Package Options Include Plastic Small-Outline (D) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-Mil Dips
Package Options Include Plastic Small-Outline (D) Packages, Ceramic Chip Carriers (FK), and Standard Plastic (N) and Ceramic (J) 300-Mil Dips
1CLR
2CLR
VCC
resets the outputs regardless of the levels of the
NC
1J
other inputs. When PRE and CLR are inactive
(high), data at the J and K inputs meeting the 3 2 1 20 19
setup-time requirements are transferred to the 1K 4 18 2J
outputs on the positive-going edge of the clock 1CLK 5 17 2K
(CLK) pulse. Clock triggering occurs at a voltage NC 6 16 NC
level and is not directly related to the rise time of 1PRE 7 15 2CLK
the clock pulse. Following the hold-time interval, 1Q 8 14 2PRE
9 10 11 12 13
data at the J and K inputs can be changed without
affecting the levels at the outputs. These versatile
GND
NC
2Q
1Q
2Q
flip-flops can perform as toggle flip-flops by
grounding K and tying J high. They also can
NC − No internal connection
perform as D-type flip-flops if J and K are tied
together.
The SN54ALS109A and SN54AS109A are characterized for operation over the full military temperature range
of −55°C to 125°C. The SN74ALS109A and SN74AS109A are characterized for operation from 0°C to 70°C.
FUNCTION TABLE
INPUTS OUTPUTS
PRE CLR CLK J K Q Q
L H X X X H L
H L X X X L H
L L X X X H† H†
H H ↑ L L L H
H H ↑ H L Toggle
H H ↑ L H Q0 Q0
H H ↑ H H H L
H H L X X Q0 Q0
† The output levels in this configuration are not specified to
meet the minimum levels for VOH if the lows at PRE and
CLR are near VIL maximum. Furthermore, this
configuration is nonstable; that is, it does not persist when
either PRE or CLR returns to its inactive (high) level.
!"#$%&" ' ()##*& %' "! +),-(%&" .%&*/ Copyright 1995, Texas Instruments Incorporated
#".)(&' ("!"#$ &" '+*(!(%&"' +*# &0* &*#$' "! *1%' '&#)$*&'
'&%.%#. 2%##%&3/ #".)(&" +#"(*''4 ."*' "& *(*''%#-3 (-).*
&*'&4 "! %-- +%#%$*&*#'/
logic symbol†
5
1PRE S
2 6
1J 1J 1Q
4
1CLK C1
3 7
1K 1K 1Q
1
1CLR R
11
2PRE
14 10
2J 2Q
12
2CLK
13 9
2K 2Q
15
2CLR
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the D, J, and N packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Operating free-air temperature range, TA: SN54ALS109A . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C
SN74ALS109A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2 •
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
•
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
SDAS198B − APRIL 1982 − REVISED AUGUST 1995
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265 3
•
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
SDAS198B − APRIL 1982 − REVISED AUGUST 1995
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Input voltage, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Operating free-air temperature range, TA: SN54AS109A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C
SN74AS109A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
4 •
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
•
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
SDAS198B − APRIL 1982 − REVISED AUGUST 1995
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265 5
•
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
SDAS198B − APRIL 1982 − REVISED AUGUST 1995
S1
RL
R1
From Output Test From Output Test From Output Test
Under Test Point Under Test Point Under Test Point
CL RL CL
CL R2
(see Note A) (see Note A)
(see Note A)
3.5 V
Output
Control 1.3 V 1.3 V
(low-level
enabling) 0.3 V 3.5 V
tPZL Input 1.3 V 1.3 V
tPLZ
0.3 V
[3.5 V
Waveform 1 tPLH tPHL
S1 Closed 1.3 V
In-Phase VOH
(see Note B) 1.3 V 1.3 V
VOL Output
