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CR Energy Optimization Methods

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CR Energy Optimization Methods

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ESL-HH-04-05-18

CLEANROOM ENERGY OPTIMIZATION METHODS

Randy Schrecengost, P.E. Phil Naughton


Senior Project Manager / Mechanical Engineer Senior Member, Motorola SPS Technical Staff
Motorola
Austin, Texas Austin, Texas

Roadmap for Semiconductors has energy goals


ABSTRACT on the roadmap for power per unit of silicon
processed; the World Semiconductor Council
The design and operation of semiconductor has policy for energy reduction, numerous
cleanrooms play an important role in the publications, workshops, and seminars touting
advancement of many of today’s technology need for energy reduction. There is no longer
needs as the use of microelectronic products any question that cutting energy usage makes
become engrained in our society. Cleanroom good business sense, especially given rate
construction has averaged double-digit growth increases being experienced in many parts of
through the 1990’s and into early 2000. the country. The purpose of this article is to
Advances in factory technology have placed inform the reader. Whereas, the obvious
demands on all aspects of cleanroom design, benefits for energy conservation policies are
construction, materials, and so on. Much of this mainly ecological; corporations with vision can
growth has been centered in hot climate of the implement policies that also contribute
sunbelt. significantly to the bottom line.
Energy efficiency has not been a high priority for
the semiconductor industry in the past, since Semiconductor Cleanroom Energy
costs related to this issue have historically
represented a relatively small percentage of Based upon surveys the Semiconductor
2 2
overall operating costs. From a Semiconductor industry has over 12,800,000 ft (1,190,000 m )
Industry website in October 2001: “Slashing of cleanroom space in the United States varying
energy consumption has become an in cleanliness from Class M1 (ISO Class 3) to
unquestioned semiconductor industry goal.” Class M6 (ISO Class 9). These cleanrooms
Semiconductor Industry Association’s have recirculation air handlers moving millions of
International Technology Roadmap for cubic feet (cubic meters) of air to transport
Semiconductors has energy goals on the contamination out of the cleanroom and maintain
roadmap for power per unit of silicon processed; the room’s cleanliness. Whereas, many in the
the World Semiconductor Council has policies semiconductor industry are implementing energy
for energy reduction, numerous publications, conservation policies this is relatively new
workshops, and seminars touting need for philosophy for many companies.
energy reduction. There is no longer any
question that cutting energy usage makes good Even the most aggressive of energy efficient
business sense, especially given rate increases semiconductor factories may use over 450 kWh
being experienced in many parts of the country. of energy for every 200 mm wafer processed
This paper will present some of the methods and the typical semiconductor factory uses
being used by a multi-national semiconductor enough electricity to serve over 7500 homes and
company to change the way they design and will spend over $1,000,000 per month for
build cleanrooms with a focus on resource electricity during peak usage periods of the
conservation, energy conservation methods, and summer. Yet, electrical costs still represent less
cost of ownership. Various clean air and energy than 5% of the total operating cost for today’s
management scenarios will be compared with 200 and 300 mm factories hindering investments
their potential for energy savings. in capital projects to improve energy efficiency.

Semiconductor Industry Semiconductor Factory Characteristics

From the SEMI (www.smi.org) website in Semiconductor factories, referred to as wafer


October 2001: “Slashing energy consumption fabs or just fabs, employ several types of
has become an unquestioned semiconductor cleanrooms, clean support spaces, and non
industry goal.” The International Technology clean spaces. The specifics of semiconductor

Proceedings of the Fourteenth Symposium on Improving Building Systems in Hot and Humid Climates, Richardson, TX, May 17-20, 2004
ESL-HH-04-05-18

