 Teach-in / Field set selection.................................................. 45
7.2.2 Monitor - field evaluation monitor........................................... 48
7.2.3 Parameter - evaluation cases................................................. 48
7.2.4 Parameters - detection fields.................................................. 49
7.3 ROS driver................................................................................................. 51
8 Maintenance...................................................................................... 52
8.1 Maintenance plan..................................................................................... 52
8.2 Cleaning..................................................................................................... 52
9 Troubleshooting................................................................................. 53
9.1 Detecting and displaying errors............................................................... 53
9.2 Resetting the password for the Service user level................................... 53
9.3 Repairs...................................................................................................... 54
9.4 Returns...................................................................................................... 54
9.5 Disposal..................................................................................................... 54
10 Technical data.................................................................................... 55
10.1 Features.................................................................................................... 55
10.2 Performance............................................................................................. 56
10.3 Interfaces.................................................................................................. 57
10.4 Mechanics/electronics............................................................................. 57
10.5 Ambient data............................................................................................. 58
11 Accessories........................................................................................ 59
12 Annex.................................................................................................. 60
12.1 Declarations of conformity and certificates............................................ 60
12.2 Licenses.................................................................................................... 60
NOTE
Read these operating instructions carefully to familiarize yourself with the device and its
functions before commencing any work.
The operating instructions are an integral part of the product. Store the instructions
in the immediate vicinity of the device so they remain accessible to staff at all times.
Should the device be passed on to a third party, these operating instructions should be
handed over with it.
These operating instructions do not provide information on the handling and safe
operation of the machine or system in which the device is integrated. Information on
this can be found in the operating instructions for the machine or system.
DANGER
… indicates a situation of imminent danger, which will lead to a fatality or serious
injuries if not prevented.
WARNING
… indicates a potentially dangerous situation, which may lead to a fatality or serious
injuries if not prevented.
CAUTION
… indicates a potentially dangerous situation, which may lead to minor/slight injuries if
not prevented.
NOTICE
… indicates a potentially harmful situation, which may lead to material damage if not
prevented.
NOTE
… highlights useful tips and recommendations as well as information for efficient and
trouble-free operation.
2 Safety information
2.1 Intended use
The TiM3xx 2D LiDAR sensor features a scan plane and is designed for the following
applications:
• Field monitoring of freely defined areas with signaling of object detection via digital
outputs.
It is suitable for applications which demand precise, non-contact optical measuring
contours and dimensioning. Typical fields of application are, for example, stationary
field protection, area monitoring, access control, mobile applications (navigation and
anti-collision of mobile platforms).
SICK AG assumes no liability for losses or damage arising from the use of the product,
either directly or indirectly. This applies in particular to use of the product that does not
conform to its intended purpose and is not described in this documentation.
WARNING
Danger due to improper use!
Any improper use can result in dangerous situations.
Therefore, observe the following information:
■ Product should be used only in accordance with its intended use.
■ All information in the documentation must be strictly observed.
■ Shut down the product immediately in case of damage.
2.3 Cybersecurity
Overview
To protect against cybersecurity threats, it is necessary to continuously monitor and
maintain a comprehensive cybersecurity concept. A suitable concept consists of organi‐
zational, technical, procedural, electronic, and physical levels of defense and considers
suitable measures for different types of risks. The measures implemented in this
product can only support protection against cybersecurity threats if the product is used
as part of such a concept.
You will find further information at www.sick.com/psirt, e.g.:
• General information on cybersecurity
• Contact option for reporting vulnerabilities
• Information on known vulnerabilities (security advisories)
NOTICE
Modifications and conversions to the device may result in unforeseeable dangers.
Interrupting or modifying the device or SICK software will invalidate any warranty claims
against SICK AG. This applies in particular to opening the housing, even as part of
mounting and electrical installation.
WARNING
Risk of injury due to insufficient training.
Improper handling of the device may result in considerable personal injury and material
damage.
■ All work must only ever be carried out by the stipulated persons.
CAUTION
Optical radiation: Class 1 Laser Product
The accessible radiation does not pose a danger when viewed directly for up to 100
seconds. It may pose a danger to the eyes and skin in the event of incorrect use.
■ Do not open the housing. Opening the housing may increase the level of risk.
■ Current national regulations regarding laser protection must be observed.
WARNING
Electrical voltage!
Electrical voltage can cause severe injury or death.
■ Work on electrical systems must only be performed by qualified electricians.
■ The power supply must be disconnected when attaching and detaching electrical
connections.
■ The product must only be connected to a voltage supply as set out in the require‐
ments in the operating instructions.
■ National and regional regulations must be complied with.
■ Safety requirements relating to work on electrical systems must be complied with.
WARNING
Risk of injury and damage caused by potential equalization currents!
Improper grounding can lead to dangerous equipotential bonding currents, which may
in turn lead to dangerous voltages on metallic surfaces, such as the housing. Electrical
voltage can cause severe injury or death.
■ Work on electrical systems must only be performed by qualified electricians.
■ Follow the notes in the operating instructions.
■ Install the grounding for the product and the system in accordance with national
and regional regulations.
3 Product description
3.1 Scope of delivery
The delivery of the device includes the following components:
Table 2: Scope of delivery
No. of Component Notes
units
1 Device in the version ordered TiM310 / TiM320: Connecting cable on the device
2x fastening clips, 2x TiM351 / TiM361: No connecting cables
M3 x 5 mm screws
1 Printed safety notes, multilin‐ Quick guide and general safety notes
gual
38.3 (1.50)
2
3
4
27.3 (1.08)
8 (0.31)
5
ß
79 (3.11)
6
55.8 (2.19)
4.3
[ Ø 16 )]
0.
