CRaTER PDR Mechanical Design

Mechanical Design, CRaTER Assembly and Electronics Assembly Preliminary Design Review
Matthew Smith Mechanical Engineer
(617)-252-1736 matt@space.mit.edu

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CRaTER PDR Mechanical Design

Overview
Instrument and Assembly Description Mechanical Environments and Requirements Mechanical Design Details Near Term Tasks Back-up slides

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CRaTER PDR Mechanical Design

Instrument and Assembly Description

Crater integrates two main sub-assemblies: The Telescope Assembly and The Electronics Assembly.
The Telescope Assembly is being designed and built by The Aerospace Corporation The Analog Board is being designed by Aerospace. The Flight Analog Boards will be built by MIT The Digital Board and Electronics Enclosure Assembly are being designed and built by MIT. MIT will integrate the sub-assemblies and perform all functional, environmental and acceptance testing.

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CRaTER PDR Mechanical Design

Instrument and Assembly Description

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Mechanical Environments
From 431-RQMT-000012, Environments Section 2.
Section 2.1.2 2.4.2 Description Net cg limit load Sinusoidal Vibration Loads Levels 12 g Frequency: Protoflight/Qual: Acceptance:

CRaTER PDR Mechanical Design

5-100 Hz 8g 6.4g

2.5

Acoustics Enclosed box without exposed thin surfaces Random Vibration Shock environment

OASPL Protoflight/Qual: 141.1 dB OASPL Acceptance: 138.1 dB See Random Vibration slide 40 g at 100 Hz 2665g at 1165 to 3000 Hz. No self induced shock. Per 431-SPEC-000091 LRO Thermal Subsystem spec.

2.6.1 2.7

2.8

Venting

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Mechanical Requirements and Verification

CRaTER PDR Mechanical Design

From 431-RQMT-000012, Verification Requirements Section 3.

Section 3.1.2.1 3.1.2.2 3.2.1 3.2.2 3.2.3.2 Description Stowed fundamental Hz Deployed fundamental Frequency Factors of Safety Test factors MEVR-10 Perform frequency verification test for Instruments with frequencies above 50 Hz.. MEVR-11 Report frequencies up to 200Hz Finite Element Model requirements Levels Freq >35 >3 Hz See FOS table See Test Factors table Low level sine sweep We will be above 50Hz. We will be above 75Hz and will not be required to submit an FEM of CRaTER.

3.3

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CRaTER PDR Mechanical Design

General Thermal Subsystem Requirements from 431-Spec-000091

Section 4.1 Description

Exterior facing MLI blankets shall have 3 mil Kapton with VDA in outer Coating.
MLI Blanket Grounding: All blankets shall be grounded per 431-ICD-00018 MLI Blanket Documentation: The location and shape documented in asbuilt ICDs. Attachment to MLI Blankets: All exterior MLI blankets shall be mechanically constrained at least at one point.

4.2

4.3

4.4

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DESIGN DETAILS Electronics Assembly

Natural Frequency Estimates
Based from Steinberg Vibration Analysis for Electronic Equipment-

CRaTER PDR Mechanical Design

(Simply supported on 4 sides.)

Top Cover~ 199 Hz Bottom Cover ~ 159 Hz Analog Board~ 138 Hz Digital Board~ 149 Hz

From SOLID WORKS model of E-Box

frequency is 702Hz at the middle plate that holds the two Circuit Card Assemblies.

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DESIGN DETAILS Mechanical Environments, Random Vibration

CRaTER PDR Mechanical Design

Random Vibration will drive most of the analysis For resonances in the Random Vibration Spec, Miles Equation shows 3 sigma loading on the order of 75-150 g Random Vibration Spec Assume Q=10
Frequency (Hz) 0 0 0 00 0 00 00 000 00 0 Power Spectral Density (g^0 /Hz) Protoflight/ Qual Acceptance

Freq Protoflight/ (Hz) Qual Acceptance 0 0 0 0 00 0 00 00 00 0 . 0 00 . 0 00 . 0 00 0 . 0 00 0 . 0 00 . 0 00 . 0 00 0 . 0

10.0 grms

00 .

