3D Measuring Laser Microscope

OLS4100

Bringing Answers to the Surface

Precise measurement. Faster operation. High-quality imaging.

Expanding the Boundaries of Laser Microscopy

Measurements and images you can count on. Every time.

LEXT OLS4100
Widely used in quality control, research, and development across an array of industries and applications,
OLYMPUS LEXT 3D measuring laser microscopes have set new standards in 3D laser microscopy. Now, as
demand grows for increased measurement precision and wider observation applicability, Olympus has
responded with the new LEXT OLS4100. Designed to facilitate faster, easier measurement and higher-quality
imaging, the OLS4100 is expanding the boundaries of laser microscopy.
The new OLYMPUS LEXT OLS4100. Going beyond the borders of possibility.

Contents
Superior
Metrology

High-Quality
Imaging

Systematic Workflow
via intuitive GUI

Advantages of Laser Scanning Microscopes

Superior Metrology

High-Quality Imaging

12

Systematic Workflow via Intuitive GUI

16

Basic Principles of the LEXT OLS4100

22

Sample Applications

24

Advantages of Laser Scanning Microscopes

Fast Non-Contact, Non-Destructive Imaging and Measurement
Non-Contact, Non-Destructive Measurement
Unlike stylus-based contact-type surface roughness
gauges, laser scanning microscopes (LSMs) employ
a low-power light that will prevent damaging the
surface.

Comparison of Measuring Method

Contact Surface
Roughness
Measurement R: 2 m

Non-Contact
Laser Microscope
R: 0.2 m (OLYMPUS)

Imaging Without Sample Preparation

A scanning electron microscope (SEM) requires
extensive sample preparation such as vacuum
evaporation and/or altering the sample to fit in the
observation chamber. An LSM allows the
measurement of samples without any prior
preparation, and immediate imaging after placing the
sample on the stage.

Start Imaging Without Sample Preparation

LSM Solution for

SEM
Samples

Roughness Gauge
Samples

With an LSM, the sample can be safely returned to the production line or
experiment thanks to non-destructive measurement.

Superior X-Y-Axis Measurement

Accurate Measurement of Submicron Distances Across the X-Y Axes
An interferometer is based on a normal white-light optical
microscope, and so achieves the same lateral resolution.
With a larger-aperture objective and reduced wavelength,
the resolution of an LSM is greatly improved over typical
white light microscopes. In addition, precise angularcontrolled movement of the laser focus means that an
LSM can perform accurate X-Y plane sub-micron
measurements on diverse types of samples.
The OLS4100 achieves a lateral resolution of 0.12
microns.

Micron-Order Laser Spot

Laser
Microscope
R:0.2m
(OLYMPUS)

 Angular-Controlled Laser Scanning for

High-Resolution Imaging
High X-Y Plane Resolution

128 x 128 m

0.12 m Line and Space (OLYMPUS)

LSM Solution for

Interferometer
Samples

LSMs have superior horizontal resolution due to a confocal optical system, making it easy to
measure the surface of the specific region of interest.

Superior Z-Axis Measurement

Accurate Measurement of Submicron Heights Across the Z-Axis

Sliced Image

Z Position
Z1

Sample Form
Z2

An SEM delivers excellent high-resolution images but lacks any

height information. With a short-wavelength laser and its confocal
optical system, an LSM only detects in-focus reflections from a
single specified focal plane along the Z-axis. Combined with a
high-precision linear scale, this allows high-definition imaging and
accurate 3D measurement.
The OLS4100 can achieve a Z-axis resolution of 10 nanometers.

Z3

Z4

Z-axis Profile
Z-Axis Image
Z1
Z2
Z3
Z4

LSM Solution for

SEM
Samples

Interferometer
Samples

LSMs are ideal for measuring the surface contour of samples with
undulations ranging from several hundred micro-meters to the submicron
order.

Superior Metrology
3D measurement of diverse samples with 10 nm height resolution and
advanced measurement parameters.