(
(0.76)]
[19.4
(0.76)
4.4 (0.17)
19.4
7 60 (2.36) [0.5 60 (2.36) 51 (2.00)
[68.8 (2.71)] (0.02)]
[76.3 (3.0)]
8 9 2 2
30°
â
‒45° 225°
0° 180°
90°
TiM35x, TiM36x
51 (2.01)
[Ø 2x
44.79 (1.76)
(0. 4.3
17
)]
Mounting set 1
1
33 (1.3)
2
16.79
(0.66)
61 (2.40)
3
4
(1.07)
5
27.3
9 à
85.75 (3.38)
6 ß á
101.12 (3.98)
62.46 (2.46)
(0.31)
8
8
(0.96)]
[24.4
(0.96)
24.4
0.7 (0.03)
7 60 (2.30) å
[68.8 (2.71)] 17.37 51 (2.01)
[76.25 (3.00)] (0.68) 46.71 (1.84)
74.39 (2.93)
30° 2 2
â
‒45° 225°
0° 180°
ã
90°
1 2 3
Status indicators
LED (red) LED (green) Description
- O Device ready/monitoring mode
O O Object detection within field/fields (if
there are lots of object detections in
a short space of time, the red LED
lighting up might look like flashing)
- Ö Teach-in: start
O O Teach-in: End of pre-warning stage,
60 seconds teach-in stage
- Ö Teach-in: End of teach-in phase
Ö - Error, start up, firmware update,
parameterization
- - Device without supply voltage
O = illuminated; Ö = flashing
TIM351-2134001 1
2
8
1067299
19160001
3
9-28V
16W 4
5 9
6
7
1 Type code
2 Conformity mark/certification mark, symbol: Observe the operating instructions!
3 Product ID with part number (P/N) and serial number (S/N)
4 Voltage supply, maximum power consumption
5 Production date
6 MAC address
7 Manufacturer/production location
8 QR code with product data (part number, serial number), example: pid.sick.com/
1090608/23000000
9 Conformity mark/certification mark
1 Device
2 Laser pulse
Required values for calculating the light spot size and minimum object size:
• Light spot size on the device cover: 7 mm (rounded up)
• Light spot divergence per single pulse: 0.49 deg (8.6 mrad)
• supplement HDDM/HDDM+ (1 measured value consists of several overlapping
single pulses): 5.8 mrad for devices with 0.33° angular resolution; 17.5 mrad for
devices with 1° angular resolution
Formula for calculating the light spot width:
(Light spot divergence [mrad] + supplement [mrad]) * distance [mm] + light spot size
on the device cover [mm] = light spot width [mm]
Calculation example of light spot width at a distance of 4 m, with supplement 5.8 mrad:
(8.6 mrad +5.8 mrad) * 4,000 mm +7 mm = 64.6 mm
Formula for calculating the height of the light spot:
Light spot divergence [mrad] * Distance [mm] + Light spot size at the device cover
[mm] = Light spot width [mm]
Example calculation of the light spot height at a distance of 4 m:
8.6 mrad * 4,000 mm +7 mm = 41.4 mm
Formula for calculating the minimum object size:
2 * supplement [mrad] * distance [mm] + light spot height [mm] = minimum object
size [mm]
Calculation example of minimum object size at a distance of 4 m, with supplement
5.8 mrad:
2 * 5.8 mrad * 4,000 mm + 41.4 mm = 87.8 mm
200 400
(7.9) (15.7)
150 3 300 3
(5.9) (11.8)
4
100 200 4
(3.9) (7.9)
5
50 100
(2.0) (3.9)
5
0 0
0 2.5 5 7.5 10 12.5 0 2.5 5 7.5 10 12.5
(8.2) (16.4) (24.6) (32.8) (41.0) (8.2) (16.4) (24.6) (32.8) (41.0)
Figure 6: Minimum object size TiM36x Figure 7: Minimum object size TiM31x/TiM32x
(max. distance: 4 m) and TiM35x
1 Size in millimeters (inc)
2 Distance in meters (feet)
3 Minimum object size
4 Light spot width
5 Light spot height
Reflection
Most surfaces produce a diffuse reflection of the laser beam in all directions. The
structure (smooth or rough), shape (flat or curved), and color (light or dark) of the
surface determine how well the laser beam is reflected.
On very rough surfaces, a large proportion of the energy is lost due to absorption.
Curved surfaces produce a higher diffusion. Dark surfaces reflect the laser beam worse
than light ones (brilliant white plaster reflects approx. 100% of the light, while black
foam rubber reflects approx. 2.4%). The aforementioned surface characteristics can
reduce the scanning range of the device, in particular for surfaces with low remission
values.
Angle of reflection
The angle of reflection corresponds to the angle of incidence. If the laser beam hits
a surface at right angles, the energy is optimally reflected. If the laser beam hits a
surface at an oblique angle, energy and range are lost accordingly.
Retroreflection
If the reflective energy is greater than 100%, the beam is not reflected diffusely in all
directions; instead it is reflected in a targeted way (retroreflection). Thus a large part of
the emitted energy can be received by the laser distance measurer. Plastic reflectors
(cat’s eyes), reflective tape, and triple prisms have these properties.
Reflective surfaces
The laser beam is almost completely deflected on reflective surfaces. This means that
an object hit by the deflected beam may be detected instead of the reflective surface.
Small objects
Objects that are smaller than the diameter of the laser beam cannot reflect the laser
light’s full energy. The portion of the light beam that does not reach the object is lost. If
all of the light reflected to the sensor is insufficient, the object may not be detected.