fabrication are beyond the scope of this paper; a areas. These arduous tolerances are
good description of the process can be found at: required throughout a specific process area
http://sematech.org/corporate/news/mfgproc/mfg and present difficult control methodology
proc.htm#steps1_2. requirements as the size of the process area
increases.
In order for the cleanroom designer to begin
an optimization of the cleanroom they must 3. The typical metal oxide semiconductor
understand energy use, energy flow and (MOS), bi-polar, Silicon-Germanium, or
appropriate design of HVAC systems for the gallium arsenide facility requires large
industry they have targeted. The characteristics quantities of conditioned fresh air to replace
of semiconductor cleanrooms are different from process exhaust and to provide for cleanroom
cleanrooms used in other industries such as pressurization. Process exhaust
2 2
pharmaceutical, aerospace, and biotechnology. requirements of up to 10 cfm/ft (51 L/s• m )
These differences lead to having unique may be required for some processes areas,
considerations when designing the cleanroom while typical industry averages are 2 to 3
2 2
layout and the HVAC systems. The following list CFM per ft (10.2-15.3 L/s•m ). This fact also
includes some of the characteristics of limits the degree of energy reduction
semiconductor manufacturing cleanrooms: associated with cleanroom make-up and its
interaction with the cleanroom air
1. Within the semiconductor industry, the factory management concept.
cleanroom air cleanliness requirements, as
defined by Federal standard 209E, "Federal 4. In addition to controlling the cleanroom air
Standard Clean Room and Work Station cleanliness level, control of cleanroom
1
Requirements, Controlled Environment ," temperature and relative humidity is crucial
including cleanliness classes M1 to M6. This for a semiconductor factory to operate
document is to be replaced by the new ISO successfully. Temperature and humidity
14644 documents. To achieve the desired control within the cleanroom will have a direct
cleanliness level, unidirectional airflow influence on the quality of the products
cleanrooms with average air velocity ranges manufactured to the point that without proper
of 40 fpm (0.20 m/s) to 100 fpm (0.51 m/s) environmental control, many products will fail
are typically used, with 70-80 fpm (0.35-0.41 minimum functional tests and thus cannot be
m/s) as the most common design velocity. sold or used. Providing the correct
Vertical unidirectional airflow air management temperature and humidity control as part of
concepts are the design of choice for the the air management concept must be fully
majority of semiconductor manufacturing understood when optimizing energy
facilities. The ramifications for choosing an air consumption.
management concept will be discussed later.
Opportunities for Cleanroom Energy
2. Within the cleanroom component load Optimization
analysis, room sensible heat ratios of 0.99 or
higher are normal due to large concentrations There are numerous areas in a fab where
of manufacturing equipment. High sensible implementing energy efficiency options can
2
internal heat loads approaching 200 W/ft result in significant resource and cost savings.
2 2
(2152 W/m ) are common, while 50-75 W/ft Annual savings of millions of kWh are possible
2
(602-807 W/m ) is a typical design criteria for with many energy efficiency projects. The
many merchant, high volume, semiconductor cleanroom designer must balance the need to
factories. The HVAC parameters restrict the meet critical environmental factors, cleanroom
cleanroom design’s flexibility of heat transfer specifications set by the operator/owner, and
options. Representative environmental maintain reasonable installation and operating
control tolerances in many facilities today are costs; while at the same time providing an
±0.2°F (±0.11°C) to ±0.5°F (±0.28°C) and efficient, functional, and flexible cleanroom. The
±1% RH to ±2.5% RH for many process cleanroom designer must understand the
aforementioned characteristics and their
interactive nature to begin an analysis of the
1
energy components that will achieve the given
As of November 2001 the US General Services scope. With the proper analysis, the cleanroom
Administration cancelled Federal Cleanroom
designer can optimize the performance of
Standard, 209E, but the actual application of the
standard does exist in many industries. The use of the individual components and systems to produce
new ISO 14644 standards is slowly gaining an effective and energy efficient total design.
acceptance in the US and around the world. The final performance of the cleanroom is judged

Proceedings of the Fourteenth Symposium on Improving Building Systems in Hot and Humid Climates, Richardson, TX, May 17-20, 2004
ESL-HH-04-05-18

by the quality of control of the critical studies energy use within semiconductor
environmental factors. cleanrooms can be divided into several large
components (See figure 1). Maintaining fab
Energy Usage in a Semiconductor Factory cleanliness, providing fresh air to replace
process exhaust, and removing the heat of
For the semiconductor industry in the U.S., process tools are the primary reasons for the
cleanroom electricity demand is estimated at large energy usages of the HVAC system. The
3500 megawatts and consumption at over largest energy use within the factory is the
15,000 gigawatt-hours per year about 1.5 manufacturing tools. These large energy
percent of total industrial electricity use, for all components may be divided into direct and
industry sectors in 1998. For many plants, indirect with respect to the manufacturing
electricity costs are the single greatest facility process. Direct energy needs are the actual
operating cost, greater than both labor and energy consumed by the manufacturing tools.
materials. In fact, for large fabs, it is not Indirect energy components are exhaust and
uncommon to have electric bills that are greater water utilities consumed by the tools.
than $1 million per month. According to several

FIGURE 1
D I W ater Support
Process W ater 5% 3% C h illers and
P u m p ing Pumps
4% 21%
N itro g e n P l a n t
5%

Exhuast Fans
6%

Recirc and Make-


up Fans
17%

Process Tools
39%

is removed from the cleanroom are the primary


FACTORS EFFECTING FAB CLEANROOM opportunities for optimization (see figure 2). For
ENERGY USE example, the ability to separate sensible heat
transfer from latent heat transfer provides
We have presented which systems consume significant savings due to the high sensible heat
energy within a typical semiconductor fab. Of ratios and the large amount of make-up air
the systems shown in figure 1 the cleanroom needed to offset process exhaust and maintain
design will directly affect the energy consumption positive room pressurization. There are also
of the recirculation and make-up air system and heat transfer efficiency opportunities between
some of the support system (this is where internal loads and the chiller plant. Efficiency
cleanroom lighting consumption is located) and gains are available during the equipment
indirectly affect the chiller and pumps. selection process, but some are beyond the
cleanroom designer’s scope (e.g. process
Energy associated with air movement, equipment heat transfer to process cooling water
cleanroom pressurization (exhaust and make-up is designed by the process equipment supplier).
air balance) and how heat (sensible and latent)

Proceedings of the Fourteenth Symposium on Improving Building Systems in Hot and Humid Climates, Richardson, TX, May 17-20, 2004
ESL-HH-04-05-18

Personnel

a function of the cleanroom design. The ability


Airborne Cleanliness to maintain room cleanliness is proportional to
the volume of recirculation air. The challenge
Controlling airborne cleanliness is a facing cleanroom designers is to provide the
fundamental requirement of a cleanroom. minimum amount of recirculation air needed to
Maintaining cleanliness requires the removal of maintain room cleanliness. The cleanroom
internally generated contaminants, the filtration designer must design an air management
of external contaminants from the fresh air concept to meet the cleanroom owners
introduced to the cleanroom, and the prevention requirements.
of external contaminants by means of positive
pressurization. To accomplish these goals, large Temperature and Humidity Control Zones
air change rates of 300 to 600 air changes per
hour for air cleanliness classes of class M1 (ISO The method of temperature and humidity
Class 2) or better will be necessary, (Table 1). control can produce one of the largest variations
The control of internally generated particles is a in energy consumption. During the past years a
function of the cleanroom protocol established by thorough understanding the heat transfer
the owner's contamination control specialist, dynamics in semiconductor cleanrooms has
while the need for sufficient airflow to quickly resulted in several methods for temperature and
remove the contaminants from the workspace is humidity control. The air management concept

