TI Designs

Compact Full HD 1080p (up to 16 Amps) Projection Display Reference

Design using DLP® Pico™ Technology

Design Overview Design Features

®
This reference design, featuring the DLP Pico™ • 1920 x 1080 resolution
0.47-inch TRP Full-HD 1080p display chipset and • Brightness: 600 RGB lumens @ 16A LED
implemented in the DLP LightCrafter Display 4710 current
G2 evaluation module (EVM), enables use of full HD • RGB LED-illuminated optical module
resolution for projection display applications such as • Driver board includes DLC3439 controllers,
accessory projectors, screenless displays, DLPA3005 PMIC/LED driver
interactive displays, wearables (including head • System board includes HDMI and USB
mounted displays), signage, industrial and medical connectivity
displays. The chipset used in the design is • PC software GUI to customize display
comprised of the DLP4710 (.47 1080p) DMD, the configurations
DLPC3439 display controller and the DLPA3005
PMIC/LED driver Featured Applications
• Screenless TV (mobile smart TV)
Design Resources
• Portable home cinema / business projector
TIDA-01226 Design Folder • Low latency gaming display
DLPC3439 Product Folder • Digital signage
DLP4710 Product Folder • Interactive surface display for retail,
restaurant, or gaming applications
DLPA3005 Product Folder
TIDA-00576 Tools Folder
Board Image

Block Diagram

Key Test Result Graph

TIDUC88 – August 2016 TIDA-01226 1

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1 Key System Specifications

The DLP LightCrafter Display module consists of three subsystems:

1. Light engine – includes the optics, red, green, blue LEDs and a 1920 x 1080 (1080p) DMD
capable of 600 lumens out-of-the-box.

Parameter Min Typ. Max Unit

Brightness @ Red 12A / 600 Lum
Green 16A / Blue 16A
LED current
Red LED Current 12 A
Green / Blue LED Current 16 A
Brightness Uniformity 73 %
Offset 100 %
Focus Range (Wide) 40 120 inch
Image diagonal size 40 100 inch

Figure 1: Optical engine specification

2. DLP Driver – includes the DLP chipset comprising of DLPC3439 Controller and DLPA3005
PMIC/LED driver with up to 16A LED current.
3. System front end – includes MSP430, ITE HDMI receiver, USB-Serial Bridge Controller and
several connectors for external inputs (HDMI, USB, etc.)

2 System Description

2.1 DLPC3439
The 2x DLPC3439 digital controllers, part of the DLP4710 (.47 1080p) chipset, supports reliable operation of the
DLP4710 digital micromirror device (DMD). The DLPC3439 controller provides a convenient, multi-functional
interface between system electronics and the DMD, enabling small form factor, low power, and high resolution
full HD displays.

Figure 2: Functional Block Diagram

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2.2 DLPA3005
The DLPA3005 is a highly-integrated power management IC optimized for DLP™ Pico ™Projector systems. The
DLPA3005 supports LED projectors up to 16 A per LED, enabled by an integrated high efficiency buck controller.
Additionally, the drivers control the RGB switches, supporting the sequencing of R, G, and B LEDs. The
DLPA3005 contains five buck converters, two of which are dedicated for DLPC low voltage supplies. Another
dedicated regulating supply generates the three timing-critical DC supplies for the DMD: VBIAS, VRST, and
VOFS.
The DLPA3005 contains several auxiliary blocks which can be used in a flexible way. This enables a tailor-made
Pico Projector system. Three 8-bit programmable buck converters can be used, for instance, to drive projector
FANs or to make auxiliary supply lines. Two LDOs can be used for a lower-current supply, up to 200 mA. These
LDOs are pre-defined to 2.5 V and 3.3 V.
Through the SPI, all blocks of the DLPA3005 can be addressed. Features included are the generation of the
system reset, power sequencing, input signals for sequentially selecting the active LED, IC self-protections, and
an analog MUX for routing analog information to an external ADC.

Figure 3: System Block Diagram

2.3 DLP4710
The DLP4710 digital micromirror device (DMD) is a digitally controlled micro-opto-electromechanical system
(MEMS) spatial light modulator (SLM). When coupled to an appropriate optical system, the DLP4710 DMD
displays a very crisp and high quality image or video. DLP4710 is part of the chipset comprising of the DLP4710
DMD, DLPC3439 display controller and DLPA3000/DLPA3005 PMIC/LED drivers. The compact physical size of the
DLP4710 coupled with the controller and the PMIC/LED driver provides a complete system solution that enables
small form factor, low power, and high resolution HD displays.

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3 Block Diagram

Figure 4: DLP LightCrafter 4710EVM Block Diagram

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3.1 Highlighted Products

3.1.1 DLPC3439 Features

 Supports Input Image Sizes up to 1080p
 24 Bit, Input Pixel Interface Support:
o Parallel Interface
o Pixel Clock up to 150MHz
 Pixel Data Processing
o IntelliBright™ Suite of Image Processing Algorithms
o Image Resizing (Scaling)
o Color Coordinate Adjustment
o Programmable Degamma
o Active Power Management Processing
o Color Space Conversion
 Auto DMD Parking at Power Down
 Compatible with the DLPA3000 and DLPA3005 PMIC/LED Drivers

3.1.2 DLPA3005 Features

 High-Efficiency, High-Current RGB LED Driver
 Drivers for External Buck FETs up to 16 A
 Drivers for External RGB Switches
 10-Bit Programmable Current per Channel
 Inputs for Selecting Color-Sequential RGB LEDs
 Generation of DMD High Voltage Supplies
 Two High Efficiency Buck Converters to Generate the DLPC343x and DMD Supply
 Three High Efficiency, 8-Bit Programmable Buck Converters for Fan Driver Application or General
Power Supply. General Purpose Buck2 (PWR6 currently supported, others may be available in the
future)
 Two LDOs Supplying Auxiliary Voltages
 Analog MUX for Measuring internal and external nodes such as a thermistor and reference levels
 Monitoring/Protections: Thermal Shutdown, Hot Die, Low-Battery, and Undervoltage Lockout (UVLO)

3.1.3 DLP4710 Features

 0.47-Inch (11.93-mm) Diagonal Micromirror Array
o 1920 × 1080 Array of Aluminum Micrometer-Sized Mirrors, in an Orthogonal Layout
o 5.4 – Micron Micromirror Pitch
o ±17° Micromirror Tilt (Relative to Flat Surface)
o Bottom Illumination for Optimal Efficiency and Optical Engine Size
o Polarization Independent Aluminum Micromirror Surface
 32-Bit SubLVDS Input Data Bus
 Dedicated DLPC3439 Display Controller and DLPA3000/DLPA3005 PMIC/LED Drivers for Reliable
Operation

4 Getting Started Hardware

This getting started procedure assumes that the EVM default conditions are as shipped.

1. Power up the DLP LightCrafter™ Display 4710 EVM by applying an external DC power supply (19V DC, 4.74
A) to PWR_IN connector (J28).

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External Power Supply Requirements:

Nom Output voltage: 19 VDC
Max Output Current: 4.74 A
Efficiency Level: V
NOTE: TI recommends using an external power supply that complies with applicable regional safety
standards such as UL, CSA, VDE, CCC, PSE, etc.

2. Move PS_ON/OFF slide switch (SW28) to the ON position.

+3.3V (D43) and INTZ (D57) LED will indicate when 19V power is applied.
3. Push ON/OFF switch (SW21) to turn on the DLP LightCrafter™ Display 4710 EVM.
+3.3V (D43), SYS_ON-OFF (D36), M_IRQ (D33) and S_IRQ (D34) LED will indicate that the DLP LightCrafter™
Display 4710 EVM is turned on.
4. After the DLP LightCrafter™ Display 4710 EVM is turned on, the projector will show a DLP LightCrafter™
Display splash image by default.
5. The focus and zoom of the image can be adjusted on the optical engine.

Zoom adjustment

Focus adjustment

Figure 5:Optical engine with focus and zoom adjustment

6. Connect USB to the LightCrafter™ Display 4710 EVM and open the GUI for 4710 EVM on your Computer.
Then you can communicate to the EVM over the GUI software. If needed, please connect a HDMI source to
the EVM.
7. When turning off the projector, push ON/OFF switch (SW21) and then move slide switch (SW28) to the OFF
position before removing the power cable.
IMPORTANT NOTE: To avoid potential damage to the DMD, it is required to turn off the projector with the
above sequence before disconnecting the power.

