DESIGN AND FABRICATION OF THERMAL

CONDUCTIVITY ANALYSIS KIT

Submitted by

K.PRAVEEN (411714114062)

J.SATHISH KUMAR (411714114074)

M.R.SUDHANVA (411714114084)

in partial fulfillment for the award of the degree

of

BACHELOR OF ENGINEERING

In

MECHANICAL ENGINEERING

PRINCE SHRI VENKATESHWARA PADMAVATHY

ENGINEERING COLLEGE

ANNA UNIVERSITY:: CHENNAI 600 025

APRIL 2018

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 ANNA UNIVERSITY: CHENNAI 600 025

BONAFIDE CERTIFICATE

Certified that this project report “DESIGN AND FABRICATION OF THERMAL

CONDUCTIVITY ANALYSIS KIT” is the bonafide work of “K.PRAVEEN

(411714114062), J.SATHISH KUMAR (411714114074), M.R.SUDHANVA

(411714114084)” who carried out the project work under my supervision.

SIGNATURE SIGNATURE

Mr.G.SATHI M.E, MBA., Mr.R.SELVAPRABHAKAR M.E.,

HEAD OF THE DEPARTMENT SUPERVISOR

Department of Mechanical Department of Mechanical

Engineering Engineering

Prince Shri Venkateshwara Prince Shri Venkateshwara

Padmavathy Enginnering College Padmavathy Enginnering College

Ponmar Ponmar

Chennai 600127 Chennai 600127

Submitted for ANNA UNIVERSITY Examination held on: _______________

INTERNAL EXAMINER EXTERNAL EXAMINER

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 ACKNOWLEDGEMENT
We wish to express our sincere thanks to our college founder and Chairman,
Dr.K.VASUDEVAN, M.A., B.ED., PH.D., for his endeavour in educating us in
this premier institution.

We are grateful to our Vice-Chairman Dr.V.VISHNU KARTHIK M.D.,

for his keen interest in our academics and the faculties offered in this premier
institution.

We would like to express our deep gratitude to our Administrative Officer

Er. K.PARTHASARATHY B.E., for his valuable support.

We wish to express our appreciation and gratefulness to our PrincipalDr.

T.SOUNDERRAJAN, M.TECH., Ph.D., for his encouragement and sincere
guidance.

We express our sincere thanks to Mr. G.SATHI M.E., MBA.,Head of the

Department, Department of Mechanical Engineering. We thank him for their
encouragement and cooperation.

We would like to thank our internal guide Mr.R.SELVAPRABHAKAR

M.E., Assistant professor, Department of Mechanical Engineering. He has always
been source of inspiration to us throughout the project. We thank him for his
motivation and guidance, which made us to complete this project efficiently.

We sincerely thank our project Coordinator Mr.G.SATHI M.E.MBA.,

Department of Mechanical Engineering. For help and support rendered to us.

We also use this opportunity to thank all the Department Staffs without
whose cooperation our project would have remained just a dream.

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 ABSTRACT

Every material will have special kind of characteristics such as structural

properties, thermal properties, crystal properties. This project on the thermal

properties is particularly based upon Thermal Conductivity. This property is most

essential for heat exchangers, heating element, thermocouple and heat engine

application. Here the Thermal Conductivity of materials are measured using

thermocouple and are automatically fed into the embedded system which controls

the entire process. From this electronic device signals are coded into the personal

computer where results can be obtained. Also comparisons of the obtained results

can be made.

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CHAPTER TITLE PAGE
NO NO
ABSTRACT ⅲ
LIST OF SYMBOLS ⅷ
LIST OF FIGURES ⅸ
1 INTRODUCTION

1.1 THERMAL CONDUCTIVITY 1

1.1.1 Conductance 2

1.2THERMAL CONDUCTIVITY MEASUREMENT 2

1.2.1 Steady state methods 3

1.3.TRANSIENT METHODS 4

1.3.1 Transient plane source method 4

1.3.2 Modified transient plane source (MTPS) 6

1.3.3 Transient line source method 7

1.3.4 Modified transient line source method 8

1.4 LASER FLASH METHOD 9

1.5 TECHNIQUES USED 10

1.5.1 Guarded hot plate method 10

1.5.2 Pipe method 10

1.5.3 Direct heating method 11

1.6 EMBEDDED SYSTEM 12

1.6.1 Applications 13

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 1.6.2 Characteristics 14

1.6.3 User interface 15

1.6.4 Processors in embedded system 16

1.7 VISUAL BASIC 16

1.7.1 Characteristics of VB 17

1.7.2 Why VB 19

1.7.3 What VB is not 20

1.7.4 When you program in VB 20

2 2. LITERATURE SURVEY 21

3 3. OBJECTIVES 26

4 4. METHODOLOGY 27

4.1 FLOWCHART 27

4.2 BLOCK DIAGRAM 28

4.3 MACHINING PROCESSES 29

4.3.1 Drilling 29

4.3.2 Soldering 29

4.3.3 Wiring 30

4.4 BASIC WORKING PRINCIPLE 31

4.5 COMPONENTS 32

4.5.1 Thermocouple 33

4.5.2 Types of thermocouple 35

4.5.3 Signal conditioner 39

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 4.5.4 Embedded circuits 42

4.5..5 Power supply unit 42

4.5.6 Step down transformer 43

4.5.7 Rectifier unit 43

4.5.8 Filtering unit 44

4.5.9 Voltage regulator 44

4.5.10 Specification 45

4.5.11 PIC unit explanation 46

4.5.12 PIC Microcontroller 46

4.5.13 RS 232 converter 48

4.5.14 Personal computer 49

4.5.15 Sample materials 49

4.5.16 Heater 50

5 DESIGN CALCULATIONS 51

6 PHOTOGRAPHIC VIEW 53

7 CONCLUSION 60

REFERENCE 61

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 LIST OF SYMBOLS

S.NO PARAMETER SYMBOL UNIT

1. Lambda Λ W/(m.K)

2. Temperature T °C

3. Conductance K W⋅K−1

6. Density Ρ kg/m3

7. Volume V

8. Length L M

9. Power Q [W·m−1]

10. Specific heat capacity cp [J·kg−1·K−1]

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 LIST OF FIGURES

Fig no LIST OF FIGURES Page No

1.1 TPS sensor, model Hot Disk 4

1.2 MTPS 6

1.3 Transient line source method 7

1.4 Guarded hot plate 10

1.5 Pipe method 10

1.6 Direct heating method 11

1.7 3- omega setup 11

1.8 Embedded system 12

4.1 Signal conditioner 39

4.2 Embedded circuit 57

4.3 RS232 Converter 48

6.1 Brass 53

6.2 Aluminium 54

6.3 Stainless Steel 54

6.4 Mild Steel 55

6.5 Analyser box 56

6.6 Assembled Analyser box 56

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6.7 Microcontroller 57

6.8 Embedded system 58

6.9 RS232 Converter 58

6.10 Transformer 59

6.11 Assembled circuit board 59