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    CES PCBARandomVibrationAnalysisusingFEA

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    souheil_sou
    The document discusses using finite element analysis to perform random vibration analysis of a printed circuit board assembly (PCBA). It describes: 1) Performing modal and power spectral density analyses with the PCBA constrained in different ways and subjected to various vibration loads. 2) The FEA procedure including defining the geometry, material properties, loads, boundary conditions, and extracting modal shapes and response results. 3) Sample modal shape and response results showing peak accelerations and displacements that identify critical frequencies and locations. 4) How the analysis helped qualify the product's behavior, identify critical component locations, and provide inputs for design changes and life testing.

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    CES PCBARandomVibrationAnalysisusingFEA

    Uploaded by

    souheil_sou
    31 views14 pages
    The document discusses using finite element analysis to perform random vibration analysis of a printed circuit board assembly (PCBA). It describes: 1) Performing modal and power spectral density analyses with the PCBA constrained in different ways and subjected to various vibration loads. 2) The FEA procedure including defining the geometry, material properties, loads, boundary conditions, and extracting modal shapes and response results. 3) Sample modal shape and response results showing peak accelerations and displacements that identify critical frequencies and locations. 4) How the analysis helped qualify the product's behavior, identify critical component locations, and provide inputs for design changes and life testing.

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    pcb ansys analysys

    Original Title

    CES PCBARandomVibrationAnalysisusingFEA (1)

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    The document discusses using finite element analysis to perform random vibration analysis of a printed circuit board assembly (PCBA). It describes: 1) Performing modal and power spectral density analyses with the PCBA constrained in different ways and subjected to various vibration loads. 2) The FEA procedure including defining the geometry, material properties, loads, boundary conditions, and extracting modal shapes and response results. 3) Sample modal shape and response results showing peak accelerations and displacements that identify critical frequencies and locations. 4) How the analysis helped qualify the product's behavior, identify critical component locations, and provide inputs for design changes and life testing.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    31 views14 pages

    CES PCBARandomVibrationAnalysisusingFEA

    Uploaded by

    souheil_sou
    The document discusses using finite element analysis to perform random vibration analysis of a printed circuit board assembly (PCBA). It describes: 1) Performing modal and power spectral density analyses with the PCBA constrained in different ways and subjected to various vibration loads. 2) The FEA procedure including defining the geometry, material properties, loads, boundary conditions, and extracting modal shapes and response results. 3) Sample modal shape and response results showing peak accelerations and displacements that identify critical frequencies and locations. 4) How the analysis helped qualify the product's behavior, identify critical component locations, and provide inputs for design changes and life testing.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
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    of 14

    PCBA Random Vibration Analysis using FEA

    Reliability Engineering Group


    Cascade Engineering Services, Inc.
    6640 185th Ave NE Redmond WA 98052
    (425) 895-8617 x 564
    www.cascade-eng.com

    PCBA Random Vibration Analysis


    Introduction
    Modal Analysis with PCBA Assembly-4 constraint locations
    PSD Analysis for 1Grms Input
    PSD Analysis for MIL Standard input prole
    Modal Analysis for modied PCBA Assembly -8 Constraint locations
    PSD Analysis for new PCBA Assembly structure & MIL standard prole

    Note : Power Spectral Density (PSD) Analysis in FEA is a


    linear, elastic and frequency domain based stress
    analysis

    FEA Procedure Outline


    Test Objective
    To characterize the PCBA Assembly boundary conditions for dierent random
    vibration loads using FEA
    Methodology
    Step 1: Geometry and Material Properties
    Step 2: Loads and Boundary Conditions
    Step 3: FEA Model Details
    Step 4: Sample Results
    Case Study Benets

    Step 1: Geometric Model & Material Properties

    CAD MODEL: PCBA-Fixture setup with standoffs

    Material Properties

    Step 2: Loads & Boundary Conditions

    Constraints / BC

    Fixed Support / Contacts

    Fixture Constraint
    Location

    8 Mounting holes on
    fixture-shaker table

    PCBA Assembly
    Constraints

    4 Mounting holes
    PCBA-standoffs- fixture

    Input PSD Plot

    Step 3: FEA Model

    Element Type Used


    SOLID187

    SOLID186

    3-D 10-Node Tetrahedral Structural Solid

    3-D 20-Node Structural Solid or Layered Solid

    10 nodes 3-D space

    20 nodes 3-D space

    DOF: UX, UY, UZ

    DOF: UX, UY, UZ

    Step 4: Sample Modal Analysis Results

    1st Mode Shape - Frequency: 305 Hz

    2nd Mode Shape - Frequency: 585 Hz

    Note:

    3rd Mode Shape - Frequency: 850 Hz

    Modal Analysis : Prerequisite for PSD Analysis


    Extracting the Fundamental mode shapes is useful for
    calculating the dynamic response of the structure

    Step 4: Sample Response PSD Results


    C3

    C2

    C1

    Locations of Interest

    Plots shows Z Direction PSD acceleration response at the chosen locations


    Peak values reveals important information about the critical resonating frequencies &

    the transmissibility of the assembly structure which is almost 9X input at PCBA Centre

    Step 4: Sample Z-Direction Displacement Results

    Range of displacements seen by the product at a certain instant of time help


    determine the critical locations for the components on the PCBA Assembly

    PCBA Stress Analysis with


    MIL Standard Input Profile

    Step 2: Boundary Conditions & Input Profiles

    Constraints / BC

    Fixed Support / Contacts

    Fixture Constraint
    Location

    8 Mounting holes on
    fixture-shaker table

    PCBA Assembly
    Constraints

    4 Mounting holes
    PCBA-standoffs- fixture

    Input: Mil STD PSD Profile

    Step 3: FEA Model

    Element Type Used


    SOLID187

    SOLID186

    3-D 10-Node Tetrahedral Structural Solid

    3-D 20-Node Structural Solid or Layered Solid

    10 nodes 3-D space

    20 nodes 3-D space

    DOF: UX, UY, UZ

    DOF: UX, UY, UZ

    Step 4: Sample Response PSD Results


    C3

    C2

    C1

    For the same boundary conditions as before & MIL standard input profile the G-level amplification on the PCBA centre
    measured up to 20x the input which may be considered a potential risk for the product

    Case Study Benefits


    Analysis virtually qualified the product behavior for chosen test
    loads
    Identified critical locations for the components on the PCBA in
    random vibration environment.
    Quantified the transmissibility factors through the structure to
    various input vibration loads.
    Provided design inputs for material and geometry changes.
    Useful for designing accelerated product life tests

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