5 Getting Started Firmware

The TIDA-01226 reference design needs firmware for the DLPC3439 and the MSP430. The EVM GUI connects
through the USB interface of the Cypress controller to the EVM.
TIDUC88 - August 2016 TIDA-01226 6
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5.1 DLPC3439 firmware

The DLPC3439 firmware is stored on the two 64 bit flash devices on the PCB board. The firmware contains the
ARM code, LED sequences, Start up configuration, Splash images and LUT’s (Look up Table).
The firmware can be downloaded on the DLP LightCrafter 4710 EVM tool folder:
http://www.ti.com/tool/dlpdlcr4710evm-g2

5.2 MSP430 code

The MSP430 code is used as a front-end processor in the DLP LightCrafter 4710 EVM. It drives Proj_ON and
configures the DLPC3439 for the external HDMI input.

The full MSP430 code is available under the DLP LightCrafter4710EVM tool folder:
http://www.ti.com/tool/dlpdlcr4710evm-g2

It can be modified by using Code Composer and can be downloaded on the MSP430 with the USB Debugging
Interface.

5.3 DLP LightCrafter GUI

The GUI (Graphical User Interface) allows users to evaluate the capabilities of the DLP chipset by sending I2C
commands to the DLPC3439.

The DLP LightCrafter GUI is available under the DLP LightCrafter4710EVM tool folder:
http://www.ti.com/tool/dlpdlcr4710evm-g2

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6 Test Setup
Testing of the TIDA-01226 reference design was performed using the DLP LightCrafter Display 4710 EVM-G2
which is the TI’s implementation of the TIDA-01226 reference design. This EVM incorporates the DLP 0.47"
1080p chipset comprising of the DLP4710 DMD, DLPC3439 controller and DLPA3005 PMIC/Led Driver. The EVM
and TI design enable faster development cycles for applications requiring full HD resolution and higher
brightness projection display solutions. The entire test data contained below was measured on one DLP
LightCrafter Display 4710 EVM-G2 to provide an example from a typical unit. Please note that performance will
vary across EVMs due to variations in manufacturing. The performance data is not guaranteed

Figure 6: DLP LightCrafter 4710 EVM-G2

7 Test Data

7.1 Lumens Measurement

This section provides the lumens measured for the EVM, which is the TI’s implementation of
this reference design.

White Point: 6600K

Lumens: 600 (ANSI)

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7.2 Power Up and Power Down Timing Measurements

Power Up and Power Down timing requirements are described in detail in the DLP4710
datasheet. Key signals measured are PROJ_ON and the power supplies to the DMD- VBIAS,
VOFFSET and VRESET. For more details on the timing requirements please refer the DLP4710
device datasheet.

Both measurements are showing following configuration:

CH 1: PROJ_ON; CH 2: VBIAS; CH 3: VOFS ; CH 4: VRST

Power Up Timing Measurements

Power down Timing Measurements

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7.3 Optical engine size

DLP4710 is a key component of the 0.47" 1080p chipset and enables use of full HD resolution
for projection display applications. The optical engine used in this DLPDLCR4710EVM is
designed for +1000 Lumens applications. Dimensions are shown in mm.

Figure 7: 1080p Optical Engine

7.4 Throw Ratio

An optical engine’s throw ratio is defined as the ratio of the distance measured from lens to
screen and the width of the projected image.

Throw Ratio = Distance/Width

The throw ratio for the optical engine used in this ref design is 1.39

TIDUC88 - August 2016 TIDA-01226 10

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8 Design Files

8.1 Schematics
To download the Schematics for each board, see the design files at http://www.ti.com/tool/TIDA-01226
LED_ANODE
VIN
VIN
Q15
C301 C302 C303 C304
C324 D58 B0530WS-7 1 8
U35-1 1 2 ILLUM_HS_DRV_Q S1 D1 22uF 22uF 22uF 22uF
TP160 10uF
VIN DLPA3005 2 7
C300 10uF S2 D2
DRST_5P5V 3 29 R570 3.9
C305 10uF DRST_5P5V ILLUM_A_FB 3 6
4 30 C370 S3 D3

2
DRST_PGND ILLUM_A_VIN
28 ILLUM_BOOST 1000pF 4 5
C306 1uF 5 ILLUM_A_BOOST D50 G D4
DRST_VIN DNI
TRP DMD: TP162 B240A-13-F
C308 TP163 CSD17309Q3 TP168

1
DRST_HS 6
VOFS = 10V DRST_HS_IND 26 ILLUM_HS_DRV 0.1uF L14 1.5uH

1
ILLUM_HSIDE_DRIVE
VBIAS = 18V 31 ILLUM_SW R575 0 ILLUM_A_SW_L LED_ANODE
D51 L15 10uH DRST_LS 2 ILLUM_A_SW
VRST = -14V DRST_LS_IND 27 ILLUM_LS_DRV R572 3.9
MBR0540

2
ILLUM_LSIDE_DRIVE
VRST TP164
D591 B0530WS-7 C309 D52 DNI DNI

2
32 2
VRST_REF 1 ILLUM_A_PGND DNI
TP165 TP166 DRST_VRST_REF 1200pF B240A-13-F C307 C313 C314 C315
C311 Q16

1
VBIAS VRST 100 38 ILLUM_A_COMP1
DMD_VRESET ILLUM_A_COMP1
C312 39 ILLUM_A_COMP2 15pF 1 8 22uF 22uF 22uF 22uF
VBIAS 99 ILLUM_A_COMP2 S1 D1
1uF TP167 DMD_VBIAS R578
35 LED_ANODE_B VIN 2 7
VOFS 98 ILLUM_B_FB TP171 3.9 S2 D2
C317 DMD_VOFFSET 34
VOFS ILLUM_B_VIN 3 6
0.47uF TP173 33 ILLUM_B_BOOST R580 10 S3 D3
ILLUM_B_BOOST
DPP_P1P8V C323 LLUM_LS_DRV_Q 4 5
C319 G D4
10uF
1uF
CSD17501Q5A
R581 0 DNI CW_PWM CW_CLK 43 36 ILLUM_B_SW R582 10 C321
CLK_OUT ILLUM_B_SW
C320 C322 CW_PWM 44 ILLUM_5P5V 4300pF
CW_PWM_OUT 37
CW_CLK 1uF 0.1uF ILLUM_B_PGND
45 40 ILLUM_B_COMP1 Q17
SPI_VIN ILLUM_B_COMP1 TP175 LED_ANODE 10
41 ILLUM_B_COMP2 1 8 LED_RED_CATHODE 9 J40
46 ILLUM_B_COMP2 TP176 S1 D1 8
6 SPI1_CLK SPI_CLK 7
30.1/1% R585 0 78048-1043 Molex

1
R584 SPI_MISO 47 19 CH1_GATE_CTRL 2 7 6
6 SPI1_DIN SPI_MISO CH1_GATE_CTRL S2 D2 LED_RED_CATHODE 5
48 20 CH2_GATE_CTRL R586 0 TP177 D53 4
6 SPI1_CSZ0 SPI_CS_Z CH2_GATE_CTRL
R587 0 3
S3 D3
6
ESDA18-1K 3 Red LED Connector
49 21 CH3_GATE_CTRL 2
6 SPI1_DOUT SPI_MOSI CH3_GATE_CTRL 1
DPP_P1P8V

2
R617 10k DNI CH1_GATE_RED 4 5
9 G D4
PROJ_ON 56 CH1_SWITCH_1
6,11 PROJ_ON PROJ_ON 10
PAD_RESETZ 57 CH1_SWITCH_2 CSD17501Q5A
5 PAD_RESETZ RESET_Z
PARKZ 58 17
Q18
5 PARKZ INTZ CH2_SWITCH_1
59 18
DGND CH2_SWITCH_2 1 8 LED_GRN_CATHODE LED_GRN_CATHODE 10
LED_SEL_0 60 S1 D1 9 J41
6 LED_SEL_0 CH_SEL_0 24 8