Wider Sample Range

Imaging Slopes up to 85
Thanks to dedicated objectives with high numerical apertures and a
dedicated optical system that obtains superior performance from a 405
nm laser, the LEXT OLS4100 can reliably measure acute-angled
samples that were previously impossible to measure. These capabilities
also enable measurement of micro-roughness on an uneven surface.
LEXT-Dedicated Objectives
Non-Exclusive Objective
Aberration
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
-1.0
-1.5
-2.0
-2.5

Optical axis

Distance from Optical Axis

Optical axis

Distance from Optical Axis

LEXT-Dedicated Objective
Aberration
2.5
2.0
1.5
1.0
0.5
0.0
-0.5
-1.0
-1.5
-2.0
-2.5

Minimized Aberrations with Dedicated Objective

Razor with an Acute Angle

Micro-Profile Measurements with

10 nm Height Resolution
With the OLS4100, an impressive X-Y resolution
of 0.12 microns is now possible thanks to a
short-wavelength 405 nm laser and a highaperture objective. As a result, the OLS4100 can
perform submicron measurements of a sample's
surface. With a precise 0.8 nanometer-resolution
linear scale and software algorithms such as our
original I-Z curve (see page 23), the OLS4100
can resolve height differences of 10 nanometers.

(MPL APON50XLEXT)
STEP Height standard Type B, PTB-5, Institut fr Mikroelektronik, Germany,
6 nm Detection in Height Measurement

Overcoming Reflectance Differences

The OLS4100 employs a dual confocal
system, incorporating two confocal optical
light paths. In combination with a highsensitivity detector, this enables the OLS4100
to capture a precise 3D image from a sample
consisting of materials with different
reflectance characteristics.

Confocal A

Confocal B

Diamond Electroplated Tool

Objective : MPLAPON50XLEXT

Applicable to Transparent Layers

Multilayer Mode
The LEXT OLS4100's new multilayer mode is
capable of recognizing the peaks of reflected
light intensities originating from multiple layers.
Setting each layer as the focal point makes it
possible to observe and measure the upper
surface of a transparent sample. This also
enables the analysis of multiple layers,
measuring the thickness of each layer.

Laser Beam

Traditional

Multilayer Mode
Z-Position

Z-Position

Upper Surface Shape

Lower Surface Shape

Reflected Light

Reflected Light

Observation/Measurement of Multiple Layers of Transparent Material

The multilayer mode facilitates observation and measurement of the transparent layer on the surface of a transparent sample. Even
with a transparent resin layer on a glass substrate, the shape and roughness of each layer, as well as the thickness of the surface
film, can be measured.
Metal Surface

Polyimide Film Surface

Polyimide Film

Metallic Surface

Industry's First* Double Performance Guarantee

Accuracy and Repeatability
Repeatability

The performance of a measuring tool is typically

expressed using two different terms: accuracy,
which indicates how close a measurement value is
to its true value, and repeatability, which indicates
the degree of variations among repeated
measurement values. The OLS4100 is the
industry's first* LSM able to assure both accuracy
and repeatability.

Repeatability &
Accuracy

Accuracy

Traceability System
The OLS4100 uses a rigorous system of production for
every component. From the objective to the laser head,
Olympus delivers only the highest-quality systems based
on comprehensive inspection to the strictest standards.
On delivery, final adjustment and calibration is performed
by qualified engineers in the actual measurement
environment.

National Standard (Japan)

National Metrology Institute of Japan (NMIJ)/National Institute of Advanced Industrial
Science and Technology (AIST)

Japan Quality Assurance

Organization (JQA)

JCSS Accredited Laboratory 0044

Olympus Corporation Quality
Assurance Division Testing and
Research Center

Standard Step

Standard Scale
LEXT OLS 4100
*According to Olympus survey as of Dec 2008.

Wide Range of Measurement Types

Seven Measurement Modes
Step Measurement
This mode allows measurement of a
step between any two arbitrary points
on a surface profile. Profile
Measurement is also available.