Proceedings of the Fourteenth Symposium on Improving Building Systems in Hot and Humid Climates, Richardson, TX, May 17-20, 2004
ESL-HH-04-05-18

will also impact the available choices for control, of energy over which the designer has the most
especially humidity control. Temperature and amount of influence.
humidity control can be one of the largest users

Table 1. Cleanroom Classifications


ISO 14644-1 compared t o FED-STD-2 0 9 E
Part icles limit s Tradit ional
Limit
ISO Classificat ion Number (N)at 0 .1 µm Limit at 0 .5 µm Limit at 5 µm FED-STD-2 0 9 E Class
Cleanliness Class
( m3) ( f t 3) ( m3 ) ( f t 3) ( m3 ) ( f t 3)
ISO Class 1 10 0 .28
ISO Class 2 100 2 .83 4 0 .11
ISO Class 3 1000 28 35 1 M1.5
ISO Class 4 1 0 ,000 283 352 10 M2.5 Class 10
ISO Class 5 1 0 0 ,000 2832 3520 100 29 1 M3.5 Class 100
ISO Class 6 1,000,000 28321 3 5 ,200 997 293 8 M4.5 Class 1 ,000
ISO Class 7 3 5 2 ,000 9969 2 ,930 83 M5.5 Class 1 0 ,000
ISO Class 8 3,520,000 99688 2 9 ,300 830 M6.5 Class 100,000
ISO Class 9 35,200,000 996885 2 9 3 ,000 8298

Maximum concent rat ion limit s (part icles per cubic met er of air) for part icles equal t o and larger t han t he considered sizes shown.
Concent rat ion limit s are calculat ed in accordance wit h Cn=10^ N x ( 0 .1/ D) ^ 2 .08
Concent rat ion limit s per cubic foot are not recognized by ISO st andards, t hey are given for comparison purposes only and
should not be used for applicat ion of t he ISO 1 4 6 4 4 f amily of st andards.

Process Exhaust Pressurization Control

While process exhaust does not have a Good pressure control is needed for many
direct impact on cleanroom energy consumption reasons in today’s cleanrooms. Pressure control
the method of exhaust replacement or makeup of the clean spaces can have an impact on
air does. How the makeup air is configured into atmospheric processes such as film deposition.
the overall air management concept can have Pressure control is used to provide barriers to
significant impact on overall cleanroom energy contamination. Positive cleanroom pressure is
consumption. Depending upon local climatic maintained to keep external contamination
conditions, the treatment of makeup air is also a (particles and moisture) out of the cleanroom,
significant user of energy in maintaining the and negative pressurization is used when trying
cleanroom environment to contain hazardous materials inside the
cleanroom from exiting (metal ions like gold,
Humidity Control Method boron, potassium, etc. must be carefully
contained). Similar to the benefits of humidity
The control of relative and absolute humidity control the method of pressure control will have
is of extreme importance to the cleanroom an impact on the makeup air quantity and
designer. Many processes require precise quality, and the method that makeup is
humidity control to insure product quality; and introduced into the air management concept will
the control of humidity is also important for the also impact the total energy consumption.
control of electro-static discharge. Corrosion of
thin films during metal deposition and etch Recirculation Fan Evaluation
processes may occur, depending on the
process. Humidity within the cleanroom is best The cleanroom recirculation fans are used to
controlled by control the make-up moisture provide a uniform airflow of ultra-clean air over
content. Make-up with the correct moisture the product workspace. In a large
2
content is mixed with the cleanroom recirculation semiconductor cleanroom with 100,000 ft (9290
air. Due to the high sensible heat ratios of 2
m ) of ISO 2-3 cleanliness (class M1) work
semiconductor cleanrooms, humidity excursions space (i.e., less than 10 particles per cubic foot
are typically caused by localized wet processes of particles less than 0.1µm in size), airflow rates
or moisture migration from adjacent spaces. of 6,000,000 to 9,000,000 CFM (2,832,000 to
Therefore, precise make-up control can provide 4,248,000 L/s) may be involved. Large amounts
consistent cleanroom control. Energy of energy are used to transport the cleanroom air
consumption can be minimized with the make-air and remove the fan heat. Many significant
treatment process. Attempts to control humidity energy savings are possible when high-efficiency
with a dehumidification/reheat process of the components are used for large quantities of air
recirculation air will result in extremely high circulation.
operating costs.

Proceedings of the Fourteenth Symposium on Improving Building Systems in Hot and Humid Climates, Richardson, TX, May 17-20, 2004
ESL-HH-04-05-18

Improving fan system efficiencies will reduce either forward curve, backward inclined, or airfoil
the recirculation air handler brake horsepower centrifugal fans, or vane and tube axial fans.
requirements. Changes in fan system When vane-axial fans are selected, the higher
efficiencies are achieved through: fan sound power levels may require additional
sound attenuation with correspondingly higher
-- Fan Drive efficiency
pressure drops, while some centrifugal fans have
-- Fan mechanical efficiency lower efficiencies but operate at lower sound
power levels. The lower static pressure system
-- Motor efficiency
combined with low speed large diameter vane-
axial fans will have substantial reduction to
Proper selection of cleanroom fans involves sound power thus reducing the need for some
evaluating fan types, drive mechanisms, sound attenuation. An analysis of the factors
maintenance requirements, sound power levels, effecting total power can be show by the
etc. Concepts 1 and 2 may use several fan following:
options: open and closed scroll centrifugal fans,