1
LED_SEL_1 61 CH3_SWITCH_1 2 7 7
6 LED_SEL_1 CH_SEL_1 25 S2 D2 6 78048-1043 Molex
CH3_SWITCH_2 D54 LED_ANODE 5
TP178 3 6 4
R591 10k/1% R592 10k/1% CMPR_REF 82 11 S3 D3 ESDA18-1K 3
6 CMP_PWM ACMPR_REF RLIM1_1 2 Green LED Connector

2
R611 300 PWM_IN_CAP CMP_OUT 81 16 CH2_GATE_GRN 4 5 1
6 CMP_OUT ACMPR_OUT RLIM1_2 G D4
6 GPIO10 SENS_LABB 80
ACMPR_IN_LABB 22
R610 0 LABB_SAMPLE 55 RLIM2_1 CSD17501Q5A
C326 6 GPIO_7 ACMPR_LABB_SAMPLE 23
SENS_FOCUS 77 RLIM2_2 EXT_RLIM
0.1uF DNI TP180 ACMPR_IN_1
SENS2 78 15 Q19
ACMPR_IN_2 RLIM_K_1
SENS3 79 13
R595 1 8 LED_BLU_CATHODE LED_BLU_CATHODE 10
J42
ACMPR_IN_3 RLIM_K_2 S1 D1 9
8
0.009

1
14 2 7 7
RLIM_BOT_K_1 S2 D2 6 78048-1043 Molex
42 12 D55 LED_ANODE 5
THERMAL_PAD RLIM_BOT_K_2 TP181 3 6 4
S3 D3 ESDA18-1K 3
2
Blue LED Connector

2
CH3_GATE_BLU 4 5 1
G D4
Connect the RLIM_K pins to SENSE
Resistor(R595) with their own traces. CSD17501Q5A
Also connect the RLIM_BOT_K pins
to the bottom of the SENSE Resistor U35-2
with their own traces. VIN C328 1uF VIN
DLPA3005
TP169 TP170
C327 1uF 85 8
VIN_SYSPWR ILLUM_VIN
R574 30k/1% THERMISTOR_P R571 0 SENS2
(DLPC3439_GPIO_11) 6 THERM_PWR 86 7 ILLUM_5P5V C329 10uF
AGND ILLUM_5P5V
TP183
C310
TP184 C332 1uF VIN
0.01uF C330 2.2uF V2P5 91
SUP_2P5V 83
4

PWR_VIN
1
2 R576 C331 4.7uF V5P0 92 84 PWR_5P5V C333 10uF
SUP_5P0V PWR_5P5V
J45
t 100k VIN
3

053261-0271 Molex TP182 TP185

96 67
1

PWR1_VIN PWR5_VIN
Thermistor
CONN C334 0.1uF PWR1_B 97 69
PWR1_BOOST PWR5_BOOST
ED20 C336 C337
L16 3.3uH PWR1_SW 95 68
PESD5V0U1BL 22uF 22uF PWR1_SWITCH PWR5_SWITCH
2

DPP_P1P1V 93 70
PWR1_PGND PWR5_PGND
DLPC3439 1.1V Core R596 0 PWR1_OUT 94 71
TP187 PWR1_FB PWR5_FB
VIN R598 10 C342 470pF
C340 C341
75 64
22uF 22uF PWR2_VIN PWR6_VIN
TP209 TP172
C346 0.1uF PWR2_B 76 65
PWR2_BOOST PWR6_BOOST
R579 0 SENS3 C348 C349
(DLPC3439_GPIO_9) 6 LS_PWR L18 3.3uH PWR2_SW 74 63
22uF 22uF PWR2_SWITCH PWR6_SWITCH
C318
DNI DPP_P1P8V 73 62
0.33uF PWR2_PGND PWR6_PGND
R600 0 PWR2_OUT 72 66
DLPC3439 1.8V & DMD VDD TP189 PWR2_FB PWR6_FB
VIN_LDO R602 10 C352 470pF
C353 C354
TP210 TP174 88 52
22uF 22uF PWR3_VIN PWR7_VIN
R583 0 SENS_LABB C358 1uF PWR3_OUT 87 50
(DLPC3439_GPIO_12) 6 LS2_PWR PWR3_OUT PWR7_BOOST
DPP_P2P5V
C360 1uF 53
C325 R604 0 PWR7_SWITCH
DNI TP191 90
0.33uF P5V PWR4_VIN 54
VIN_LDO C363 1uF PWR7_PGND
VIN_LDO 89
R606 0 PWR4_OUT 51
PWR7_FB
VIN
P3P3V
R608 0
R609 0 DNI PWR4_OUT
DNI P3P3V_INTF C367 1uF
DLPC3439 VINTF R650 0
TP211

Figure 8: DLPDLCR4710EVM-G2 Schematic

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8.2 Bill of Materials

To download the Bill of Materials for each board, see the design files at http://www.ti.com/tool/TIDA-01226

Table 1: Bill of Material

Manufacturer PCB
Item Qty Reference Value Part Description Manufacturer Alternate Part Note
Part Number Footprint

C6,C49,C75,C190,C191,C225,C226,C2
27,C229,C233,C234,C236,C237,C238,
C248,C250,C286,C287,C288,C308,C3
22,C326,C334,C346,C368,C369,C378, 0.10µF ±10% 16V X7R Ceramic CC0402KRX7R
1 47 0.1uF Yageo 311-1338-1-ND 0402
C379,C380,C381,C382,C383,C387,C3 Capacitor 7BB104
88,C389,C390,C392,C393,C394,C395,
C396,C397,C398,C420,C423,C424,C4
27

C79,C89,C90,C91,C92,C93,C94,C95,C
96,C97,C98,C99,C100,C101,C103,C10
4,C105,C106,C107,C108,C109,C110,C
111,C112,C113,C114,C115,C116,C117
,C118,C119,C120,C121,C122,C123,C1
24,C125,C126,C127,C128,C130,C131, 0.10µF ±10% 6.3V X5R Ceramic CC0201KRX5R
2 75 0.1uF Yageo 311-1408-1-ND 0201
C132,C146,C175,C176,C177,C178,C1 Capacitor 5BB104
83,C186,C187,C188,C189,C194,C195,
C196,C197,C198,C199,C202,C209,C2
11,C213,C215,C219,C220,C221,C222,
C223,C224,C228,C276,C277,C278,C2
79
10000pF ±10% 25V X7R Ceramic CC0402KRX7R
3 3 C102,C129,C310 0.01uF Yageo 311-1337-1-ND 0402
Capacitor 8BB103
CC0805KKX5R
4 3 C179,C323,C412 10uF 10µF ±10% 25V X5R Ceramic Capacitor Yageo 311-1869-1-ND 0805
8BB106
C180,C181,C184,C193,C200,C206,C2
CC0603MRX5R
5 15 07,C208,C210,C212,C214,C218,C249, 10uF 10µF ±20% 6.3V X5R Ceramic Capacitor Yageo 311-1448-1-ND 0603
5BB106
C273,C285
C182,C185,C192,C201,C203,C235,C2
CC0402KRX5R
6 16 45,C247,C274,C289,C320,C360,C367, 1uF 1µF ±10% 10V X5R Ceramic Capacitor Yageo 311-1439-1-ND 0402
6BB105
C384,C386,C391
18pF ±5% 50V C0G, NP0 Ceramic CC0402JRNPO
7 2 C216,C217 18pF Yageo 311-1415-1-ND 0402
Capacitor 9BN180
8 9 C230,C231,C232,C239,C240,C241,C2 0.1uF 0.10µF ±10% 25V X5R Ceramic Yageo CC0402KRX5R 311-1697-1-ND 0402

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70,C417,C419 Capacitor 8BB104

