HT8972 Voice Echo: Features

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HT8972

Voice Echo
Features
· Operating voltage: 4.5V~5.5V · Low distortion rate
· ADM algorithm - Echo mode: 1%
- Surround mode: 0.2%
· Low noise
- Echo mode: -85dB · Built-in 40Kb SRAM
- Surround mode: -90dB · Automatic reset function
· 16-pin DIP/SOP package

Applications
· Television · Video disc player
· Karaoke systems · Sound equipments

General Description
The HT8972 is an echo/surround effect processor. It is Its built-in 40Kb SRAM can generate delay time effect
designed for various audio systems including karaoke, and can control the delay time value through the exter-
television, sound equipments, etc. The chip consists of nal VCO resistor.
a built-in pre-amplifier, VCO or Voltage Control OSC,
The VCO circuit can reduce external components and
40Kb SRAM, A/D and D/A converters as well as delay
make it easy to adjust the delay time.
time control logic.

Block Diagram

L P F 1 _ IN L P F 1 _ O U T L P F 2 _ O U T L P F 2 _ IN O P 2 _ O U T O P 2 _ IN O P 1 _ IN O P 1 _ O U T C C 0 C C 1

4 .7 k W 4 .7 k W
M O D

C O M P D E M
L P F 2

L P F 1

1 /2 V C C D I D O 0 D O 1
M O M I C L O C K
A U T O
R E S E T
4 0 K B its
V C O
R A M

V C C R E F A G N D D G N D O S C _ O v c o

Rev. 1.00 1 December 23, 2008


HT8972

Pin Assignment

V C C 1 1 6 L P F 1 _ IN
R E F 2 1 5 L P F 1 _ O U T
A G N D 3 1 4 L P F 2 _ O U T
D G N D 4 1 3 L P F 2 _ IN
O S C _ O 5 1 2 O P 2 _ O U T
V C O 6 1 1 O P 2 _ IN
C C 1 7 1 0 O P 1 _ IN
C C 0 8 9 O P 1 _ O U T
H T 8 9 7 2
1 6 D IP -A /S O P -A

Pad Assignment

L P F 1 _ O U T

L P F 2 _ O U T
L P F 1 _ IN

L P F 2 _ IN
D G N D
A G N D

V C C
R E F

1 5 1 4 1 3 1 2 1 1 1 0
1 1 6

(0 ,0 )

2 3 4 5 6 7 8 9
V C O

C C 1

O P 1 _ O U T

O P 1 _ IN
C C 0

O P 2 _ IN

O P 2 _ O U T
O S C _ O

Chip size: 2475´2065 (mm)2


* The IC substrate should be connected to VSS in the PCB layout artwork.

Rev. 1.00 2 December 23, 2008


HT8972

Pad Coordinates Unit: mm

Pad No. X Y Pad No. X Y


1 -883.875 861.250 9 1027.425 -892.700
2 -865.105 -891.900 10 907.375 890.431
3 -564.105 -892.700 11 715.175 890.429
4 -44.775 -892.700 12 467.375 890.431
5 147.425 -892.700 13 275.175 890.429
6 395.225 -892.700 14 60.790 879.700
7 587.425 -892.700 15 -203.150 868.440
8 835.225 -892.700 16 -783.875 861.250

Pad Description
Pad No. Pad Name I/O Internal Connection Description
1 DGND I ¾ Digital ground

2 OSC_O O ¾ System oscillator output

3 VCO I ¾ System oscillator input, system frequency adjustable pin

4 CC1 ¾ ¾ Current control 1

5 CC0 ¾ ¾ Current control 0

6 OP1_OUT O ¾ OP1 output

7 OP1_IN I ¾ OP1 input

8 OP2_IN I ¾ OP2 input

9 OP2_OUT O ¾ OP2 output

10 LPF2_IN I ¾ Low pass filter 2 input

11 LPF2_OUT O ¾ Low pass filter 2 output

12 LPF1_OUT O ¾ Low pass filter 1 output

13 LPF1_IN I ¾ Low pass filter 1 input

14 VCC I ¾ Analog and positive power supply

15 REF I ¾ Analog reference voltage

16 AGND I ¾ Analog ground

Absolute Maximum Ratings


Supply Voltage ...........................VSS-0.3V to VSS+6.0V Storage Temperature ............................-50°C to 125°C
Input Voltage..............................VSS-0.3V to VDD+0.3V Operating Temperature .............................-20°C to 70°

Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed
in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.

