BD733L5FP-CE2 Ultra Low Quiescent Current LDO

Datasheet
Automotive regulator
Ultra Low Quiescent Current LDO

Regulator
BD7xxL5FP-C
●General Description ●Key specifications

The BD7xxL5FP-C Series are low quiescent regulators  Ultra low quiescent current: 6.0μA (Typ.)
featuring 50V absolute maximum voltage, and output  Output current capability: 500mA
voltage accuracy of ±2％, 500mA output current and 6μA  High output voltage accuracy: ±2％
(Typ.) current consumption. There regulators are  Low ESR ceramic capacitor can be used as output
therefore ideal for applications requiring a direct capacitor
connection to the battery and a low current consumption.
Ceramic capacitors can be used for compensation of the ●Packages
output capacitor phase. Furthermore, these ICs also
feature overcurrent protection to protect the device from
FP: TO252-3 6.50mm×9.50mm×2.50mm
damage caused by short-circuiting and an integrated
thermal shutdown to protect the device from overheating
at overload conditions.
●Features
 Ultra low quiescent current: 6.0μA (Typ.)
 Output current capability: 500mA Figure 1. Package Outlook
 High output voltage accuracy: ±2％
 Low saturation voltage by using PMOS output
transistor. ●Applications
 Integrated overcurrent protection to protect the IC  Automotive (body, audio system, navigation system,
from damage caused by output short-circuiting. etc.)
 Integrated thermal shutdown to protect the IC from
overheating at overload conditions.
 Low ESR ceramic capacitor can be used as output
capacitor.
 TO252-3 type package
●Typical Application Circuits
Figure 2. Typical Application Circuits
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
.www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-T2T0AN00020-1-2
1/18
TSZ22111・14・001 2.Oct.2012 Rev.001
BD7xxL5FP-C Datasheet
●Ordering Information
B D 7 x x L 5 F P - C E 2
Output Voltage Package Taping

33: 3.3V FP: TO252-3 E2: reel-wound
50: 5.0V embossed tamping
●Pin Configuration ●Pin Description
TO252-3 Pin No. Pin Name Function

(TOP VIEW)
1 VCC Supply voltage input pin
2 N.C. N.C.
3 VOUT Output pin
Fin GND GND
（※N.C. terminals are not need to connect to GND.）
1 2 3
Figure 3. Pin Configuration
●Block Diagram GND(FIN)
PREREG
VREF DRIVER
OCP
TSD
VCC(1PIN) N.C. VOUT(3PIN)
Figure 4. Block Diagram
www.rohm.com
2/18
TSZ22111・15・001 2.Oct.2012 Rev.001
●Absolute Maximum Ratings（Ta=25℃）

Parameter Symbol Ratings Unit
*1
Supply Voltage VCC -0.3 to +50.0 V
*2
Power Dissipation Pd 1.2 W
Operating Temperature Range Topr -40 to +125 °C
Storage Temperature Range Tstg -55 to +150 °C
Maximum Junction Temperature Tjmax 150 °C
*1 Pd should not be exceeded.
*2 9.6mW/℃ reduction when Ta≧25℃ if mounted on a glass epoxy board of 70mm×70mm×1.6mm.
●Operating Conditions（-40 < Ta < +125℃）
■BD733L5FP-C
Parameter Symbol Min. Max. Unit
*3
Supply Voltage VCC 4.17 45.0 V
*4
Startup Voltage VCC 3.0 - V
Output Current IOUT 0 500 mA
■BD750L5FP-C
Parameter Symbol Min. Max. Unit
*3
Supply Voltage VCC 5.6 45.0 V
*4
Startup Voltage VCC 3.0 - V
Output Current IOUT 0 500 mA
*3 For output voltage, refer to the dropout voltage corresponding to the output current. This condition is 200mA load.
*4 When IOUT=0mA
●Electrical Characteristics (BD733L5FP-C)