0.10µF ±10% 50V X7R Ceramic CC0603KRX7R
9 2 C262,C410 0.1uF Yageo 311-1344-1-ND 0603
Capacitor 9BB104
Multilayer Ceramic Capacitors MLCC - CC1206KKX7R GRM31CR61H106
10 3 C263,C305,C324 10uF Yageo 1206
SMD/SMT 1206 10uF 50volt X5R +/-10% 9BB106 KA12L
140-
Aluminum Electrolytic Capacitors - SMD VZH221M1HTR-
11 1 C264 220uF Lelon VZH221M1HTR10 EC-10
50 Volts 220uF 20% 10x10.3 1010
10
603- (6 (c)); (7(c)
Multilayer Ceramic Capacitors MLCC - CC0402JRNPO
12 1 C266 120pF Yageo CC402JRNPO9B 0402 I). Date:
SMD/SMT 120pF 50V NPO 5% 9BN121
N121 03/31/16
GRM32ER61E2
13 5 C268,C271,C269,C416,C418 22uF 22µF ±10% 25V X5R Ceramic Capacitor Murata 490-3889-1-ND 1210
26KE15L
CC0603MRX5R
14 4 C272,C300,C329,C333 10uF 10µF ±20% 10V X5R Ceramic Capacitor Yageo 311-1817-1-ND 0603
6BB106
0.22µF ±10% 25V X7R Ceramic CC0603KRX7R
15 1 C283 0.22uF Yageo 311-1803-1-ND 0603
Capacitor 8BB224
C301,C302,C303,C304,C336,C337,C3 C3216X5R1V22
16 10 22uF 22µF ±20% 35V X5R Ceramic Capacitor TDK 445-8045-1-ND 1206
48,C349,C307,C313 6M160AC
CC0603KRX5R
17 6 C306,C327,C328,C332,C312,C319 1uF 1µF ±10% 50V X5R Ceramic Capacitor Yageo 311-1787-1-ND 0603
9BB105
603- (6 (c)); (7(c)
1200pF ±5% 50V C0G, NP0 Ceramic CC1206JRNPO
18 1 C309 1200pF Yageo CC126JRNPO9B 1206 I). Date:
Capacitor 9BN122
N122 03/31/16
15pF ±5% 50V C0G, NP0 Ceramic CC0402JRNPO
19 1 C311 15pF Yageo 311-1017-1-ND 0402
Capacitor 9BN150
0.47µF ±10% 50V X5R Ceramic CC0603KRX7R UMK107ABJ474K
20 1 C317 0.47uF Yageo 0603
Capacitor 9BB474 A-T
GRM1887U1H4
21 1 C321 4300pF 4300pF ±5% 50V U2J Ceramic Capacitor Murata 490-6397-1-ND 0603
32JA01
2.2µF ±20% 6.3V X5R Ceramic CC0402MRX5R
22 1 C330 2.2uF Yageo 311-1442-1-ND 0402
Capacitor 5BB225
4.7µF ±20% 6.3V X5R Ceramic CC0402MRX5R
23 1 C331 4.7uF Yageo 311-1730-1-ND 0402
Capacitor 5BB475
CC0603MRX5R
24 4 C340,C341,C353,C354 22uF 22µF ±20% 6.3V X5R Ceramic Capacitor Yageo 311-1815-1-ND 0603
5BB226
470pF ±10% 50V X7R Ceramic CC0603KRX7R
25 2 C342,C352 470pF Yageo 311-1078-1-ND 0603
Capacitor 9BB471
CC0402KRX5R
26 2 C358,C363 1uF 1µF ±10% 25V X5R Ceramic Capacitor Yageo 311-1698-1-ND 0402
8BB105
CC0603KRX7R
27 1 C370 1000pF 1µF ±10% 25V X5R Ceramic Capacitor Yageo 311-1080-1-ND 0603
9BB102
28 1 C411 0.012uF 0.012µF ±10% 50V X7R Ceramic Yageo CC0603KRX7R 311-1807-1-ND 0603

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Capacitor 9BB123
CC0805MKX5R
29 1 C413 22uF 22µF ±20% 10V X5R Ceramic Capacitor Yageo 311-1900-1-ND 0805
6BB226
CC0805KKX7R
30 2 C414,C415 4.7uF 4.7µF ±10% 25V X7R Ceramic Capacitor Yageo 311-1885-1-ND 0805
8BB475
3300pF ±10% 50V X7R Ceramic CC0402KRX7R
31 1 C425 3300pF Yageo 311-1034-1-ND 0402
Capacitor 9BB332
ED1,ED2,ED3,ED4,ED5,ED6,ED7,ED8,
ED9,ED10,ED11,ED12,ED13,ED14,ED
PESD5
15,ED16,ED19,D25,D26,ED21,ED22,E PESD5V0U1BL.
32 36 V0U1B TVS DIODE 5VWM SOD882 NXP 568-4803-1-ND SOD882
D17,ED18,ED20,ED23,ED24,ED25,ED 315
L.315
26,ED27,ED36,ED37,ED38,ED39,ED40
,ED41,ED42
BAT54 DIODE ARRAY SCHOTTKY 30V
33 1 D32 Diodes Inc. BAT54CW 568-1613-1-ND SOT323
CW SOT323
16-
213SY 16- 16-
D33,D34,D36,D44,D45,D46,D56,D57,D
34 11 GC/S53 LED YELLOW-GRN CLEAR 0402 SMD Everlight 213SYGC/S530- 213SYGC/S530- 0402
66,D67,D43
0- E2/TR8 E3/TR8-ND
E2/TR8
MBR05 DIODE SCHOTTKY 40V 500MA MBR0540T1GOS
35 1 D51 ON Semi MBR0540 SOD123
40 SOD123 CT-ND
ESDA1 STMicroelectronic
36 3 D53,D54,D55 TVS DIODE 15VWM 34VC SOD523 ESDA18-1K 497-10767-1-ND SOD523
8-1K s
B0530 DIODE SCHOTTKY 30V 500MA B0530WS-FDICT-
37 2 D58,D59 Diodes Inc. B0530WS-7 SOD323
WS-7 SOD323 ND
DIODE SCHOTTKY 40V 500MA B0540W-FDICT-
38 2 D68,D69 SS0540 PANJIT SS0540 SOD123
SOD123 ND
GMLB-
FB1,FB2,FB3,FB5,FB6,FB8,FB9,FB10,
160808- GMLB-160808-
39 19 FB11,FB12,FB30,FB31,FB32,FB33,L5, FERRITE BEAD 70 OHM 0603 1LN MAG.LAYERS 490-5253-1-ND 0603
0070S- 0070S-N1
L6,L7,L8,L9
N1
GMLB-
100505- GMLB-100505-
40 6 FB20,FB22,FB23,FB24,FB25,FB26 FERRITE BEAD 120 OHM 0402 1LN MAG.LAYERS 490-4004-1-ND 0402
0120P- 0120P-N8
N8

TU3007 4 Positions Header, Shrouded Connector

41 1 J11 WNR- 0.098" (2.50mm) Through Hole, Right TYU TU3007WNR-04 455-1627-ND
04 Angle Tin

47151- HDMI Receptacle Connector 19 Position

42 1 J18 Molex 47151-1101
1101 Surface Mount, Right Angle, Horizontal

TIDUC88 - August 2016 TIDA-01226 14

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TU1501
6 Positions Header, Shrouded Connector
43 1 J21 WNV- TYU TU1501WNV-06 455-1661-ND
0.059" (1.50mm) Through Hole Tin
06
104060-
44 1 J22 CONN FFC FPC 80POS 0.50MM R/A Molex 104060-8017
8017

TU1501 3 Positions Header, Shrouded Connector

TU1501WNR-
45 1 J23 WNR- 0.059" (1.50mm) Surface Mount, Right TYU 455-1694-2-ND
03S
03S Angle Tin

TU1501
3 Positions Header, Shrouded Connector
46 4 J24,J43,J32,J33 WNV- TYU TU1501WNV-03 455-1658-ND
0.059" (1.50mm) Through Hole Tin
03

TU1252 8 Positions Header, Shrouded Connector

TU1252WNR-
47 1 J26 WNR- 0.049" (1.25mm) Surface Mount, Right TYU WM7626TR-ND
08S
08S Angle Tin

IDJ-
48 1 J28 CON PWR JCK 2.5 X 6.0MM W/SHLD HCH IDJ-D43B2 CP-047BH-ND
D43B2
14 Positions Header, Shrouded
CH8714
49 1 J34 Connector 0.100" (2.54mm) Through CviLux CH87142V200 WM6547-ND
2V200
Hole Gold

TU5005 2 Positions Header, Unshrouded,

TU5005WNV-
50 1 J35 WNV- Breakaway Connector 0.100" (2.54mm) TYU WM8072-ND
1x02
1x02 Through Hole Tin

78048- Headers & Wire Housings PCB

51 3 J40,J41,J42 Molex 78048-1043
1043 HEADERS

TU1252 2 Positions Header, Shrouded Connector

TU1252WNR-
52 1 J45 WNR- 0.049" (1.25mm) Surface Mount, Right TYU WM7620TR-ND
02S
02S Angle Tin

