L501 Hardware Design

L501_Hardware Design
LTE CAT1 Module Series
Version： V1.0
Date： 2020-03-31
Copyright © Shanghai Mobiletek Communication Ltd Shanghai Mobiletek Communication Ltd 0

Notice
Some features of the product and its accessories described herein rely on the software installed,
capacities and settings of local network, and therefore may not be activated or may be limited by local
network operators or network service providers. Thus, the descriptions herein may not exactly match
the product or its accessories which you purchase. Shanghai Mobiletek Communication Ltd reserves
the right to change or modify any information or specifications contained in this manual without prior
notice and without any liability.
Copyright
This document contains proprietary technical information which is the property of Shanghai Mobiletek
Communication Ltd. copying of this document and giving it to others and the using or communication
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of the contents thereof, are forbidden without express authority. Offenders are liable to the payment of
damages. All rights reserved in the event of grant of patent or the registration of a utility model or
design. All specification supplied herein are subject to change without notice at any time.
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DISCLAIMER
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ALL CONTENTS OF THIS MANUAL ARE PROVIDED “AS IS”. EXCEPT AS REQUIRED BY
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APPLICABLE LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED,

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INCLUDINGBUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND
FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN RELATION TO THE ACCURACY,
RELIABILITY OR CONTENTS OF THIS MANUAL.TO THE MAXIMUM EXTENT PERMITTED BY
APPLICABLE LAW, IN NO EVENT SHALL SHANGHAI MOBILETEKCOMMUNICATION LTD BE
LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR CONSEQUENTIAL DAMAGES, OR
LOSS OF PROFITS, BUSINESS, REVENUE, DATA, GOODWILL SAVINGS OR ANTICIPATED
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Copyright © Shanghai Mobiletek Communication Ltd 1

Version History
Date Version Modify records Author
2020-03-31 V1.0 First Release Rc.Dong
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CONTENT
1. Introduction ............................................................................................................................................ 5
1.1 Hardware Diagram .............................................................................................................................. 5

1.2 Main features ....................................................................................................................................... 5
1.3 Specifications ...................................................................................................................................... 7
1.4 Interfaces ............................................................................................................................................. 7
2. Package Information.............................................................................................................................. 8
2.1 Pin Configuration ................................................................................................................................. 8

2.2 Pin definition ........................................................................................................................................ 9
2.3 Package Information ......................................................................................................................... 14
2.3.1 Dimensions ................................................................................................................................. 14
2.3.2 Product labeling .......................................................................................................................... 15
2.3.3 Module size ................................................................................................................................ 17
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2.3.4 Recommend Pad ........................................................................................................................ 18
3. Interface Circuit Design ....................................................................................................................... 19

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3.1 Power Section ................................................................................................................................... 19
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3.1.1 Power Supply ............................................................................................................................. 19
3.1.2 Hardware Power On ................................................................................................................... 20
3.1.3 Hardware reset ........................................................................................................................... 20
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3.2 SIM Interface ..................................................................................................................................... 20

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3.2.1 Pin Description ........................................................................................................................... 20
3.2.2 SIM application ........................................................................................................................... 21
3.3 SD Card Interface.............................................................................................................................. 22
3.4 USB Interface .................................................................................................................................... 23
3.4.1 USB Application .......................................................................................................................... 23
3.4.2 Firmware Update ........................................................................................................................ 24
3.5 UART Interface .................................................................................................................................. 24
3.5.1 Pin Description ........................................................................................................................... 24
3.5.2 UART application ........................................................................................................................ 25
3.6 Audio Interface .................................................................................................................................. 26
3.6.1 Digital Audio Interface ................................................................................................................ 26
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3.6.2 Analog Audio Interface ............................................................................................................... 27

3.7 IIC Interface ....................................................................................................................................... 28
3.8 NETLIGHT Interface.......................................................................................................................... 29
3.8.1 NETLIGHT LED Control circuit ................................................................................................... 29
3.8.2 NETLIGHT LED Status description ............................................................................................ 29
3.9 Interactive Application Interface ........................................................................................................ 30
3.9.1 Pin Description ........................................................................................................................... 30
3.9.2 Interface Application ................................................................................................................... 30
3.10 SPI Interface.................................................................................................................................... 31
3.11 ADC ................................................................................................................................................. 31

4. Electrical characteristics ...................................................................................................................... 32
4.1 Electrical characteristic ..................................................................................................................... 32

4.2 Temperature characteristic ................................................................................................................ 32
4.3 Absolute Maximum Power ................................................................................................................. 33
4.4 Recommended operating conditions................................................................................................. 33
4.5 Power consumption ........................................................................................................................... 33
4.6 Power Sequence ............................................................................................................................... 34
4.7 Digital Interface Characteristics ........................................................................................................ 34
4.8 ESD ................................................................................................................................................... 35
5. RF Features ......................................................................................................................................... 37
5.1 RF Main Features.............................................................................................................................. 37

5.2 Data link ............................................................................................................................................ 39
5.3 Antenna Circuit Design ...................................................................................................................... 39
5.4 Antenna Design ................................................................................................................................. 40
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6. Storage, Production and Package....................................................................................................... 42
6.1 Storage .............................................................................................................................................. 42

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6.2 Production ......................................................................................................................................... 42
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6.2.1 Module confirmation and moisture ............................................................................................. 43
6.2.2 SMT reflow attentions ................................................................................................................. 44
6.2.3 SMT stencil design and the problem of less tin soldering .......................................................... 45
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6.2.4 SMT attentions ........................................................................................................................... 45