tPHZ 0.3 V VOL
tPZH tPLH
VOH tPHL
Waveform 2 VOH
Out-of-Phase
S1 Open 1.3 V 0.3 V 1.3 V 1.3 V
Output
(see Note B) (see Note C) VOL
[0 V
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS PROPAGATION DELAY TIMES
6 •
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
•
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
PACKAGE OPTION ADDENDUM
www.ti.com 25-Apr-2024
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
84000012A ACTIVE LCCC FK 20 55 Non-RoHS SNPB N / A for Pkg Type -55 to 125 84000012A Samples
& Green SNJ54ALS
109AFK
8400001EA ACTIVE CDIP J 16 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 8400001EA Samples
& Green SNJ54ALS109AJ
JM38510/37102B2A ACTIVE LCCC FK 20 55 Non-RoHS SNPB N / A for Pkg Type -55 to 125 JM38510/ Samples
& Green 37102B2A
JM38510/37102BEA ACTIVE CDIP J 16 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 JM38510/ Samples
& Green 37102BEA
M38510/37102B2A ACTIVE LCCC FK 20 55 Non-RoHS SNPB N / A for Pkg Type -55 to 125 JM38510/ Samples
& Green 37102B2A
M38510/37102BEA ACTIVE CDIP J 16 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 JM38510/ Samples
& Green 37102BEA
SN54ALS109AJ ACTIVE CDIP J 16 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 SN54ALS109AJ Samples
& Green
SN74ALS109AD ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 ALS109A Samples
SN74ALS109AN ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 SN74ALS109AN Samples
SN74ALS109ANSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 ALS109A Samples
SN74AS109AD ACTIVE SOIC D 16 40 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 AS109A Samples
SN74AS109AN ACTIVE PDIP N 16 25 RoHS & Green NIPDAU N / A for Pkg Type 0 to 70 SN74AS109AN Samples
SN74AS109ANSR ACTIVE SO NS 16 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM 0 to 70 74AS109A Samples
SNJ54ALS109AFK ACTIVE LCCC FK 20 55 Non-RoHS SNPB N / A for Pkg Type -55 to 125 84000012A Samples
& Green SNJ54ALS
109AFK
SNJ54ALS109AJ ACTIVE CDIP J 16 25 Non-RoHS SNPB N / A for Pkg Type -55 to 125 8400001EA Samples
& Green SNJ54ALS109AJ
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 25-Apr-2024
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
• Catalog : SN74ALS109A
• Military : SN54ALS109A
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com 25-Apr-2024
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Nov-2023
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Sprocket Holes
Q1 Q2 Q1 Q2
Pocket Quadrants
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Nov-2023
Width (mm)
H
W
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 30-Nov-2023
TUBE
T - Tube
height L - Tube length
W - Tube
width
Pack Materials-Page 3
GENERIC PACKAGE VIEW
FK 20 LCCC - 2.03 mm max height
8.89 x 8.89, 1.27 mm pitch LEADLESS CERAMIC CHIP CARRIER
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4229370\/A\
www.ti.com
PACKAGE OUTLINE
NS0016A SCALE 1.500
SOP - 2.00 mm max height
SOP
10.4 2X
10.0 8.89
NOTE 3
8
9
0.51
16X
5.4 0.35
B 0.25 C A B 2.00 MAX
5.2
NOTE 4
0.15 TYP
SEE DETAIL A
0.25 0.3
GAGE PLANE 0.1
0 - 10
1.05
0.55 DETAIL A
TYPICAL
(1.25)
4220735/A 12/2021
NOTES:
1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm, per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm, per side.
www.ti.com
EXAMPLE BOARD LAYOUT
NS0016A SOP - 2.00 mm max height
SOP
1 16
16X (0.6)
SYMM
14X (1.27)
8 9
(R0.05) TYP
(7)
4220735/A 12/2021
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
NS0016A SOP - 2.00 mm max height
SOP
1 16
16X (0.6)
SYMM
14X (1.27)
8 9
4220735/A 12/2021
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
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