The portion of the light that does not reach the front object can be reflected by a larger
object in the background. If all of the light reflected to the sensor is sufficient, this
object is detected. This can lead to a corruption of the measured value.
Figure 13: Scanning range as a function of Figure 14: Scanning range as a function of
object remission, TiM31x / TiM32x object remission, TiM35x / TiM36x
1 Object remission in percent 1 Object remission in percent
2 Measuring range in meters (feet) 2 Measuring range in meters (feet)
3.6.8 Filter
The device has digital filters for pre-processing and optimizing the measured distance
values. They enable the device to be adapted to meet the specific requirements of the
respective application.
The filters can be combined without restrictions. If several filters are active, then the
filters are applied sequentially to the results of the preceding filter. The processing
sequence is as follows:
• Edge filter
• Particle filter
• Average filter
The active filter functions affect the output measured values. It is not possible to recal‐
culate the original measured values from the filtered output values. For this reason,
certain combinations of filters might not be advisable.
A particularly effective way to reduce the data in a scan (reduction of measurement
points) is to restrict the scan range (“Data output” > “Output range”) or the media filter.
The edge filter enables points to be entirely suppressed at the outer edges of the
object.
! "
Figure 15: Without the particle filter: Violation Figure 16: Using the particle filter: The
of the contour due to dust particles in the response to dust particles in the detection
vicinity of the object. field is delayed by one scan. Particles can
thereby be blanked.
1) For the variants TiM310 / TiM320, the maximum distance can be set to 4,000 mm.
Individual outliers (shown in bold in the table) influence the average value.
Once the measured value telegram has been confirmed, the first measured value is
not output until after the configured number of scans. Therefore, there is always a time
delay equivalent to the number of scans configured for averaging. The digit of the first
scan included in the averaging calculation is always output in the scan counter. Invalid
distance values (= 0) are not included in the averaging calculation, so that in these
places a smaller number of scans is used in the division calculation.
Based on the scanning frequency of 15 Hz, a measured value is generated every
67 s. The time delay affecting data output results from this base value multiplied
by the number of averaging operations (e.g., 2 averaging operations = 134 ms,
10 averaging operations = 670 ms).
NOTE
• We recommend adding a supplement of at least 100 mm to the protective field
length in order to stop the vehicle before a possible collision.
• If retro-reflectors are situated in the path of the vehicles, or if you anticipate that
the braking force of the vehicle will diminish over time, you may, under certain
circumstances, need to increase the recommended supplement.
• The width of the switching field should cover the vehicle width. You should also
configure a supplement of at least 100 mm on every side.
Mounting height
The recommended mounting height for mobile applications is at least 150 mm.
The switching field length SL can be calculated using the following formula (guideline
values based on a pixel calculation):
SL = SA + ZG + ZR + ZB
SA = Stopping distance
ZG = General supplement of the LiDAR sensor = 100 mm
ZR = Supplement for application-related influences or the selected application parame‐
ters
ZB = Supplement for the decreasing braking force of the vehicle. This can be obtained
from the relevant vehicle documentation, or alternatively: 10% of the stopping distance.
Stopping distance SA
The stopping distance comprises the vehicle’s braking distance and the distance cov‐
ered during the response time of the LiDAR sensor and the vehicle control’s response
time.
2 3 4
NOTE
Please note that a vehicle’s braking distance does not increase linearly with increasing
speed, but rather in a squared relationship. This is particularly important if you switch
between different-sized switching fields depending on the speed.
How to calculate the distance SAnS covered during the response time of the LiDAR
sensor:
SAnS = TS × Vmax
TS = Response time of the LiDAR sensor
Vmax Maximum speed of the vehicle, from the relevant vehicle documentation
The response time TS of the LiDAR sensor depends on:
• the base response time of the LiDAR sensor
• whether multiple sampling is set
• Filter settings (e.g., particle filter)
ZR supplement
This supplement must be determined on an application-specific basis and taken into
account appropriately. The following factors can make it necessary to use a supple‐
ment: reflectors or shiny objects on the scan plane, multi-echo analysis, blanking size,
device filter (e.g., particle filter).
NOTICE
Damage due to improper transport!
■ The product must be packaged with protection against shock and damp.
■ Recommendation: Use the original packaging.
■ Note the symbols on the packaging.
■ Do not remove packaging until immediately before you start mounting.
4.2 Unpacking
• To protect the device against condensation, allow it to equilibrate with the ambient
temperature before unpacking if necessary.
• Handle the device with care and protect it from mechanical damage.
• To avoid ingress of dust and water, only remove the protective elements, e.g.
protective caps of the electrical connections just before attaching the connecting
cable.
NOTE
Complaints regarding defects should be filed as soon as these are detected. Damage
claims are only valid before the applicable complaint deadlines.
4.4 Storage
• Electrical connections are provided with a protective cap.
• Do not store outdoors.
• Store in a place protected from moisture and dust.
• Recommendation: Use the original packaging.
• To allow any residual dampness to evaporate, do not package in airtight contain‐
ers.
• Do not expose to any aggressive substances.
• Protect from sunlight.
• Avoid mechanical shocks.
• Storage temperature: see "Technical data", page 55.
• Relative humidity: see "Technical data", page 55.
• For storage periods of longer than 3 months, check the general condition of all
components and packaging on a regular basis.
5 Mounting
5.1 Mounting instructions
• Observe the technical data.
• Protect the sensor from direct and indirect sunlight.
• To prevent condensation, avoid exposing the device to rapid changes in tempera‐
ture.
• The mounting site has to be designed for the weight of the device.
• The device can be mounted in any position.
• It should be mounted so that it is exposed to as little shock and vibration as possi‐
ble. Optional mounting accessories are available, see "Accessories", page 59.
