Applications and Processing of Ceramics Word File
Applications and Processing of Ceramics Word File
Applications and Processing of Ceramics Word File
Introduction Ceramics
The word ceramic is originated from greekword keromikos, which means burnt stuff.
high hardness
Brittleness
Classification Ceramics
Ceramics are classified in many ways. It is due to divergence in composition,
properties and applications.
Clay products: clay is the one of most widely used ceramic raw material. It is found in
great abundance and popular because of ease with which products are made. Clay
products are mainly two kinds structural products (bricks, tiles, sewer pipes) and white-
wares (porcelain, chinaware, pottery, etc.).
Abrasive ceramics: these are used to grind, wear, or cut away other material. Thus
the prime requisite for this group of materials is hardness or wear resistance in addition
to high toughness. As they may also exposed to high temperatures, they need to exhibit
some refractoriness. Diamond, silicon carbide, tungsten carbide, silica sand, aluminium
oxide / corundum are some typical examples of abrasive ceramic materials.
Cements: cement, plaster of paris and lime come under this group of ceramics. The
characteristic property of these materials is that when they are mixed with water, they
form slurry which sets subsequently and hardens finally. Thus it is possible to form
virtually any shape. They are also used as bonding phase, for example between
construction bricks.
Advanced ceramics: these are newly developed and manufactured in limited range
for specific applications. Usually their electrical, magnetic and optical properties and
combination of properties are exploited. Typical applications: heat engines, ceramic
armours, electronic packaging, etc.
Aluminium nitride (AlN): because of its typical properties such as good electrical
insulation but high thermal conductivity, it is used in many electronic applications such
as in electrical circuits operating at a high frequency. It is also suitable for integrated
circuits. Other electronic ceramics include barium titanate(BaTiO3) and Cordierite
(2MgO-2Al2O3-5SiO2).
Lead zirconium titanate(PZT): it is the most widely used piezoelectric material, and is
used as gas igniters, ultrasound imaging, in underwater detectors.
Silica (SiO2): is an essential ingredient in many engineering ceramics, thus is the most
widely used ceramic material. Silica-based materials are used in thermal insulation,
abrasives, laboratory glassware, etc. it also found application in communications media
as integral part of optical fibers. Fine particles of silica are used in tires, paints, etc.
Silicon carbide (SiC): it is known as one of best ceramic material for very high
temperature applications. It is used as coatings on other material for protection from
extreme temperatures. It is also used as abrasive material. It is used as reinforcement
in many metallic and ceramic based composites. It is a semiconductor and often used in
high temperature electronics. Silicon nitride (Si3N4) has properties similar to those of
SiCbut is somewhat lower, and found applications in such as automotive and gas
turbine engines.
Titanium oxide (TiO2): it is mostly found as pigment in paints. It also forms part of
certain glass ceramics. It is used to making other ceramics like BaTiO3.
Titanium boride (TiB2): it exhibits great toughness properties and hence found
applications in armorproduction. It is also a good conductor of both electricity and heat.
Uranium oxide (UO2): it is mainly used as nuclear reactor fuel. It has exceptional
dimensional stability because its crystal structure can accommodate the products of
fission process.
Yttrium aluminium garnet (YAG, Y3Al5O12): it has main application in lasers (Nd-
YAG lasers).
Zirconia(ZrO2): it is also used in producing many other ceramic materials. It is also
used in making oxygen gas sensors, as additive in many electronic ceramics. Its single
crystals are part of jewellery.
Processing ceramics
The very specific character of ceramicshigh temperature stabilitymakes conventional
fabrication routes unsuitable for ceramic processing.
Inorganic glasses, though, make use of lower melting temperatures. Most other
ceramic products are manufactured through powder processing.
Ceramic powders prepared are shaped using number of techniques, such as casting,
compaction, extrusion/hydro-plastic forming, injection molding.
Tape casting, also known as doctor blade process, is used for the production of thin
ceramic tapes. In this technique slurry containing ceramic particles, solvent, plasticizers,
and binders is then made to flow under a blade and onto a plastic substrate. The shear
thinning slurry spreads under the blade. The tape is then dried using clean hot air.
Later-on the tape is subjected to binder burnout and sintering operations. Tape
thickness normally range between 0.1 and 2 mm. Commercially important electronic
packages based on alumina substrates and barium titanatecapacitors are made using
this technique.
Slip castingis another casting technique widely used. This technique uses aqueous
slurry, also known as slip, of ceramic powder. The slip is poured into a plaster of Paris
(CaSO4:2H2O) mold. As the water from slurry begins to move out by capillary action, a
thick mass builds along the moldwall. When sufficient product thickness is built, the rest
of the slurry is poured out (drain casting). It is also possible to continue to pour more
slurry in to form a solid piece (solid casting).
Sintering is the firing process applied to green ceramics to increase its strength.
Sintering is carried out below the melting temperature thus no liquid phase presents
during sintering. However, for sintering to take place, the temperature must generally be
maintained above one-half the absolute melting point of the material. During sintering,
the green ceramic product shrinks and experiences a reduction in porosity. This leads to
an improvement in its mechanical integrity. These changes involve different mass
transport mechanisms that cause coalescence of powder particles into a more dense
mass. With sintering, the grain boundary and bulk atomic diffusion contribute to
densification, surface diffusion and evaporation condensation can cause grain growth,
but do not cause densification. After pressing, ceramic particles touch one another.
During initial stages of sintering, necks form along the contact regions between adjacent
particles thus every interstice between particles becomes a pore. The pore channels in
the compact grow in size, resulting in a significant increase in strength. With increase in
sintering time, pores become smaller in size. The driving force for sintering process is
the reduction in total particle surface area, and thus the reduction in total surface
energy. During sintering, composition, impurity control and oxidation protection are
provided by the use of vacuum conditions or inert gas atmospheres.