Area/Volume Measurement

Surface Roughness
Measurement
This mode allows measurement of line
roughness on one line and plane
roughness on the entire surface.

With a user-defined threshold level on a

surface profile, this mode allows
measurement of the volume (or area) of
a geometry above or below the
threshold level.

Particle Measurement*

Geometric Measurement

This mode enables auto-separation of particles with the

separator function, setting of a threshold level, and setting
of a detection range within a region of interest.

This mode allows measurement of the distance between

two arbitrary points on a geometric image. The geometric
shape and angle for circle, rectangle, etc. are measured.

Film Thickness
Measurement*

Auto Edge Detection/

Measurement*

This mode allows the thickness of a

film on a transparent body to be
measured by detecting changes in
refractive index.

This mode allows a line width or a diameter to

be measured by automatically detecting
edges in a geometric image. This reduces
uncertainty by eliminating operator error.

OLYMPUS Stream*
Workflow Solution for
Improved Image Analysis
Performance
For grain size analysis or
nonmetallic inclusion rating,
optional OLYMPUS Stream microimaging software is available,
which can be uploaded directly
from the OLS4100.
"OLYMPUS Stream"
Launch Button

*Optional unit.

Improved Roughness Measurement

The LEXT OLS4100 has been developed to represent a new standard of surface roughness measuring. The OLS4100 is
calibrated in the same way as contact surface roughness gauges and has the necessary roughness parameters and filters
required per ISO and JQA. This allows users with contact surface roughness gauges to obtain output results from the
system consistent with their existing instruments, with the advantage of greater speed and non-contact measurement.
The OLS4100 has a roughness-specific mode enabling roughness profile measurement for sample lengths up to 100mm
with an automatic line stitching function.

Micro Roughness
Contact surface roughness gauges cannot measure micro surface contours less than the stylus tip diameter. The OLS4100
can measure the surface roughness of micro geometries at high resolution due to a minute laser spot diameter.

Contact Surface
Roughness
Measuring Machine
R: 2 m

LEXT
OLS4100
R: 0.2 m

Non-Contact Measurement
Since a contact surface roughness gauge uses a hard
needle-shaped stylus, it is more likely to scratch the surface
of a soft specimen, damaging or deforming it. With adhesive
specimens, on the other hand, the stylus can attach to the
specimen and be damaged when pulled loose, making it
impossible to obtain correct results. The OLS4100, a noncontact laser microscope, can perform accurate surface
roughness measurement regardless of surface texture
conditions.

Polymer Film 3D image (above) and Results of Roughness Measurement (left)

Soft Specimen

10

Adhesive Specimen

Measurement of Features at the Micron Level

Surface roughness gauges cannot measure micron-level features since their styli are not able to access these areas. The
OLS4100 can correctly identify a measuring position and easily perform roughness measurement of a target micro area.

Bonding Wires

LEXT OLS 4100 Parameters

Parameter Compatibility
The OLS4100 comes with the same Surface
Profile Parameters as contact-type surface
roughness gauges, offering compatible
operability and measurement results.

Primary Profile

: Pp, Pv, Pz, Pc, Pt, Pa, Pq, Psk, Pku, Psm, Pq, Pmr(c), Pc, Pmr

Roughness Profile

: Rp, Rv, Rz, Rc, Rt, Ra, Rq, Rsk, Rku, Rsm, Rq, Rmr(c),Rc, Rmr, RZJIS, Ra75

Waviness Profile

: Wp, Wv, Wz, Wc, Wt, Wa, Wq, Wsk, Wku, Wsm, Wq, Wmr(c), Wc, Wmr

Bearing Area Curve

: Rk, Rpk, Rvk, Mr1, Mr2

Motif

: R, Rx, AR, W, Wx, AW, Wte

Roughness Profile (JIS 1994) : Ra(JIS1994), Ry, Rz(JIS1994), Sm, S, tp

Others

: R3z, P3z, PeakCount

Accommodating Next-Generation Parameters

The OLS4100 comes with roughness (3D)
parameters conforming to ISO25178 for
reliable evaluation of the planar area.