• In application areas with severe vibrations or shocks caused by vibrations,
jolts or abrupt changes in directions (e.g., when mounted to a manned forklift
truck), mounting with vibration dampers is to be carried out (see "Accessories",
page 59). Mount the device in a freely suspended manner.
• When mounting the device, make sure there are no reflective surfaces behind the
reference target, see "Setup and dimensions", page 11.
• When mounting the device, make sure the swivel connector area is recessed so it
does not lie on the mounting surface see "Setup and dimensions", page 11.
• To avoid inaccurate measurements when installing multiple devices: Make sure
that the laser spot of one device is not in the visible range of another device, see
"Mutual interference", page 28.
• Avoid having shiny or reflective surfaces in the scanning range, e.g., stainless
steel, aluminum, glass, reflectors, or surfaces with these types of coatings.
• Protect the device from moisture, contamination, and damage.
• Make sure that the status indicator is clearly visible.
• Do not subject the device to excessive shock or vibrations. In systems subjected to
heavy vibrations, secure the fixing screws with screw-locking devices.
• The M3 x 5 screws included with delivery are intended for mounting the fastening
clips via the blind hole threads on the rear or underside of the device, see "Setup
and dimensions", page 11. If the mounting clamps are not used or if other screws
are used, the screws must not be screwed into the thread by more than 2.8 mm.
The maximum tightening torque is 0.8 Nm.
2. Make the electrical connection. Attach and tighten a voltage-free cable, see "Con‐
necting the device electrically", page 37 .
3. Switch on the supply voltage.
✓ The green operating LED lights up.
4. Align the vertical center line of the field of view of the device with the center of the
area to be monitored. The marking (90° axis) on the upper side of the optics cover
serves as a alignment aid.
NOTE
Optical sensors and other IR light sources can influence the measurement and detec‐
tion capabilities of the device.
The device has been designed to minimize the probability of mutual interference with
devices of the same type. To rule out even the slightest effects on the measurement
accuracy, the devices should be arranged such the laser beams are not received by
another device.
6 Electrical installation
6.1 Prerequisites for safe operation of the device
WARNING
Risk of injury and damage caused by electrical current!
As a result of equipotential bonding currents between the device and other grounded
devices in the system, faulty grounding of the device can give rise to the following
dangers and faults:
• Dangerous voltages are applied to the metal housings.
• Devices will behave incorrectly or be destroyed.
• Cable shielding will be damaged by overheating and cause cable fires.
Remedial measures
• Only skilled electricians should be permitted to carry out work on the electrical
system.
• If the cable insulation is damaged, disconnect the voltage supply immediately and
have the damage repaired.
• Ensure that the ground potential is the same at all grounding points.
• Where local conditions do not meet the requirements for a safe earthing method,
take appropriate measures. For example, ensure low-impedance and current-carry‐
ing equipotential bonding.
The device is connected to the peripheral devices (any local trigger sensor(s), system
controller) via shielded cables. The cable shield – for the data cable, for example –
rests against the metal housing of the device.
The device can be grounded through the cable shield or through a blind tapped hole in
the housing, for example.
If the peripheral devices have metal housings and the cable shields are also in contact
with their housings, it is assumed that all devices involved in the installation have the
same ground potential.
This is achieved by complying with the following conditions:
■ Mounting the devices on conductive metal surfaces
■ Correctly grounding the devices and metal surfaces in the system
■ If necessary: low-impedance and current-carrying equipotential bonding between
areas with different ground potentials
1 2 3
System SICK
Controller Device Power Supply
=8
=9
7 6 U 5 4
Figure 20: Example: Occurrence of equipotential bonding currents in the system configuration
1 System controller
2 Device
3 Voltage supply
4 Grounding point 2
5 Closed current loop with equalizing currents via cable shield
6 Ground potential difference
7 Grounding point 1
8 Metal housing
9 Shielded electrical cable
If these conditions are not fulfilled, equipotential bonding currents can flow along the
cable shielding between the devices due to differing ground potentials and cause the
hazards specified. This is, for example, possible in cases where there are devices within
a widely distributed system covering several buildings.
Remedial measures
The most common solution to prevent equipotential bonding currents on cable shields
is to ensure low-impedance and current-carrying equipotential bonding. If this equipo‐
tential bonding is not possible, the following solution approaches serve as a suggestion.
NOTICE
We expressly advise against opening up the cable shields. This would mean that the
EMC limit values can no longer be complied with and that the safe operation of the
device data interfaces can no longer be guaranteed.
1 2 2 3 4
Electro- Electro-
System optical optical SICK Power
Controller signal signal Device Supply
isolator isolator
6 5
=7 =8 =9
Figure 21: Example: Prevention of equipotential bonding currents in the system configuration by
the use of electro-optical signal isolators
1 System controller
2 Electro-optical signal isolator
3 Device
4 Voltage supply
5 Grounding point 2
6 Grounding point 1
7 Metal housing
8 Shielded electrical cable
9 Optical fiber
The use of electro-optical signal isolators between the islands isolates the ground loop.
Within the islands, a stable equipotential bonding prevents equalizing currents on the
cable shields.
Measures for small system installations
For smaller installations with only slight potential differences, insulated mounting of the
device and peripheral devices may be an adequate solution.
1 2 3
System SICK
Controller Power Supply
Device
8 U 6 4
7
=9 =ß
Figure 22: Example: Prevention of equipotential bonding currents in the system configuration by
the insulated mounting of the device
1 System controller
2 Device
3 Voltage supply
4 Grounding point 3
5 Insulated mounting
6 Grounding point 2
7 Ground potential difference
8 Grounding point 1
9 Metal housing
ß Shielded electrical cable
Even in the event of large differences in the ground potential, ground loops are effec‐
tively prevented. As a result, equalizing currents can no longer flow via the cable shields
and metal housing.