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6.3 Packaging Information ...................................................................................................................... 47
7. Safety Information ............................................................................................................................... 48

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1. Introduction
L501 is a Cat1 module for LCC+LGA package, with stable and reliable performance. It can well meet
customer's requirements for cost-effective, low-power applications. It suits to IoT areas, such as PoC,
Mobile payment, security and alarm systems, on-board vehicle, DTU, asset tracking, sharing
economy, etc.
1.1 Hardware Diagram
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Antenna
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Key
UART
R
2/4G
ADC
F
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IIC
EN
USB
GPIO
SDIO Baseband
PCM Power Battery
SPI Management 3.3~4.2V
SIM
Audio SPI Nor

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Figure 1.1-1 L501 Functional architecture
1.2 Main features
 CPU
ARM Cortex-R5@624MHz

 Flash
SPI Nor Flash: 128Mb
 Frequency bands
TDD-LTE: B34/B38/B39/B40/B41
FDD-LTE: B1/B3/B5/B8
GSM: B3/B8
 Output Power
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LTE: 23dBm±2dB
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GSM: GSM900 33dBm±2dB
DCS1800 30dBm±2dB
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 Sensitivity
EN
TBD
 Data transmission
LTE Cat1 DL: 10Mbps
UL: 5Mbps
 Power consumption
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Flight mode: 0.7mA @3.8V
LTE Standby: 1.2mA @3.8V
GSM Standby: 1.3mA @3.8V

1.3 Specifications
 Supply Voltage Range: 3.3～4.2V（typ3.8V）
 Dimensions: 30mm * 30mm * 2.9mm
 Package: 135-pin LCC+LGA
 Operation Temperature Range: -40℃～+85℃
 Storage Temperature Range: -45℃～+90℃
 Support WIFI SCAN
 Weight : Approx 5g
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1.4 Interfaces
 IIC
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

GPIO
EINT
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 USB2.0
EN
 ADC
 SIM: Support 1.8V/3V
 UART
 SPI
 PCM
 Key
 Analog Audio
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 Antenna

2. Package Information
2.1 Pin Configuration
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Figure 2.1-1 L501 Pin View

2.2 Pin definition
Table 2.2-1 L501 Pin description
Pin Power
Pin name Type Function Description State(1)
NO. domain
1. GND G Ground GND
2. GND G Ground GND
3. PWRKEY I Power key button 0～4.2V Open
4. RESET I System reset signal 1.8V Open
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5. GND G Ground GND
6. SPI_CLK O SPI clock 1.8V Open

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SPI_MISO/
7. I SPI master in slave out 1.8V Open
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UART3_RX
SPI_MOS1/
8. O SPI master out slave in 1.8V Open
UART3_TX
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9. SPI_CS O SPI chip-select 1.8V Open
10. GND G Ground GND
11. VBUS P USB 5V voltage input 5V Open
12. USB_DM DIO Open

USB port differential data line
13. USB_DP DIO Open
15. VDD_1V8 P 1.8V output voltage 1.8V Open

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16. NC NC
17. USIM_DATA I/O USIM data 1.8/3.0V Open
18. USIM_RESET O USIM reset 1.8/3.0V Open
19. USIM_CLK O USIM clock 1.8/3.0V Open
20. USIM_VDD P USIM output voltage 1.8/3.0V Open
21. SD_CMD I/O SD card command pin 3.0V Open

22. SD_DATA0 I/O 3.0V Open

SD card data pin
26. SD_CLK O SD card clock output 3.0V Open
27. MIC- AI Microphone Channel 0～1.8V Open
28. GPIO86 I/O General Purpose Input Output 86 1.8V Open
29. MIC+ AI Microphone Channel 0～1.8V Open
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31. REC- AO Receiver output -1.8～1.8V Open
32. REC+ AO Receiver output -1.8～1.8V Open

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33. DACL_N AO Audio DAC left channel N -1.8～1.8V Open
34. VDD_1V8 P 1.8V output voltage 1.8V Open

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35. OUT_32K O 32k out Open

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36. DACL_P AO Audio DAC left channel P -1.8～1.8V Open
38. VBAT P VBAT

Power supply 3.3～4.2V
39. VBAT P VBAT

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44. VDD_EXT P VDD_EXT output voltage for SD 3.0V Open
46. ADC2 I ADC external input channel 2 0.1～1.2V Open
47. ADC1 I ADC external input channel 1 0.1～1.2V Open

48. SD_DET I SD detect pin 1.8V Open
Output PIN as operating status

49. STATUS O 1.8V Open
indicating of module
Host to set the module into sleep or
50. WAKEUP_IN I 1.8V Open
wake up the module from sleep
Output PIN as LED control for
51. NETLIGHT O 1.8V Open
network status
Output PIN can be used as wake
52. WAKEUP_OUT O 1.8V Open
signal to host from module
53. USIM_DET I USIM detect pin 1.8V Open
54. FLIGHTMODE I Input PIN as RF operating control 1.8V Open
55. SCL I/O IIC clock 1.8V Open
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56. SDA I/O IIC data 1.8V Open

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58.
59.
GND
NC
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NC
GND
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EN
62. VBAT P VBAT

Power supply 3.3～4.2V
63. VBAT P VBAT
66. UART1_RTS DI UART1 ready to receive 1.8V Open

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67. UART1_CTS DO UART1 clear to send 1.8V Open
68. UART1_RX DI UART1 receive data input 1.8V Open
69. UART1_RING DO UART1 ring indicator 1.8V Open
70. UART1_DCD DO UART1 data carrier detect 1.8V Open
71. UART1_TX DO UART1 transmit output 1.8V Open
72. UART1_DTR DI UART1 Data terminal ready 1.8V Open