Airflow x Static Pressure (1)


Bhp =
6356 x ηm x ηf
Rearranging terms and solving for static pressure

Airflow x Static Pressure(v) Airflow x Static Pressure(c) (2)


=
6356 x ηm x ηv 6356 x ηm x ηc

Combining similar terms

Static Pressure(v) Static Pressure(c) (3)


=
ηv ηc
Solving for centrifugal fan efficiency

Static Pressure(v) = Static Pressure(c) x


ηv (4)
ηc
Where:

Airflow is in ft 3 per minute


Static pressure is in inches WC
6356 is a conversion factor
ηm is motor efficiency

ηf is fan efficiency

ηc is centrifugal fan efficiency

ηv is vane-axial fan efficiency

Proceedings of the Fourteenth Symposium on Improving Building Systems in Hot and Humid Climates, Richardson, TX, May 17-20, 2004
ESL-HH-04-05-18

motor voltage to match the torque requirement of


Using Equations 1 through 4, one can see the fan, thereby minimizing inefficiencies due to
that the change in fan efficiencies results in a slip. Overall, the resultant motor efficiency is
linear offset in static pressure. Thus, when 75% to 80%, compared to less than 40% for
comparing an 75% efficient (total efficiency) phased split capacitor or shaded pole motor
vane-axial fan with a 65% efficient (total designs. With this improved efficiency also
efficiency) centrifugal fan, the ratio of 75/65 comes the byproduct of quieter operation. New
(1.154) times the static pressure of the backward inclined versus forward curve
centrifugal fan will allow a 15.4% higher static centrifugal fans are used with a mechanical
pressure for the vane-axial fan for equal brake efficiency of 60%, this allows for a potential total
horsepower requirements. When high-efficiency efficiency of (0.6 x 0.8) x 100% = 48%, still
fans are selected, considerable energy savings significantly less than the 80% achieved by direct
will result. drive vane-axial fan systems.

The trend toward smaller local fans for Good fan selection provides an optimum
cleanroom recirculation should be evaluated mechanical design; the choice of drive
against the use of larger, more efficient central mechanism and motor type will also yield
fans. Localized FFUs provide for greater considerable energy-savings potential.
2
flexibility in the cleanroom configuration and Additional energy savings of 2-5 W/ft of
localized cleanliness zones can be achieved in 2
cleanroom space (21.6-54 W/m ) may be
the midst of less clean spaces. FFUs typically
achieved with the substitution of high-efficiency
have lower static pressure requirements since
motors for standard efficiency motors. The
sensible and latent cooling is done within other
choice to use fans with motors outside the
heat transfer blocks. When localized fan filter
units (FFU) are used to reduce the system's primary air stream will save 1.0-1.5 W/ft2 (10.7-
static pressure, there is a trade-off between 16.15 W/m2) due to motor inefficiency, but
decreasing efficiency and static pressure removal of the motor from the airstream by using
decreases. FFUs cannot develop significant belt-driven fans with lower mechanical
static pressure so the cleanroom designer must efficiencies will reduce the energy savings.
be careful in designing the cleanroom air path. High-efficiency motors have an inefficiency of 6-
Careful selection of very low velocity, low 8%, whereas belt drive systems have
pressure cooling coils is needed. After air passes inefficiencies of 4-6%. The use of special direct-
through any internal sound attenuators and the drive fans with motors outside the airstream
discharge HEPA filters, there is comparatively (bifurcated fan housings) may result in higher
little pressure left to offset external static system effects and lower total efficiency.
pressure losses. For many older small FFUs
with motor sizes less than 1 horsepower (0.75 To summarize cleanroom fan energy: the
kW) and in-line centrifugal forward-curved fans, energy associated with the cleanroom fan is a
the total efficiency drops to 25% to 50% due to function of the type of fan used, the fan
poor motor and fan efficiencies. An 85% arrangement (i.e. direct drive, belt driven), motor
mechanically efficient, direct-drive vane-axial fan type, and the total pressure (static pressure +
has a motor efficiency of 94% and total efficiency velocity pressure = total pressure) of the fan
of (0.85 x 0.94) x 100% = 79.9%. Compare this system. As seen in equations 1-4, static
with an FFU operating at 1.5 in. WC (373.5 Pa) pressure is also a contributor to energy
of static pressure, 55% mechanical efficiency, consumption. Significant air-side saving can be
70% motor efficiency (3 phase motors), and total achieved by lowering the system static pressure:
efficiency of (0.55 x 0.70) x 100% = 38.5%. 1) Reduce the cleanroom airflow static path
Using single phase shaded pole motors the total pressure losses. 2) Reduce the cleanroom
efficiency can drop to 25%. FFUs designs are airflow in all areas or in selected areas with
now available with the fan, the motor and the mixed cleanroom HEPA filter velocities. Many
motor controller optimized for efficiency. These manufacturers use cleanroom unidirectional
designs include a brushless, electronically velocities of less than the historical average of
commutated dc motor with an external rotor. 90 fpm (0.457 m/s). The potential air-side energy
The fan impeller is fitted directly onto the rotor. savings for cleanroom velocity reductions only
Either embedded microprocessors or remote are summarized in Figure 3.
microprocessor control is used to adjust the

