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    Fin

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    manasgupta496
    An aluminum heat sink with an array of 11 fins is attached to a silicon chip to dissipate heat. The fins are spaced 1.8 mm apart and have dimensions of 15 mm long and 0.182 mm thick. Given a chip temperature of 85°C, convection coefficient of 100 W/m^2-K, and thermal resistance of 2x10^-6 m^2-K/W between the chip and heat sink, the corresponding power of the chip is 31.8 W.

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    Fin

    Uploaded by

    manasgupta496
    72 views1 page
    An aluminum heat sink with an array of 11 fins is attached to a silicon chip to dissipate heat. The fins are spaced 1.8 mm apart and have dimensions of 15 mm long and 0.182 mm thick. Given a chip temperature of 85°C, convection coefficient of 100 W/m^2-K, and thermal resistance of 2x10^-6 m^2-K/W between the chip and heat sink, the corresponding power of the chip is 31.8 W.

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    financial arrays

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    An aluminum heat sink with an array of 11 fins is attached to a silicon chip to dissipate heat. The fins are spaced 1.8 mm apart and have dimensions of 15 mm long and 0.182 mm thick. Given a chip temperature of 85°C, convection coefficient of 100 W/m^2-K, and thermal resistance of 2x10^-6 m^2-K/W between the chip and heat sink, the corresponding power of the chip is 31.8 W.

    Copyright:

    © All Rights Reserved
    Download as PPTX, PDF, TXT or read online from Scribd
    Download as pptx, pdf, or txt
    72 views1 page

    Fin

    Uploaded by

    manasgupta496
    An aluminum heat sink with an array of 11 fins is attached to a silicon chip to dissipate heat. The fins are spaced 1.8 mm apart and have dimensions of 15 mm long and 0.182 mm thick. Given a chip temperature of 85°C, convection coefficient of 100 W/m^2-K, and thermal resistance of 2x10^-6 m^2-K/W between the chip and heat sink, the corresponding power of the chip is 31.8 W.

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    © All Rights Reserved
    Download as PPTX, PDF, TXT or read online from Scribd
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    Example: heat sink employing fin arrays

    (P3.144)
    An isothermal silicon chip of width W = 20 mm on a side is soldered to an aluminum heat
    sink (k = 180 W/m-K) of equivalent width. The heat sink has a base thickness of Lb =3 mm
    and an array of 11 rectangular fins, each of length Lf = 15 mm. Air flow at T∞ = 20 °C is
    maintained through channels formed by the fins and a cover plate, and for a convection
    coefficient of h = 100 W/m2-K, a minimum fin spacing of 1.8 mm is dictated by limitations
    ′′
    on the flow pressure drop. The solder joint has a thermal resistance of 𝑅𝑡,𝑐 = 2 x 10-6 m2-
    K/W.

    Consider limitations for which the array has N = 11 fins, in which case values of the fin
    thickness t =0.182 mm and pitch S=1.982 mm are obtained from the requirements that
    W=(N 1)S+t and S-t=1.8 mm. If the maximum allowable chip temperature is Tc=85∘ C,
    what is the corresponding value of the chip power qc? An adiabatic fin tip condition may
    be assumed, and airflow along the outer surfaces of the heat sink may be assumed to
    provide a convection coefficient equivalent to that associated with airflow through the
    channels.

    Ans. 31.8 W

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