73. PCM_OUT O PCM I/F data out 1.8V Open
74. PCM_IN I PCM I/F data in 1.8V Open
75. PCM_SYNC I/O PCM interface sync 1.8V Open
76. PCM_CLK O PCM interface clock 1.8V Open
79. NC NC
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82. ANT ANT Antenna Open
83. NC NC
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84. NC NC
FORCE_
85. I Force software download 1.8V Open
DOWNLOAD
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EN
86. NC NC
87. NC NC

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100. NC NC
101. NC NC
102. NC NC
103. NC NC
104. NC NC
105. NC NC
106. NC NC
107. NC NC
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108. NC NC
109. NC NC
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110. NC NC
111. NC NC
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113. OUT_26M O 26M out Open
114. UART2_TX DO UART2 transmit output 1.8V Open
115. UART2_RX DI UART2 receive data input 1.8V Open
116. NC NC
117. NC NC

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122. NC NC
123. NC NC
124. NC NC

125. NC NC
126. NC NC
127. NC NC
128. NC NC
129. NC NC
130. NC NC
131. NC NC
132. NC NC
133. NC NC
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134. NC NC

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Notes: (1) Suggested status when not in use.
Table 2.2-2 Pin type description

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P:POWER G:GROUND
I:INPUT DI:DIGITAL INPUT
O:OUTPUT DO:DIGITAL OUTPUT
DIO:DIGITAL INPUT OUTPUT AI:ANALOG INPUT
AO:ANALOG OUTPUT I/O:INPUT or OUTPUT
ANT:ANTENNA NC:NOT CONNECT

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2.3 Package Information
2.3.1 Dimensions
The L501 mechanical dimensions are described as following figure (Top view, Back view, Side view).

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Figure 2.3.1-1 Mechanical Dimensions
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2.3.2 Product labeling
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Figure 2.3.2-1 Label of L501

Table 2.3.2-1 Description of label
Item Description
A Pin1 mark
B Logo of company
C PID number
D QR code---include IMEI number
E WEEE
F IMEI number
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G SN number
H Module name
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I Module configuration，C stands for L501C
J QR code---include SN number
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2.3.3 Module size
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Figure 2.3.3-1 Module Size (Unit: mm)
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2.3.4 Recommend Pad
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Figure 2.3.4-1 Recommend pad(Top view, Unit: mm)

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3. Interface Circuit Design

3.1 Power Section
3.1.1 Power Supply
VBAT is the main power supply of the smart module, and the input voltage range is 3.3V to 4.2V. The
recommended voltage is 3.8V. Because the module transmit burst may cause voltage to drop, the
highest current peak will more than 2A (RF max current will be about 2A, and add the current of other
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parts of system working). A large capacitor is recommended to be used near VBAT pins, and the
bigger of the capacitor's value is the better. In order to improve the continued flow of large current, it is
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recommended to use a low-impedance tantalum capacitor 100uF or larger. During layout, the
capacitors are close to the VBAT pins.

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EN
VBAT
Power Module
100uF 22uF 4.7uF 100nF
Figure 3.1.1-1 Power Supply circuit

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Notes: According to the environment, please select capacitor as large value as possible; and
add 100pF, 33pF capacitors if requiring.

3.1.2 Hardware Power On
Module 3-pin is the Power on key. Pulling down the PWRKEY at least 3s～5s and then releasing, the
module will boot. It is internally pull-up to VBAT, and does not need to pull up externally.
PWRKEY
ESD
Figure 3.1.2-1 Turn on circuit
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3.1.3 Hardware reset
Module 4-pin is the hardware reset input. The module will reset hardware when it receives a 1s low
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level signal. It is internally pull-up to VDD_1V8, and does not need to pull up externally.
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RESET
EN
ESD
Figure 3.1.3-1 System Reset
3.2 SIM Interface
3.2.1 Pin Description

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L501 supports and is able to automatically detect 3.0V and 1.8V SIM card. SIM card interface signals
are shown in table 3.2.1-1.
Table 3.2.1-1 (U)SIM Pin Description
Pin NO. Pin Name Signal definition Function Description

17 USIM_DATA SIM card data pin SIM card DATA signal, I/O signal
SIM card reset signal, output by

18 SIM_RESET SIM card reset pin
the module
SIM card clock signal, output by
19 USIM_CLK SIM card clock pin
the module
53 USIM_DET SIM detect pin SIM detect pin, input signal
VSIM card power supply, output by

20 VSIM_VDD VSIM output voltage
the module
3.2.2 SIM application
Please note to increase the ESD components on SIM card signal group (PIN number: 17, 18, 19, 20),
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near the SIM card seat.
In order to meet the requirements of 3GPP TS 27.005 protocol and EMC certification, the proposed
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SIM card is arranged near the module SIM card interface, and avoid to layout too long resulting in
serious waveform distortion, affecting the signal integrity. USIM_CLK and USIM_DATA signals are
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recommended to be protected. Paralleling a 1uF capacitor between GND and VSIM_VDD, it can filter
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out the interference of radio frequency signals.
USIM_DATA I/O
USIM_CLK CLK
VPP
USIM_RESET RST
GND
USIM_VDD VCC
NC
ESD ESD ESD ESD

1uF
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Figure 3.2.2-1 (U)SIM Circuit

Notes: The capacity value of ESD components should be under 22pF.
3.3 SD Card Interface
The L501 supports 4-bit SD interfaces and SDIO2.0. Each SD signal should be protected by ESD
components close to the connector. SD_CLK signal should be protected by GND. The SD card can
support up to 32GB, which is mainly used for field test storage log.
SD_CMD SD_CMD
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SD_DATA0 SD_DATA0
SD_DATA1 SD_DATA1
SD_DATA2 SD_DATA2
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SD_DATA3 SD_DATA3
SD_CLK SD_CLK
VDD_EXT VDD_EXT
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SD_DET SD_DET
EN
GND GND
L501 SD Card
ESD
ESD
ESD
ESD
ESD
ESD
ESD
ESD
4.7uF
Figure 3.3-1 SD Card Circuit

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Notes: The capacity value of ESD should be under 10pF.

