bd2242g-e

Datasheet
1 Channel Compact High Side Switch ICs
1ch Adjustable Current Limit

High Side Switch ICs
BD2222G BD2242G BD2243G
Description Key Specifications
BD2222G, BD2242G and BD2243G are low ◼ IN Operating Voltage: 2.8V to 5.5V
on-resistance N-channel MOSFET high-side power ◼ On Resistance: (VIN=5V) 89mΩ(Typ)
switches, optimized for Universal Serial Bus (USB) ◼ Current Limit Threshold: 0.2A to 1.7A adjustable
applications. These devices are equipped with the ◼ Standby Current: 0.01μA (Typ)
function of over-current detection, thermal shutdown, ◼ Operating Temperature Range: -40°C to +85°C
under-voltage lockout and soft-start. Moreover, the
range of Current limit threshold can be adjusted from
0.2A to 1.7A by changing the external resistance.
Package W(Typ) x D(Typ) x H (Max)
Features SSOP6 2.90mm x 2.80mm x 1.25mm
◼ Adjustable Current Limit Threshold: 0.2A to 1.7A
◼ Low On-Resistance (Typ 89mΩ) N-channel
MOSFET Built-in
◼ Soft-Start Circuit
◼ Output Discharge Function
➢ BD2242G, BD2243G
◼ Open-Drain Fault Flag Output
◼ Thermal Shutdown
◼ Under-Voltage Lockout
◼ Reverse Current Protection when Power Switch Off
◼ Control Input Logic
➢ Active-High: BD2222G, BD2242G SSOP6
➢ Active-Low: BD2243G
◼ UL : File No.E243261
◼ IEC 60950-1 CB scheme approval
Applications
USB hub in consumer appliances, PC,
PC peripheral equipment and so forth
Typical Application Circuit

5V (Typ)
3.3V
IN OUT
CIN
10μF
1μF +
GND ILIM CL
10kΩ to RLIM - 120μF
100kΩ
EN /OC
Figure 1. Typical Application Circuit

Lineup
Output Load Adjustable Output
Current Control input Orderable Part
Current Limit Channel Discharge Package
logic Number
Max Threshold function
1.5A 0.2A to 1.7A 1ch High No SSOP6 Reel of 3000 BD2222G – GTR
1.5A 0.2A to 1.7A 1ch High Yes SSOP6 Reel of 3000 BD2242G – GTR
1.5A 0.2A to 1.7A 1ch Low Yes SSOP6 Reel of 3000 BD2243G – GTR
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays
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© 2012 ROHM Co., Ltd. All rights reserved. TSZ02201-0E3E0H300280-1-2
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Block Diagram
IN OUT
Reverse current
Protection
Under-voltage
Lockout
GND
Charge Thermal
Pump Shutdown
EN /OC
Over-current Delay
ILIM
Protection Counter
Figure 2. Block Diagram

(BD2222G)
IN OUT
Reverse current
Protection
/EN
Under-voltage
Lockout
GND
Charge
Pump
Thermal
EN Shutdown /OC
Over-current Delay
ILIM
Protection Counter
Figure 3. Block Diagram

(BD2242G, BD2243G)
Pin Configuration
IN 1 6 OUT
GND 2 5 ILIM
EN 3 4 /OC
Figure 4. Pin Configuration (TOP VIEW)

Pin Descriptions
Pin No. Symbol I/O Function
1 IN I Switch input and the supply voltage for the IC.
2 GND - Ground.
Enable input.
3 EN I High-level input turns on the switch (BD2222G, BD2242G)
Low-level input turns on the switch (BD2243G)
Over-current notification terminal.
4 /OC O Low level output during over-current or over-temperature condition.
Open-drain fault flag output.
Current limit threshold set Pin. External resistor used to set Current limit
5 ILIM O
threshold. Recommended 11.97 kΩ ≤ RLIM ≤ 106.3 kΩ
6 OUT O Power switch output.
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Absolute Maximum Ratings(Ta=25°C)

Parameter Symbol Rating Unit
IN Supply Voltage VIN -0.3 to +7.0 V
EN Input Voltage VEN -0.3 to +7.0 V
ILIM Voltage VILIM -0.3 to +7.0 V
ILIM Source Current IILIM 1 mA
/OC Voltage V/OC -0.3 to +7.0 V
/OC Sink Current I/OC 10 mA
OUT Voltage VOUT -0.3 to +7.0 V
Storage Temperature Tstg -55 to +150 °C
Power Dissipation (Note1) Pd 0.67 W
(Note 1) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5.4mW per 1°C above 25°C
Caution: Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to
predict all destructive situations such as short-circuit modes, open circuit modes, etc. Therefore, it is important to
consider circuit protection measures, like adding a fuse, in case the IC is operated in a special mode exceeding the
absolute maximum ratings.
Recommended Operating Conditions