（Unless otherwise specified ,-40 < Ta < +125°C,VCC=13.5V, IOUT=0mA, Reference value: Ta=25°C）
Limit
Parameter Symbol Unit Conditions
Min. Typ. Max.
Quiescent current Ib - 6 15 μA
8V<VCC<16V
Output voltage VOUT 3.23 3.30 3.37 V
0mA<IOUT<500mA
Dropout voltage ΔVd - 0.4 0.8 V VCC=VOUT×0.95, IOUT=200mA
f=120Hz, ein=1Vrms,
Ripple rejection R.R. 50 63 - dB
IOUT=100mA
Line regulation Reg I - 5 20 mV 8V<VCC<16V
Load regulation Reg L - 5 20 mV 10mA<IOUT<250mA
●Electrical Characteristics (BD750L5FP-C)

（Unless otherwise specified ,-40 < Ta < +125°C,VCC=13.5V, IOUT=0mA, Reference value: Ta=25°C）
Limit
Parameter Symbol Unit Conditions
Min. Typ. Max.
Quiescent current Ib - 6 15 μA
8V<VCC<16V
Output voltage VOUT 4.9 5.0 5.1 V
0mA<IOUT<500mA
Dropout voltage ΔVd - 0.25 0.5 V VCC=VOUT×0.95, IOUT=200mA
f=120Hz, ein=1Vrms,
Ripple rejection R.R. 50 60 - dB
IOUT=100mA
Line regulation Reg I - 5 20 mV 8V<VCC<16V
Load regulation Reg L - 5 20 mV 10mA<IOUT<250mA
www.rohm.com
3/18
TSZ22111・15・001 2.Oct.2012 Rev.001
●Typical Performance Curves

■BD733L5FP-C Reference data
Unless otherwise specified: -40 < Ta < +125°C, VCC=13.5V, IOUT=0mA
100 6
90 -40℃ -40℃
25℃ 5 25℃
CIRCUIT CURRENT : lb[µA] .
80
OUTPUT VOLTAGE : VOUT[V] .

125℃ 125℃
70
4
60
50 3
40
2
30
20
1
10
0 0
0 10 20 30 40 50 0 10 20 30 40 50
SUPPLY VOLTAGE : VCC[V] SUPPLY VOLTAGE : VCC[V]
Figure 5. Quiescent current Figure 6. Output voltage vs. Supply voltage

IOUT=10mA
6 6
-40℃ -40℃
5 25℃ 5 25℃
125℃ 125℃
4 4
3 3
2 2
1 1
0 0
0 10 20 30 40 50 0 300 600 900 1200 1500
SUPPLY VOLTAGE : VCC[V] OUTPUT CURRENT : IOUT[mA]
Figure 7. Output voltage vs. Supply voltage Figure 8. Output voltage vs. Load
IOUT=100mA
www.rohm.com
4/18
TSZ22111・15・001 2.Oct.2012 Rev.001

1.2 90
80 -40℃
1 25℃
RIPPLE REJECTION : R.R.[dB] .

70 125℃
DROPOUT : △Vd[V]
0.8 60
50
0.6
40
0.4 30
20
0.2
10
0 0
0 50 100 150 200 250 300 350 400 450 500 10 100 1000 10000 100000
OUTPUT CURRENT : IOUT[mA] FREQUENCY : f[Hz]
Figure 9. Dropout voltage Figure 10. Ripple rejection
(ein=1Vrms,IOUT=100mA)
20 6
18 -40℃
5
OUTPUT VOLTAGE : VOUT[V]
16 25℃
CIRCUIT CURRENT : lb[µA]
125℃
14
4
12
10 3
8
2
6
4 1
2
0 0
0 40 80 120 160 200 100 120 140 160 180 200
OUTPUT CURRENT : IOUT[mA] AMBIENT TEMPERATURE : Ta[℃]
Figure 11. Total supply current vs. Load Figure 12. Thermal shutdown
(Output voltage vs. temperature)
www.rohm.com
5/18
TSZ22111・15・001 2.Oct.2012 Rev.001