3.4 USB Interface
3.4.1 USB Application
The USB interface conforms to the USB2.0 specification and electrical characteristics. It supports
low-speed, full-speed and high-speed modes. The data exchange between the main processor (AP)
and the module is mainly completed through the USB interface.
The USB is mainly used for data transmission, firmware update, module program testing and send
AT command. The DM/DP differential impedance need to be controlled at 90ohm ±10%, and it should
be protected up and down, and can’t be crossed with other lines. USB circuit is as follow.
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VBUS VBUS
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USB_DM USB_DM
USB_DP USB_DP
N F LY
GND GND
EN
L501 AP
1uF ESD
Figure 3.4.1-1 USB Circuit

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Notes: If you use the serial port communication, the VBUS and DM/DP reserved test
points respectively in order to firmware update. If DM/DP is used to communicate with the
MCU, the position of the DM / DP signal near the module needs to reserve a test point and
the DM/DP requires a series 0R resistor. The resistor is placed near the module and the
test point is placed between module and resistor.

3.4.2 Firmware Update
The L501 requires the module to enter the forced download mode when updating the firmware
through the USB interface. When FORCE_DOWNLOAD (PIN85) is detected to be high during
module startup, it enters USB download mode. The circuit of the FORCE_DOWNLOAD interface is
as follow.
85
FORCE_DOWNLOAD 1.8V
Key
L501
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Figure 3.4.1-1 The FORCE_DOWNLOAD Circuit
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3.5 UART Interface
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EN
The L501 provides three UART serial communication interfaces: UART1 can be used as complete
non-synchronous communication interface, supporting standard modem handshake signal control
and in compliance with the RS-232 interface protocol, also supporting 4-wire serial bus interface or
2-wire serial bus interface mode. UART2 is used as a debug port of the L501. UART3 is multiplexed
with SPI interface and can be used to connect peripherals.

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The three groups of UART port support programmable data width, stop bits, and parity bits, with
separate TX and RX FIFOs (512 bytes each). The baud rate of normal application of UART
(non-Bluetooth) is 115200bps.
Table 3.5.1-1 UART Pin Description
Pin NO. Pin Name I/O Function Description

66 UART1_RTS DI UART1 ready to receive
67 UART1_CTS DO UART1 clear to send
68 UART1_RX I UART1 receive data input
UART1 ring indicator. It can be used as

69 UART1_RING DO
wake out signal to host from module
70 UART1_DCD DO UART1 data carrier detect
71 UART1_TX O UART1 transmit data output
UART1 Data terminal ready(wake up

72 UART1_DTR DI
module)
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3.5.2 UART application

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If used UART in communication between the module and application processor, and the level is 1.8V,
the connection mode is shown in Figure 3.5.2-1 and figure 3.5.2-2. You can use the complete RS232
mode, 4 wires or 2 wires mode connection. Module interface level is 1.8V. If the AP interface level
does not match, you must increase the level conversion circuit.
TX TX
RX RX
L501 AP
CTS CTS
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RTS RTS
GND GND
Figure 3.5.2-1 Connect to AP method(4lines)

L501 AP
Serial Port Serial Port
TX TX
RX RX
CTS CTS
RTS RTS
DTR DTR
DCD DCD
RING RING
GND GND
Figure 3.5.2-2 Connect to AP method
3.6 Audio Interface
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L501 provides two audio interfaces: digital audio interface and analog audio interface.
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3.6.1 Digital Audio Interface
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L501 provides a digital audio interface (PCM) that can be used as a PCM master device to transmit
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digital voice signals. L501 only acts as a master device. PCM sync and PCM CLK are as output pins
and PCM sync output 16kHz synchronization signals, the PCM data support 8-bit or 16 bit data
format.
PCM_OUT DAC_IN MIC+

PCM_IN ADC_OUT MIC-
PCM_SYNC LRCK
PCM_CLK BCLK
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SCL SCL SPKP

SDA SDA
SPKN
GND GND
L501 Codec
Figure 3.6.1-1 PCM Circuit（L501 as Main device）

3.6.2 Analog Audio Interface
L501 supports audio input and outputs, which can meet different audio demands. The audio must
take the differential layout and must be protected by GND around it. The audio layout should be not
parallel to other layout of power or high speed routes.
(1) The MIC input signal (MIC + / MIC-) provided by the module only supports ordinary MIC (ordinary
MIC have only two pins). The reference circuit is shown in Figure 3.6.2-1.
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ESD 33pF
Bead MIC+
+
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100pF
Bead MIC-
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ESD 33pF
Figure 3.6.2-1 Common MIC Circuit
(2) The module provides normal receiver output, and the receiver signals take the differential layout
and connect directly to the device. The reference circuit is shown in Figure 3.6.2-2.
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ESD 33pF
Bead REC+
100pF
Bead REC-
ESD 33pF
Figure 3.6.2-2 REC Circuit
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(3) The module provides a set of DACL_P and DACL_N differential output signals, which can realize
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the function of the speaker under the amplification of an external PA. The reference circuit is shown in
Figure 3.6.2-3.
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2.2uF 2.2uF
EN
VBAT
4.7uF
D2
C1
D1
A3
B3
B1
B2
100K
VDD
VDD
C1P
C2P
C1N
C2N
C2N
A4 D3 4.7uF
ESD
AUDIO_PA_EN SHDN PVDD

