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Lecture 5

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6 views

Lecture 5

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ahmedabousree4
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© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
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Lecture #5

Bulk micro-machining and classification of nanomaterials


Dr. Shady Abdelnasser, Ph.D.

Department of Energy and Renewable Energy Engineering


Egyptian Chinese University
Outline

Steps for bulk micromachining

Classification of nanomaterials
❖ 0D
❖ 1D
❖ 2D
❖ 3D

Microelectronics & Nanoelectronics


Processes for MEMS Fabrication
Micromachining
The process of building microscopic mechanical parts out of silicon substrate

The method is used to fabricate variety of mechanical parts such as beams, gears,
springs and many other mechanical structures

These mechanical structures will be used in wide range of microsensors such as


Comb drive actuator, MEMS micro-engine (gear train).
Surface vs Bulk Micro-Machining

Building microstructures by selectively etching builds microstructures by deposition and etching


inside a substrate structural layers over a substrate.
Micromachining techniques
Film deposition
Photolithography
Etching

One of Silicon micromachining technologies is bulk


micromachining

The method is used to develop micromechanical


structures within the bulk of a silicon wafer by
selectively removing part within the wafer material

The etching process can be performed by either


dipping the silicon wafer into an etching solution
(wet etching) or by exposing the material to vapors
or glow-discharge plasma in vacuum chambers (dry
etching)
Typical steps for bulk micro-machining Process

• Step 1: Substrate preparation – typically 500 to 700 𝜇𝑚 silicon (Si) crystal

• Step 2: After RCA cleaning, deposition of a silicon dioxide (𝑆𝑖𝑂2); sacrificial layer
– typical thickness 1 to 2𝜇𝑚.
➢This layer is obtained when the oxygen penetrates the substrate
➢This layer helps to protect some areas of the substrate from the chemicals
used later for machining
➢At the end of the process, it can be removed
Step 3: Patterning (photoresist deposition + optical
lithography) expose photoresist to light

Step 4: Developing (stripping) photoresist (immersed in a


chemical solution, called the developer, which dissolves
(removes) the unpattern portions of the photoresist)

Step 5: Sacrificial layer; SiO2 layer etching

The etching could be wet (using some chemicals)


or dry (using plasma or gases)
Step 6: Substrate etching; removing a part of the
substrate.

Step 7: Deposition of polysilicon (structural


material) layer

Step 8: Substrate etching for creating deeper


trenches

Step 9: Creation of a suspended structure (proof


mass) after repeating the same steps on the
bottom side of the substrate and removing the
residual SiO2 at both sides.
Clean Room
• IC fabrication facility
requires a clean room,
particularly in lithography
areas.

• A cleanroom is a
controlled environment
that maintains a very low
concentration of airborne
particles. It filters
pollutants like dust,
airborne microbe particles
to provide the cleanest area
possible.
• This controlled
environment protect the
production of the devices.
Dust particles settling on semiconductor wafers
Clean Room and lithographic masks can cause defects in the
devices.

• As shown in the figure, air particles adhering


to the surface of the mask behave as opaque
patterns that can be transferred to the circuit
patterns, leading to unintended results.

• For instance, particle 1 may lead to the


formation of a pinhole in the underlying layer.

• Particle 2 may cause a reduction of current flow

• Particle 3 may lead to a short circuit between


the two conducting regions and render the circuit
useless.
Cleanrooms are classified according to the
number and size of particles permitted per
volume of air.

In a clean room, the total number of dust


particles per unit volume must be tightly
controlled along with other parameters such as
temperature, humidity, pressure, and so on.

Each class of clean room is usually defined to


be one that has a certain count of dust
particles.

As shown in the figure, a class 10 is better than


class 100 and so on since it includes less
number of dust particles. Class 10 or better
clean room is required.
Problem Solving

If a 125-mm diameter wafer is exposed for 1 minute to an air stream under a


laminar-flow condition at 30 m/min, how many dust particles will land on
the wafer in a class 10 clean room?

Solution

For a class 10 clean room, there are 350 particles per cubic meter. The air
volume that goes over the wafer in 1 min is:
(30 m/min) x π (0.125/2)2 x 1 min = 0.368 m3

The number of dust particles contained in the air volume is 350 x 0.368 =
128 particles
Classification of Nanomaterials

Nanomaterials are usually


considered to be materials
with at least one dimension
that measures 100 nanometres
or less.

They may be in the form of


particles, tubes, rods or fibres.
Nanomaterials
Nanomaterials are classified into four types based on their size dimensions: 0D, 1D,
2D, and 3D, as described below.
0D nanomaterials: These nanomaterials have all three dimensions (x, y, and z) in the
nanoscale range. No dimension outside the Nano range. 0D nanomaterials include
uniform nanoparticles, nanospheres, and quantum dots, all of which are considered
point-like particle
ID nanomaterials: Nanomaterials in this class have two of their
three dimensions in the nanoscale range, but one dimension of the
nanostructure is outside the non-metric range. 1D nanomaterials,
such as nanotubes, nanorods, and nanowires
2D nanomaterials have plate-like shapes with two dimensions outside the nanometer range, but
1D is at the nanoscale. thin-film coatings, nano sheets, and nanoplates.

3D nanomaterials are nanomaterials that are not confined to the nanoscale in any dimension. All
dimensions of a 3D nanomaterial are outside the nanometer range or greater than 100 nm. It
includes nanoparticle dispersion, and bundles of nanowires and nanotubes.

The dimensions of 3D nanomaterials can be beyond nanoscale, but they are not the same with
bulk materials. All dimensions of a 3D material are outside the nanometer range or greater than
100 nm, but the bulk (inherent) material is made up of individual blocks that are in the
nanometer scale, so 3D nanomaterials have three arbitrary dimensions above 100 nm.
Classification of Nanomaterials
• Carbon nanotubes

• Extended tubes made by


rolling graphene sheets or nano
walls, they are flexible, highly
electrically conductive and
mechanically very strong
(ultimate intrinsic tensile
strengths in the 100–200 GPa,
among the highest in existing
materials).

• They can be used in reinforced


composites, sensors, display
devices and energy conversion
and storage systems.
Classification of Nanomaterials

• Carbon nanotubes on
glass or plastic sheets
allow manufacturers to
make clear conductive
panels for displays that
are extremely thin.
Classification of Thin Films
Nanomaterials Thin layers of materials (nanometer structural materials) deposited
on a substrate surface using techniques such as, physical vapor
deposition (PVD) or chemical vapor deposition (CVD).

They can be applied in electronic semiconductor devices. This


includes integrated circuit chips (IC), as well as light-emitting
diodes (LEDs) and solar panels.
Microelectronics & Nanoelectronics
• Microelectronics
and nanoelectronics utilize fabrication
techniques to miniaturize materials and
components for use in advanced electronic
devices.

• Microelectronics and nanoelectronics are


subfields of electronics in which the nominal
sizes of electronic components are between
100 µm or smaller (microelectronics) or 100
nm or smaller (nanoelectronics).

Decreasing the size allow more components


to fit into integrated circuits, allowing for
more powerful and energy-efficient
electronic devices with reduced weights and
power consumption.
Problem Solving #2

If a 9-cm diameter wafer is exposed for 1 minute to an air stream under a


laminar-flow condition at 20 m/min, how many dust particles will land on
the wafer in a class 100 clean room?

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