Rating
Parameter Symbol Unit
Min Typ Max
IN Operating Voltage VIN 2.8 5.0 5.5 V
Operating Temperature TOPR -40 - +85 °C
Electrical Characteristics (VIN = 5V, RLIM =20kΩ, Ta = 25°C, unless otherwise specified.)
DC Characteristics
Limit
Parameter Symbol Unit Conditions
Min Typ Max
VEN = 5V, VOUT = open,
(BD2222G, BD2242G)
Operating Current IDD - 120 168 μA
(BD2243G)
(BD2222G, BD2242G)
Standby Current ISTB - 0.01 5 μA
(BD2243G)
VENH 2.0 - - V High input
EN Input Voltage
VENL - - 0.8 V Low input
EN Input Leakage IEN -1 0.01 1 μA VEN = 0V or 5V
On-Resistance RON - 89 120 mΩ IOUT = 500mA
Reverse Leak Current IREV - - 1 μA VOUT = 5V, VIN = 0V
112 212 313 RLIM = 100kΩ
Current Limit Threshold ITH 911 1028 1145 mA RLIM = 20kΩ
1566 1696 1826 RLIM = 12kΩ
IOUT = 1mA, VEN = 0V (BD2242G)
Output Discharge Resistance RDISC 30 60 120 Ω
IOUT = 1mA, VEN = 5V (BD2243G)
/OC Output Low Voltage V/OC - - 0.4 V I/OC = 1mA
VTUVH 2.35 2.55 2.75 V VIN increasing
UVLO Threshold
VTUVL 2.30 2.50 2.70 V VIN decreasing
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AC Characteristics
Limits
Parameter Symbol Unit Conditions
Min Typ Max
Output rise Time tON1 - 0.6 6 ms
Output Turn-On Time tON2 - 1 10 ms
RL = 100Ω
Output Fall Time tOFF1 - 1.8 20 μs
Output Turn-Off Time tOFF2 - 3.2 40 μs
/OC Delay Time t/OC 4 7 12 ms
Measurement Circuit
VIN VIN
IIN A
CIN= IN OUT CIN= IN OUT

1µF 1µF RL
GND ILIM GND ILIM
RLIM RLIM
VEN VEN
EN /OC EN /OC
A. Operating Current, Standby Current B. EN Input Voltage, Output Rise/Fall Time

Output Turn-On/ Turn-Off Time
VIN VIN I/OC=
10kΩ 1mA
A
IIN IOUT IOUT
CIN= IN OUT CL= CIN= IN OUT CL=
※100µF 1µF 100µF 1µF 100µF
GND ILIM GND ILIM
RLIM RLIM
VEN VEN
EN /OC EN /OC
C. On-Resistance, Current Limit Threshold, /OC Delay Time D. /OC Output Low Voltage
※Use capacitance more than 100μF at output short circuit test by using
external power supply.
VIN VIN
IOUT=
1mA
CIN= IN OUT CIN= IN OUT

1µF RL 1µF
GND ILIM GND ILIM
RLIM RLIM
VEN VEN
EN /OC EN /OC
E. UVLO Threshold F. Output Discharge Resistance
Figure 5. Measurement Circuit
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Timing Diagram
VEN VENH VENL VEN VENL VENH
tON2 tOFF2 tON2 tOFF2
90% 90% 90% 90%

VOUT VOUT
10% 10% 10% 10%
tON1 tOFF1 tON1 tOFF1
Figure 6. Output Rise/Fall Time Figure 7. Output Rise/Fall Time

