AA2214SURSK

2.2 x 1.4 mm Surface Mount LED Lamp

DESCRIPTIONS PACKAGE DIMENSIONS

The Hyper Red source color devices are made with
AlGaInP on GaAs substrate Light Emitting Diode

Electrostatic discharge and power surge could
damage the LEDs

It is recommended to use a wrist band or
anti-electrostatic glove when handling the LEDs

All devices, equipments and machineries must be
electrically grounded

FEATURES

2.2 mm x 1.4 mm, 1.3 mm high

Low power consumption

Available on tape and reel

Package: 2000 pcs / reel

Moisture sensitivity level: 3

Halogen-free

RoHS compliant

APPLICATIONS

Backlight

Status indicator RECOMMENDED SOLDERING PATTERN
(units : mm; tolerance : ± 0.1)

Home and smart appliances

Wearable and portable devices

Healthcare applications

ATTENTION
Observe precautions for handling
electrostatic discharge sensitive devices

Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.2(0.008") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to
change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.

SELECTION GUIDE
Iv (mcd) @ 20mA [2] Viewing Angle [1]
Emitting Color
Part Number Lens Type
(Material)
Min. Typ. 2θ1/2

180 350
AA2214SURSK ■ Hyper Red (AlGaInP) Water Clear 120°
*55 *100

Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity / luminous flux: +/-15%.
* Luminous intensity value is traceable to CIE127-2007 standards.

© 2020 Kingbright. All Rights Reserved. Spec No: DSAK2209 / 1201005725 Rev No: V.8A Date: 08/27/2020 Page 1 / 4
 AA2214SURSK
ELECTRICAL / OPTICAL CHARACTERISTICS at TA=25°C
Value
Parameter Symbol Emitting Color Unit
Typ. Max.

Wavelength at Peak Emission IF = 20mA λpeak Hyper Red 645 - nm

Dominant Wavelength IF = 20mA λdom [1] Hyper Red 630 - nm

Spectral Bandwidth at 50% Φ REL MAX

∆λ Hyper Red 28 - nm
IF = 20mA

Capacitance C Hyper Red 35 - pF

Forward Voltage IF = 20mA VF [2] Hyper Red 1.95 2.5 V

Reverse Current (VR = 5V) IR Hyper Red - 10 µA

Temperature Coefficient of λpeak

TCλpeak Hyper Red 0.14 - nm/°C
IF = 20mA, -10°C ≤ T ≤ 85°C

Temperature Coefficient of λdom

TCλdom Hyper Red 0.05 - nm/°C
IF = 20mA, -10°C ≤ T ≤ 85°C

Temperature Coefficient of VF
TCV Hyper Red -1.9 - mV/°C
IF = 20mA, -10°C ≤ T ≤ 85°C
Notes:
1. The dominant wavelength (λd) above is the setup value of the sorting machine. (Tolerance λd : ±1nm. )
2. Forward voltage: ±0.1V.
3. Wavelength value is traceable to CIE127-2007 standards.
4. Excess driving current and / or operating temperature higher than recommended conditions may result in severe light degradation or premature failure.

ABSOLUTE MAXIMUM RATINGS at TA=25°C

Parameter Symbol Value Unit

Power Dissipation PD 75 mW

Reverse Voltage VR 5 V

Junction Temperature Tj 115 °C

Operating Temperature Top -40 to +85 °C

Storage Temperature Tstg -40 to +85 °C

DC Forward Current IF 30 mA

Peak Forward Current IFM [1] 185 mA

Electrostatic Discharge Threshold (HBM) - 3000 V

Thermal Resistance (Junction / Ambient) Rth JA [2] 460 °C/W

Thermal Resistance (Junction / Solder point) Rth JS [2] 280 °C/W

Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. Rt h JA ,Rt h JS Results from mounting on PC board FR4 (pad size ≥ 16 mm 2 per pad).
3. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033.

© 2020 Kingbright. All Rights Reserved. Spec No: DSAK2209 / 1201005725 Rev No: V.8A Date: 08/27/2020 Page 2 / 4
 AA2214SURSK
TECHNICAL DATA
RELATIVE INTENSITY vs. WAVELENGTH SPATIAL DISTRIBUTION

Red
100% -15° 0°
15°
Ta = 25 °C Ta = 25 °C
30°
Relative Intensity (a. u.)

-30°
80%
-45° 45°
60%

40% -60° 60°

20%
-75° 75°

0%
350 400 450 500 550 600 650 700 750 800 90°
-90°
Wavelength (nm) 1.0 0.5 0.0 0.5 1.0

HYPER RED
Forward Current vs. Luminous Intensity vs. Forward Current Derating Curve Luminous Intensity vs.
Forward Voltage Forward Current Ambient Temperature
50 2.5 50 2.5
Luminous intensity normalised

Luminous intensity normalised

Ta = 25 °C Ta = 25 °C Permissible forward current
40 2.0 40 2.0
Forward current (mA)

at T a = 25 °C
at 20 mA

30 1.5 30 1.5
(mA)

20 1.0 20 1.0

10 0.5 10 0.5

0 0.0 0 0.0
1.5 1.7 1.9 2.1 2.3 2.5 0 10 20 30 40 50 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Forward voltage (V) Forward current (mA) Ambient temperature (°C) Ambient temperature (°C)

REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS TAPE SPECIFICATIONS (units : mm)

REEL DIMENSION (units : mm)

Notes:
1. Don't cause stress to the LEDs while it is exposed to high temperature.
2. The maximum number of reflow soldering passes is 2 times.
3. Reflow soldering is recommended. Other soldering methods are not recommended as they might
cause damage to the product.

© 2020 Kingbright. All Rights Reserved. Spec No: DSAK2209 / 1201005725 Rev No: V.8A Date: 08/27/2020 Page 3 / 4
 AA2214SURSK
PACKING & LABEL SPECIFICATIONS

HANDLING PRECAUTIONS
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is
more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone
encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED.

1. Handle the component along the 2. Do not directly touch or handle the silicone lens 3. Do not stack together assembled
side surfaces by using forceps or surface. It may damage the internal circuitry. PCBs containing exposed LEDs.
appropriate tools. Impact may scratch the silicone lens
or damage the internal circuitry.

4-1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4-2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4-3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure
precise pickup and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver
plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such
substances.

PRECAUTIONARY NOTES
1. The information included in this document reflects representative usage scenarios and is intended for technical reference only.
2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to
the latest datasheet for the updated specifications.
3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If
customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening
liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance.
5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright.
6. All design applications should refer to Kingbright application notes available at https://www.KingbrightUSA.com/ApplicationNotes

© 2020 Kingbright. All Rights Reserved. Spec No: DSAK2209 / 1201005725 Rev No: V.8A Date: 08/27/2020 Page 4 / 4
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