Q. Write A Short Notes On Grounding, Shielding and Bonding

Q.
WRITE A SHORT NOTES ON

GROUNDING,SHIELDING AND
BONDING
GROUNDING:
 Grounding is a technique that provides a low-resistance path

between electrical or electronics equipment and the earth or
common reference low-impedance plane to bypass fault current
or EMI signal.
 Thus Electrical grounding is essential for the protection of

personal against electrical Shock ,fire threat because of insulation
burn out from lightening or electrical short circuit and protection
of equipment and systems against EMI
Precautions in earthing:
 Moisturization
 Chemical Salting
 Cathode Protection
 Corrosion Reduction
 Materials, Size, Coatings and methods of Bonding
Chemical Salting:
MgSO4 CuSO4
CaCl2 NaCl
KNO3
Cathode Protection:
 Galvanic Corrosion
Develops from the formation of a voltaic cell between two
different metals with moisture acting as electrolyte.
 Electrolytic Corrosion
Develops when two metals are in contact through an
electrolyte.
Corrosion Reduction:
Effective way to avoid the effects of corrosion is to use
metals low in electrochemical activity such as tin, lead, or
copper.
Materials, Size, Coatings:
 copper wires are recommended for construction
 Dimensions of wire, area, and the depth of the plane must be
selected as per resistance
SYSTEM GROUNDING NETWORK
 EMC Grounding networks of a system are selected based
on frequency range of intended signals and system
configurations.
 All low-frequency circuits can be grounded using wires,
whereas high-frequency circuits and high-speed logic
circuits must have low-impedance interference-free return
paths in the form of conducting planes or coaxial cables.
 The signal ground network can be
 Single point grounding
 Multipoint grounding
 Hybrid grounding and
 Floating ground.
Single Point Grounding:
 Each subsystem is grounded to separate ground

planes.
 These individual ground planes from each
subsystem are finally connected by the shortest
path to the system ground point of reference
potential.
 Avoids problems of common mode impedance
coupling
 Operates better at low Frequencies
Multipoint Grounding:
 Every equipment is heavily bonded to a solid ground
conducting plane which is then earthed for safety
purpose.
 At high frequencies there exist different potentials at

different points on the interconnecting systems
which need to be grounded at multiple points to zero
reference potential.
• Operated better at high frequencies
Hybrid Grounding:
 The ground appears as a single point ground at low
frequencies and a multipoint ground at high
frequencies.
 Both the sensor and driver circuit must be grounded
and the coaxial cable shield needs to be grounded at
both ends.
 A low frequency ground current loop is avoided by
the capacitor at one ground.
 At high frequencies ,the capacitor produces low
reactance and cable shield is grounded.
 This circuit simultaneously behaves as a single-point
ground at low frequencies and a multipoint ground at
high frequencies.
Floating Ground:
 Electrically isolated from the equipment cabinets,
building, ground and other conductive objects to avoid
a coupling loop for noise currents present in the
ground system and their flow in signal circuits
shielding:
 EM SHIELDING is the technique that reduces or

prevents coupling of undesired radiated EM energy
into equipment, so as to enable it to operate
compatibly in EM environment.
 Reduce undesired EM energy

 Can be used from zero frequency to high frequencies.
 Shielding is produced by putting a metallic
barrier in the path of electromagnetic waves in
between emitter and receptor.
 The EM waves while penetrating experience an
intrinsic impedance of metal.
 This value is extremely low for good conductors.
 Two basic mechanisms, reflection loss and

absorption loss are responsible for major part of
the shielding.
Representation of shielding
mechanism:
Shielding Effectiveness:
 The main objective of shielding is to restrict radiations
to a specified region to prevent it from entering
susceptible devices . The quality of shielding is
expressed in the form of Shielding Effectiveness of
the material.
 Shielding of materials can be solids or screens and can
be in form of boxes, partitions, cables and connector
shields.
 Shielding Effectiveness is defined as the ratio of
incident power to transmitted power.
Wave impedance as a function of distance
Different ways of shielding
1.Single shield:
This shield contains a single layer of metal. The
layer has got particular impedance and this layer
contains no air gaps.
2. Multimedia Laminated Shield:
This type of shielding contains several layer shields
of different impedances and contains air gaps in
between them. The shielding effectiveness of
multimedia shielding can be increased by controlling
the impedance of the materials and thickness.
Total reflection loss can be expressed as the sum
of reflection losses at each interface
 3.Isolated Double Shield: In a big shielding enclosure a
very high shielding is normally provided with double isolated
conducting metal sheets separated by a inner core made up of
dry plywood.
Apertures in shielding wall:
Electromagnetic penetration through
small apertures:
In the discontinuities shielding effectiveness is achieved.
large apertures:
 If the aperture is large compared to
wavelength the incident can propagate
considerably.
 Shielding effectiveness becomes
very poor
Multiple apertures:
 The amount of shielding reduction depends
on the spacing between any two apertures.
Holes in thin barriers (d>t):
Multiple holes in thin barriers:
Multiple holes in thick barriers(d>>t) :

Cable shielding:
 A cable shield is needed to prevent the outward
emission of EM waves from the cable, and/or to
protect signal conductors from external EMI.
 Shielding effectiveness of any given cable depends on
nature of EMI to be shielded and type of terminations
at the two ends.
Types of Cables:
A. Twinax cable
B. Quadrax cable
C. Coax cable
D. Triax cable
A. TWINAX CABLE:
B. QUADRAX CABLE:
C. TRIAX CABLE:
Electrical Bonding:
 Electrical bonding is a process in which components
or modules of assembly , equipment or subsystems
are electrical connected by low-impedance conductor.
 Electrical bonding is done to avoid potential
difference between points.
 Electric bonding done between electrically
conductive materials , pipes , tubes , electrical
equipment.
 Way to effectively bond different metallic surfaces of
electrical equipment , pipes , tubes is with copper
conductor , rated lugs and appropriate bolts , screws
 Effectively bonded equipment safely conduct phase-
to-ground fault current , induced currents , surge
currents during abnormal conditions.
 Several factor influence the EMI performance of
bonding
 Intermodulation products due to contacts
between similar and dissimilar metals
 Potential differences due to DC and AC
resistance and inductance
 Adverse impedance response due to
resonance.
 Bonding by different methods
 Joining two metallic items or surfaces through
welding or brazing
 By bridging two metallic surfaces with a metallic
bond strap
 Bond of metallic interfaces through fasters or
metal-to-metal contact.
 Depending on the band strap used Resistance of AC
and DC will be different.
 Dc and AC resistance will be inversely proportional
to the cross-sectional area and perimeter of
conductor.
General Guidelines of good bonds are
 Bond surfaces should be neat and clean and no
Nonconductive finishes given at the contact .
 Required pressure should be maintained to hold
surfaces in contact .
 Bonding done between similar metals to avoid
corrosion and intermodulation.
 Replaceable washers should be used when joining
nuts and bolts,
 Soldering must be avoided to give enough
mechanical strength
Thank you

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WRITE A SHORT NOTES ON

 Grounding is a technique that provides a low-resistance path

 Thus Electrical grounding is essential for the protection of

 Each subsystem is grounded to separate ground

 At high frequencies there exist different potentials at

 EM SHIELDING is the technique that reduces or

 Reduce undesired EM energy

 This value is extremely low for good conductors.

 Two basic mechanisms, reflection loss and

Multiple holes in thin barriers:

Multiple holes in thick barriers(d>>t) :

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