Pressure

Freescale Semiconductor Document Number: MPX2202

Data Sheet: Technical Data Rev 8, 10/2012

200 kPa On-Chip Temperature

Compensated Silicon MPX2202
Pressure Sensors Series
0 to 200 kPa (0 to 29 psi)
The MPX2202 devices series are silicon piezoresistive pressure sensor 40 mV Full Scale
providing a highly accurate and linear voltage output directly proportional to (Typical)
the applied pressure. The sensor is a single monolithic silicon diaphragm with
the strain gauge and a thin-film resistor network integrated on chip. The chip
is laser trimmed for precise span and offset calibration and temperature
compensation. They are designed for use in applications such as pump/
motor controllers, robotics, level indicators, medical diagnostics, pressure
switching, barometers, altimeters, etc. Application Examples
Features Pump/Motor Controllers
Robotics
Temperature Compensated Over 0C to +85C Level Indicators
Easy-to-Use Chip Carrier Package Options Medical Diagnostics
Available in Absolute, Differential and Gauge Configurations Pressure Switching
Ratiometric to Supply Voltage Barometers
Available in Easy-to-Use Tape and Reel Altimeters

ORDERING INFORMATION
Case # of Ports Pressure Type
Device Name Device Marking
No. None Single Dual Gauge Differential Absolute
Unibody Package (MPX2202 Series)
MPX2202A 344 MPX2202A
MPX2202DP 344C MPX2202DP
MPX2202AP 344B MPX2202AP
MPX2202GP 344B MPX2202GP
MPX2202ASX 344F MPX2202A
Small Outline Package (MPXV2202 Series)
MPXV2202GP 1369 MPXV2202GP
MPXV2202DP 1351 MPXV2202DP
MPXV2202GC6TI 482A MPXV2202G
MPAK Package (MPXM2202 Series)
MPXM2202D 1320 MPXM2202D
MPXM2202DT1 1320 MPXM2202D
MPXM2202A 1320 MPXM2202A
MPXM2202GS 1320A MPXM2202GS
MPXM2202GST1 1320A MPXM2202GS
MPXM2202AS 1320A MPXM2202AS

2005-2008, 2012 Freescale Semiconductor, Inc. All rights reserved.

 Pressure

UNIBODY PACKAGES

MPX2202A MPX2202AP/GP MPX2202DP MPX2202ASX

CASE 344-15 CASE 344B-01 CASE 344C-01 CASE 344F-01

SMALL OUTLINE PACKAGES MPAK

MPXV2202DP MPXV2202GP MPXV2202GC6T1 MPXM2202A MPXM2202GS/AS

CASE 1351-01 CASE 1369-01 CASE 482A-01 CASE 1320-02 CASE 1320A-02

MPX2202
Sensors
2 Freescale Semiconductor, Inc.
 Pressure
Operating Characteristics

Table 1. Operating Characteristics

(VS = 10 Vdc, TA = 25C unless otherwise noted, P1 > P2)

Characteristics Symbol Min Typ Max Unit

Pressure Range(1)
Absolute Pressure Range MPX2202A POP 20 200 kPa
Differential Pressure Range MPX2202D POP 0 200 kPa

Supply Voltage(2) VS 10 16 Vdc

Supply Current Io 6.0 mAdc

Full Scale Span(3) VFSS 38.5 40 41.5 mV

Offset(4)
MPX2202D, MPXM2202D/G Series Voff -1.0 1.0 mV
MPX2202A, MPXM2202A Series -2.0 2.0

Sensitivity V/P 0.2 mV/kPa

(5)
Linearity
MPXM2202D/G, MPX2202D Series -0.6 0.4 %VFSS
MPXM2202A, MPX2202A Series -1.0 1.0

Pressure Hysteresis(5) (0 to 200 kPa) 0.1 %VFSS

Temperature Hysteresis(5) (-40C to +125C) 0.5 %VFSS

Temperature Effect on Full Scale Span(5) TCVFSS -2.0 2.0 %VFSS

Temperature Effect on Offset(5) TCVoff -1.0 1.0 mV

Input Impedance Zin 1000 2500

Output Impedance Zout 1400 3000

Response Time(6) (10% to 90%) tR 1.0 ms

Warm-Up 20 ms

Offset Stability(7) 0.5 %VFSS

1. 1.0 kPa (kiloPascal) equals 0.145 psi.

