ESDA-1K

EOS and ESD Transil™ protection for charger and battery port

Features
■ Breakdown voltage: 12 V, 18 V
■ Unidirectional device
■ High peak power dissipation: 450 W (8/20 µs
waveform) SOD-523
■ ESD protection level better than
IEC 61000-4-2 level 4: 30 kV contact
discharge. Figure 1. Functional diagram
■ Low leakage current < 0.5 µA at 5 V
Pin 1
■ PCB area: 1.3 mm2

Benefits
■ High EOS and ESD protection level
■ High integration
■ Suitable for high density board
■ Small package

Complies with the following standards Pin 2

■ IEC 61000-4-2 level 4
– 15 kV (air discharge) Description
– 8 kV (contact discharge)
The ESDA-1K is a single line Transil diode
■ MIL STD 883G - Method 3015-7 Class 3B
designed specifically for the protection of
– HBM (Human Body Model): ≥ 8 kV integrated circuits in portable equipment and
miniaturized electronics devices subject to ESD
Applications and EOS transient overvoltages.

Where transient overvoltage protection in ESD

sensitive equipment is required, such as:
■ Computers
■ Printers
■ Communication systems
■ Cellular phone handsets and accessories
■ Video equipment

TM: Transil is a trademark of STMicroelectronics.

September 2010 Doc ID 17883 Rev 1 1/10

www.st.com 10
Characteristics ESDA-1K

1 Characteristics

Table 1. Absolute maximum ratings (Tamb = 25 °C)

Symbol Parameter Value Unit

IEC 61000-4-2 air discharge 30

VPP Peak pulse voltage kV
IEC 61000-4-2 contact discharge 30
Tj Operating Junction temperature rage -40 to +150 °C
Tstg Storage temperature range -65 to +150 °C
TL Maximum lead temperature for soldering during 10 s 260 °C
0

Table 2. Absolute maximum ratings (tamb = 25 °C) - product specific parameters

Order code IPP (A) peak pulse current (8/20 µs) PPP (W) peak pulse power (8/20 µs)

ESDA12-1K 16 450
ESDA18-1K 12 400

Figure 2. Electrical characteristics (definitions)

Symbol Parameter

Table 3. Electrical characteristics (values, Tamb = 25 °C)

VBR @ IR IRM @ VRM VCL@ IPP (8/20 µs) Cline(1)

Order code Min. Typ. Max. Max. Max. Max.

V V mA µA V V A V A pF

ESDA12-1K 12 13 1 0.5 10 16.5 1 28 16 150

ESDA18-1K 18 19 1 0.5 15 24 1 34 12 105
1. VR = 0 V, Fosc = 1 MHz, Vosc = 30 mV

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ESDA-1K Characteristics

Figure 3. Peak pulse power dissipation Figure 4. Peak pulse power dissipation
versus exponential pulse duration versus initial junction temperature
(typical values) (typical values)
PPP (W) PPP(W)
1000 1000
8/20 µs
Tj=25 °C 900
ESDA12-1K
800
ESDA18-1K
700
100 ESDA12-1K
600
500 ESDA18-1K
400
10
300
200
100
tP (µs) Tj (°C)
1 0
10 100 1000 25 50 75 100 125 150 175

Figure 5. Clamping voltage versus peak Figure 6. Leakage current versus junction
pulse current (typical values) temperature (typical values)
IPP (A) IR (nA)
100.0 100.00
8/20 µs VR = VRM = 10 V for ESDA12-1K
Tjinitial = 25 °C VR = VRM =1 5V for ESDA18-1K

10.0 ESDA12-1K
ESDA12-1K
1.00

1.0 ESDA18-1K ESDA18-1K

VCL (V) Tj (°C)

0.1 0.01
0 10 20 30 25 35 45 55 65 75 85

Figure 7. ESD response to IEC 61000-4-2 Figure 8. ESD response to IEC 61000-4-2
(+15 kV air discharge) ESDA12-1K (-15 kV air discharge) ESDA12-1K

5 V / div 5 V / div
C2

C2

100 ns / div 100 ns / div

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Ordering information scheme ESDA-1K

2 Ordering information scheme

Figure 9. Ordering information scheme

ESDA XX - 1K

ESD array

Breakdown voltage
XX = 12: 12 V min.
XX = 18: 18 V min.

Package
1 = 1 line
K = SOD-523

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ESDA-1K Package information

3 Package information

● Epoxy meets UL94,V0

● Lead-free package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.

Table 4. SOD-523 dimensions

Dimensions

E 0.15 M C A B
Ref. Millimeters Inches
E1
B
Min. Typ. Max. Min. Typ. Max.

2xb D A 0.50 0.60 0.70 0.020 0.024 0.028

0.20 M C A B
E 1.50 1.60 1.70 0.059 0.063 0.067
A
R0.1 8°
E1 1.10 1.20 1.30 0.043 0.047 0.051
A

c
D 0.70 0.80 0.90 0.028 0.031 0.035
SEATING PLANE
7°
C L
b 0.25 0.35 0.010 0.014
c 0.07 0.20 0.003 0.008
L1 L 0.15 0.20 0.25 0.006 0.008 0.010
L1 0.05 0.20 0.002 0.008

Figure 10. Footprint (dimensions in mm) Figure 11. Marking

0.7

0.3
Pin 1
1X Pin 2

Note: Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no
case should this product marking be used to orient the component for its placement on a
PCB. Only pin 1 mark is to be used for this purpose.

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Package information ESDA-1K

Figure 12. Tape and reel specification

Ø 1.50
2.0 4.10
0.22

1.75
1.35

3.5
8.0

0.50 0.90 4.0

0.73

All dimensions are typical values in mm User direction of unreeling

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ESDA-1K Recommendation on PCB assembly

4 Recommendation on PCB assembly

4.1 Solder paste

1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste recommended.
3. Offers a high tack force to resist component displacement during PCB movement.
4. Use solder paste with fine particles: powder particle size 20-45 µm.

4.2 Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.
3. Standard tolerance of ± 0.05 mm is recommended.
4. 3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.

4.3 PCB design preference

1. To control the solder paste amount, the closed via is recommended instead of open
vias.
2. The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.

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Recommendation on PCB assembly ESDA-1K

4.4 Reflow profile

Figure 13. ST ECOPACK® recommended soldering reflow profile for PCB mounting

Temperature (°C)
260°C max
255°C
220°C

180°C

125 °C 2°C/s recommended

2°C/s recommended
3°C/s max 6°C/s max
6°C/s max

3°C/s max

0
0 1 2 3 4 5 6 7
10-30 sec Time (min)

90 to 150 sec 90 sec max

Note: Minimize air convection currents in the reflow oven to avoid component movement.

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ESDA-1K Ordering information

5 Ordering information

Table 5. Ordering information

Order code Marking Package Weight Base qty Delivery mode

ESDA12-1K 12
SOD-523 1.46 3000 Tape and reel
ESDA18-1K 18

Note: The marking can be rotated by multiples of 90° to differentiate assembly location.

6 Revision history

Table 6. Document revision history

Date Revision Changes

02-Sep-2010 1 First issue.

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 ESDA-1K

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