Overall 14.1 Grms

00 . 0

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DESIGN DETAILS Stress Margins, Electronics Assembly Pieces

Load levels are superceded by random vibration spec Factors of Safety used for corresponding material from 431-SPEC-000012. Metals: 1.25 Yield, 1.4 Ultimate Composite: 1.5 Ultimate Margin of Safety = (Allowable Stress or Load)/(Applied Stress or Load x FS) 1
Description Top Cover Bottom Cover Digital Board Analog Board E-box Structure Material Desc. Aluminum 6061 Aluminum 6061 FR4 FR4 Aluminum 7075 MS Yield +14.2 +13.4 brittle Brittle > +2.8 MS Ultimate +19.5 +18.4 +1.5 +0.2 >+3.1 Comments Note 1 Note 1 Note 1 Note 1 Note 2

CRaTER PDR Mechanical Design

Note 1. From Steinberg, Vibration Analysis for Electronic Equipment Note 2. From SOLID WORKS, COSMOS excluding top and bottom covers in the model. All components have positive Margin of Safety

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CRaTER PDR Mechanical Design

Mechanical Design Details

The first fundamental frequency is estimated to be 149 Hz.
Not required to produce an FEM since our predicted first frequency is >75 Hz.

All positive margins of safety. Meet all factors of safety. No Fracture Critical Items.

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CRaTER PDR Mechanical Design

Internal Requirements for the Electronics Assembly

Derived Internal Mechanical Requirements for Electronics Enclosure
Have adequate contact area (.5 in^2 min) to the spacecraft to support Thermal requirements. Provide safe structure, within Factors of Safety specified, to support Telescope Assembly. Provide for mounting 2 Circuit Card Assemblies.
The Analog Board and Digital Board must be separated by an aluminum plate.

The Analog Board to provide direct linear path for electronics from the telescope interface to the Digital Board interface to reduce noise. Provide means to route cable from telescope to the Analog side of the Electronics Enclosure. Electrically isolate the electronics Enclosure from the Telescope, yet provide sufficient thermal conductance path. Provide adequate surface area for mounting electrical components. Interface to the Spacecraft to be on one side of the Electronics Enclosure.
The interface connectors to be on the Digital side of the Electronics Enclosure (separate from the Analog side)

Provide GN2 purge interface inlet and outlet ports. Follow the octave rule for natural frequency of the PWAs to the Electronics Enclosure. Details need to be worked out for the GN2 design. Electrical isolation of the E-box and Telescope needs more thought.

The Electronics Assembly meets all internal requirements except for

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DESIGN DETAILS Electrical/Mechanical Interface

Interface Connectors
J1 9 Pin D-Sub Male 311409-1P-B-12 J2 9 Pin D-sub Female 311409-1S-B-12 J3 1553, J4 1553, BJ3150 BJ3150

CRaTER PDR Mechanical Design

Mounting Hardware - Six #10-32 SHCS Surface roughness of 63 micro inches or better for interface surfaces. Mounting surfaces have Electrically Conductive finish (MIL-C-5541 Cl 3) PART OF MID DRAWING NUMBER 32-02003.02

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CRaTER PDR Mechanical Design

NEAR TERM TASKS

Update MICD to reflect latest configuration. Further develop analysis on natural frequencies and stresses using SOLID WORKS and COSMOS on the complete CRaTER Assembly. Finalize interface between Telescope Assembly and Electronics Box Assembly.
Specify the electrical isolation material between the telescope and the E-Box.

Identify the GN2 purge system (mechanical interface to the spacecraft, internal flow, pressure measurements) Complete the drawings for part and assembly fabrication. Define attachment points and outline for thermal blankets.