1nF
15nF 3.3K
DACL_N
AW8736 0R
A2 B4 1
INN VOP
220pF
A1 D4
INP VON 0R
2
GND
GND
GND
C2
C3
C4
15nF 3.3K
DACL_P
ESD
1nF
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Figure 3.6.2-3 Speaker Amplify Circuit
3.7 IIC Interface
L501 can support a group of IIC interface. It can communicate with peripherals through the IIC
interface. It is internally pulled up to VDD_1V8 through 4.7K resistor. It supports standard mode
(100KHz) and fast mode (400KHz).

3.8 NETLIGHT Interface
3.8.1 NETLIGHT LED Control circuit
NETLIGHT (PIN51) can be used to control the LED status of the network.
POWER
NETLIGHT
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100K
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N F LY
EN
Figure 3.8.1-1 NETLIGHT LED Circuit
3.8.2 NETLIGHT LED Status description
NETLIGHT (PIN13) is used as the enable pin. Table 3.8.2-1 lists the LED status.
Table 3.8.2-1 NETLIGHT LED Status
LED Status Module Status

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OFF Power off or PSM Mode
64ms ON/800ms OFF Shut down network
64ms ON/3000ms OFF Registered network

3.9 Interactive Application Interface
L501 provides a variety of interfaces for interacting with the application processor, including
WAKEUP (WAKEUP includes WAKEUP_IN and WAKEUP_OUT), STATUS and FLIGHTMODE.
Table 3.9.1-1 Interactive Application Interface
Pin NO. Pin Name I/O Function Description
49 STATUS O AP query module status
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50 WAKEUP_IN I AP wakes up module
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52 WAKEUP_OUT O Module wakes up AP
54 FLIGHTMODE
TI I Flight mode
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3.9.2 Interface Application

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The L501 provides a direct interactive signal to communicate with the AP.
STATUS: Module status query. Low level indicates power-off state or power-on initialization state, and
high level indicates power-on state.
WAKEUP_IN: After the module enters sleep, the host can wake up the module by pulling down this
signal. After the host pulls the signal high, the module is allowed to enter sleep.
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WAKEUP_OUT: When the module has an event and needs to communicate with the AP, the module
can wake up the AP by setting this pin to low level (Low level will last 120ms).
FLIGHTMODE: It can be used to control the module to enter or exit flight mode. The module enters
flight mode by external input low level.

3.10 SPI Interface
L501 supports one SPI interface and is master device in default. SPI_MISO and SPI_MOSI signals of
SPI interface are multiplexed with UART3
SPI_CLK SPI_CLK
SPI_MISO SPI_MISO
SPI_MOSI SPI_MOSI
SPI_CS SPI_CS
GND GND
Slave
L501 Device
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Figure 3.10-1 SPI Connecting
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3.11 ADC
L501 provides an ADC for detecting light-sensitive resistors or other devices that require ADC
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detection. The Max voltage of ADC is 1.2V with 12-bit accuracy.
Table 3.11-1 ADC value
Parameter Min. Typ. Max. Unit
Input range 0.05 1.2 V

CO

4. Electrical characteristics
4.1 Electrical characteristic
Table 4.1-1 Electrical characteristic
Power Min. Nom. Max Unit
VBAT 3.3 3.8 4.2 V
AL
Peak current -0.3 - 2.0 A
ID NQ
TI
Notes: The over-low voltage can’t power on the module. Over-high voltage may be danger to
damage the module.

N F LY
EN
4.2 Temperature characteristic
Table 4.2-1 Temperature characteristic
State Min. Nom. Max Unit

CO
Working -40 25 85 ℃
Storage -45 25 90 ℃
Notes: When the temperature is over the range, the RF performance may be dropped. It also
may cause power down or restart problem.

4.3 Absolute Maximum Power
Table 4.3-1 Absolute maximum power rating
PIN Name Description Min. Typ. Max. Unit
VDD_1V8 Digital power for IO -0.3 2 V
VBAT Power supply -0.3 6 V
4.4 Recommended operating conditions
AL
Table 4.4-1 Recommended operating range
ID NQ
PIN Name Description Min. Typ. Max. Unit
VDD_1V8
TI
Digital power for IO 1.7 1.8 1.98 V
N F LY
EN
Notes: All the GPIOs, UART and IIC of module are 1.8V.
4.5 Power consumption
Table 4.5-1 Power Consumption

CO
Parameter Conditions Min. Average Max. Unit
Power off mode VBAT=3.8V - 15 uA
Flight mode VBAT=3.8V - 0.7 mA
LTE Standby VBAT=3.8V 1.2 mA

GSM Standby VBAT=3.8V 1.3 mA
Peak current VBAT=3.8V 2 A
Notes: The test value of power consumption is the value tested in laboratory condition.
4.6 Power Sequence
AL
VBAT
ID NQ
VRTC
ONKEY
BUCK1
TI15ms
1ms
N F LY
LDO5 1ms
EN
1ms
BUCK2
BUCK3
1ms
LDO1
1ms
BUCK4
1ms
LDO2
Figure 4.6-1 Power up time sequence diagram
4.7 Digital Interface Characteristics