Proceedings of the Fourteenth Symposium on Improving Building Systems in Hot and Humid Climates, Richardson, TX, May 17-20, 2004
ESL-HH-04-05-18

Annual Energy Savings Through Reduced St atic Pressure

4,000,0 0 0

3,500,0 0 0

3,000,0 0 0

2,500,0 0 0
Annual KWH Savings

0 .1 '' SP
0 .2 '' SP
0 .3 '' SP
2,000,0 0 0 0 .5 '' SP
0 .8 '' SP
1 .0 '' SP
1,500,0 0 0

1,000,0 0 0

5 0 0 ,0 0 0

0
100000 250000 500000 750000 1000000 1250000 1500000 1750000 2000000 2250000
Cleanroom Reciculat ion Flowrate (CFM)

FIGURE 3
with its impact on cleanroom performance. This
Airflow Path Evaluation interrelationship must be considered in order to
assess the operating cost benefits of one device
The primary source of energy saving’s vs. the first cost of another. When the optimized
potential is from reduced air-side static pressure system requires a threefold increase in capital
losses, using efficient ductwork fittings, lower coil cost with a ten-year simple payback, the
and filter face velocities, etc. The following air- cleanroom owner may decide to distribute the
side components typically are used within the investment dollars to other systems.
standard cleanroom air supply and return
system: Most of the economical static pressure
reductions can be accomplished with lower coil,
-- Air-moving apparatus damper, and/or filter face velocities and efficient
-- Cooling/heating apparatus ductwork design. Removing or redesigning air
filtration and cleanroom components must be
-- Air filters balanced against the primary goals of the
-- Sound attenuators cleanroom, such as the desired air cleanliness
level.
-- HEPA/ULPA filter plenums or supply
ducts When hundreds of thousands of CFM are
-- Air balance devices involved, the reduction in fan static pressure of
just 0.1 in. WC (24.9 Pa) can result in $7200 per
-- Supply/return ductwork and fittings 2 2
year of savings for a 10,000 ft (929 m )
-- Fire and smoke protection devices cleanroom (see Figure 7). In addition to fan
horsepower savings, each 0.1 in. WC (24.9 Pa)
-- Cleanroom components including raised
will also produce 3.9 tons (13.7 kW) of air
flooring, ionization grids, etc.
conditioning savings due to the reduced fan heat
10
load
The design and selection of each component
are interrelated, and the cleanroom designer
Lowering the air-side pressure drop
must balance the energy use of each component
associated with heat transfer coils and filters is a

Proceedings of the Fourteenth Symposium on Improving Building Systems in Hot and Humid Climates, Richardson, TX, May 17-20, 2004
ESL-HH-04-05-18

readily available energy-saving option for Another method of reducing the system's
designers. While the use of air filters is the static pressure is to use a low-velocity duct
primary means to achieve the desired air design. Low-velocity systems occupy more
cleanliness level, the quantity and quality of facility space and have higher capital costs.
filtration are normally established by the Therefore, alternative designs must be used that
cleanroom owner's contamination control compensate for higher velocity distribution
specialist. Many semiconductor cleanrooms use system pressure losses. A common design to
only minor amounts of prefiltration, typically one solve this predicament is the use of a
set of 30% efficient prefilters. Other pressurized plenum for air supply to the
semiconductor firms use two stages of HEPA/ULPA filter ceiling.
prefiltration, a 30% and a 90% efficient filter in
series. The removal of pre-filters after a Pressurized plenum designs may reduce
cleanroom is operating is also quite common. system static requirements up to 1.0 in. WC (249
The owner normally makes the choice of one- Pa) when compared to ducted HEPA filter
stage filtration, two-stage filtration, or no systems. The primary benefit of ducted HEPA
prefiltration. Therefore, the extra operating costs filters is the precise balance of the cleanroom
associated with the 0.75 in. WC (186.8 Pa) to 1.0 unidirectional velocity profile or parallelism.
in. WC (249 Pa) pressure drop required for Precise balance also provides the flexibility to
prefiltration must outweigh the shorter HEPA have mixed cleanroom velocities. For example,
filter life expectancy. (Prefilter operating costs the cleanroom airflow velocity may provide 90
will vary from $5.00 to $8.00 per year per square fpm (0.457 m/s) over the production equipment
foot verse the HEPA filter cost of $12.00 to and the remainder of the cleanroom may operate
$15.00 per square foot.) The expected life of the at 60 fpm (0.305 m/s) which results in a lower
HEPA/ULPA filters is not the only issue. The overall cleanroom velocity proportional to the
potential down-time required to replace the ratio of mixed velocity areas. Most of the latest
HEPA filters are typically an overriding factor in Semiconductor factories are using
the decision. minienvironments are based upon this principle.

A good HEPA filter ceiling system design For cleanrooms using FFUs, the ability to
can prevent external contaminants from entering reduce the air path static losses is quite limited.
the cleanroom and provide the proper The cleanroom air path for FFUs is limited to the
unidirectional airflow to remove the internal cleanroom itself and this may seem to indicate a
contaminants. The cleanroom designer has significant benefit to the FFU concept it also one
many choices available for potential energy of the drawbacks. FFU arrangements cannot
savings within the HEPA filter system. The make changes to the air path without impacting
quality of HEPA filter removal efficiency and the the manufacturing environment or manufacturing
pressure drop of the HEPA filter must be equipment arrangement. Therefore, the range of
discussed during project planning. HEPA filters system static pressure is small. For the latest
with 99.97% removal efficiency of all particles factories with reduced cleanroom coverage, the
0.3µm or larger are available, as well as HEPA use of FFUs is become a de facto standard.
filters with removal efficiencies of 99.99999% for FFU manufacturers are responding to request for
particles 0.12µm or larger. The pressure drop higher efficient units.
associated with many HEPA filters will depend
on the type of filter media used and the quantity Figure 4 shows the static pressure range for
of media per square foot of filter face area. each the common fan types used. Also,
Today, HEPA filter pressure drops vary from 0.2 indicated is typical power consumption per unit
in.WC (49.8 Pa) to 1.0 in. WC (249 Pa). of airflow. Figure 8 also presents the ranges for
Normally, the lower the pressure drop, the higher high efficiency fan systems and typical system
the cost of the filter, but with higher dust holding efficiencies are also shown.
capacity and lower operating costs. The choice
of which filter to use must be input from the
cleanroom owner.