Amplitude Parameters

: Sq, Ssk, Sku, Sp, Sv, Sz, Sa

Functional Parameters

: Smr(c), Sdc(mr), Sk, Spk, Svk, SMr1, SMr2, Sxp

Volumetric Parameters

: Vv(p), Vvv, Vvc, Vm(p), Vmp, Vmc

Lateral Parameters

: Sal, Str

LEXT OLS4100 performance is comparable with results of a surface roughness gauge.

Primary Profile from LEXT OLS4100

s=2.5 m with Filtering

Primary Profile from a Contact Surface Roughness Gauge

11

High-Quality Imaging
For clear 3D color images, high-sensitivity laser DIC, or high-dynamic range
(HDR) images.

Crystal-Clear 3D Color Images

Three Types of Integrated Images
The LEXT OLS4100 can acquire three different types of information at the same time: a true-color optical microscope image, a
laser microscope image, and height map. The OLS4100 makes it possible to capture an optical microscope image consisting
of in-focus pixels only, and integrate them with a true-color optical microscope image containing height information.

Real-Color 3D Image

Confocal 3D Laser Image

Height Map

Natural Color Reproduction

The OLS4100 uses a white LED light and a high-color-fidelity CCD camera to generate clear, natural-looking color images,
comparable to those obtained with high-grade optical microscopes.

2D Color Image (Inkjet Dots on Paper, Objective 20x)

3D Color Image (Inkjet Dots on Paper, Objective 20x)

13

More Realistic Surface Reproduction

DIC

Laser DIC (Differential Interference Contrast)

Differential Interference Contrast (DIC) is an observation method used to visualize nanometer micro surface contours, which
normally lie far beyond the resolving power of a laser microscope. Thanks to its DIC laser mode, the LEXT OLS4100 allows you
to obtain live images comparable to those of an electron microscope, under relatively low power magnifications.

Laser Image without DIC (Polymer Film)

Laser Image with DIC (Polymer Film)

Laser Image without DIC (5x Objective)

Laser Image with DIC (5x Objective)

STEP Height standard Type B, PTB-5, Institut fr Mikroelektronik, Germany

STEP Height standard Type B, PTB-5, Institut fr Mikroelektronik, Germany,

Actual Height of the Feature : 6 nm

14

Optimized Balance Between Brightness and Contrast

HDR

HDR (High Dynamic Range) Imaging

The OLS4100's High Dynamic Range (HDR) function combines several optical microscope images captured using different
exposures. Brightness, contrast, texture, and saturation are controlled individually so that HDR creates images with a wide
dynamic range. This enables clear visualization of a color image, especially for samples lacking texture.

Color Image without HDR

(Super-Density Fabric, Objective 20x, Zoom 1x)

Color Image with HDR

(Super-Density Fabric, Objective 20x, Zoom 1x)

Algorithm
Parameter Adjustment
Several Different Exposure Images

To compress image data

into bit capacity of the display:

Brightness Control
Processed Image

Contrast Control
High Tone Image Processing

Texture Control

Saturation Control

Stabilization of Measurement and

Imaging Environments
To eliminate external influences on measurement and
imaging, the OLS4100 incorporates a hybrid vibrationdampening mechanism using coil springs and dampening
rubber to stabilize the operating environment. This eliminates
the need for a dedicated vibration-dampening stand,
allowing measurements on any desktop.

Hybrid Vibration-Dampening Mechanism

15

Systematic Workflow via Intuitive GUI

Easy operation accomplishes your goals faster than ever.

16

Easy Three-Step Process

With the LEXT OLS4100, observation or measurement begins immediately once the sample is placed on the stage.
Thanks to our easy three-step Imaging, Measurement and Reports process, measurement procedures can be quickly
mastered, even by those not familiar with laser microscopy.