(BD2222G, BD2242G) (BD2243G)
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Typical Performance Curves
160 160
Ta=25°C VIN=5.0V
RLIM=20kΩ RLIM=20kΩ
DD [μA]
Operating C urrent : I DD [μA]
120 120
Operationg Current : I
80 80
40 40
0 0
2 3 4 5 6 -50 0 50 100
Supply Voltage : VIN [V] Ambient Temperature : Ta[°C]
Figure 8. Operating Current vs Supply Voltage Figure 9. Operating Current vs Ambient Temperature
EN Enable EN Enable
1.0 1.0
Ta=25°C VIN=5.0V
0.8 0.8
Standby C urrent : IS TB[μA]
Standby C urrent : IS TB[μA]
0.6 0.6
0.4 0.4
0.2 0.2
0.0 0.0
2 3 4 5 6 -50 0 50 100
Figure 10. Standby Current vs Supply Voltage Figure 11. Standby Current vs Ambient Temperature
EN Disenable EN Disenable
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Typical Performance Curves - continued
2.0 2.0
Ta=25°C VIN=5.0V
Low to High
Enable Input Voltage : V E N[V]
Enable Input Voltage : V E N[V]

1.5 1.5
Low to High
High to Low
High to Low
1.0 1.0
0.5 0.5
0.0 0.0
2 3 4 5 6 -50 0 50 100
Figure 12. EN Input Voltage vs Figure 13. EN Input Voltage vs
Supply Voltage Ambient Temperature
200 200
Ta=25°C VIN=5.0V
IOUT=500mA IOUT=500mA
150 150
On Resistance : R ON [m Ω]
On Resistance : R ON [m Ω]
100 100
50 50
0 0
2 3 4 5 6 -50 0 50 100
Figure 14. On-Resistance vs Supply Voltage Figure 15. On-Resistance vs Ambient Temperature
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0.5 0.5
Ta=25°C VIN=5.0V
0.4 0.4
Over Current Threshold : I TH [A]

0.3 0.3
0.2 0.2
0.1 0.1
0.0 0.0
2 3 4 5 6 -50 0 50 100
Figure 16. Over Current Threshold 1 vs Figure 17. Over Current Threshold 1 vs
1.3 1.3
Ta=25°C VIN=5.0V
1.2 1.2
1.1 1.1
1.0 1.0
0.9 0.9
0.8 0.8
2 3 4 5 6 -50 0 50 100
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2.0 2.0
Ta=25°C VIN=5.0V
1.9 1.9

1.8 1.8
1.7 1.7
1.6 1.6
1.5 1.5
2 3 4 5 6 -50 0 50 100
100 100
Ta=25°C VIN=5.0V
I/OC=1mA I/OC=1mA
/OC Output Low Voltage : V/OC [mV]
/OC Output Low Voltage : V/OC [mV]
80 80
60 60
40 40
20 20
0 0
2 3 4 5 6 -50 0 50 100
Figure 22. /OC Output Low Voltage vs Figure 23. /OC Output Low Voltage vs
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2.7 1.0
UVLO H ysteresis Voltage:V HSY [V]

UVLO Threshold : V TUV H , VTUV L[V]
2.6 0.8
VTUVH
2.5 0.6
VTUVL
2.4 0.4
2.3 0.2
2.2 0.0
-50 0 50 100 -50 0 50 100
Ambient Temperature : Ta[℃] Ambient Temperature : Ta[°C]
Figure 24. UVLO Threshold vs Figure 25. UVLO Hysteresis Voltage vs
Ambient Temperature Ambient Temperature
3.0 3.0
Ta=25°C VIN=5.0V
2.5 RL=100Ω 2.5 RL=100Ω
Output R ise Time : tON1 [ms]
Output R ise Time : tON1 [ms]
2.0 2.0
1.5 1.5
1.0 1.0
0.5 0.5
0.0 0.0
2 3 4 5 6 -50 0 50 100
Figure 26. Output Rise Time vs Figure 27. Output Rise Time vs
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3.0 3.0
Ta=25°C VIN=5.0V
2.5 RL=100Ω 2.5 RL=100Ω
Output Turn On Time : tON2 [ms]
Output Turn On Time : tON2 [ms]

2.0 2.0
1.5 1.5
1.0 1.0
0.5 0.5
0.0 0.0
2 3 4 5 6 -50 0 50 100
Figure 28. Output Turn On Time vs Figure 29. Output Turn On Time vs
5.0 5.0
Ta=25°C VIN=5.0V
RL=100Ω RL=100Ω
4.0 4.0
Output Fall Time : tOFF1 [μs]
Output Fall Time : tOFF1 [μs]
3.0 3.0
2.0 2.0
1.0 1.0
0.0 0.0
2 3 4 5 6 -50 0 50 100
Figure 30. Output Fall Time vs Figure 31. Output Fall Time vs
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6.0 6.0
Ta=25°C VIN=5.0V
RL=100Ω RL=100Ω
5.0 5.0
Output Turn Off Time : tOFF2 [μs]
Output Turn Off Time : tOFF2 [μs]