3.315 10
3.310 9

3.305 8
3.300
7
3.295
6
3.290
5
3.285
4
3.280
-40 -25 -10 5 20 35 50 65 80 95 110 125
-40 0 40 80 120
AMBIENT TEMPERATURE : Ta[℃] AMBIENT TEMPERATURE : Ta[℃]
Figure 13. Output voltage vs. temperature Figure 14. Quiescent current vs. temperature
www.rohm.com
6/18
TSZ22111・15・001 2.Oct.2012 Rev.001

100 8
90 -40℃ -40℃
25℃ 7

25℃
80
125℃ 125℃
6
70
60 5
50 4
40
3
30
2
20
10 1
0 0
0 10 20 30 40 50 0 10 20 30 40 50
SUPPLY VOLTAGE : VCC[V] SUPPLY VOLTAGE : VCC[V]
Figure 15. Quiescent current Figure 16. Output voltage vs. Supply voltage
8 8
7 -40℃ 7 -40℃
25℃ 25℃
6 125℃ 6 125℃
5 5
4 4
3 3
2 2
1 1
0 0
0 10 20 30 40 50 0 300 600 900 1200 1500
SUPPLY VOLTAGE : VCC[V] OUTPUT CURRENT : IOUT[mA]
Figure 17. Output voltage vs. Supply voltage Figure 18. Output voltage vs. Load
IOUT=100mA
www.rohm.com
7/18
TSZ22111・15・001 2.Oct.2012 Rev.001

1.2 90
-40℃ 80 -40℃
.
25℃ 25℃
RIPPLE REJECTION : R.R.[dB]

DROPOUT VOLTAGE : △Vd[V]
125℃ 70 125℃
0.8 60
50
40
0.4 30
20
10
0.0 0
0 50 100 150 200 250 300 350 400 450 500 10 100 1000 10000 100000
OUTPUT CURRENT : IOUT[mA] FREQUENCY : f[Hz]
Figure 19. Dropout voltage Figure 20. Ripple rejection
(ein=1Vrms,IOUT=100mA)
20 8
18 -40℃
7
.
25℃
16
125℃ 6
14
5
12
10 4
8 3
6
2
4
1
2
0 0
0 40 80 120 160 200 100 120 140 160 180 200
OUTPUT CURRENT : IOUT[mA] AMBIENT TEMPERATURE[℃]
Figure 21. Total supply current vs. Load Figure 22. Thermal shutdown
(Output voltage vs. temperature)
www.rohm.com
8/18
TSZ22111・15・001 2.Oct.2012 Rev.001

5.020 10
5.015
9
5.010

5.005
8
5.000
4.995 7
4.990
6
4.985
4.980
5
4.975
4.970 4
-40 0 40 80 120 -40 -25 -10 5 20 35 50 65 80 95 110 125
AMBIENT TEMPERATURE : Ta[℃] AMBIENT TEMPERATURE : Ta[℃]
Figure 23. Output voltage vs. temperature Figure 24. Quiescent current vs. temperature
www.rohm.com
9/18
TSZ22111・15・001 2.Oct.2012 Rev.001
●Reference data (BD7xxL5FP-C Series) TO252-3
Measurement setup for Figure 5, 14, 15, 24 Measurement setup for Measurement setup for Figure 8, 18
Figure 6, 7, 12, 13, 16, 17, 22, 23
Measurement setup for Figure 9, 19 Measurement setup for Figure 10, 20 Measurement setup for Figure 11, 21
www.rohm.com
10/18
TSZ22111・15・001 2.Oct.2012 Rev.001
●Selection of Components Externally Connected

・VCC pin
Insert capacitors with a capacitance of 0.1μF or higher between the VCC and GND pin. Choose the capacitance
according to the line between the power smoothing circuit and the VCC pin. Selection of the capacitance also
depends on the application. Verify the application and allow for sufficient margins in the design. We recommend
using a capacitor with excellent voltage and temperature characteristics.
・Output pin capacitor