Proceedings of the Fourteenth Symposium on Improving Building Systems in Hot and Humid Climates, Richardson, TX, May 17-20, 2004
ESL-HH-04-05-18

Figure 4. Static Pressure Range for Fan Types

Fan System Efficiency Comparison

0.700

0.600

0.500 RAH Standard Eff.


watts/cfm

RAH High Eff.


0.400
FTU Standard Eff.
FTU High Eff.
0.300
FFU Standard Eff.
0.200 FFU High Eff.

0.100

0.000
0.75 1 1.25 1.5 2 2.5 3
Total Static Pressure (" WC)

leaving temperature as well as the operating


The individual system components discussed so
costs. Assuming a typical semiconductor
far can greatly impact the total system operating
cleanroom space condition of 68°F (20°C) at
costs. Within the total semiconductor cleanroom
40%RH and the resultant 42.8°F (6°C) dewpoint,
system, smaller subsystems may also be
a chilled/glycol water temperature of 35°F
optimized for improved total system operation.
(1.7°C) to 37°F (2.8°C) normally would be used.
Methods to improve energy efficiency within the
A minimum heat exchanger approach of 5°F to
direct cleanroom air management system have
7°F (2.8°C-3.9°C) is recommended for good
been presented. The HVAC process also
controllability. The cost of generating the chilled
includes another large energy user, the make-up
water is a large portion of the total operating
air treatment system. One of the largest
costs of the make-up air conditioning system.
subsystem energy users is the make-up air-
Selecting chillers with low kilowatt per ton
handling system when both its fan energy and
(kW/ton) ratios will prove cost-effective for many
the chiller operating costs are considered. The
large semiconductor facilities. The designer
heat transfer load of the makeup is a very large
should evaluate the chilled-water temperature
portion (typically greater than 25%) of the total
differential design to minimize the kW/Ton ratio.
heat transfer.
When traditional chilled water dehumidification is
Make-up Air Treatment Evaluation used for conditioning make-up air, the operating
costs may be reduced with a number of
As previously mentioned, the treatment of the innovative approaches, including pre-cooling the
cleanroom make-up air is a significant user of make-up air with heat recovery modules, using
energy. Although the make-up treatment is not evaporative cooling, using closed-circuit cooling
within the cleanroom envelop per se’ its airflow is tower water, and using less expensive (i.e. lower
filtered using HEPA filters and the control of the kW/ton) chillers. The use of evaporative cooling
temperature and moisture content (dewpoint is not very feasible in humid climates. Closed-
control) is very critical. Also, the volume of circuit cooling towers may function in humid
make-up air is proportional to cleanroom integrity climates, but the additional capital costs may
(leak mitigation) and the quantity of exhaust prove this method unattractive. Using dual water
volume from the space. This HVAC process temperature systems is an effective and
affords the cleanroom designer several economical means of reducing operating costs.
opportunities to optimize the energy Further discussion of the HVAC process is
consumption. beyond the scope of this paper, but the possible
The water temperatures selected for range of energy consumption and operating cost
chilled/glycol water dehumidification systems will can vary by 70% is some cases and several
directly affect the conditioned make-up air times higher in extreme cases.

Proceedings of the Fourteenth Symposium on Improving Building Systems in Hot and Humid Climates, Richardson, TX, May 17-20, 2004
ESL-HH-04-05-18