2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
5. Accuracy (error budget) consists of the following:
Linearity:Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or
maximum rated pressure, at 25C.
TcSpan:Output deviation at full rated pressure over the temperature range of 0 to 85C, relative to 25C.
TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C.
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

MPX2202
Sensors
Freescale Semiconductor, Inc. 3
 Pressure
Maximum Ratings

Table 2. Maximum Ratings(1)

Rating Max Value Unit

Maximum Pressure (P1 > P2) 400 kPa

Storage Temperature -40 to 125 C

Operating Temperature -40 to 125 C

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Voltage Output versus Applied Differential

The differential voltage output of the sensor is directly (P1) side relative to the vacuum (P2) side. Similarly, output
proportional to the differential pressure applied. voltage increases as increasing vacuum is applied to the
The absolute sensor has a built-in reference vacuum. The vacuum (P2) side relative to the pressure (P1) side.
output voltage will decrease as vacuum, relative to ambient, Figure 1 illustrates a block diagram of the internal circuitry
is drawn on the pressure (P1) side. on the stand-alone pressure sensor chip.
The output voltage of the differential or gauge sensor
increases with increasing pressure applied to the pressure

VS
3

Thin Film 2
Temperature +VOUT
Sensing Compensation
Element 4
and Calibration VOUT
Circuitry

GND

Figure 1. Temperature Compensated and Calibrated

Pressure Sensor Schematic

MPX2202
Sensors
4 Freescale Semiconductor, Inc.
 Pressure
On-Chip Temperature Compensation and Calibration

40 VS = 10 VDC
35 TA = 25C
30 P1 > P2 TYP
25 Span
Range

Output (mVDC)
20 MAX
(TYP)
15
10 MIN
5
0
-5 Offset
kPa 0 25 50 75 100 125 150 175 200 (TYP)
PSI 7.25 14.5 21.75 29
Pressure
Figure 2. Output vs. Pressure Differential
Figure 2 shows the output characteristics of the MPX2202 The effects of temperature on full scale span and offset are
series at 25C. The output is directly proportional to the very small and are shown under Operating Characteristics.
differential pressure and is essentially a straight line.

Differential/Gauge Absolute
Silicone Gel Silicone Gel Die Stainless Steel
Die Stainless Steel Metal Cover
Die Coat Die Coat
P1 Metal Cover P1 Epoxy
Epoxy Case
Wire Bond Wire Bond
Case

Lead Frame Bond Lead Frame

Differential/Gauge Element Die Absolute Element Die
P2 P2 Bond

Figure 3. Cross Sectional Diagram (not to scale)

Figure 3 illustrates the differential/gauge die in the basic
chip carrier (Case 344). A silicone gel isolates the die surface
and wire bonds from the environment, while allowing the Least
Least Squares Fit Square
pressure signal to be transmitted to the silicon diaphragm. Deviation
The MPX2202 series pressure sensor operating Exaggerated
characteristics and internal reliability and qualification tests Performance
Curve Straight Line
are based on use of dry air as the pressure media. Media
Relative Voltage Output

Deviation
other than dry air may have adverse effects on sensor
performance and long term reliability. Contact the factory for
information regarding media compatibility in your application.

LINEARITY End Point Straight

Linearity refers to how well a transducer's output follows Line Fit
the equation: Vout = Voff + sensitivity x P over the operating
pressure range. There are two basic methods for calculating
nonlinearity: (1) end point straight line fit (see Figure 4) or
Offset
(2) a least squares best line fit. While a least squares fit gives
the best case linearity error (lower numerical value), the 50 100
0
calculations required are burdensome.
Pressure (% Full Scale)
Conversely, an end point fit will give the worst case error
(often more desirable in error budget calculations) and the Figure 4. Linearity Specification Comparison
calculations are more straightforward for the user.
Freescales specified pressure sensor linearities are based
on the end point straight line method measured at the
midrange pressure.

MPX2202
Sensors
Freescale Semiconductor, Inc. 5
 Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale designates the two sides of the pressure sensor pressure sensor is designed to operate with positive
as the Pressure (P1) side and the Vacuum (P2) side. The differential pressure applied, P1 > P2.
Pressure (P1) side is the side containing silicone gel which The Pressure (P1) side may be identified by using the
isolates the die from the environment. The Freescale MPX following table.