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CRaTER PDR Mechanical Design

Backup Slides

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CRaTER PDR Mechanical Design

Factors of Safety

Table 00 - from 000 -SPEC- 000000 Design Factor of Safety Type of Hardware Yield Ultimate Tested Flight Structure - Metallic 00 .0 0 .0 Tested Flgiht Structure - Beryllium 0 .0 0 .0 Tested Flight Structure - Composite N/A 0 .0 Pressure Loaded Structure 00 .0 0 .0 Pressure Lines and Fittings 00 .0 0 .0 Untestest Flight Structure - Metallic Only 0 .0 0 .0

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Analog Board Analysis

an 8.429 x 5.95 board separated into two parts

BOARD ANALYSIS
1 2

CRaTER PDR Mechanical Design

3 4 5 6

Polyimide modulus of elasticity Thickness poisson ratio length width weight g pi

E (lb/in sq h (inches) u a (in) b (in) W (lb) in/secSq

4.21E+05 0.06 0.12 4.215 5.95 0.6 386 3.14

4.21E+05 0.09 0.12 4.215 5.95 0.65 386 3.14

4.21E+05 0.1 0.12 4.215 5.95 0.69 386 3.14

4.21E+05 0.11 0.12 4.215 5.95 0.71 386 3.14

4.21E+05 0.12 0.12 4.215 5.95 0.73 386 3.14

4.21E+05 0.15 0.12 4.215 5.95 0.79 386 3.14

D=E*h^3/(12(1-u^2)) density p for a a simply supported board on 4 sides

D= mass/area=W/gab

7.69 6.19797E-05

25.95 6.7145E-05

35.60 7.13E-05

47.38 7.33E-05

61.51 7.54E-05

120.14 8.16E-05

f=pi/2((D/p)^.5)(1/a^2+1/b^2))^.5

Frequency=(Hz)

47

83

94

107

120

161

From Steinberg, vibration analysis for electronic equipment page 149

for a fixed beam on 4 sides

Frequency=(Hz) Average Frequency

91 69 121

160

182 138

207 157 176

232 237

312

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BOARD ANALYSIS
Analog Board Analysis Contd
STRESS

CRaTER PDR Mechanical Design

Gin=peak load(g's)=

125

125

125

125

125

125

Q=transmisibility=

10

10

10

10

10

10

Gout=Gin*Q=

1250

1250

1250

1250

1250

1250

W=board weight(lb)=

0.6

0.65

0.69

0.71

0.73

0.79

q=load intensity=W*Gout/ab

13.393

14.509

15.402

15.848

16.295

17.634

My=bending moment at center=

6.641

7.195

7.637

7.859

8.080

8.744

DYNAMIC BENDING STRESS

Kt= stress concentration factor h=height

3 0.06

3 0.09

3 0.1

3 0.11

3 0.12

3 0.15

Sb=6*Kt*My/h^2= lb/in^2 FACTORS OF SAFETY

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Stress due to bending

33206

15988

13747

11691

10100

6995

Digital Board Analysis

a 8.562 x 7.488 board two sections

BOARD ANALYSIS
1 2

CRaTER PDR Mechanical Design

3 4 5 6

modulus of eleasticity Polyimide fiberglass Thickness poisson ratio length width weight g pi

E, psi h(inches) u a (in) b (in) W (lb) in/secSq

4.21E+05 0.06 0.12 4.281 7.488 0.55 386 3.142857143

4.21E+05 0.09 0.12 4.281 7.488 0.57 386 3.14285714

4.21E+05 0.1 0.12 4.281 7.488 0.58 386 3.142857

4.21E+05 0.11 0.12 4.281 7.488 0.59 386 3.142857

4.21E+05 0.12 0.12 4.281 7.488 0.6 386 3.142857

4.21E+05 0.15 0.12 4.281 7.488 0.61 386 3.142857

D=E*h^3/(12(1-u^2)) density p for a a simply supported board on 4 sides

D= mass/area=W/gab

7.69 4.44492E-05

25.95 4.6066E-05

35.60 4.69E-05

47.38 4.77E-05

61.51 4.85E-05

120.14 4.93E-05

f=pi/2((D/p)^.5)(1/a^2+1/b^2))^.5

Frequency, HZ =

47.32

85.39

99.14

113.41

128.14

177.60

This is from an example by Steinberg, vibration analysis for electronic equipment page 149

for a fixed board on 4 sides

Frequency, HZ =

94.79 71

171.06 128

198.61

227.19 170

256.69 192

355.79 267

Average Frequency

149

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BOARD ANALYSIS
Digital Board Analysis Contd
STRESS