Keeping Track of the Sample

Macro Map Functionality
The OLS4100s macro map function allows wide-field image display of a sample under low magnification, with a rectangular
observation marker on the macro sample image. The field of view can be set up to 441 (21x21) times wider than the
conventional view. When used with the motorized six-lens nosepiece, the macro map function allows smooth, convenient, oneclick operation for stage movement and magnification. Accurate parfocality and objective centering can be preset and
synchronized with one-click stage movement and magnification.

Fast Macro Map Stitching

Two stitching methods are available for scanning large
areas: Manual mode for live image acquisition and
Automatic mode for faster image acquisition. Operation is
quick and simple2D stitching starts automatically at the
touch of a single button, and wide area images are
acquired immediately. The stitching size is available from
five steps in 3x3, 5x5, 7x7, 9x9, and 21x21 in Automatic
mode. Unnecessary parts of the acquired images can also
be removed manually with simple mouse/joystick
operation.

17

Smart Scan for Simple 3D Imaging

Speed of image acquisition is significantly increased, with automatic adjustments for brightness and position across the Z-axis
direction and planar surface.

Automatic 3D Image Acquisition

Conventional 3D scanning requires complicated settings that are difficult for novice users. With the LEXT OLS4100s new
Smart Scan mode, even first-time users can quickly acquire 3D images with a single click of a button. In addition to upper and
lower limit settings, appropriate brightness level is automatically set up by the system based on the image to be captured,
allowing even new users to obtain accurate height measurements and an optimized image.

3D Imaging

Conventional 3D Acquisition

OLS4100 3D Acquisition

Upper/Lower Limit Setting

Acquisition Pitch Setting
Brightness Setting

Upper Limit Setting

Auto Recognition

Lower Limit Setting

Lowered to Preset Level

Automatic Brightness Control

OLS4100

Conventional Model

Automatic
Control

Brightness Control with a Range of Height

Brightness Control on a Plane

Greater Reduction of Acquisition Time

18

Lower Limit
Setting

Brightness
Setting

Upper Limit
Setting

Brightness &
Upper/
Lower Limit
Check

Click on
Acquisition
Button

Auto Lower
Limit Setting

Auto Upper
Limit Setting

Auto
Brightness
Setting

Steps Automated in Smart Scan

Click on
Acquisition
Button

Acquisition

Acquisition

Improved Scanning Speed

The new Ultra-Fast mode allows scanned image acquisition at twice the speed of conventional Fast mode, and
approximately nine times the speed of Fine mode. This makes it possible to measure micro-samples with very steep angles,
such as the tip of a knife, which is difficult to observe due to fine Z-step movement and high magnification.

Number of images acquired in a set amount of elapsed time:

Fine

1.0

5.5

Fast

9.3

Ultra-Fast

10
(images)

Actual scanning time varies depending on magnification and Z-acquisition range.

High-Speed Acquisition of Required Areas Only

The OLS4100 also comes with a Band Scan mode for measurement of limited target areas, providing measurement
performance 1/8th faster than conventional modes.

1024
X
128

Acquisition with a Full Scan

Acquisition with Band Scan (1/8th )

19

New High-Speed Stitching Mode

Specify Target Areas from Wider-Area Stitched Images
As in macro mapping, the area to be observed can be specified from a wide area map. In Automatic mode, an area map can be
automatically generated in roughly half the time it normally takes by setting a rectangular stitching size of up to 625 images.
Observation can begin immediately once the target area is specified on the area map.

Individual 2D Images Before Stitching (Simulation)

2D Image After Stitching

Stitching Area: Square (21x3) 63 Pieces

Stitching Area: Circle (3 Points)

3D Image After Stitching

Manually Specifying Required Image Areas

In Live mode, the area to be observed
can be selected manually by tracing the
required region onscreen. This is ideal
when the sample has an irregular shape.

Quick Image Acquisition

In Smart Scan mode, all it takes is the click of a button. As the location across the Z-axis is automatically adjusted, image
acquisition in the Z-axis direction can be restricted to required areas only, for rapid high-power observation across a wide area.