NOTICE
The voltage supply for the device and the connected peripheral devices must also
guarantee the required level of insulation.
Under certain circumstances, a tangible potential can develop between the insulated
metal housings and the local ground potential.
SOPAS
Delay- "USB 2.0"
Connection box 4
action
fuse Device 2
0.8 A Configuration
Field monitoring
6 Diagnosis
IN 1 IN 2 IN 3 IN 4 PNP: 3
INGND
Vs 5 NPN: "Power/I/O"
Vs
TiMxxx-10xxxxx
IN 1 33 20 OUT 1
IN 2 43 21 OUT 2
CDB730-001
IN 3 30 Connection 10 OUT 3
IN 4 31 module 13 OUT 4 USB
SGND 12 1 22 GND
OUT 4
OUT 3
OUT 2
OUT 1
...
... SOPAS
"USB 2.0"
6 1 5 10
1 2 Device 2
Configuration
11 15 Field monitoring
GND Diagnosis
Vs 4 3
"Power/I/O"
Figure 24: “Power, I/O” connection: Cable with 15-pin D-Sub-HD male connector
1 Connection modules
2 Device
3 Configuration, field monitoring or diagnostics
4 Supply voltage Vs
TiMxxx-11xxxxx
Customer-provided 1 4
3 2
11 1
OUT 1 OUT 2 OUT 3 OUT 4 5 10 USB
9
6
8
7 12
SOPAS
"USB 2.0"
Delay- Connection box 4
action Device 2
fuse Configuration
0.8 A Field monitoring
6 Diagnosis
IN 1 IN 2 IN 3 IN 4 PNP: 3
INGND
Vs 5 NPN: "Power/I/O"
Vs
Figure 25: “Power//I/O” connection: Cable with 12-pin A-coded M12 male connector
1 Provided by customer
2 Device
3 Configuration, field monitoring or diagnostics
4 Connecting device
5 Supply voltage Vs
6 Fuse 0.8 A, slow-acting
NOTE
Pre-assembled cables can be found on the product page.
The product page can be accessed via the SICK Product ID: pid.sick.com/{P/N}/{S/N}
{P/N} corresponds to the part number of the product, see type label.
{S/N} corresponds to the serial number of the product, see type label (if indicated).
NOTICE
Faults during operation and defects in the device or the system
Incorrect wiring may result in operational faults and defects.
■ Follow the wiring notes precisely.
The enclosure rating stated in the technical data is achieved only with screwed plug
connectors or protective caps.
Protect the device from dust and moisture when the plastic USB cover is open.
The USB interface is only for parameterization. Remove the USB cable for problem-free
operation of the device.
All circuits connected to the device must be configured as SELV or PELV circuits. SELV =
safety extra-low voltage, PELV = protective extra-low voltage.
Protect the device with an external 0.8 A slow-blow fuse at the beginning of the supply
cable.
When operating the device together with a connection module, observe the operating
instructions of the connection module!
Connect the connecting cables in a de-energized state. Do not switch on the supply
voltage until installation is complete and all connecting cables are connected to the
device and control.
Wire cross-sections in the supply cable from the customer’s power system must be
implemented in accordance with the applicable standards.
NOTE
The recommended connecting cables and their associated technical data can be found
on the online product page.
The product page can be accessed via the SICK Product ID: pid.sick.com/{P/N}/{S/N}
{P/N} corresponds to the part number of the product, see type label.
{S/N} corresponds to the serial number of the product, see type label (if indicated).
6.4.1 TiMxxx-01xxxxx
“Power/I/O” connection
NOTE
All products with the type code TiM3xx-01xxxxx are intended to be operated with
flying leads. For production-related reasons, individual product variants with this type
code are delivered with a 15-pin D-Sub HD male connector. For these products, the
customer is responsible for cutting off the male connector and creating the cable end.
Alternatively, the products may be operated with a male connector. In this case, the
information for the product variants with the type code TiMxxx-10xxxxx applies for the
PIN assignment.
– Shielding Metal
6.4.2 TiMxxx-10xxxxx
“Power/I/O” connection
1 2 3 4 5
6 7 8 9 10
11 12 13 14 15
6.4.3 TiMxxx-11xxxxx/TiMxxx-21xxxxx
“Power/I/O” connection
2 1
3 10
11 9
4 8
5 12
6 7
4 3
NOTICE
Observe the wiring instructions, see "Wiring instructions", page 34.
Vin 5
3.32 K
C INGND
D GND
GND
GND GND
Figure 26: Wiring of digital input (PNP version)
1 External supply voltage VS ext
2 Supply voltage Vs for device
3 Device
4 Signal IN X
5 Input voltage Vin
VS ext 1 VS 2
Device 3
A VS
VS
B IN 6.64 K
Vin 4
3.32 K
C IN X 5
D GND
GND
GND GND
Figure 27: Wiring of digital input (NPN version)
1 External supply voltage VS ext
2 Supply voltage Vs for device
3 Device
4 Input voltage Vin
5 Signal IN X
Switching behav‐ Current to the input starts the assigned function in the device.
ior Default: Active high level, debounce 10 ms
Properties Opto-decoupled
Switchable with an electronic switch (PNP output) or mechanical switch
Electrical values see "Mechanics/electronics", page 57
Digital outputs
The device has 4 switching digital outputs.
In combination, the digital outputs OUT 1 to OUT 3 signal the breach of the individual
fields of a field set.
The digital output OUT 4 is used to issue an error and a regular index pulse.