In order to prevent oscillation, a capacitor needs to be placed between the output pin and GND pin. We recommend
using a capacitor with a capacitance of 4.7μF or higher. Electrolytic, tantalum and ceramic capacitors can be used.
When selecting the capacitor ensure that the capacitance of 4.7μF or higher is maintained at the intended applied
voltage and temperature range. Due to changes in temperature the capacitor’s capacitance can fluctuate possibly
resulting in oscillation. For selection of the capacitor refer to the IOUT vs. ESR data. The stable operation range
given in the reference data is based on the standalone IC and resistive load. For actual applications the stable
operating range is influenced by the PCB impedance, input supply impedance and load impedance. Therefore
verification of the final operating environment is needed.
When selecting a ceramic type capacitor, we recommend using X5R, X7R or better with excellent temperature and
DC-biasing characteristics and high voltage tolerance.
Also, in case of rapidly changing input voltage and load current, select the capacitance in accordance with verifying
that the actual application meets with the required specification.
●Measurement setup
TO252-3
○Condition ○Condition
VCC=13.5V VCC=13.5V
Cin=0.1µF Cin=0.1µF
4.7µF<COUT<22µF 4.7µF<COUT<100µF
-40℃<Ta<+125℃ -40℃<Ta<+125℃
www.rohm.com
11/18
TSZ22111・15・001 2.Oct.2012 Rev.001
●Cautions on PC Board layout , Power Dissipation , Thermal Derating Curves
TO252-3
5 IC mounted on a ROHM standard board

Board size: 70mm×70mm×1.6mm
Copper area: 7mm×7mm
Power dissipation Pd (W)
4 TO252-3 θja=104.1(℃/W)
2
1.2
1
0
0 25 50 75 100 125 150
Temperature atmosphere Ta(℃)
Figure .25
TO252-3 (Reference data)
5 IC mounted on a ROHM standard board

③4.8 Board size: 70mm×70mm×1.6mm
Power dissipation Pd (W)
Copper area: 7mm×7mm

4
①: 2-layer PCB (Copper foil area on the reverse side of PCB:15mm×15mm)
②3.5 ②: 2-layer PCB (Copper foil area on the reverse side of PCB:70mm×70mm)
3 ③: 4-layer PCB (Copper foil on the reverse side of PCB:70mm×70mm)
①: θja=67.6℃/W
2 ②: θja=35.7℃/W
③: θja=26.0℃/W
①1.85
1
0
0 25 50 75 100 125 150
Temperature atmosphere Ta(℃)
Figure .26
www.rohm.com
12/18
TSZ22111・15・001 2.Oct.2012 Rev.001
Refer to the heat mitigation characteristics illustrated in Figure 25. and Figure 26. when using the IC in an environment of Ta≧
25°C. The characteristics of the IC are greatly influenced by the operating temperature, and it is necessary to operate under the
maximum junction temperature Timax.
Figure 25. and Figure 26. show the power dissipation and heat mitigation characteristics of the TO252-3 package. Even if the
ambient temperature Ta is at 25°C it is possible that the junction temperature Tj reaches high temperatures. Therefore, the IC
should be operated within the power dissipation range.
The following method is used to calculate the power consumption Pc (W)
Pc＝(VCC－VOUT)×IOUT＋VCC×Ib
VCC : Input voltage
Power dissipation Pd≧Pc VOUT : Output voltage
IOUT : Load current
The load current Lo is obtained by operating the IC within the power dissipation range.
Ib : Bias current
Ishort : Shorted current
Pd－VCC×Ib
IOUT≦
VCC－VOUT
（Refer to Figure11. and Figure21. for the Ib）
Thus, the maximum load current IOUTmax for the applied voltage VCC can be calculated during the thermal design process.
Calculation example 1) with Ta＝125℃, VCC＝13.5V, VOUT＝3.3V (TO252-3)