Measuring
Areas in
Z-Axis
Direction

Smart Scan Mode

20

Conventional Acquisition Mode

Customizable Reports at the Touch of a Button

Report Creation
The OLS4100 generates reports at the touch of a button after measurement, and an edit function allows the operator to
customize each report template. Copying and pasting measured results into a word processing/spreadsheet application is
also quite simple, as is retrieving required images/reports from a database.

One-Click Solutions
Wizard Function
A detailed user-designed wizard function eliminates the need for lengthy training and allows quick and easy operation by
new operators.

Custom Recipe Applying to Multiple Images Offers Speedy Report Output

Image A

Image B

Image C

Customizable
Recipe

Image D

21

Basic Principles of the LEXT OLS4100

405 nm Laser Scan
The lateral resolution of an optical microscope is defined largely by the parameters of the optics and the wavelength of the light
source. With a 405 nm short-wavelength semiconductor laser, the LEXT OLS4100 enjoys a high lateral resolution in comparison
to a conventional microscope using visible light with a 550 nm peak.

OLS4100 Light Source

600 nm

400 nm

OLS4100 Light Source

(405 nm)

700 nm

800 nm

Conventional Microscopes
(550 nm peak)

2D Scanning System
For 2D scanning, the OLS4100 incorporates an
Olympus scanner-on-scanner. An electromagnetic
MEMS scanner handles the X direction, while a
high-precision Galvano mirror takes care of
scanning in the Y direction. This innovative system
enables the axis of the scanner and the exit pupil
of the objective to be placed at an optically
conjugate position. This ideal optical layout allows
accurate high-speed, low-distortion X-Y scanning,
enabling the OLS4100 to provide high-density
scanning up to 4096 x 4096 pixels.

Confocal Optical System

A confocal optical system captures only the in-focus image while simultaneously eliminating flare. In addition, confocal
technology can be used as a height sensor since only thin image planes of the same height are captured. The OLS4100 is
equipped with an Olympus dual confocal system, enhancing optical performance for precise 3D images even with samples
made up of materials with different reflectances. The circular pinhole point of laser light also produces a uniform confocal effect,
enhancing contrast in every direction.

Non-Confocal

Confocal

Non-Confocal
Photomultiplier

Photomultiplier

Circular
Confocal
Pinhole
Telan Lens

22

Telan Lens

Confocal

CFO Search
Obtaining height information is a primary
function of the OLS4100 and is achieved by
moving the objective upward to detect the
change of light intensity along the Z-axis.
Olympus CFO (calculated focus operation)
technology detects light intensity automatically in
order to obtain discrete height data. The
approximate curve of an ideal I-Z curve is
calculated alongside the maximum brightness
value and Z-axis information, which define each
image pixel. CFO search technology significantly
improves repeatabilityone of the most
indispensable assets of a measurement tool.

Multiple Images Acquired by Shifting Focus

Reflective
Intensity
Calculated
Reflection
Intensity

Calculated Height

Height

Detects Peak Intensity for Every Pixel

OLS4100 Optical Path Diagram

Based on these basic principles, the LEXT OLS4100 offers the following features:
10-nanometer resolution in the
Z-axis direction to enable 3D
surface contour measurement

Horizontal (X-Y direction)

resolution of 0.12 m to enable
high-definition image observation

Violet laser enables non-contact

observation and measurement

23

Sample Applications
Semiconductor/FPD (Flat Panel Display)
1

1 Wafer Bump

(objective 100x/optical zoom 1.5x/scanning area 85 m x 85 m)

2 Light Guide Panel
(objective 50x/optical zoom 1x/scanning area 256 m x 256 m)
3 Chip Pad
(objective 50x/optical zoom 2x/scanning area 128 m x 128 m)
4 Laser Dot on Light Guide Panel
(objective 100x/optical zoom 1x/scanning area 128 m x 128 m)

Electronic Component/MEMS (Microelectromechanical System)