Table 3. Pressure (P1) Side Delineation

Part Number Case Type Pressure (P1) Side Identifier

MPX2202A 344 Stainless Steel Cap

MPX2202DP 344C Side with Part Marking

MPX2202GP/AP 344B Side with Port Attached

MPX2202ASX 344F Side with Port Attached

MPX2202GP 1369 Side with Port Attached

MPX2202DP 1351 Side with Part Marking

MPXV2202GP 1369 Side with Port Attached

MPXV2202DP 1351 Side with Part Marking

MPXV2202GC6TI 482A Side with Port Attached

MPXM2202A/ATI/DT/DTI 1320 Side with Part Marking

MPXM2202GS/GSTI/AS/ASTI 1320A Side with Port Attached

MPX2202
Sensors
6 Freescale Semiconductor, Inc.
 Pressure
PACKAGE DIMENSIONS

A D 8 PL NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
4 0.25 (0.010) M T B S A S Y14.5M, 1982.
5 2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
N B 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
G
8 INCHES MILLIMETERS
1 DIM MIN MAX MIN MAX
A 0.415 0.425 10.54 10.79
B 0.415 0.425 10.54 10.79
S C 0.500 0.520 12.70 13.21
W D 0.038 0.042 0.96 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25
J 0.009 0.011 0.23 0.28
V K 0.061 0.071 1.55 1.80
M 0 7 0 7
N 0.444 0.448 11.28 11.38
C S 0.709 0.725 18.01 18.41
V 0.245 0.255 6.22 6.48
H W 0.115 0.125 2.92 3.17
J
T
PIN 1 IDENTIFIER SEATING
M PLANE
K

CASE 482A01
ISSUE A
DATE 05/13/98

MPX2202
Sensors
Freescale Semiconductor, Inc. 7
 Pressure
PACKAGE DIMENSIONS
NOTES:
C 1. DIMENSIONING AND TOLERANCING PER ASME
R Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION -A- IS INCLUSIVE OF THE MOLD
M STOP RING. MOLD STOP RING NOT TO EXCEED
1 4
Z 16.00 (0.630).
2 3 INCHES MILLIMETERS
B -A-
DIM MIN MAX MIN MAX
A 0.595 0.630 15.11 16.00
N B 0.514 0.534 13.06 13.56
PIN 1 1 2 3 4 L C 0.200 0.220 5.08 5.59
D 0.016 0.020 0.41 0.51
-T- F 0.048 0.064 1.22 1.63
SEATING G 0.100 BSC 2.54 BSC
PLANE F J 0.014 0.016 0.36 0.40
J G L 0.695 0.725 17.65 18.42
F Y M 30 NOM 30 NOM
D 4 PL N 0.475 0.495 12.07 12.57
0.136 (0.005) M T A M DAMBAR TRIM ZONE: R 0.430 0.450 10.92 11.43
THIS IS INCLUDED Y 0.048 0.052 1.22 1.32
WITHIN DIM. "F" 8 PL Z 0.106 0.118 2.68 3.00

STYLE 1: STYLE 2: STYLE 3:

PIN 1. GROUND PIN 1. VCC PIN 1. GND
2. + OUTPUT 2. - SUPPLY 2. -VOUT
3. + SUPPLY 3. + SUPPLY 3. VS
4. - OUTPUT 4. GROUND 4. +VOUT

CASE 344-15
ISSUE AA
UNIBODY PACKAGE

NOTES:
SEATING
-T- -A- 1. DIMENSIONING AND TOLERANCING PER ANSI
PLANE Y14.5M, 1982.
U 2. CONTROLLING DIMENSION: INCH.
R L
H INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 1.145 1.175 29.08 29.85
N PORT #1
B 0.685 0.715 17.40 18.16
POSITIVE -Q- C 0.305 0.325 7.75 8.26
PRESSURE D 0.016 0.020 0.41 0.51
(P1) F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
H 0.182 0.194 4.62 4.93
B J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
1 2 3 4 L 0.290 0.300 7.37 7.62
PIN 1 N 0.420 0.440 10.67 11.18
K
-P- P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
0.25 (0.010) M T Q S S R 0.230 0.250 5.84 6.35
S 0.220 0.240 5.59 6.10
J F U 0.910 BSC 23.11 BSC
C G
D 4 PL
0.13 (0.005) M T S S Q S
STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT

CASE 344B-01
ISSUE B
UNIBODY PACKAGE

MPX2202
Sensors
8 Freescale Semiconductor, Inc.
 Pressure

PACKAGE DIMENSIONS
NOTES:
-A- 1. DIMENSIONING AND TOLERANCING PER ANSI
V U Y14.5M, 1982.
PORT #1 W L 2. CONTROLLING DIMENSION: INCH.
R
H INCHES MILLIMETERS
PORT #2 PORT #1 DIM MIN MAX MIN MAX
PORT #2
VACUUM POSITIVE PRESSURE A 1.145 1.175 29.08 29.85
N (P2) (P1) B 0.685 0.715 17.40 18.16
C 0.405 0.435 10.29 11.05
-Q- D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
SEATING B SEATING
H 0.182 0.194 4.62 4.93
PLANE PLANE
J 0.014 0.016 0.36 0.41
1 2 3 4
PIN 1 K 0.695 0.725 17.65 18.42
K L 0.290 0.300 7.37 7.62
-P- N 0.420 0.440 10.67 11.18
-T- -T- 0.25 (0.010) M T Q S S P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
J F R 0.063 0.083 1.60 2.11
C G S 0.220 0.240 5.59 6.10
U 0.910 BSC 23.11 BSC
D 4 PL V 0.248 0.278 6.30 7.06
0.13 (0.005) M T S S Q S W 0.310 0.330 7.87 8.38

STYLE 1:
PIN 1. GROUND
2. + OUTPUT
3. + SUPPLY
4. - OUTPUT

CASE 344C-01
ISSUE B
UNIBODY PACKAGE

NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
-A- Y14.5M, 1994.
U 2. CONTROLLING DIMENSION: INCH.
SEATING
-T- PLANE L
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
R PORT #2 H A 1.145 1.175 29.08 29.85
VACUUM POSITIVE B 0.685 0.715 17.40 18.16
(P2) PRESSURE C 0.305 0.325 7.75 8.26
(P1) D 0.016 0.020 0.41 0.51
N F 0.048 0.064 1.22 1.63
-Q- G 0.100 BSC 2.54 BSC
H 0.182 0.194 4.62 4.93
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
B L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
1 2 3 4 Q 0.153 0.158 3.89 4.04
K R 0.230 0.250 5.84 6.35
PIN 1 S 0.220 0.240 5.59 6.10
S U 0.910 BSC 23.11 BSC

C F
-P- G
J 0.25 (0.010) M T Q S D 4 PL STYLE 1:
PIN 1. GROUND
0.13 (0.005) M T S S Q S 2. + OUTPUT
3. + SUPPLY
4. - OUTPUT

CASE 344D-01
ISSUE B
UNIBODY PACKAGE

MPX2202
Sensors
Freescale Semiconductor, Inc. 9
 Pressure
PACKAGE DIMENSIONS

CASE 1351-01 PAGE 1 OF 2

ISSUE A
SMALL OUTLINE PACKAGE

MPX2202
Sensors
10 Freescale Semiconductor, Inc.
 Pressure

PAGE 2 OF 2
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE

MPX2202
Sensors
Freescale Semiconductor, Inc. 11
 Pressure

CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE

MPX2202
Sensors
12 Freescale Semiconductor, Inc.
 Pressure
PACKAGE DIMENSIONS

CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE

MPX2202
Sensors
Freescale Semiconductor, Inc. 13
 Pressure
PACKAGE DIMENSIONS

CASE 1320-02
ISSUE B
MPAK

MPX2202
Sensors
14 Freescale Semiconductor, Inc.
 Pressure
PACKAGE DIMENSIONS

CASE 1320-02
ISSUE B
MPAK

MPX2202
Sensors
Freescale Semiconductor, Inc. 15
 Pressure
PACKAGE DIMENSIONS

PIN 4

PIN 1

CASE 1320A-02
ISSUE A
MPAK

MPX2202
Sensors
16 Freescale Semiconductor, Inc.
 Pressure
PACKAGE DIMENSIONS

CASE 1320A-02
ISSUE A
MPAK

MPX2202
Sensors
Freescale Semiconductor, Inc. 17
 Pressure
REVISION HISTORY
Revision Revision
Description of changes
number date

7 01/2012 In Table 1. Operating Characteristics, in the Characteristic column under Pressure Range, added
rows for Absolute Pressure Range MPX2202A and Differential Pressure Range MPX2202D
devices

8 10/2012 Deleted references to device number MPXV2022GC6U throughout the document

MPX2202
Sensors
Freescale Semiconductor, Inc. 18
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MPX2202
Rev. 8
10/2012