MU- USB - mini B USB 2.0 OTG Receptacle

53 1 J47 05F4- Connector 5 Position Surface Mount, OBJECTIVE MU-05F4-24 WM5461CT-ND
24 Right Angle, Horizontal

TIDUC88 - August 2016 TIDA-01226 15

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TU2001
6 Positions Header, Shrouded Connector
54 1 J48 WNV- TYU TU2001WNV-06 455-1708-ND
0.079" (2.00mm) Through Hole Tin
06
MMD-10DZ- SRP1038A-
55 1 L10 15uH FIXED IND 15UH 6.25A 45 MOHM SMD MAG.LAYERS
150M-M1 150MCT-ND
Fixed Inductors XFL3012 Low DCR Ind 994-XFL3012-
56 1 L11 2.2uH MAG.LAYERS MLPS-3015-2R2
2.2 uH 20 % 1.9 A 222MEC
MMD-12EZ-
57 1 L14 1.5uH FIXED IND 1.5UH 23A 3.16 MOHM MAG.LAYERS 283-4548-1-ND
1R5M-V1
MMD-04BZ- SRP4020TA-
58 1 L15 10uH FIXED IND 10UH 1.8A 243 MOHM SMD MAG.LAYERS
100M-S1 100MTR-ND
MMD-06CZ-
59 2 L16,L18 3.3uH FIXED IND 3.3UH 6A 30 MOHM SMD MAG.LAYERS 541-1009-1-ND
3R3M-V1
CMM21
CMM21T-900M-
60 1 L21 T- CMC 90 OHM 300MA 2 LN SMD Chilisin 445-5193-1-ND
N
900M-N

61 2 Q4,Q7 2N7002 MOSFET N-CH 60V 0.36A SOT-23 NXP 568-5818-1-ND SOT23
2N7002P,215
P,215
DMN26 DMN26D0UT-
62 1 Q8 MOSFET N-CH 20V 230MA SOT523 Diodes Inc. DMN26D0UT SOT523
D0UT 7DICT-ND
CSD17
63 1 Q15 MOSFET N-CH 30V 60A 8SON Texas Instruments CSD17309Q3 296-27250-1-ND 8SON
309Q3
CSD17
64 4 Q16,Q17,Q18,Q19 MOSFET N-CH 30V 100A 8SON Texas Instruments CSD17501Q5A 296-28437-1-ND 8SON
501Q5A
65 2 Q20,Q21 BCP68 TRANS NPN 20V 1A SOT223 NXP BCP68 568-6107-1-ND SOT223
MMBT2
MMBT2222ALT MMBT2222ALT1G
66 2 Q22,Q23 222ALT TRANS NPN 40V 0.6A SOT23 ON Semi SOT23
1G OSCT-ND
1G
YC124-
YC124-JR-
67 6 RP1,RP2,RP3,RP4,RP5,RP6 JR- RES ARRAY 4 RES 33 OHM 0804 Yageo YC124J-33CT-ND 0402*4
0733R
0733R
R1,R2,R6,R139,R149,R162,R172,R173
,R175,R176,R179,R209,R210,R349,R3
50,R351,R365,R367,R432,R433,R447,
RC0402JR-
68 45 R612,R651,R652,R661,R662,R665,R6 10K RES SMD 10K OHM 5% 1/16W 0402 Yageo 11-10KJRCT-ND 0402
0710K
66,R667,R668,R670,R671,R677,R679,
R680,R685,R693,R699,R704,R706,R7
08,R769,R770,R795,R729

TIDUC88 - August 2016 TIDA-01226 16

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 www.ti.com

R9,R109,R116,R120,R125,R140,R141,
R171,R208,R211,R234,R235,R237,R2
39,R241,R242,R243,R356,R358,R359,
R366,R368,R376,R377,R379,R387,R3
88,R389,R394,R395,R396,R397,R398,
R399,R400,R402,R403,R404,R406,R4
08,R410,R411,R412,R413,R414,R415,
R416,R417,R419,R425,R427,R430,R4
31,R435,R451,R452,R477,R478,R487,
RES SMD 0.0OHM JUMPER 1/16W RC0402JR-
69 119 R488,R504,R505,R521,R525,R533,R5 0 Yageo 311-0.0JRCT-ND 0402
0402 070R
34,R537,R538,R539,R540,R541,R542,
R571,R579,R583,R604,R614,R615,R6
23,R629,R630,R631,R632,R636,R637,
R638,R640,R641,R643,R644,R646,R6
50,R657,R659,R663,R664,R672,R673,
R674,R676,R678,R682,R683,R684,R6
87,R688,R696,R702,R774,R775,R778,
R779,R782,R798,R654,R655,R675,R6
19,R621
R12,R51,R52,R67,R68,R69,R71,R72,R
RC0402FR-
70 21 73,R74,R75,R76,R121,R122,R123,R16 30.1 RES SMD 30.1 OHM 1% 1/16W 0402 Yageo YAG3111CT-ND 0402
0730R1
4,R182,R184,R186,R344,R584
R35,R36,R37,R60,R63,R64,R65,R117,
R118,R119,R142,R143,R169,R183,R1 RC0402JR- 311-100KJRCT-
71 22 100K RES SMD 100K OHM 5% 1/16W 0402 Yageo 0402
85,R189,R345,R373,R393,R401,R436, 07100K ND
R656
RC0402JR-
72 2 R114,R115 43 RES SMD 43 OHM 5% 1/16W 0402 Yageo 311-43JRCT-ND 0402
0743R
RC0402FR- 311-7.50KLRCT-
73 6 R124,R126,R127,R136,R206,R207 7.5K RES SMD 7.5K OHM 1% 1/16W 0402 Yageo 0402
077K5 ND
RC0402FR- 311-300KLRCT-
74 1 R348 300K RES SMD 300K OHM 1% 1/16W 0402 Yageo 0402
07300K ND
RC0402JR-
75 3 R352,R524,R474 47K RES SMD 47K OHM 5% 1/16W 0402 Yageo 311-47KJRCT-ND 0402
0747K
RC0402JR-
76 1 R355 2M RES SMD 2M OHM 5% 1/16W 0402 Yageo YAG3295CT-ND 0402
072M
RC0402FR- 311-22.0KLRCT-
77 1 R357 22K RES SMD 22K OHM 1% 1/16W 0402 Yageo 0402
0722K ND
RC0402JR-
78 6 R360,R361,R363,R364,R362,R622 33 RES SMD 33 OHM 5% 1/16W 0402 Yageo 311-33JRCT-ND 0402
0733R
RC0402FR-
79 1 R375 4.75K RES SMD 4.75K OHM 1% 1/16W 0402 Yageo 311-4.75KLCT-ND 0402
074K75
RC0402FR- 311-1.00MLRCT-
80 2 R378,R785 1M RES SMD 1M OHM 1% 1/16W 0402 Yageo 0402
071M ND
RC0402FR- 311-1.50KLRCT-
81 1 R380 1.5K RES SMD 1.5K OHM 1% 1/16W 0402 Yageo 0402
071K5 ND