The structure and wiring principle of the digital outputs are shown below.
Device 1
OUT X 2 X 4
Vout 3
GND Y
Device 1 VS 2
VS X
4
Vout 3
OUT X 5 Y
GND Z
Longer connecting cables at the digital outputs of the device should be avoided due to
the resulting fall in voltage. This is calculated as follows:
Δ U = (2 x length x current) : (conductance value x cross-section)
Conductance value for copper: 56 m/Ω mm2.
1
A
2 3
B C D E F
7 Operation
7.1 SOPAS ET
The following activities are normally performed using the SOPAS ET configuration
software:
• Field evaluation application: adjusting the 3 fields of a field set.
• Parameterization: tailoring other device parameters to the application.
• Diagnosis: determining the cause of a fault.
To parameterize the device, you will require a computer with SOPAS ET installed and a
free Ethernet connection (recommended) or, alternatively, a free USB interface.
NOTE
The most up-to-date version of the SOPAS ET software can be downloaded from
www.sick.com/SOPAS_ET. The respective system requirements for installing SOPAS
ET are also specified there.
NOTE
To use SOPAS ET with the device, you need a device description file (SDD) for this
device. You can install this in SOPAS ET using the device catalog. The device description
file is saved on the device and can be installed there. Alternatively, installation is
possible from the SICK website (Internet connection required). Use the wizard in SOPAS
ET to do this.
Following installation of the device description file, the device can be selected from the
device catalog and added to a project.
A connection to the device is established via the communication interface. The connec‐
tion must be activated for data transmission (online).
Certain functions (e.g., Edit parameters) require you to be logged in to the device:
> Device > Login > Select user level and enter password:
NOTE
Software access to the device is protected by user levels and passwords. After success‐
fully configuring the device, you should change the passwords so they can fulfill their
protective function.
• No password required
• Read only permissions
• Not all parameters are visible
Maintenance Maintenance can view the application-related device parameters.
NOTE
Change the passwords during initial commissioning to protect your device.
A higher user level can change the password of a lower user level.
NOTE
If the password for the Service user level has been lost: see "Resetting the password for
the Service user level", page 53.
Information about the device is displayed in the device window (> Device > Open) and
the device can also be configured here.
NOTE
Changes to parameters that are made in SOPAS ET are not saved automatically in
the device. After you have completed the configuration, you must save it in the device
permanently by pressing the Save permanent button.
NOTE
To reset the device to the factory settings, use the Load defaults option in SOPAS ET.
With the Load application defaults option, the network settings remain unchanged, all
other settings are reset to the factory settings.
Tools
Depending on the selected view, different tools are available to help you perform
configurations or customize the display.
The following are examples of some of the tools for customizing the display:
•
Button : Display fields in the polar coordinates system.
•
Button : Change over the view of the device/fields. Device black: View from
above, device blue: View from below.
•
Button or : Switch off display of the full measuring line or display measur‐
ing line as dotted.
NOTE
If you change the parameters of the Ethernet interface via the Ethernet interface, you
must first save the data permanently to non-volatile memory in the device and then
restart the device. A Restart button is provided in SOPAS ET for this purpose.
90°
Field 3
Field 2
Field 1
180° 0°
Segmented, Rectangle
free shape type
Figure 30: Structure of the fields of a field set and possible field shapes
1 Segmented, free field shape
2 Nested together, rectangle
7.2.1.1 Teach-in
Preparation
• Remove all objects that will not permanently be in the field of view in monitoring
mode later on.
• Distance yourself sufficiently from the device during the advance warning phase of
the teach-in so that you are not detected as part of the field contour.
O = illuminated; Ö = flashing
The taught-in field contour is automatically and permanently saved as a new field set 1.
Input level: Low (in resting position): ≤ 2 V, high (in working position): ≥ 8 V
In the Field evaluation monitor window, SOPAS displays the field contour (scan line) cur‐
rently seen by the device through ambient reflection in blue.
If the 4 digital inputs are not energized, SOPAS displays the following for field set 1
according to the default setting of the device:
• 3 evaluation fields (segmented rectangles) or the field shape generated with the
aid of teach-in with its dimensions
• Status of the digital inputs/outputs
• Position of the mouse pointer
SOPAS displays the fields as green if no object detection is present.
If objects of a certain size are located for a certain duration in the part of the visual
range that is covered by fields, the device will recognize this as an object detection.
SOPAS displays this separately in yellow for the individual fields.
Click the “Reset” button to make SOPAS reset the digital output counters.
When selecting the response time, note that the device internal reaction time must also
be added (max. 67 ms).
To test the effects of the changed settings, change to the Field evaluation monitor view.
If the changed fields have been transferred to the device as described, SOPAS will
also display these in the monitor, displaying the infringed fields in yellow. If you wish to
observe another field set, it must first be activated accordingly using the digital inputs.
The user can change parameters in the right part of the window. SOPAS immediately
transfers these changes to the device (default setting).
However, detection fields that have been changed in size and shape must always be
manually transferred to the device using the button. All changed parameters are only
temporarily stored in the device for the time being and are not stored on the computer.
In order to optimize the dimensions of the detection fields:
1. Under Field selection, for example, select field set 1.
2. Select the field to be configured.
3. Make the required optimizations, see description in the following sections.
Rotating the field pair and device around the central axis
► In order to align the position of the field pair in SOPAS to the conditions on site
from the user´s perspective, enter and confirm the desired angle of rotation in the
0.0° input. A negative “-” sign sets the turning direction to the right.
The product page can be accessed via the SICK Product ID: pid.sick.com/{P/N}/{S/N}
{P/N} corresponds to the part number of the product, see type label.