4.0 4.0
3.0 3.0
2.0 2.0
1.0 1.0
0.0 0.0
2 3 4 5 6 -50 0 50 100
Figure 32. Output Turn Off Time vs Figure 33. Output Turn Off Time vs
10 10
Ta=25°C VIN=5.0V
8 8
/OC Delay Time : t/OC [ms]
/OC Delay Time : t/OC [ms]
6 6
4 4
2 2
0 0
2 3 4 5 6 -50 0 50 100
Figure 34. /OC Delay Time vs Figure 35. /OC Delay Time vs
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200 200
Ta=25°C VIN=5.0V
IOUT=1mA IOUT=1mA
DIS C [Ω ]
DIS C [Ω]
150 150
Dsic On R esistance : R
Disc On R esistance : R
100 100
50 50
0 0
2 3 4 5 6 -50 0 50 100
Figure 36. Discharge On Resistance Figure 37. Discharge On Resistance vs
vs Supply Voltage Ambient Temperature
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Typical Wave Forms
VEN VEN
(5V/div.) (5V/div.)
V/OC V/OC
(5V/div.) (5V/div.)
VOUT VOUT
(5V/div.) (5V/div.)
IIN IIN
(50mA/div.) VIN=5V (50mA/div.) VIN=5V
RL=100Ω RL=100Ω
TIME (0.5ms/div.) TIME (1μs/div.)

Figure 38. Output Rise Characteristic Figure 39. Output Fall Characteristic
(BD2242G) (BD2242G)
VEN V/OC
(5V/div.) (5V/div.)
V/OC VOUT
(5V/div.) (5V/div.)
CL=47μF
CL=100μF Limit current
VOUT Current limit threshold
(5V/div.) CL=220μF
VIN=5V
RLIM=20kΩ
IIN RL=100Ω IIN
(0.5A/div.) (0.5A/div.) VIN=5V
RLIM=20kΩ
CL=100μF
CL=47μF CL=100μF
TIME (0.5ms/div.) TIME (20ms/div.)

Figure 40. Inrush Current Response Figure 41. Over Current Response
(BD2242G) Ramped Load
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Typical Wave Forms - continued
VEN VEN
(5V/div.) VIN=5V (5V/div.)
RLIM=20kΩ
CL=100μF
V/OC V/OC
(5V/div.) (5V/div.)
Removal of load
TSD detection TSD detection
TSD recovery
TSD recovery
VOUT VOUT
(5V/div.) (5V/div.)
VIN=5V
RLIM=20kΩ
IIN IIN CL=100μF
(0.5A/div.) (0.5A/div.)
TIME (20ms/div.) TIME (20ms/div.)

Figure 42. Over Current Response Figure 43. Over Current Response
Enable Into Short Circuit Disenable From Short Circuit
(BD2242G) (BD2242G)
VIN VIN VIN=VEN

(5V/div.) VIN=VEN
(5V/div.)
V/OC V/OC
(5V/div.) (5V/div.)
UVLO detection
UVLO recovery
VOUT VOUT
(5V/div.) (5V/div.)
IIN IIN
(50mA/div.) V/OC=3.3V (50mA/div.) V/OC=3.3V
RL=100Ω RL=100Ω
TIME (1s/div.) TIME (1s/div.)

Figure 44. UVLO Response Figure 45. UVLO Response
Increasing VIN (BD2242G) Decreasing VIN (BD2242G)
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Typical Wave Forms - continued
V/OC V/OC
(5V/div.) (5V/div.)
VOUT VOUT
(5V/div.) (5V/div.)
VIN=5V VIN=5V
CL=100μF CL=100μF
IIN IIN
(2A/div.) (2A/div.)
TIME (2ms/div.) TIME (5μs/div.)

1Ω Load Connected At Enable 1Ω Load Connected At Enable
V/OC V/OC
(5V/div.) (5V/div.)
VOUT VOUT
(5V/div.) (5V/div.)
VIN=5V VIN=5V
CL=100μF CL=100μF
IIN IIN
(2A/div.) (2A/div.)
TIME (2ms/div.) TIME (5μs/div.)