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RC0402FR-
82 1 R381 3K RES SMD 3K OHM 1% 1/16W 0402 Yageo 311-3KLRCT-ND 0402
073K
RC0402JR-
83 6 R383,R385,R613,R616,R689,R691 180 RES SMD 180 OHM 5% 1/16W 0402 Yageo 311-180JRCT-ND 0402
07180R
RC0402JR-
84 5 R437,R479,R526,R527,R528 390 RES SMD 390 OHM 5% 1/16W 0402 Yageo 311-390JRCT-ND 0402
07390R
RC0402FR- 311-470KLRCT-
85 1 R443 470K RES SMD 470K OHM 1% 1/16W 0402 Yageo 0402
07470K ND
RC1206JR-
86 5 R472,R575,R596,R600,R606 0 RES SMD 0.0 OHM JUMPER 1/4W 1206 Yageo 311-0.0ERCT-ND 1206
070R
RC0402FR-
87 2 R480,R471 215K RES SMD 215K OHM 1% 1/16W 0402 Yageo YAG3055CT-ND 0402
07215K
RC0402FR- 311-47.5KLRCT-
88 1 R482 47.5K RES SMD 47.5K OHM 1% 1/16W 0402 Yageo 0402
0747K5 ND
RC0402FR- 311-2.20KLRCT-
89 4 R529,R530,R635,R749 2.2K RES SMD 2.2K OHM 1% 1/16W 0402 Yageo 0402
072K2 ND
RC0603JR-
90 2 R570,R572 3.9 RES SMD 3.9 OHM 5% 1/10W 0603 Yageo 311-3.9GRCT-ND 0603
073R9
RC0402FR- 311-30.0KLRCT-
91 1 R574 30K RES SMD 30K OHM 1% 1/16W 0402 Yageo 0402
0730K ND
TSM0A104F39H
92 1 R576 100K THERMISTOR NTC 100K OHM 1% 0402 THINKING 490-4803-2-ND 0402
1RZ
RC1210JR- 603-RC1210JR-
93 1 R578 3.9 Thick Film Resistors - SMD 3.9 OHM 5% Yageo 1210
073R9 073R9L
RC0402FR-
94 2 R580,R582 10 RES SMD 10 OHM 1% 1/16W 0402 Yageo 311-10.0LRCT-ND 0402
0710R
RES SMD 0.0OHM JUMPER 1/10W RC0603FR-
95 3 R585,R586,R587 0 Yageo 311-0.0HRCT-ND 0603
0603 070R
RC0402FR- 311-10.0KLRCT-
96 2 R591,R592 10K RES SMD 10K OHM 1% 1/16W 0402 Yageo 0402
0710K ND
71- (7(c) I).
Current Sense Resistors - SMD 3watts LR2512-
97 1 R595 0.009 Ralec WSLP25129L000 2512 Date:
.009ohms 1% 23R009F4
FEA 05/01/16
RC0603FR- 311-10.0HRCT-
98 2 R598,R602 10 RES SMD 10 OHM 1% 1/10W 0603 Yageo 0603
0710R ND
RC0402JR-
99 1 R611 300 RES SMD 300 OHM 5% 1/16W 0402 Yageo 311-300JRCT-ND 0402
07300R
R743,R761,R762,R763,R765,R767,R7 RC0402JR-
100 8 3.3K RES SMD 3.3K OHM 5% 1/16W 0402 Yageo 311-3.3KJRCT-ND 0402
68,R797 073K3
RC0603FR-
101 1 R744 442 RES SMD 442 OHM 1% 1/10W 0603 Yageo 311-442HRCT-ND 0603
07442R
RC0603FR- 311-140KHRCT-
102 1 R745 140K RES SMD 140K OHM 1% 1/10W 0603 Yageo 0603
07140K ND
RC0402FR-
103 1 R747 30.9K RES SMD 30.9K OHM 1% 1/16W 0402 Yageo YAG3110CT-ND 0402
0730K9

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RC0402FR-
104 1 R793 75K RES SMD 75K OHM 1% 1/16W 0402 Yageo 311-75KLRCT-ND 0402
0775K
105 1 SW21 STS-D5 SWITCH TACTILE SPST-NO 0.05A 12V HCH STS-D5 EG4375CT-ND
DS_13
106 1 SW28 SWITCH SLIDE SPDT 5A 120V Dawning DS_13P_S044 EG2478-ND
P_S044
CDCLV
CDCLVC1102P
107 1 U11 C1102P IC CLK BUFFER 1:2 250MHZ 8TSSOP Texas Instruments 296-27610-1-ND 8-TSSOP
W
W
SN74A
U15,U25,U26,U36,U37,U50,U51,U52,U SN74AUP1G07
108 12 UP1G0 IC BUFF/DVR NON-INV 3.6V SC705 Texas Instruments 296-18256-1-ND SC70-5
53,U54,U55,U56 DCKR
7DCKR
W25Q6
W25Q64FVSSI W25Q64FVSSIG-
109 2 U16,U18 4FVSSI IC FLASH 64MBIT 104MHZ 8SOIC Winbond 8-SOIC
G ND
G
LM1117
IMPX- LM1117IMPX- LM1117IMPX-
110 1 U20 IC REG LDO 3.3V 0.8A SOT223 Texas Instruments SOT-223
3.3/NO 3.3/NOPB 3.3/NOPBCT-ND
PB
24LC024T-
111 1 U21 24LC02 IC EEPROM 2KBIT 400KHZ 8SOIC Microchip 24LC02 8-SOIC
I/SNCT-ND
TPS206
112 1 U22 IC SWITCH PWR DIST SNGL SOT23-5 Texas Instruments TPS2061DBV 296-23968-1-ND SOT23-5
1DBV
IT6801 Contact Business
113 1 U23 HDMI Receiver ITE Tech Inc IT6801FN 76-QFN
FN Unit
TLV700
114 1 U24 IC REG LDO 1.2V 0.2A 5SOT Texas Instruments TLV70012DDC 296-27218-1-ND SOT23-5
12DDC
SN74C
SN74CBTLV325
115 1 U27 BTLV32 IC LV DUAL FET MUX/DEMUX 16SSOP Texas Instruments 296-9135-1-ND 16-SOIC
7D
57D
TLV700
116 2 U29,U47 IC REG LDO 3.3V 0.2A 5SOT Texas Instruments TLV70033DDC 296-27937-1-ND SOT23-5
33DDC
TPS543
IC REG BCK ADJ 3A SYNC TPS54335ADD TPS54335ADDAR
117 1 U32 35ADD Texas Instruments 8-SOIC
8SOPWRPAD AR -ND
AR
TLV625
TLV62565DBVR-
118 1 U33 65DBV IC REG BCK ADJ 1.5A SYNC SOT23-5 Texas Instruments TLV62565DBVR SOT23-5
ND
R
MSP43
MSP430F5514I
119 1 U34 0F5514I IC MCU 16BIT 64KB FLASH 64VQFN Texas Instruments 296-31693-1-ND 64-QFN
RGC
RGC
DLPA3
DLPA3005DPF
120 1 U35 005DPF IC PMIC/LED DRIVER DLP 100HTQFP Texas Instruments 296-43149-1-ND 100-HTQFP
D
D
DLPC3
121 2 U39,U40 IC CTRLR DGRL DPP3439 176DLP Texas Instruments DLPC3439 296-42180-5-ND 201-VFBGA
439

TIDUC88 - August 2016 TIDA-01226 19

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TXS010
122 1 U44 IC VOLT-LEVEL TRANSLATOR US8 Texas Instruments TXS0102DCU 296-21931-1-ND 8-VSSOP
2DCU
SN74A
SN74AVC4T774
123 2 U45,U46 VC4T77 IC BUS TRANSCVR 4BIT DL 16TSSOP Texas Instruments 296-24739-1-ND 16-TSSOP
PWR
4PWR
CY7C6
CY7C65215- CY7C65215-
124 1 U48 5215- IC USB TO SERIAL BRIDGE 32QFN Cypress 32-QFN
32LTXI 32LTXI-ND
32LTXI
SN74L
SN74LVC1G06
125 1 U49 VC1G0 IC INVERTER SINGLE 1INPUT SC705 Texas Instruments 296-8484-1-ND SC70-5
DCK
6DCK
LM2940 LM2940IMP-
126 1 U62 IC REG LDO 5V 1A SOT223 Texas Instruments LAM2940IMP-5 SOT-223
IMP-5 5.0/NOPBCT-ND
SN74L
SN74LVC1G08
127 1 U65 VC1G0 IC GATE AND 1CH 2-INP SC-70-5 Texas Instruments 296-11602-1-ND SC70-5
DCK
8DCK
SO3225-
128 1 X3 24MHz OSC XO 24.000MHZ CMOS SMD YOKE 024000-F1A- 535-13158-1-ND 3.2*2.5mm
BBA-YA
S5032B-
129 1 Y1 27MHz 27MHz ±30ppm Crystal 18pF 50 Ohm YOKE 027000-FA-16- 887-1093-1-ND 5*3.2mm
30-YA
C11,C12,C13,C14,C204,C205,C246,C2 0.10µF ±10% 16V X7R Ceramic CC0402KRX7R
130 0 0.1uF Yageo 311-1338-1-ND 0402
75,C385 Capacitor 7BB104
0.33µF ±10% 6.3V X5R Ceramic CC0402KRX5R
131 0 C318,C325 0.33uF Yageo 311-1683-1-ND 0402
Capacitor 5BB334
0.033µF ±10% 16V X5R Ceramic CC0402KRX5R
132 0 C426 33nF Yageo 311-1695-2-ND 0402
Capacitor 7BB333
B240A- DO-214AC,
133 0 D50,D52 DIODE SCHOTTKY 40V 2A SMA Diodes Inc. B240A-13-F B240A-FDICT-ND
13-F SMA
GMLB-
160808- GMLB-160808-
134 0 FB4,FB7 FERRITE BEAD 70 OHM 0603 1LN MAG.LAYERS 490-5253-1-ND 0603
0070S- 0070S-N1
N1
GMLB-
100505- GMLB-100505-
135 0 FB21 FERRITE BEAD 120 OHM 0402 1LN MAG.LAYERS 490-4004-1-ND 0402
0120P- 0120P-N8
N8
TU5005
TU5005WNV-
136 0 J20 WNV- 2 Positions Header, Unshrouded, TYU WM8072-ND
1x02
1x02
R3,R4,R107,R108,R128,R129,R382,R3
84,R653,R669,R681,R694,R698,R707, RC0402JR-
137 0 10K RES SMD 10K OHM 5% 1/16W 0402 Yageo 11-10KJRCT-ND 0402
R709,R790,R791,R792,R390,R374,R4 0710K
85,R486,R784,R617,R794,R353