CO
Table 4.7-1 Digital IO Voltage
Parameter Description Min. Typical Max. Unit
VIH High level input voltage 0.7*VDD_1V8 1.8 1.98 V

VIL Low level input voltage 0 - 0.3*VDD_1V8 V
VOH High level output voltage 0.8*VDD_1V8 1.8 1.98 V
VOL Low level output voltage 0 - 0.2*VDD_1V8 V
Notes: Suit to all GPIOs, IIC, UART interfaces.
4.8 ESD
AL
The module contains high sensitive electronic and is an electrostatic Sensitive Device. More
ID NQ
TI
attentions should be paid to the procedure of handing and packaging. The ESD test results are
shown in the following table.

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EN
ESD parameter（Tem: 25°C，humidity: 45%）
Table 4.8-1 ESD Performance
PIN Name Contact discharge Air discharge
VBAT ±4KV ±8KV
GND ±4KV ±8KV
ANT ±4KV ±8KV

CO
Enhanced ESD performance method:
1、 If a converted board is added, it should have enough GND pins and be equally distributed. And
the Layout of GND should be enough wide.
2、 Key (Power key, Force_download key and Reset key) need to add ESD device. Reset key line

can’t be near the edge of the board.
3、 UART and other plug connector need to add ESD devices, and the other control lines from the
outside of the machine also need to add ESD devices.
4、 SIM card should be added ESD protect.
5、 External antenna, please add ESD device, ESD Cpf<0.5pF.
AL
Notes: For ESD protect, please add ESD methods according to upper ways.
ESD components include varistors and TVS. For better performance, please use
ID NQ
TVS.
TI
N F LY
EN
CO

5. RF Features
5.1 RF Main Features
a) Support FDD/TDD LTE Rel-8 CAT1;
b) Support GSM/GPRS/EGPRS;
c) Support WIFI SCAN;
d) Support LTE bands include Band 1/3/5/8/34/38/39/40/41;
AL
e) Support GSM bands include GSM900/DCS1800;
The operating frequency range of the product is shown in table 5.1-1.

ID NQ
TI Table 5.1-1 Frequency Band
N F LY
Band Uplink Downlink Note

EN
Band1 1920 MHz ～ 1980 MHz 2110 MHz ～ 2170 MHz

CO
Band41 2535 MHz ～ 2655 MHz 2535 MHz ～ 2655 MHz Support 120MHz bandwidth
GSM900 880 MHz ～ 915 MHz 925 MHz ～ 960 MHz
DCS1800 1710 MHz ～ 1785 MHz 1805 MHz ～ 1880 MHz
Table 5.1-2 Output power

Band Max output power Min output power
Band1 23dBm±2dB < -40dBm
AL
GSM900 33dBm±2dB 5dBm±2dB

ID NQ
DCS1800 30dBm±2dB 0dBm±2dB
TI Table 5.1-3 Receive sensitivity

N F LY
EN
Band REF SENS @10MHz (Total)
Band1 TBD
Band3 TBD
Band5 TBD
Band8 TBD
Band34 TBD
Band38 TBD
CO
Band39 TBD
Band40 TBD
Band41 TBD
GSM900 TBD
DCS1800 TBD
“TBD” Under development.

5.2 Data link
Table 5.2-1 Data link
Band Downlink Uplink
Band1 TBD TBD
Band3 TBD TBD
Band5 TBD TBD
Band8 TBD TBD
Band34 TBD TBD
AL
Band38 TBD TBD
Band39 TBD TBD

ID NQ
Band40
Band41
TBD
TBD
TI TBD
TBD
N F LY
“TBD” Under development.

EN
5.3 Antenna Circuit Design
The connecting part of the RF antenna supports the PAD form. The connection between the module
and the main board antenna interface is required to be welded and connected through a microstrip
line or a strip line. The microstrip line or strip line is designed according to the characteristic
impedance of 50 ohm, and the length of the wire is less than 10mm. Reserved ∏ matching network.
CO
Antenna
matching circuit
RF Connector
GND
R1 R2
Main_ANT
GND
C1 C2
NC NC
MODULE
MODULE

Figure 5.3-1 Main Antenna Design
Figure R1, C1, C2 and R2 composition of the antenna matching network for antenna debugging, the
default R1, R2 paste 0 ohm resistor and C2, C1 empty paste.
RF Connector in the figure is used for testing and conducting test (for example, CE, FCC, etc.), which
need to be placed as close as possible by the module, the RF path from the module to the antenna
feed point should be kept 50 ohm impedance control.
This product antenna peripheral circuit design, the proposed RF circuit Layout program: RF line
trances top layer, a reference to the second layer. Users need to pay attention to the design of the
AL
PCB line: to ensure the RF has full reference GND layer.
ID NQ
TI
N F LY
EN
Figure 5.3-2 RF Trace Design
5.4 Antenna Design

CO
PIFA or IFA antenna can be used for inner antenna; Whip antenna can be used for external antenna.
The antenna gain must more than 3dBi. The recommend area of inner antenna: 100mm*10mm*6mm
(L*W*H), the main board length no less than 90mm. The antenna should be as far as possible from
the chip and memory, power interface, data cable interface, camera FPC, screen FPC, connector
FPC, and other possible EMI modules and devices.