{S/N} corresponds to the serial number of the product, see type label (if indicated).
8 Maintenance
8.1 Maintenance plan
Depending on the assignment location, the following preventive maintenance tasks
may be required for the device at regular intervals:
Table 13: Maintenance plan
Maintenance work Interval To be carried out
by
Check device and connecting cables Depends on ambient conditions and Specialist
for damage at regular intervals. climate.
Clean housing and optics cover. Depends on ambient conditions and Specialist
climate.
Check the screw connections and Depends on the place of use, ambi‐ Specialist
plug connectors. ent conditions or operating require‐
ments. Recommended: At least every
6 months.
Check the mounting accessories and Depends on the place of use, ambi‐ Specialist
vibration dampers used. ent conditions or operating require‐
ments. Recommended: At least every
6 months.
Check that all unused connections Depends on ambient conditions and Specialist
are sealed with protective caps. climate. Recommended: At least
every 6 months.
8.2 Cleaning
NOTICE
Equipment damage due to improper cleaning.
Improper cleaning may result in equipment damage.
■ Only use recommended cleaning agents and tools.
■ Never use sharp objects for cleaning.
► Clean the optics cover at regular intervals and in the event of contamination with a
lint-free lens cloth and plastic cleaning agent. Rinse off coarse dirt first with water.
The cleaning interval essentially depends on the ambient conditions.
9 Troubleshooting
9.1 Detecting and displaying errors
Error memory
The device has an error memory where its internal error states are recorded. The
content of the error memory is retained when the device is switched off and when the
“Restore Factory Settings” function is used.
The SOPAS ET software can be used to create a diagnostics report containing error
information (Complete view, Configuration tab, Start Diagnosis button).
NOTE
The responsible SICK sales company or the responsible SICK service partner carefully
checks each code request to reset the password. A risk of deception by third parties
nevertheless exists. The operating entity should therefore take suitable security meas‐
ures.
The operating entity should also take suitable measures to limit, as best as possible,
access to the product. This includes, in particular, physical access as well as access to
the software interfaces of the product.
6. Click Ok.
✓ Password has been reset to the default password servicelevel. Parameters are
not changed.
9.3 Repairs
Repair work on the device may only be performed by qualified and authorized personnel
from SICK AG. Interruptions or modifications to the device by the customer will invalid‐
ate any warranty claims against SICK AG.
9.4 Returns
► Only send in devices after consulting with SICK Service.
► The device must be sent in the original packaging or an equivalent padded pack‐
aging.
NOTE
To enable efficient processing and allow us to determine the cause quickly, please
include the following when making a return:
• Details of the contact person
• Description of the application
• Description of the fault that occurred
9.5 Disposal
If a device can no longer be used, dispose of it in an environmentally friendly manner
in accordance with the applicable country-specific waste disposal regulations. Do not
dispose of the product along with household waste.
NOTICE
Danger to the environment due to improper disposal of the device.
Disposing of devices improperly may cause damage to the environment.
Therefore, observe the following information:
■ Always observe the national regulations on environmental protection.
■ Separate the recyclable materials by type and place them in recycling containers.
10 Technical data
NOTE
The relevant online product page for your product, including technical data, dimensional
drawing, and connection diagrams, can be downloaded, saved, and printed from the
Internet.
The product page can be accessed via the SICK Product ID: pid.sick.com/{P/N}/{S/N}
{P/N} corresponds to the part number of the product, see type label.
{S/N} corresponds to the serial number of the product, see type label (if indicated).
Please note: This documentation may contain further technical data.
10.1 Features
Variant TiM31x TiM32x TiM35x TiM36x
Measurement HDDM+ (improved behavior for edge hits)
principle
Application Indoor Outdoor
Light source Infrared (wavelength 850 nm, max. pulse power Infrared (wave‐
880 mW, max. pulse width 5 ns, pulse frequency length 850 nm,
550 kHz) max. pulse power
880 mW, max.
pulse width 5 ns,
pulse frequency
1,500 kHz)
Laser class 1 (IEC 60825-1:2014, EN 60825-1:2014+A11:2021)
Complies with 21 CFR 1040.10 and 1040.11 except for conformance with
IEC 60825-1 Ed.3., as described in Laser Notice No. 56 dated 8 May 2019.