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R131,R132,R145,R148,R150,R151,R1
77,R178,R197,R198,R220,R221,R240,
R354,R386,R392,R409,R418,R481,R4
89,R535,R536,R610,R618,R620,R624,
RES SMD 0.0OHM JUMPER 1/16W RC0402JR-
138 0 R639,R658,R660,R686,R690,R692,R7 0 Yageo 311-0.0JRCT-ND 0402
0402 070R
01,R740,R757,R758,R759,R760,R764,
R766,R771,R772,R780,R781,R799,R5
81,R609,R695,R697,R700,R703,R705,
R776,R777,R796
RC0201JR-
139 0 R369,R370,R371,R372 100 RES SMD 100 OHM 5% 1/20W 0201 Yageo 311-100NCT-ND 0201
07100R
RC0402JR- 311-100KJRCT-
140 0 R407,R483,R788,R789 100K RES SMD 100K OHM 5% 1/16W 0402 Yageo 0402
07100K ND
RC1206JR-
141 0 R608,R750 0 RES SMD 0.0 OHM JUMPER 1/4W 1206 Yageo 311-0.0ERCT-ND 1206
070R
RC0402JR-
142 0 R783 330 RES SMD 330 OHM 5% 1/16W 0402 Yageo 311-330JRCT-ND 0402
07330R
SN74A
SN74AUP1G07
143 0 U28,U63 UP1G0 IC BUFF/DVR NON-INV 3.6V SC705 Texas Instruments 296-18256-1-ND SC70-5
DCKR
7DCKR
311-7.50KLRCT-
144 0 R144 7.5K RES SMD 7.5K OHM 1% 1/16W 0402 Yageo RTT027501FTH Ralec
ND
2200pF ±10% 16V X7R Ceramic CC0201KRX7R
145 0 C284 2.2nF Yageo 311-1602-1-ND 0201
Capacitor 7BB222
C3216X5R1V22
146 0 C314,C315 22uF 22µF ±20% 35V X5R Ceramic Capacitor TDK 445-8045-1-ND 1206
6M160AC
TU5005
TU5005WNV-
147 0 J29,J30 WNV- 3 Positions Header, Unshrouded TYU WM8073-ND
1x03
1x03
TPS380
TPS3808G01D
148 0 U64 8G01D IC VOLT SUPERVISOR ADJ 6SON Texas Instruments 296-23656-1-ND 6-SON
RV
RV

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8.3 PCB Layout Recommendations

The layout for the TIDA-01226 has been created in PADS. The PCB has been designed to fit the form factor of
the optical engine.

8.3.1 Layout Prints

To download the Layout Prints for each board, see the design files at http://www.ti.com/tool/TIDA-01226
TOP SILKSCREEN

Figure 9: Silkscreen TOP

TOP SOLDER MASK

Figure 10: Solder Mask TOP

TOP LAYER

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 www.ti.com

Figure 11: Top Layer

GROUND PLANE LAYER 2

Figure 12: Layer 2 GND

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 www.ti.com

SIGNAL LAYER 3

Figure 13: Layer 3 Signal

SIGNAL LAYER 4

Figure 14: Layer 4 Signal

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PWR LAYER 5

Figure 15: PWR Layer 5

BOTTOM LAYER

Figure 16: Bottom Layer

BOTTOM SOLDER MASK

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 www.ti.com

Figure 17: Bottom Solder Mask

BOTTOM SILKSCREEN

Figure 18: Bottom Silkscreen

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Copyright © 2016, Texas Instruments Incorporated
 www.ti.com

MECHANICAL DIMENSIONS

Figure 19: Mechanical Dimensions

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 www.ti.com

8.4 PADS Project

The PADS project files for each board can be downloaded from http://www.ti.com/tool/TIDA-01226

Figure 20: Layout

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 www.ti.com

8.5 Layout Guidelines

The layout guidelines shown here are subsets of the guidelines included in the component datasheets. Please
also refer to the DLPC3439, DLP4710 and DLPA3005 datasheet for more information.

8.5.1 DLPC3439 Layout Guidelines

TI recommends 1-oz. copper planes in the PCB design to achieve needed thermal connectivity.

8.5.1.1 PCB layout Guidelines for Internal ASIC PLL Power

The following guidelines are recommended to achieve desired ASIC performance relative to the internal PLL.
Each DLPC3439 contains 2 internal PLLs which have dedicated analog supplies (VDD_PLLM , VSS_PLLM,
VDD_PLLD, VSS_PLLD). As a minimum, VDD_PLLx power and VSS_PLLx ground pins should be isolated using a
simple passive filter consisting of two series ferrites and two shunt capacitors (to widen the spectrum of noise
absorption). It’s recommended that one capacitor be a 0.1uf capacitor and the other be a 0.01-µF capacitor. All
four components should be placed as close to the ASIC as possible but it’s especially important to keep the
leads of the high frequency capacitors as short as possible. Note that both capacitors should be connected
across VDD_PLLM and VSS_PLLM / VDD_PLLD and VSS_PLLD respectfully on the ASIC side of the ferrites.
The characteristics for the ferrite beads should be as follows:
 DC resistance less than 0.40 Ω
 Impedance at 10 MHz equal to or greater than 180 Ω
 Impedance at 100 MHz equal to or greater than 600 Ω
The PCB layout is critical to PLL performance. It is vital that the quiet ground and power are treated like analog
signals. Therefore, VDD_PLLM and VDD_PLLD must be a single trace from each DLPC3439 to both capacitors
and then through the series ferrites to the power source. The power and ground traces should be as short as
possible, parallel to each other, and as close as possible to each other.

Figure 21: PLL Filter Layout

8.5.1.2 DLPC3439 Reference Clock

The DLPC3439 requires an external reference clock to feed its internal PLL. A crystal oscillator can supply this
reference. For flexibility, the DLPC3439 accepts either of two reference clock frequencies, but both must have a
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 www.ti.com

maximum frequency variation of ±200 ppm (including aging, temperature, and trim component variation). The
two DLPC3439 devices require a single dedicated oscillator where the oscillator output drives both DLPC3439
devices. The oscillator must drive the PLL_REFCLK_I pin on each DLPC3439 and the PLL_REFCLK_O pins should
be left unconnected. The external oscillator must be able to drive at least a 15-pF load. Routing length from the
oscillator to each DLPC3439 should be closely matched.

8.5.1.3 Number of Layer Changes

 Single-ended signals: Minimize the number of layer changes
 Differential signals: Individual differential pairs can be routed on different layers, but the signals of a
given pair should not change layers.

8.5.1.4 Terminations
 No external termination resistors are required on DMD_HS differential signals.
 The DMD_LS_CLK and DMD_LS_WDATA signal paths should include a 43-Ω series termination resistor
located as close as possible to the corresponding ASIC pins.
 The DMD_LS_RDATA signal path should include a 43-Ω series termination resistor located as close as
possible to the corresponding DMD pin.
 DMD_DEN_ARSTZ does not require a series resistor.
 Please refer to the DLPC3439 datasheet for length specifications.