1

1 Photomask
(objective 20x/optical zoom 1x/scanning area 640 m x 640 m)
Sample provided by Koshibu Precision Co., Ltd. (P3,P24)
2 Micro Lens
(objective 100x/optical zoom 1x/scanning area 128 m x 128 m)
3 Flexible PCB Connector
(objective 50x/optical zoom 1x/scanning area 256 m x 256 m)
4 MEMS
(objective 20x/optical zoom 1.3x /scanning area 483 m x 483 m)

24

Material/Metal Processing
1

1 Diamond Electrocoating Tool

(objective 50x/optical zoom 1x/scanning area 256 m x 256 m)

2 Carbon
(objective 100x/optical zoom 1x/scanning area 128 m x 128 m)
3 Ultra-Thin Pipe
(objective 100x/optical zoom 1x/scanning area 128 m x 128 m)
4 Adhesive Tape
(objective 50x/optical zoom 2x/scanning area 128 m x 128 m)

5 Sandpaper #400 (3D)

(objective 20x/optical zoom 1x/scanning area 640 m x 640 m)
6 Sandpaper #400 (2D)
7

(objective 20x/optical zoom 1x/scanning area 640 m x 640 m)

7 Super-Density Fabric (3D)
(objective 20x/optical zoom 1x/scanning area 640 m x 640 m)

25

LINEUP

Standard-Type OLS4100-SAF

405

MAIN UNIT DIMENSIONS

300mm-Stage-Type OLS4100-LAF

276

Unit: mm

550

448

COMBINATION SYSTEM DIMENSIONS

1300

26

358

MAIN UNIT
LSM Section

Measurement

Light Source/Detector

Planar Measurement

Height Measurement

Color Observation Section

Light Source: 405 nm Semiconductor Laser,

Detector: Photomultiplier

Total Magnification

108x 17,280x

Zoom

Optical Zoom: 1x 8x

Repeatability

100x: 3n-1=0.02 m

Accuracy

Measurement Value 2%

System

Revolving Nosepiece Vertical-Drive System

Stroke

10 mm

Scale Resolution

0.8 nm

Movement Resolution

10 nm

Display Resolution

1 nm

Repeatability

50x: n-1=0.012 m

Accuracy

0.2+L/100 m or Less (L=Measuring Length)

Light Source/Detector

Light Source: White LED,

Detector: 1/1.8-Inch 2-Megapixel Single-Panel CCD

Zoom

Digital Zoom: 1x 8x

Revolving Nosepiece

Motorized BF Sextuple Revolving Nosepiece

Differential Interference Contrast Unit

Differential Interference Contrast Slider: U-DICR,

Polarizing Plate Unit Built-In

Objective

BF Plan Semi-apochromat 5x, 10x

LEXT-Dedicated Plan Apochromat 20x, 50x, 100x

Z Focusing Unit Stroke

100 mm

XY Stage

100x100 mm (Motorized Stage),

Option: 300x300 mm (Motorized Stage)

This product is designed for use in industrial environments for the EMC performance. Using it in a residential environment may affect other equipment in the environment

OBJECTIVE SPECIFICATIONS
Model

Magnification

Field of View

Working Distance (WD)

Numerical Aperture (NA)

MPLFLN5X

108x-864x

2,560-320 m

20.0 mm

0.15

MPLFLN10X

216x-1,728x

1,280-160 m

11.0 mm

0.30

MPLAPON20XLEXT

432x-3,456x

640-80 m

1.0 mm

0.60

MPLAPON50XLEXT

1,080x-8,640x

256-32 m

0.35 mm

0.95

MPLAPON100XLEXT

2,160x-17,280x

128-16 m

0.35 mm

0.95

27

 OLYMPUS CORPORATION is ISO9001/ISO14001 certified.

www.olympus-ims.com

All company and product names are registered trademarks and/or trademarks of their respective owners.
Images on the PC monitors are simulated.
Specifications and appearances are subject to change without any notice or obligation on the part of the manufacturer.

For enquiries - contact

www.olympus-ims.com/contact-us

M1775E-072014