Table 5.4-1 Antenna Specifications
Parameter Specification
Efficiency >40%
S11/VSWR <-10dB
Polarization linear polarization
Low Band >18dBm
TRP Middle Band >18dBm
High Band >18dBm
Low Band <-92dBm (@10MHz)
AL
TIS Middle Band <-92dBm (@10MHz)
High Band <-92dBm (@10MHz)

ID NQ
TI
Low Band Band 5/8
Middle Band Band 1/3/34/39
High Band Band 38/40/41

N F LY
EN
CO

6. Storage, Production and Package

6.1 Storage
The rank of moisture proof of the module is level 3. There is an obvious sign on the table of the
internal and the external packaging.
In the vacuum sealed bag, the module can be stored for 180 days when the temperature is below
40°C and the humidity is below 90% under good air circulation.
AL
Humidity level is described detail as follows:
ID NQ
TI
Table 6.1-1 Humidity level
Rank Factory Environment ≦ +30°C /60%RH

N F LY
EN
1 No control < 30°C /85%RH
2 One year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
CO
6 Baking before using, SMT during the time table signs
Notes: Moving, storage, production of module must meet the demand of IPC/JEDEC J-STD-033.
6.2 Production
The module is a humidity sensitive device. If the device needs reflow soldering, disassembly and

maintenance, we must strictly comply with the requirements of humidity sensitive device. If module is
damp, a reflow soldering or using a hot-air gun maintenance will lead to internal damage, because
the water vapor has the rapid expansion of the burst, causing physical injury to the device, like PCB
foaming and BGA component fail. So customers should refer to the following recommendations.
6.2.1 Module confirmation and moisture
The module in the production and packaging process should be strictly accordance with the humidity
sensitive device operation. The factory packaging is vacuum bag, desiccant, and humidity indicator
card. Please pay attention to the moisture control before SMT and the confirmation of the following
aspects.
AL
Demand of Baking confirmation
ID NQ
TI
Smart module uses vacuum sealed bag, which can make it stored for 6 months under the condition of
temp 40°C and humidity < 90%. The module should be baked before reflowing soldering if any of the
N F LY
conditions below happen.

EN
1. Storage exceeds the time limit.
2. Package damages and vacuum bags have air leakage.
3. Humidity indicating card change the color at 10%.
4. Module is placed naked in the air over 168 hours.

CO
5. Module is placed naked in the air under 168 hours but not temp 30°C and humidity < 60%.
Baking condition confirmation
The moisture proof level of the smart module is level 3. And the baking conditions are as follows.
Table 6.2.1-1 Baking conditions

Baking
conditions 120°C / 5%RH 40°C / 5%RH
Baking time 4 hours 30 days
Description not use the original tray Can use the original tray
Notes: The original anti-ESD tray temperature does not exceed 50°C. Otherwise the tray
will be deformed.
The anti-ESD tray of the original packaging is only used for packaging, and can’t be
used as a SMT tray.
During taking and placing, please take notes of ESD and cannot be placed as
overlay.
AL
ID NQ
Customer product maintenance
TI
If maintenance module after SMT, it is easy for damp module to damage when removing, so the
N F LY
module disassembly and other related maintenance operations should complete within 48 hours after
EN
SMT, or need to bake and then maintenance the module.
Because the module return from the field work can’t ensure the dry state, it must be baked in
accordance with the conditions of baking, then for disassembly and maintenance. If it has been
exposed to the humid environment for a long time, please properly extend the baking time, such as
125°C/36 hours.
6.2.2 SMT reflow attentions

CO
The module has the BGA chips, chip resistances and capacitances internally, which will melt at high
temperature. If module melt completely encountered a large shock, such as excessive vibration of
reflux conveyor belt or hit the board, internal components will easily shift or be false welding. So,
using intelligent modules over the furnace need to pay attention to:
 Modules can’t be vibrate larger, namely customer requirements as far as possible in orbit (chain)

furnace, furnace, avoid on the barbed wire furnace, in order to ensure smooth furnace.
 The highest temperature can’t too high. In the condition that meet the welding quality of
customer motherboard and module, the lower furnace temperature and the shorter maximum
temperature time, the better.
Some customer’s temperature curve in the line is not suitable, high temperature is too high, and
customer motherboard melt good, but non-performing rate is on the high side. Through the analysis
of the causes, it found that melt again of BGA components lead device offset and short circuit. After
adjusting the temperature curve, it can ensure that the customer’s motherboard the welding quality,
and also improve the pass through rate. Non-performing rate is controlled below the 2/10000.
AL
6.2.3 SMT stencil design and the problem of less tin soldering
ID NQ
TI
Part of customers found false welding or circuit short when reflowing. The main reason is module tin
less, PCB distortion or tins too large. Suggestions are as follows:

N F LY
EN
 Suggest use ladder stencil, which means the depth of the region of module is thicker than other
areas. Please adjust validation according to the measured thickness of solder paste, the actual
company conditions and experience value. The products need to strictly test.
 Stencil: Reference module package and the user can adjust according to their company
experience; Outside of the module, the stencil extends outside. The GND pads use the net
stencil.
CO
6.2.4 SMT attentions
If customer motherboard is thin and slender with a furnace deformation, warping risks, you will be
suggested to create "a furnace vehicle" to ensure the welding quality. Other production proposals are
as follows:
 The solder pastes use brands like Alfa.

 The module must use the SMT machine mount (important), and do not recommend manually
placed or manual welding.
 For SMT quality, Please ensure the necessary condition according to actual condition of factory
before SMT, like SMT pressure, speed (very important), stencil ways.
 We must use the reflow oven more than 8 temperature zones, and strictly control the furnace
temperature curve.
Recommended temperature:
AL
B. constant temperature zone: temperature 140-210°C, time: 60s-120s.
E. recirculation zone: PEAK temperature 220-245°C, time: 45s-75s.