8.5.1.5 Routing Vias and Stubs

 There should be no more than two vias on any DMD_HS_signal.
 Any and all vias on DMD_HS signals should be located as close to the ASIC as possible.
 There should be now more than two vias on the DMD_LS_CLK and DMD_LS_WDATA signals.
 Any and all vias on the DMD_LS_CLK and DMD_LS_WDATA signals should be located as close to the
ASIC as possible.
 Stubs should be avoided.

8.5.2 DLPA3005 Layout Guidelines

For switching power supplies, the layout is an important step in the design, especially when it concerns high
peak currents and high switching frequencies. If the layout is not carefully done, the regulator could show
stability issues and/or EMI problems. Therefore, it is recommended to use wide and short traces for high
current paths and for their return power ground paths. For the DMD HV regulator, the input capacitor, output
capacitor, and the inductor should be placed as close as possible to the IC. In order to minimize ground noise
coupling between different buck converters it is advised to separate their grounds and connect them together
at a central point under the part. For the DMD HV regulator, the recommended value for the capacitors is 1 µF
for VRST and VOFS, 470 nF for VBIAS. The inductor value is 10 µH.
The high currents of the buck converters concentrate around pins VIN, SWITCH and PGND (Figure 22). The
voltage at the pins VIN, PGND and FB are DC voltages while the pin SWITCH has a switching voltage between
VIN and PGND. When the FET betweenpins 52 – 53 is closed the red line indicates the current flow while the
blue line indicates the current flow when the FET between pins 53 – 54 is closed. These paths carry the highest
currents and must be kept as short as possible.
For the LDO supply to the DMD, it is recommended to use a 1 µF/16 V capacitor on the input and a 10 µF/6.3 V
capacitor on the output of the LDO assuming an input voltage of 12 V. For LDO bucks, it is recommended to use
a 1 µF/16 V capacitor on the input and a 1 µF/6.3 V capacitor on the output of the LDO.

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Figure 22: High AC Current Paths in a Buck Converter

The trace to the VIN pin carries high AC currents. Therefore the trace should have the lowest possible resistance
to prevent voltage drop across the trace. Additionally the decoupling capacitors should be placed as close to the
VIN pin as possible. The SWITCH pin is connected back and forth between the VIN or GND. This means a square
wave voltage is present on the SWITCH pin with amplitude of VIN, and containing high frequencies. This can
lead to EMI problems if not properly handled. To reduce EMI problems a snubber network (RSN7 & CSN7) is
placed at the SWITCH pin to prevent and/or suppress unwanted high frequency ringing at the moment of
switching. The PGND pin sinks high current and should also be connected to a star ground point such that it
does not interfere with other ground connections.
The FB pin is the sense connection for the regulated output voltage which is a DC voltage; no current is flowing
through this pin. The voltage on the FB pin is compared with the internal reference voltage in order to control
the loop. The FB connection should be made at the load such that I•R drop is not affecting the sensed voltage.

8.5.2.1 SPI Connections

The SPI interface consists of several digital lines and the SPI supply. If routing of the interface lines is not done
properly, communication errors can occur. The SPI lines should not be routed close to potential interfering
sources. Noise cntamination can be prevented by ensuring that the SPI ground line is routed together with the
digital lines as much as possible to the respective pins. The SPI interface should have a dedicated ground
connection to the DGND of the DLPA3005 (Figure 23). This prevents ground noise between SPI ground
references of DLPA3005 and DLPC due to the high current in the system.

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Figure 23: SPI Connections

Interfering sources should be kept away from the interface lines as much as possible. Especially high current
lines such as neighboring PWR_7 should be routed carefully. If PWR_7 is routed too close to for instance the
SPI_CLK it could lead to false clock pulses and thus communication errors.

8.5.2.2 RLIM Routing

RLIM is used to sense the LED current. To accurately measure the LED current, the RLIM _K_1,2 lines should be
connected close to the top-side of measurement resistor RLIM, while RLIM_BOT_K_1,2 should be connected
close to the bottom-side of RLIM. The switched LED current is running through RLIM. Therefore a low-ohmic
ground connection for RLIM is strongly advised.

8.5.2.3 LED Connection

The wiring from the external RGB switches to the LEDs carries large switching currents. Special attention needs
to be paid to these connections.
Two perspectives apply to the LED-to-RGB switches wiring:
1. The resistance of the wiring, Rseries
2. The inductance of the wiring, Lseries
The location of the parasitic series impedances are depicted in Figure 24.

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Figure 24: Parasitic Inductance (LSeries) and Resistance (RSeries) in Series with LED

Currents up to 16 A can run through the wires connecting the LEDs to the RGB switches. Even small resistances
in these connections can cause noticeable power dissipation. Assuming 16A of LED current, every 10 mΩ of
series resistance results in a parasitic power dissipation of 2.5 W. This might cause PCB heating, but more
important overall system efficiency is deteriorated.
Additionally the resistance of the wiring might impact the control dynamics of the LED current. It should be
noted that the routing resistance is part of the LED current control loop. The LED current is controlled by VLED.
For a small change in VLED (ΔVLED) the resulting LED current variation (ΔILED) is given by the total differential
resistance in that path, as:

where
rLED is the differential resistance of the LED
Ron_SW_P,Q,R the on resistance of the strobe decoder switch.

In this expression Lseries is ignored since realistic values are usually too low to cause any noticeable impact on
the power dynamics. All the comprising differential resistances are in the range of 12.5 mΩ to several 100’s mΩ.
Without paying special attention a series resistance of 100 mΩ can easily be obtained. It is advised to keep this
series resistance sufficiently low, i.e. <10 mΩ. The series inductance plays an important role when considering
the switched nature of the LED current. While cycling through R, G and B LEDs, the current through these
branches is turned-on and turned-off in short time duration. Specifically turning off is fast. A current of 16 A
goes to 0 A in a matter of 50 ns. This implies a voltage spike of about 1 V for every 5 nH of parasitic inductance.
It is recommended to minimize the series inductance of the LED wiring by:
 Short wires
 Thick wires / Multiple parallel wires
 Small enclosed area of the forward and return current path
If the inductance cannot be made sufficiently low, a Zener diode needs to be used to clamp the drain voltage of
the RGB switch such it does not surpass the absolute maximum rating. The clamping voltage need to be chosen
between the maximum expected VLED and the absolute maximum rating. Be sure to maintain sufficient margin
of the clamping voltage relative to the mentioned minimum and maximum voltage.

8.5.3 DLP4710 Layout Guidelines

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There are no specific layout guidelines for the DMD as the DMD is typically connected using a board to board
connector to and a flex cable. The flex cable provides the interface of data and ctrl signals between the
DLPC3439 controller and the DLP4710 DMD. Some layout guideline for the flex cable interface to the DMD are:
 Match lengths for the LS_WDATA and LS_CLK signals.
 Minimize vias, layer changes, and turns for the HS bus signals.
 Minimum of two 220-nF decoupling capacitor close to VBIAS.
 Minimum of two 220-nF decoupling capacitor close to VRST.
 Minimum of two 220-nF decoupling capacitor close to VOFS.
 Minimum of four 220-nF decoupling capacitor close to VDDI and VDD.

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8.6 Gerber files

To download the Gerber files for each board, see the design files at http://www.ti.com/tool/TIDA-01226

Figure 25: Gerber Layer 1

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 www.ti.com

8.7 Assembly Drawings

To download the Assembly Drawings for each board, see the design files at http://www.ti.com/tool/TIDA-01226

Figure 26: Assembly TOP

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 www.ti.com

9 Software Files
To download the software files for this reference design, please see the link at http://www.ti.com/tool/DLPDLCR4710EVM-
G2

10 References

1. Texas Instruments E2E Community, https://e2e.ti.com/support/dlp__mems_micro-electro-

mechanical_systems
2. Texas Instruments DLPC3439 datasheet http://www.ti.com/lit/ds/symlink/dlpc3439.pdf
3. Texas Instruments DLPA3005 datasheet http://www.ti.com/lit/ds/symlink/dlpa3005.pdf
4. Texas Instruments DLP4710 datasheet http://www.ti.com/lit/ds/symlink/dlp4710.pdf

TIDUC88 - August 2016 TIDA-01226 37

Copyright © 2016, Texas Instruments Incorporated
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