In summary, when the chilled-water system and The following approach was used to
the cleanroom air-management system are estimate baseline year energy consumption for
examined, the professional designer should not various system’s energy distribution: 1) analyze
underestimate any potential energy savings with available measured and recorded system
semiconductor cleanrooms. operating data; 2) model and simulate the
system’s energy usage for all conditions; and, 3)
Total System Dynamics benchmark the energy model with other
measured data to ensure the model's accuracy.
Several optimization methods have been
reviewed. When the entire cleanroom energy One important system modeled was the
flow is considered and the interactions of air flow 100% outside air handling system to a major
and heat transfer are optimized as a total system semiconductor manufacturing plant. The OA
this can be referred to as optimization of the total system was modeled using a Bin Method
system dynamics. The potential savings of the Spreadsheet based upon the American Society
complete system dynamics are sometimes of Heating Refrigerating and Air Conditioning
difficult to envision. It is obvious to most design Engineers (ASHRAE) "Simplified Energy
engineers that the use of high efficiency motors, Analysis Using the Modified Bin Method". After
fans, pumps, etc., will provide for higher total the "Base Case" model was completed,
system efficiency. The key is to foresee the measured and monitored field data was used as
interaction of the individual components with the a benchmark by which the model was compared.
whole system, as demonstrated when comparing Once complete the "Base Case" model was then
reduced system static pressure vs. high fan modified to represent various changes in the
efficiency. By using identical high-efficiency systems’ operation and to determine possible
equipment, many different psychometric energy cost savings. The savings and
processes can be analyzed. implementation costs were then used to
After the consideration of air management determine associated simple paybacks in order
concept is made, the system dynamics are to recommend project retrofits.
considered when designing the temperature and
humidity control system. Within each air Process Exhaust Reductions
management concept the factors affecting
cleanroom energy are different. When a total The purpose of this project was to reduce
system dynamics analysis is performed the excess exhaust amounts to all Gas Cabinets
cleanroom designer can begin an HVAC (GCs), Valve Manifold Boxes (VMBs), and
optimization process. This HVAC optimization Chemical Dispense Units (CDUs) in HPM rooms
process involves a thorough knowledge of all and Subfab areas within the fab facility. This not
heat transfer and particle transfer mechanisms only had an immediate impact on exhaust fan
occurring. It is beyond the scope of this paper to power, but on the energy required to condition
derive or expand the concepts involved in a makeup air used to supplant the exhaust
detailed optimization or case study, but there are quantities. This overall project effort resulted in
several sources available to those wishing to the rebalance, or new install balance, of
explore this topic in more detail. approximately 240 GCs, 180 VMBs, and 38
CDUs.
CASE HISTORIES:
The project, actually implemented over a
period of about two years, did not decrease the
Energy Savings Project Methodology:
availability of the exhaust system and maintained
all NFPA, local Fire Department and ESIH
Although some metered energy usage data Standards. It was actually anticipated to assist
was available where multiple projects were in Toxic Gas Monitoring (TGM) at all localized
successfully implemented, the majority of the
points. Additionally, since airflow was reduced in
systems were not monitored or recorded by the some areas (primarily at VMBs) to a level below
Facilities Management Control System (FMCS).
which the installed pressure gases can reliably
Simplified energy modeling (which can take
read, those existing gauges were removed and
many forms) can be completed to model or made available for other tool install
simulate a building or system’s energy usage requirements.
when monitoring is lacking. The modeling can
be completed to take into account specific types
Gas Cabinet Exhaust Reductions.
of energy-using systems and their operating
schedules; thus providing a more accurate
The optimization of exhaust for the fab’s gas
estimate of energy consumption.
cabinets resulted in a total estimated savings of

Proceedings of the Fourteenth Symposium on Improving Building Systems in Hot and Humid Climates, Richardson, TX, May 17-20, 2004
ESL-HH-04-05-18

approximately 41,000 cfm of exhaust and checked, measured, and verified and all
associated makeup air. This was determined to remained within required specification levels
provide annualized savings of about: 928,000 after the airflow reductions.
kWhs ($41,700), 570,000 lbs steam ($2,700),
and 1.5 million Ton-hrs chilled water ($68,900) HEPA Velocity/Laminar Flow Reductions.
for a total cost savings of $113,300. This
equates to an approximate savings of about The optimization of recirculation airflows
$2.77 per CFM. Previous studies had indicated resulted in a total estimated savings of
costs in $/CFM in the range from $2.80 to as approximately 2.55 million cfm of recirculation
high as $4.50 for the treatment of Makeup Air airflows. This was determined to provide
(MUA). annualized savings of about 13.61 million kWhs
(1,585 kW demand) for the direct airflows, and
VMB Exhaust Reductions. another 3.48 million kWhs for central plant
refrigeration savings (about 451 Tons, 406 kW
The optimization of exhaust for the fab’s demand). Total yearly dollar savings was
VMBs resulted in an estimated savings of estimated to be between $769,100 to 923,000
approximately 5,400 cfm of exhaust and dependent upon the energy rate used.
associated MUA. This was estimated to provide
similar annualized savings of: 122,950 kWhs MUA System Evaluation
($5,500), 75,000 lbs steam ($350), and 201,000
Ton-hrs chilled water ($9,100) for a total cost The MUA system consists of multiple, 100%
savings of $15,000. This project also provided a outside air units that function to provide a
one time savings of about $9,100 for the avoided constant dewpoint temperature (DPT) and static
costs of the relocated magnehelics. pressure control to the fab ductwork. The DPT is
approximately 46º F because the clean space
CDU Exhaust Reductions. specifications are 68º F +/- 2º F, and 45% RH +/-
3%. Thus, the initial sensible and practically all
The optimization of exhaust for the fab’s latent cooling and humidification requirements
CDUs and associated VMBs resulted in are met by these units. The fab MAHUs have
estimated savings of about 6,700 cfm of exhaust both a 42° F pre-cooling coil (PCC) and a
and MUA; and annualized savings of: 151,500 secondary cooling coil (SCC) which begin the
kWhs ($6,800), 93,000 lbs steam ($450), and primary cooling of the outside air. Final
247,750 Ton-hrs chilled water ($11,250) for a dehumidification cooling uses a 32° F CHW coil
total cost savings of $18,500. (GCC) generated from glycol chillers. The fan is
a variable volume (speed) plug fan, whose
Recirculation Air Reductions speed is regulated by duct static pressure in the
MUA header ducts.
The purpose of this project was to reduce
excess recirculation CFMs within the fab’s In the direction of airflow, the MUA system
Recirculation Air Handling Units (RAHUs) was broken into six main blocks. The first four
without compromising airborne cleanliness. blocks are within the MAHUs themselves, while
Prior to implementation of this project the the remaining two blocks are the ductwork
maximum, minimum and average air change sections. The first block or Inlet Section consists
rates for the cleanroom areas were 443, 269, of an outside air damper, 30/30 pre-filters, a hot
and 338 ACHs, respectively. After water pre-heating coil (PHC), a set of
implementation, the maximum, minimum and chemical/carabon filters, and a set of 95%
average ACHs were 337, 139, and 252 ACHs. intermediate filters.
However, this data is somewhat misleading in
that not all areas (particularly Photolithography) The second block, the Cooling Section, is
were reduced due to manufacturing risk comprised of two 42º F chilled water coils (PCC
aversion. Another way to review this data is that and CC), and the final 32º F glycol coil (GCC).
the maximum reduction was about 34% from The third block is the Fan Section with the
pre- to post laminar flows, while the minimum plenum fan as the only mechanical component.
was 9% and the average was 22%, respectively. The fourth block is the Outlet Section and
consists of the reheat coil with a recirculation
All post-data indices indicated no significant pump (RHC and RHCP), final ULPA filters, a
change to any environmental or contamination steam grid humidifier (SH), and a discharge
control issues (AMCs, particles, pressurization, damper.
parallelism, and/or temperatures and humidities).
Every significant area of concern was trended,