0Ω Load Connected At Enable 0Ω Load Connected At Enable
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Application Circuit Example
5V (Typ)
10kΩ to
100kΩ
+ IN OUT
C CIN
- +
Controller GND ILIM CL SBD
RLIM -
EN /OC
Figure 50. Application Circuit Example
Application Information
Ringing may cause bad influences on IC operations. In order to avoid this case, connect a low ESR bypass capacitor
across IN terminal and GND terminal of IC. 1μF or higher is recommended. When excessive current flows due to output
short-circuit or so, ringing occurs because of inductance between power source line to IC may exert a bad influence upon
IC. In order to decrease voltage fluctuations from power source line to IC, connect a low ESR capacitor in parallel with CIN.
10μF to 100μF or higher is effective.
When OUT terminal voltage is less than the absolute voltage (-0.3V), there is possibility that this IC suffers physical
damage by parasitic diode. Recommended Voltage is over -0.3V. When OUT terminal and GND terminal short-circuit,
undershoot occurs. To reduce undershoot level, recommendation is to put C L and SBD near the OUT terminal. As
pattern-layout and Application affect the undershoot level, make sure to leave an adequate margin.
Pull up /OC output via resistance value of 10kΩ to 100kΩ.
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external
components including AC/DC characteristics as well as the dispersion of the IC.
Functional Description
1. Switch Operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. The IN terminal
is also used as power source input to internal control circuit.
When the switch is turned on from EN control input, the IN terminal and OUT terminal are connected by a 89mΩ(Typ)
switch. In ON status, the switch is bidirectional. Therefore, when the potential of OUT terminal is higher than that of the IN
terminal, current flows from OUT terminal to IN terminal.
Since a parasitic diode between the drain and the source of switch MOSFET is canceled, current flow from OUT to IN is
prevented during off state.
2. Thermal Shutdown Circuit (TSD)
If over-current limit would continue, the temperature of the IC would increase drastically. If the junction temperature were
beyond 120°C(Typ) in the condition of over-current detection, thermal shutdown circuit operates and makes power switch
turn off and outputs fault flag (/OC). Then, when the junction temperature decreases lower than 110°C(Typ), power switch
is turned on and fault flag (/OC) is cancelled. Also, regardless of over-current condition, if the junction temperature were
beyond 160°C(Typ), thermal shutdown circuit makes power switch turn off and outputs fault flag (/OC).When junction
temperature decreases lower than 140°C(Typ), power switch is turned on and fault flag (/OC) is cancelled. Unless the
fact of the increasing chips temperature is removed or the output of power switch is turned off, this operation repeats.
Fault flag (/OC) is output without delay time at thermal shutdown.
The thermal shutdown circuit operates when the switch is on (EN signal is active).
3. Over-Current Detection (OCD)
The over current detection circuit (OCD) limits current and outputs error flag (/OC) when current flowing in each switch
MOSFET exceeds a specified value. There are three cases when the OCD is activated. The OCD operates when the
switch is on (EN signal is active).
(1). When the switch is turned on while the output is in short-circuit status, the switch gets in current limit status
immediately. (See figure 42.)
(2). When the output short-circuits or when high current load is connected while the switch is on, very large current
flows until the over current limit circuit reacts. When this happens, the over-current limit circuit is activated and the
current limitation is carried out. (See figure 48,49.)
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(3). When the output current increases gradually, current limitation does not work until the output current exceeds the
over current detection value. When it exceeds the over current detection value, current limitation is carried out.
(See Figure 41.)
4. Under-Voltage Lockout (UVLO)
UVLO circuit prevents the switch from turning on until the IN exceeds 2.55V(Typ). If the IN drops below 2.5V(Typ) while
the switch turns on, then UVLO shuts off the power switch. UVLO has hysteresis of a 50mV(Typ).
Under-voltage lockout circuit works when the switch is on (EN signal is active). (see Figure 44,45.)
5. Fault Flag (/OC) Output
Fault flag output is an N-MOS open drain output. At detection of over-current or thermal shutdown, output is low-level.
Over-current detection has delay filter. This delay filter prevents instantaneous current detection such as inrush current
at switch on, hot plug from being informed to outside, but if charge up time for output capacitance is longer than delay
time, fault flag output asserts low level. When output current is close to Current Limit Threshold value, fault flag output
(/OC) might be low level before turning to over-current condition because it is affected by current swinging or noise. If
fault flag output is unused, /OC pin should be connected to open or ground line.
Over-Current Over-Current
Detection Load Removed
VOUT
ITH Limit current