ID NQ
TI
N F LY
EN
CO
Figure 6.2.4-1 Temperature Curve

Notes: Customer’s board deformation must be controlled well. By reducing the number of
imposition or increasing patch clamp to reduce the deformation.
Module thickness of the stencil is recommended to be thickened, and the rest position
can be maintained by 0.1mm.
6.3 Packaging Information
The L501 module is packaged with a roll of tape and sealed with a vacuum-sealed antistatic bag.
Coil tape
AL
One coil can hold 250 modules, as shown in the figure.
ID NQ
TI Belt
N F LY
Product
EN
direction
Plastic tray
CO
K0
Size: B0=30.0; K0=3.0; Unit: mm
Figure 6.3-1 Coil tape information

7. Safety Information
For the reasonable usage of the module, please comply with all these safety notices of this page. The
product manufacturers should send followed safety information to user, operator or product’s spec.
The devices using the module may disturb some electronic equipment. Put the
module away from the phone, TV, radio and automation equipment to avoid the
module and the equipment to interfere with each other.
Shut down the mobile device or change to flying mode before boarding. The Using
of wireless appliances in an aircraft is forbidden to avoid the interference, or else
AL
cause to unsafe flying, even violate the law.
In hospital or health care center, switch off the mobile devices. RF interference
may damage the medical devices, like hearing-aid, cochlear implant and heart
ID NQ
TI
pacemaker etc.
Mobile devices can’t guarantee to connect in all conditions, like no fee or with an
invalid SIM card. When you need emergent help, please remember using
N F LY
emergency calls and make sure your device power on in an area with well signal.
EN
Put the module away from inflammable gases. Switch off the mobile device when
close to gas station, oil depot, chemical plant etc.
The module is not water proof. Please don’t use the module in the area with high
humidity like bathroom, which will decelerate the physical performance, insulation
resistance and mechanical strength.
Non-professionals can’t teardown the module which will damage it. Refer to the
specification or communicate the related staffs to repair and maintain it.
CO
Please switch on the module before cleaning. The staffs should be equipped with
anti-ESD clothing and gloves.
The users and product manufacturers should abide by the national law of wireless modules and
devices. If not, Mobiletek will not respond the related damages.

L501 Hardware Design

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L501_Hardware Design

LTE CAT1 Module Series

Copyright © Shanghai Mobiletek Communication Ltd Shanghai Mobiletek Communication Ltd 0

APPLICABLE LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED,

Copyright © Shanghai Mobiletek Communication Ltd 1

Copyright © Shanghai Mobiletek Communication Ltd 2

1.1 Hardware Diagram .............................................................................................................................. 5

2.1 Pin Configuration ................................................................................................................................. 8

3. Interface Circuit Design ....................................................................................................................... 19

3.2 SIM Interface ..................................................................................................................................... 20

3.6.2 Analog Audio Interface ............................................................................................................... 27

Copyright © Shanghai Mobiletek Communication Ltd 3

4. Electrical characteristics ...................................................................................................................... 32

4.1 Electrical characteristic ..................................................................................................................... 32

5.1 RF Main Features.............................................................................................................................. 37

6.1 Storage .............................................................................................................................................. 42

6.2.4 SMT attentions ........................................................................................................................... 45

7. Safety Information ............................................................................................................................... 48

Copyright © Shanghai Mobiletek Communication Ltd 4

1.1 Hardware Diagram

Audio SPI Nor

Figure 1.1-1 L501 Functional architecture

1.2 Main features

Copyright © Shanghai Mobiletek Communication Ltd 5

SPI Nor Flash: 128Mb

LTE Cat1 DL: 10Mbps

Flight mode: 0.7mA @3.8V

LTE Standby: 1.2mA @3.8V

GSM Standby: 1.3mA @3.8V

Copyright © Shanghai Mobiletek Communication Ltd 6

 Supply Voltage Range: 3.3～4.2V（typ3.8V）

 Dimensions: 30mm * 30mm * 2.9mm

 Package: 135-pin LCC+LGA

 Operation Temperature Range: -40℃～+85℃

 Storage Temperature Range: -45℃～+90℃

 Support WIFI SCAN

 SIM: Support 1.8V/3V

Copyright © Shanghai Mobiletek Communication Ltd 7

Figure 2.1-1 L501 Pin View

Copyright © Shanghai Mobiletek Communication Ltd 8

2.2 Pin definition

Table 2.2-1 L501 Pin description

1. GND G Ground GND

2. GND G Ground GND

3. PWRKEY I Power key button 0～4.2V Open

4. RESET I System reset signal 1.8V Open

6. SPI_CLK O SPI clock 1.8V Open

10. GND G Ground GND

11. VBUS P USB 5V voltage input 5V Open

12. USB_DM DIO Open

14. GND G Ground GND

15. VDD_1V8 P 1.8V output voltage 1.8V Open

17. USIM_DATA I/O USIM data 1.8/3.0V Open

18. USIM_RESET O USIM reset 1.8/3.0V Open

19. USIM_CLK O USIM clock 1.8/3.0V Open

20. USIM_VDD P USIM output voltage 1.8/3.0V Open

21. SD_CMD I/O SD card command pin 3.0V Open

Copyright © Shanghai Mobiletek Communication Ltd 9

22. SD_DATA0 I/O 3.0V Open