Proceedings of the Fourteenth Symposium on Improving Building Systems in Hot and Humid Climates, Richardson, TX, May 17-20, 2004
ESL-HH-04-05-18

All the MUA entering the complex is mixed savings from high quality water used in the clean
with the return air from the fab and is controlled steam humidifiers.
to maintain the fab temperature, humidity and
pressurization requirements. MUA Leakage Reduction.

Each of the MAHUs separate coils should be In the process of the overall system review,
controlled as well as possible so there is no it was determined that increased maintenance in
extraneous heating and cooling, but in fact actual replacing door seal gaskets in the hundreds of
operation of the MAHUs resulted in some existing RAHUs would result in savings to MUA.
unnecessary heating and cooling. This was Once completed, this project added additional
primarily due to some institutionalized reasoning estimated savings of: 986,700 kWhs, 1,500 lbs
for risk mitigation to the fab, but also because of steam, and 276,450 ton-hrs chilled water for a
normal issues regarding mechanical system total savings of $65,000 annually.
components such as valves, and controllers.
SUMMARY
Through some specialized maintenance
increases, manual setpoint changes and This paper presented some of the methods
optimization programming of controls algorithms, being used by multi-national semiconductor
this project was completed to provide additional companies to change the way cleanrooms are
assistance in control of the units for energy being designed and operated. Considering
savings. resource conservation, energy conservation
methods, and cost of ownership, allows for
MUA Control Treatment Adjustments. unique opportunities for employing innovative
designs to reduce system operating costs and
The baseline estimate of the energy use of help the customer compete in a world economy.
the MUA system was as follows: 9.94 million Various clean air and energy management
kWhs, 8,030 lbs steam, and 17.62 million ton-hrs optimization methods were presented along with
chilled water for a total cost of $1.29 million their potential for energy savings. This paper
annually. The optimization of the MAHU final air also introduced a holistic design approach, total
delivery to meet fab specifications consisted of system dynamics, to evaluate the energy
correcting valve leakages and adjusting and efficiency of cleanroom designs. The benefits of
controlling setpoints on all the heating (Preheat, individual system component efficiency and the
Reheat), cooling (Precool, Secondary cool, and optimization of the total system dynamics will
final glycol cool), and steam humidifier coils. result in cost and energy savings for the operator
The resulting total estimated savings from these and for the customer. Implementation of these
efforts were approximately 12,350 lbs steam, principles will produce better designs for the
and 2.56 million ton-hrs of chilled water for a client and a rewarding satisfaction for the
total savings of $185,200 annually. Of this designer.
savings, approximately $10,700 dollars is

Bibliography and References


LBL and McIlvaine Co.
International Technology Roadmap for Semiconductors 2000 Update
Energy and Water Efficiency for Semiconductor Manufacturing, May 2000, Northwest Pollution Prevention
Resource Center
United States Environmental Protection Agency, "Second U.S. EPA Semiconductor Energy Efficiency
Opportunities Workshop, Proceedings," Austin, TX, October 22, 1998
Energy Information Administration, "Table A11. Retail Sales of Electricity by U.S. Electric Utilities to
Ultimate Consumers by Sector, Census Division, and State, 1998," found in the report "Electric Power
Annual 1998, Volume I."
Fabtech Second Edition, “Saving Energy with Advanced Cleanroom Air Recirculation Systems”
Naughton, Philip, 1991 “HVAC Systems for Semiconductor Cleanrooms — Part 1, System Components”,
1991 ASHRAE Transactions.

Proceedings of the Fourteenth Symposium on Improving Building Systems in Hot and Humid Climates, Richardson, TX, May 17-20, 2004
ESL-HH-04-05-18

Gerbig, F. T. 1984. "Energy consumption in. vertical laminar-flow cleanrooms." Microcontamination,


April/May
Aloi, C. W. 1976. "What you always wanted to know about centrifugal refrigeration systems." 1976
Proceedings of Chilled Water Conference, Purdue University.
Naughton, Philip, 1991 “HVAC Systems for Semiconductor Cleanrooms — Part 2, Total System
Dynamics”, 1991 ASHRAE Transactions
O’Halloran, Michael, 1998. “Improving Wafer Fab Resource Reduction Using A Systems Synergy
Approach”
Grout, Richard V., 1998 “Strategic Selection of Air Management Technologies to Reduce Costs and
Optimize Fab Performance”

Proceedings of the Fourteenth Symposium on Improving Building Systems in Hot and Humid Climates, Richardson, TX, May 17-20, 2004

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