IOUT
t/OC
V/OC
Figure 51. Over-Current Detection
VEN
VOUT Over-current detection
Thermal Shutdown
IOUT
Thermal Shutdown recover

V/OC
/OC delay time
Figure 52. Over-Current Detection, Thermal Shutdown Timing (BD2222G, BD2242G)
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VEN
VOUT Over-current detection
Thermal Shutdown
IOUT
V/OC Thermal Shutdown recover
/OC delay time
Figure 53. Over-Current Detection, Thermal Shutdown Timing (BD2243G)
6. Adjustable Current Limit Threshold
BD2222/42/43G is able to change over-current detection value from 0.2A to 1.7A by connecting resistance (RLIM)
between ILIM pin and GND pin. The resistance value from 11.97KΩ to 106.3kΩ is recommended for RLIM. The
relational expression and the table for resistance value and over-current detection value are described below. Allocate
RLIM close to IC as possible. Be careful not to be affected by parasitic resistance of board pattern because over-current
detection value is depended on the resistance value between ILIM pin and GND pin. ILIM pin cannot be used as open
and short to GND pin. The RLIM resistance tolerance directly affects the current limit threshold accuracy.
Recommended to use low tolerance resistance.
Over Current Threshold Equation,
Ith(Typ)[mA] = 19364 × RLIM[kΩ]-0.98
Ith(Min)[mA] = Ith(Typ)[mA] × 0.98 - 96
Ith(Max)[mA] = Ith(Typ)[mA] × 1.02 + 96
2000
1800
Typ.
1600 Min.
Current Limit Threshold : Ith [mA]
Max.
1400
1200
1000
800
600
400
200
0
0 20 40 60 80 100 120
Current Limit Resistor : R LIM [kΩ]
Figure 54. Ith vs. RLIM
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Current Limit Threshold (mA)

RLIM (kΩ)
MIN TYP MAX
106.30 100 200 300
70.28 198 300 402
52.40 296 400 504
41.73 394 500 606
34.65 492 600 708
29.60 590 700 810
25.83 688 800 912
22.91 786 900 1014
20.57 884 1000 1116
18.67 982 1100 1218
17.08 1080 1200 1320
15.74 1178 1300 1422
14.59 1276 1400 1524
13.60 1374 1500 1626
12.73 1472 1600 1728
11.97 1570 1700 1830
Table 1. Ith Tolerance vs. RLIM
7. Output Discharge Function (BD2242G and BD2243G)
When the switch is turned off from disable control input or UVLO function, the 60Ω(Typ.) output discharge circuit
between OUT and GND turns on. By turning on this switch, electric charge at capacitive load is discharged. But when
the voltage of IN declines extremely, then the OUT pin becomes high impedance without UVLO function.
Power Dissipation
(SSOP6 package)
700
600
POWER DISSIPATION : Pd [mW]
500
400
300
200
100
0
0 25 50 75 85 100 125 150
AMBIENT TEMPERATURE : Ta [℃]
* 70mm x 70mm x 1.6mm Glass Epoxy Board
Figure 55. Power Dissipation Curve (Pd-Ta Curve)
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TSZ22111・15・001 24.Nov.2020 Rev.006
BD2222G BD2242G BD2243G
I/O Equivalence Circuit

Symbol Pin No. Equivalent Circuit
EN 3 EN
/OC
/OC 4
ILIM 5
ILIM
OUT
6
BD2222G OUT
OUT
6
BD2242G OUT
BD2243G
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Operational Notes
1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply terminals.
2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7. Rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Terminals

Input terminals of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance
and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input terminals should be connected to
the power supply or ground line.
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BD2222G BD2242G BD2243G
Operational Notes – continued
12. Regarding the Input Pin of the IC

This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Resistor Transistor (NPN)
Pin A Pin B B Pin B
C
Pin A E
P B C
P+ P+ P+ N P P+
N N N N Parasitic N N N
E
Elements
Parasitic
P Substrate P Substrate
Elements
GND GND GND GND
Parasitic Parasitic N Region
Elements Elements close-by
Figure 56. Example of monolithic IC structure
13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)

This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
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BD2222G BD2242G BD2243G
Ordering Information
B D 2 2 x x G - G T R
Part Number Package G: Halogen free Packaging and forming specification

BD2222 G: SSOP6 package TR: Embossed tape and reel
BD2242
BD2243
Marking Diagram
SSOP6 (TOP VIEW)
Part Number Marking