0.953－13.5×Ib
IOUT≦
10.2 θja=26.0℃/W → -38.4mV/℃
25℃=4.8W → 125℃=0.953W
IOUT≦93mA (Ib:6μA)
At Ta＝125℃ with Figure 26 ③ condition, the calculation shows that ca 93mA of output current is possible at 10.2V potential
difference across input and output.
Calculation example 2）with Ta＝125℃, VCC＝13.5V, VOUT＝5.0V (TO252-3)

0.953－13.5×Ib
IOUT≦ θja=26.0℃/W → -38.4mV/℃
8.5 25℃=4.8W → 125℃=0.953W
IOUT≦112mA (Ib:6μA)
At Ta＝125℃ with Figure 26 ③ condition, the calculation shows that ca 112mA of output current is possible at 8.5V potential
difference across input and output.
www.rohm.com
13/18
TSZ22111・15・001 2.Oct.2012 Rev.001
●Application Examples
・Applying positive surge to the VCC pin
If the possibility exists that surges higher than 50V will be applied to the VCC pin, a zenar diode should be placed
between the VCC pin and GND pin as shown in the figure below.
TO252-3
・Applying negative surge to the VCC pin

If the possibility exists that negative surges lower than the GND are applied to the VCC pin, a Shottky diode should be
place between the VCC pin and GND pin as shown in the figure below.
TO252-3
・Implementing a protection diode
If the possibility exists that a large inductive load is connected to the output pin resulting in back-EMF at time of startup
and shutdown, a protection diode should be placed as shown in the figure below.
VOUT
●I/O equivalence circuits
○Input terminal ○Output terminal *inside of () shows 5V
www.rohm.com
14/18
TSZ22111・15・001 2.Oct.2012 Rev.001
●Operational Notes
1) Absolute maximum ratings
Exceeding the absolute maximum rating for supply voltage, operating temperature or other parameters can result in
damages to or destruction of the chip. In this event it also becomes impossible to determine the cause of the damage
(e.g. short circuit, open circuit, etc). Therefore, if any special mode is being considered with values expected to exceed
the absolute maximum ratings, implementing physical safety measures, such as adding fuses, should be considered.
2) The electrical characteristics given in this specification may be influenced by conditions such as temperature, supply
voltage and external components. Transient characteristics should be sufficiently verified.
3) GND electric potential

Keep the GND pin potential at the lowest (minimum) level under any operating condition. Furthermore, ensure that,
including the transient, none of the pin’s voltages are less than the GND pin voltage.
4) GND wiring pattern

When both a small-signal GND and a high current GND are present, single-point grounding (at the set standard point) is
recommended. This in order to separate the small-signal and high current patterns and to ensure that voltage changes
stemming from the wiring resistance and high current do not cause any voltage change in the small-signal GND. Similarly,
care must be taken to avoid wiring pattern fluctuations in any connected external component GND.
5) Inter-pin shorting and mounting errors

Ensure that when mounting the IC on the PCB the direction and position are correct. Incorrect mounting may result in
damaging the IC. Also, shorts caused by dust entering between the output, input and GND pin may result in damaging
the IC.
6) Inspection using the set board

The IC needs to be discharged after each inspection process as, while using the set board for inspection, connecting a
capacitor to a low-impedance pin may cause stress to the IC. As a protection from static electricity, ensure that the
assembly setup is grounded and take sufficient caution with transportation and storage. Also, make sure to turn off the
power supply when connecting and disconnecting the inspection equipment.
7) Power dissipation (Pd)

Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the
IC is mounted on a 70mm X 70mm X 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the Pd rating.
8) Thermal design
The power dissipation under actual operating conditions should be taken into consideration and a sufficient margin
should be allowed for in the thermal design. On the reverse side of the package this product has an exposed heat pad for
improving the heat dissipation. Use both the front and reverse side of the PCB to increase the heat dissipation pattern as
far as possible. The amount of heat generated depends on the voltage difference across the input and output, load
current, and bias current. Therefore, when actually using the chip, ensure that the generated heat does not exceed the
Pd rating.
Tjmax: maximum junction temperature=150℃, Ta: ambient temperature (℃), θja: junction-to-ambient thermal
resistance (℃/W), Pd: power dissipation rating (W), Pc: power consumption (W), VCC: input voltage,
VOUT: output voltage, IOUT: load current, Ib: bias current
Power dissipation rating Pd (W)＝(Tjmax－Ta) / θja
Power consumption Pc (W)＝(VCC-VOUT)×IOUT＋VCC×Ib
www.rohm.com
15/18
TSZ22111・15・001 2.Oct.2012 Rev.001
9) Rapid variation in VCC voltage and load current

In case of a rapidly changing input voltage, transients in the output voltage might occur due to the use of a MOSFET as
output transistor. Although the actual application might be the cause of the transients, the IC input voltage, output current
and temperature are also possible causes. In case problems arise within the actual operating range, use
countermeasures such as adjusting the output capacitance.
10) Minute variation in output voltage

In case of using an application susceptible to minute changes to the output voltage due to noise, changes in input and
load current, etc., use countermeasures such as implementing filters.
11) Overcurrent protection circuit

This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. This protection
circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC should not be used in
applications characterized by continuous operation or transitioning of the protection circuit.
12) Thermal shutdown (TSD)

This IC incorporates and integrated thermal shutdown circuit to prevent heat damage to the IC. Normal operation should
be within the power dissipation rating, if however the rating is exceeded for a continued period, the junction temperature
(Tj) will rise and the TSD circuit will be activated and turn all output pins OFF. After the Tj falls below the TSD threshold
the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from heat
damage.
13) In some applications, the VCC and pin potential might be reversed, possibly resulting in circuit internal damage or
damage to the elements. For example, while the external capacitor is charged, the VCC shorts to the GND. Use a
capacitor with a capacitance with less than 1000μF. We also recommend using reverse polarity diodes in series or a
bypass between all pins and the VCC pin.
14) This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P/N junctions are formed at the intersection of these P layers with the N layers of other elements to create a
variety of parasitic elements.
For example, in case a resistor and a transistor are connected to the pins as shown in the figure below then:
○ The P/N junction functions as a parasitic diode when GND > pin A for the resistor, or GND > pin B for the transistor.
○ Also, when GND > pin B for the transistor (NPN), the parasitic diode described above combines with the N layer of the
other adjacent elements to operate as a parasitic NPN transistor.
Parasitic diodes inevitably occur in the structure of the IC. Their operation can result in mutual interference between
circuits and can cause malfunctions and, in turn, physical damage to or destruction of the chip. Therefore do not employ
any method in which parasitic diodes can operate such as applying a voltage to an input pin that is lower than the
(P substrate) GND.
Resistor Transistor (NPN)
(Pin A) (Pin B) B (Pin B)

C E
B C
N
P P E
P+ P+ P+ P+
N GND
N
N N N N
P sub Parasitic element

P Parasitic
or transistor
element
GND GND (Pin A)
Parasitic element
or transistor Parasitic
element
www.rohm.com
16/18
TSZ22111・15・001 2.Oct.2012 Rev.001
Status of this document

The Japanese version of this document is formal specification. A customer may use this translation version only for a reference
to help reading the formal version.
If there are any differences in translation version of this document formal version takes priority
Application example
· ROHM cannot provide adequate confirmation of patents.
· The product described in this specification is designed to be used with ordinary electronic equipment or devices (such as audio-visual equipment,
office-automation equipment, communications devices, electrical appliances, and electronic toys).
Should you intend to use this product with equipment or devices which require an extremely high level of reliability and the malfunction of which
would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel
controllers and other safety devices), please be sure to consult with our sales representative in advance.
· ROHM assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no
representations that the circuits are free from patent infringement.
www.rohm.com
17/18
TSZ22111・15・001 2.Oct.2012 Rev.001
●Marking Diagram (TOP VIEW)
TO252-3
TO252-3
(TOP VIEW)
Part Number Marking
Part Number
Output Voltage (V)
Marking
BD733L5 3.3
BD750L5 5.0
LOT Number
●Physical Dimension Tape and Reel Information
●Revision History
Date Revision Changes