Aperture angle 270°
Scan field flat‐ Typ. ± 3.0° Typ. ± 1.5°
ness 1)
Scanning fre‐ 15 Hz
quency
Angular resolu‐ 1° 0.33°
tion
Working range 0.05 m ... 4 m 0.05 m ... 10 m
Scanning range – 5 m (typical)
for 5% remission
Scanning range 2 m (typical) 8 m (typical) 2)
with 10% remis‐
sion
Spot size Spot size on the optics cover: 7 mm
Divergence: 8.6 mrad (0.49°)
Number of ech‐ 1
oes evaluated
1) Reference area for base of housing
2) at ambient temperature < -15 °C: typ. 7.5 m
180°
180°
4 10
(32.81) 225°
(13.12) 225°
6
2 (19.69)
(6.56)
270° 270°
2
(6.56)
0 90° 0 90°
–2
(–6.56)
–2
(–6.56) –6
(–19.69)
–4 ‒45° ‒45°
(–13.12) –10
(–32.81)
0°
0°
–4 –2 0 2 4 –10 –6 –2 0 2 6 10
(–13.12) (–6.56) (6.56) (13.12) (–32.81) (–19.69) (–6.56) (6.56) (19.69) (32.81)
Scanning range max.: 4 m (13.12 feet) 2 Scanning range max.: 10 m (32.81 feet) 2
Scanning range typical (for objects with 10 % remission): Scanning range typical (for objects with 10 % remission):
2 m (6.56 feet) 3 8 m (26.25 feet) 3
Figure 33: TiMx1x / TiMx2x working range dia‐ Figure 34: TiMx5x / TiMx6x working range dia‐
gram gram
1 Sensing range in meters (feet) 1 Sensing range in meters (feet)
2 Maximum sensing range: 4 m 2 Maximum sensing range: 10 m
(13.12 feet) (32.81 feet)
3 Typical sensing range for objects with 3 Typical sensing range for objects with
10% remission: 2 m (6.56 feet) 10% remission: 8 m (26.25 feet)
10.2 Performance
Variant TiM31x TiM32x TiM35x TiM36x
Response time Typ. 1 scan: 67 ms
Max. 2 scans: 134 ms 1)
Power-up delay Typ. 20 s
Detectable object Almost any
shape
Measurement Statistical (1 σ): < 30 mm 2) Statistical (1 σ): < 20 mm 2)
errors Systematic: ± 40 mm 2) Systematic: ± 60 mm 2)
Temperature drift: 0.5 mm/K Temperature drift: 0.5 mm/K
Integrated appli‐ Field evaluation Field evaluation with flexible fields
cation
Number of field 16 triple fields (48 fields), of which 16 triple fields, (48 fields, contour as
sets 1 triple (3 fields) can be configured reference; 1 triple (3 fields) can be
directly at the scanner) configured directly at the scanner)
Simultaneous 1 (3 fields) 1 (3 fields)
evaluation cases 2 (2 fields for detection and 1 field
for contour as reference)
Filter Edge filter
Particle filter
Average filter
1) Corresponds to max. 134 ms between +45° and +225° of the working range, max. 150 ms between
-45° and +45° of the working range (see "Working range diagram", page 56).
2) Typical value at 90% remission up to maximum sensing range; real value depends on ambient conditions.
10.3 Interfaces
Variant TiM31x TiM32x TiM35x TiM36x
Ethernet - TCP/IP (SOPAS parameterization)
USB Type: Micro-USB
Function: AUX, configuration
Digital inputs 4
PNP: Vin = max. 28 V, Iin = max. 5 mA), opto-decoupled, debouncing time
approx. 10 ms
NPN: Common reference potential 9 ... 28 V
Digital outputs 3 (NPN, additional 1x "device ready")
Each Iout ≤ 100 mA, not electrically isolated from the supply voltage, short-
circuit proof/temperature protected
Delay time 67 ms ... 30,000 ms (can be configured)
Holding time 67 ms ... 600,052 ms (can be configured)
Optical indicators 2 LEDs (0n, output state)
Control elements Pushbutton (teach-in)
10.4 Mechanics/electronics
Variant TiM31x TiM32x TiM35x TiM36x
Electrical connec‐ TiM3xx-01xxxxx: Connecting cable 1 x Ethernet connection, 4-pin M12
tion with open end, 15-wire 1) female connector
TiM3xx-10xxxxx: Connecting cable 1 x voltage supply connection, 12-pin
with male connector, D-Sub-HD, 15- M12 male connector
pin 1 x micro USB female connector, type
TiM3xx-11xxxxx: Connecting cable B
with male connector, M12, 12-pin, A-
coded
Supply voltage 9 V DC ... 28 V DC
SELV and PELV acc. to IEC 60364-4-41:2005-12
Power consump‐ 4 W (typical), with unloaded digital outputs, incl. start-up current
tion 16 W, with 4 max. loaded digital outputs
Input voltage Low: Vin ≤ 2 V; Iin ≤ 0.3 mA
High: 8 V ≤ Vin ≤ 32 V; 0.7 mA ≤ Iin ≤ 5 mA
Output voltage Low: 0 V ≤ Vout ≤ 2 V
High: (VS – 2 V) ≤ Vout ≤ VS; Iout ≤ 100 mA
Housing color Light blue (RAL 5012) Gray (RAL 7032)
Enclosure rating IP65 IP67
(IEC 60529:1989+AMD1:1999+ (IEC 60529:1989+AMD1:1999
AMD2:2013) +AMD2:2013), only valid with closed
“Aux interface” plastic cover
Protection class III (IEC 61140:2016-1)
Housing Base part: Aluminum die cast
Optics cover: Polycarbonate with scratch-resistant coating
Weight 150 g, without connecting cables 250 g, without connecting cables
Dimensions (L x 60 mm x 60 mm x 79 mm 60 mm x 60 mm x 86 mm
W x H)
11 Accessories
NOTE
On the product page you will find accessories and, if applicable, related installation
information for your product.
The product page can be accessed via the SICK Product ID: pid.sick.com/{P/N}/{S/N}
{P/N} corresponds to the part number of the product, see type label.
{S/N} corresponds to the serial number of the product, see type label (if indicated).
12 Annex
12.1 Declarations of conformity and certificates
You can download declarations of conformity and certificates via the product page.
The product page can be accessed via the SICK Product ID: pid.sick.com/{P/N}/{S/N}
{P/N} corresponds to the part number of the product, see type label.
{S/N} corresponds to the serial number of the product, see type label (if indicated).
12.2 Licenses
SICK uses open source software which is published by the rights holders under a
free license. Among others, the following license types are used: GNU General Public
License (GPL version 2, GPL version 3), GNU Lesser General Public License (LGPL), MIT
license, zlib license and licenses derived from the BSD license.
This program is provided for general use without warranty of any kind. This warranty
disclaimer also extends to the implicit assurance of marketability or suitability of the
program for a particular purpose.
More details can be found in the GNU General Public License.
For license texts see www.sick.com/licensetexts.
Printed copies of the license texts are also available on request.