CRaTER PDR Mechanical Design

Gin=peak load(g's)=

125

125

125

125

125

125

Q=transmisibility=

10

10

10

10

10

10

Gout=Gin*Q=

1250

1250

1250

1250

1250

1250

W=board weight(lb)=

0.55

0.57

0.58

0.59

0.6

0.61

q=load intensity=W*Gout/ab

12.277

12.723

12.946

13.170

13.393

13.616

My=bending moment at center=

5.782

5.992

6.097

6.202

6.307

6.412

DYNAMIC BENDING STRESS

Kt= stress concentration factor h=height

3 0.06

3 0.09

3 0.1

3 0.11

3 0.12

3 0.15

Sb=6*Kt*My/h^2= lb/in^2

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28908

13315

10974

9226

7884

5130

FOS Yield

E-BOX COVERS, ANALYSIS

Top Cover Elastic Modulus E(lb/in sq 1.00E+07

CRaTER PDR Mechanical Design

Bottom Cover

1.00E+07

Thickness

h(inches)

0.063

0.063

Poisson ratio

0.33

0.33

length

a (in)

9.343

9.119

width

b (in)

6.623

8.443

weight

W (lb)

0.41

0.46

in/secSq

386

386

pi

3.142857143

3.142857143

125

125

0.828233449

0.746833585

D=E*h^3/(12(1-u^2)

D=

233.837392

233.837392

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density p mass/area=W/gab 1.71655E-05 1.54784E-05

CURRENT BEST ESTIMATE, MASS PROPERTIES

Electronics Assembly
Analog CCA Digital CCA Interconnect Cable, A/D Internal E-box Cables Mechanical Enclosure Top Cover Bottom Cover Hardware Purge system

CRaTER PDR Mechanical Design

grams
480 540 52 122 1800 250 225 166 178

lbs
1.05 1.19 0.11 0.27 3.96 0.55 0.49 0.36 0.39

Electronics Assembly Sub-Total

Detector Assembly
Circuit Board Telescope Sub-Assy Detector Mechanical Enclosure

3813

8.38

138 1398 525

0.30 .87 1.15

Detector Assembly Sub- Total MLI and TPS Sub-Total Mounting Hardware Sub-Total

1061 250 40

2.32 .55 .09

CRaTER CBE Total

5164

11.34

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CRaTER PDR Mechanical Design

Drawing List
Drawing Number Drawing Title 32-1000 CRaTER Assembly Rev. Layout Complete 0% Drawing Created Checked Released

32-10200 32-10201 32-10202 32-10203 32-10204 32-10205

Electronics Assembly Digital Electronics, PWA Analog Electronics PWA Electronics Enclosure Cover, Top Electronics Enclosure Cover, Bottom Electronics Enclosure

02 02 01 01 -

25% 50% 50% 95% 95% 95%

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Material Properties

CRaTER PDR Mechanical Design

Density
2 2 1 2

Material Aluminum 0000 -T0 Aluminum 0000 A000 0000 AMS Polyimide 00 glass %

(lb/in ) 00 .0 0 00 .0 0 00 .0 0 00 .0 0

Young's Tensile Tensile Modulus Ultimate Yield (ksi) (ksi) (ksi) 00 ,0 0 0 .0 0 .0 0 00 ,0 0 0 .0 0 0 0 0 ,0 0 00 0 0 00 0 00 0 0 0 0 0

Poisson's Ratio 00 .0 00 .0 00 .0 -

Where Used Covers Structure Fasteners Circuit Board

1. MIL-HDBK-5J 2. Efunda materials list via efunda.com

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