2.Oct.2012 001 New Release
www.rohm.com
18/18
TSZ22111・15・001 2.Oct.2012 Rev.001
Datasheet
Notice
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
Precaution on using ROHM Products

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment,
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Notice - Rev.004
© 2013 ROHM Co., Ltd. All rights reserved.
Datasheet
Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Precautions Regarding Application Examples and External Circuits

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label

QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act

Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Notice - Rev.004
Datasheet
Other Precaution
1. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
2. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
3. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
4. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
5. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice - Rev.004

BD733L5FP-CE2 Ultra Low Quiescent Current LDO

Uploaded by

Copyright:

Available Formats

BD733L5FP-CE2 Ultra Low Quiescent Current LDO

Uploaded by

Document Information

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

BD733L5FP-CE2 Ultra Low Quiescent Current LDO

Uploaded by

Copyright:

Available Formats

Datasheet

Ultra Low Quiescent Current LDO

●General Description ●Key specifications

●Typical Application Circuits

Figure 2. Typical Application Circuits

Output Voltage Package Taping

●Pin Configuration ●Pin Description

TO252-3 Pin No. Pin Name Function

（※N.C. terminals are not need to connect to GND.）

Figure 3. Pin Configuration

●Block Diagram GND(FIN)

VCC(1PIN) N.C. VOUT(3PIN)

Figure 4. Block Diagram

●Absolute Maximum Ratings（Ta=25℃）

●Operating Conditions（-40 < Ta < +125℃）

●Electrical Characteristics (BD733L5FP-C)

●Electrical Characteristics (BD750L5FP-C)

●Typical Performance Curves

OUTPUT VOLTAGE : VOUT[V] .

Figure 5. Quiescent current Figure 6. Output voltage vs. Supply voltage

■BD733L5FP-C Reference data

RIPPLE REJECTION : R.R.[dB] .

■BD733L5FP-C Reference data

CIRCUIT CURRENT : lb[µA]

■BD750L5FP-C Reference data

OUTPUT VOLTAGE : VOUT[V] .

OUTPUT VOLTAGE : VOUT[V] .

■BD750L5FP-C Reference data

RIPPLE REJECTION : R.R.[dB]

■BD750L5FP-C Reference data

CIRCUIT CURRENT : lb[µA]

●Reference data (BD7xxL5FP-C Series) TO252-3

●Selection of Components Externally Connected

・Output pin capacitor

●Cautions on PC Board layout , Power Dissipation , Thermal Derating Curves

5 IC mounted on a ROHM standard board

TO252-3 (Reference data)

5 IC mounted on a ROHM standard board

Copper area: 7mm×7mm

The following method is used to calculate the power consumption Pc (W)

Calculation example 1) with Ta＝125℃, VCC＝13.5V, VOUT＝3.3V (TO252-3)

Calculation example 2）with Ta＝125℃, VCC＝13.5V, VOUT＝5.0V (TO252-3)

・Applying negative surge to the VCC pin

●I/O equivalence circuits

○Input terminal ○Output terminal *inside of () shows 5V

3) GND electric potential

4) GND wiring pattern

5) Inter-pin shorting and mounting errors

6) Inspection using the set board

7) Power dissipation (Pd)

9) Rapid variation in VCC voltage and load current

10) Minute variation in output voltage

11) Overcurrent protection circuit

12) Thermal shutdown (TSD)

Resistor Transistor (NPN)

(Pin A) (Pin B) B (Pin B)

P sub Parasitic element

Status of this document

●Marking Diagram (TOP VIEW)

●Physical Dimension Tape and Reel Information