2
1
1PIN MARK LOT Number
Part Number Part Number Marking
BD2222G BN
BD2242G AY
BD2243G AZ
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BD2222G BD2242G BD2243G
Physical Dimension, Tape and Reel Information

Package Name SSOP6
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Revision History
Date Revision Changes

12.OCT.2012 0000 Draft
27.FEB.2013 0001 Over Current Threshold Limits
7.MAR.2013 001 Authentic Release
Add Typical Wave Forms for over current response
23.APR.2013 002
Change I/O Equivalence Circuit (EN)
Applied new style and improved understandability.
Improved Symbol name.
12.FEB.2014 003
Improved in Operational Notes.
Add Output Discharge Function in Functional Description
9.JUN.2014 004 Add BD2222G
Add UL, CB scheme No.
P.14 Figure 40. Revise TIME range.
26.JUL.2017 005
P.16 Figure 46,47,48,49 Revise IIN range.
P.17 Change Application information.
24.Nov.2020 006 P.26-2, P26-3 Updated packages and part numbers.
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BD2222G BD2242G BD2243G
Ordering Information
B D 2 2 x x G - G Z T R
Part Number Package G: Halogen free Packaging and forming specification

BD2222 G: package TR: Embossed tape and reel
BD2242 SSOP6A
BD2243 Production site
Z: Added
Marking Diagram
SSOP6A (TOP VIEW)
Part Number Marking

2
1
1PIN MARK LOT Number
Part Number Part Number Marking
BD2222G BN
BD2242G AY
BD2243G AZ
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Physical Dimension, Tape and Reel Information

Package Name SSOP6A
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Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipment (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅡb
CLASSⅢ CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used.
However, recommend sufficiently about the residue.) ; or Washing our Products by using water or water-soluble
cleaning agents for cleaning residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.004
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl 2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E Rev.004
Datasheet
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
Notice – WE Rev.001

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Datasheet

1 Channel Compact High Side Switch ICs

1ch Adjustable Current Limit

Typical Application Circuit

Figure 1. Typical Application Circuit

Figure 2. Block Diagram

Figure 3. Block Diagram

Figure 4. Pin Configuration (TOP VIEW)

6 OUT O Power switch output.

Absolute Maximum Ratings(Ta=25°C)

Recommended Operating Conditions

CIN= IN OUT CIN= IN OUT

A. Operating Current, Standby Current B. EN Input Voltage, Output Rise/Fall Time

CIN= IN OUT CIN= IN OUT

E. UVLO Threshold F. Output Discharge Resistance

Figure 5. Measurement Circuit

VEN VENH VENL VEN VENL VENH

tON2 tOFF2 tON2 tOFF2

90% 90% 90% 90%

tON1 tOFF1 tON1 tOFF1

Figure 6. Output Rise/Fall Time Figure 7. Output Rise/Fall Time

Typical Performance Curves

Standby C urrent : IS TB[μA]

Typical Performance Curves - continued

Enable Input Voltage : V E N[V]

Typical Performance Curves - continued

Over Current Threshold : I TH [A]

Over Current Threshold : I TH [A]

Typical Performance Curves - continued

Over Current Threshold : I TH [A]

/OC Output Low Voltage : V/OC [mV]

Typical Performance Curves - continued

UVLO H ysteresis Voltage:V HSY [V]

Output R ise Time : tON1 [ms]

Typical Performance Curves - continued

Output Turn On Time : tON2 [ms]

Output Fall Time : tOFF1 [μs]

Typical Performance Curves - continued

Output Turn Off Time : tOFF2 [μs]

Typical Performance Curves - continued

Typical Wave Forms

TIME (0.5ms/div.) TIME (1μs/div.)

TIME (0.5ms/div.) TIME (20ms/div.)

Typical Wave Forms - continued

TIME (20ms/div.) TIME (20ms/div.)

VIN VIN VIN=VEN

TIME (1s/div.) TIME (1s/div.)

Typical Wave Forms - continued

TIME (2ms/div.) TIME (5μs/div.)

TIME (2ms/div.) TIME (5μs/div.)

Application Circuit Example

Figure 50. Application Circuit Example

2. Thermal Shutdown Circuit (TSD)

3. Over-Current Detection (OCD)

4. Under-Voltage Lockout (UVLO)

5. Fault Flag (/OC) Output

ITH Limit current

Figure 51. Over-Current Detection

VOUT Over-current detection

Thermal Shutdown recover