Rev. 1.00 3 December 23, 2008


HT8972

Electrical Characteristics Ta=25°C

Test Conditions
Symbol Parameter Min. Typ. Max. Unit
VDD Conditions
VCC Operating Voltage ¾ ¾ 4.5 5.0 5.5 V
ICC Operating Current 5V ¾ ¾ 15 30 mA
GV Voltage Gain 5V RL=47kW ¾ -0.9 2.5 dB
VOMAX Maximum Output Voltage 5V THD=10% 0.9 1.8 ¾ Vrms

THD Total Harmonic Distortion 5V Filter= A-Weighting ¾ 0.7 1.5 %


NO Output Noise Voltage 5V Filter= A-Weighting ¾ -85 -60 dBV

DVCC=-20dBV (0.1Vrms)
PSRR Power Supply Rejection Ratio 5V ¾ -40 -30 dB
f=100Hz

Rev. 1.00 4 December 23, 2008


HT8972

Functional Description
The HT8972 is an echo/surround effect generator with · Echo mode
built-in 40Kb SRAM. It ensures low distortion as well as
V O U T
low noise for processing audio signal delay. The chip
V IN L P F 1 A /D D e la y D /A L P F 2
provides two playing modes (echo and surround) and
the playing function block diagrams are shown as fol-
lows.
· Surround mode

V IN L P F 1 A /D D e la y D /A L P F 2 V O U T

ROSC-fOSC-Delay_time-Distortion Cross table


ROSC 56.2 44 36.3 30.6 25.9 23.1 20.7 kW
fOSC 2 2.5 3 3.5 4 4.5 5 MHz
Td 320 264 219 188 164 147 132 ms
THD 1.3 1.05 0.815 0.625 0.58 0.525 0.43 %

ROSC 18.5 16.7 15.1 14.5 13.9 11.9 10.9 kW


fOSC 5.5 6 6.5 7 7.5 8 8.5 MHz
Td 120 110 102 93 88 82 78 ms
THD 0.4 0.335 0.315 0.3 0.275 0.26 0.25 %

ROSC 10 9 8.06 7.3 6.4 5.8 5.3 kW


fOSC 9 10 11 12 13 14 15 MHz
Td 73.2 65.6 59.2 54.4 50 46 44 ms
THD 0.23 0.218 0.205 0.19 0.17 0.1675 0.1575 %

ROSC 4.8 4.4 4 3.7 3.3 3 2.8 kW


fOSC 16 17 18 19 20 21 22 MHz
Td 41.2 38.4 36 33.6 33 32 30 ms
THD 0.16 0.145 0.14 0.14 0.13 0.125 0.12 %

Rev. 1.00 5 December 23, 2008


HT8972

Application Circuits
Echo Mode

9 V
1 m F 1 k W 1 m F 1 k W 3 8 4 .7 m F
4 5 5 8 1
M IC 2 2 0 k W
4 M IC V O L
4 .7 k W 4 .7 k W 4 7 k W
4 7 k W
1 0 0 m F
3 9 p F
4 .7 k W
5 6 0 W
V C C 6 8 0 0 p F 4 .7 m F
4 .7 k W 4 .3 k W
2 2 m F
V C C 1 0 0 k W
1 0 k W 4 .7 m F 2 .7 k W
1 V C C 1 6
L P F 1 _ IN
1 0 0 m F 2 R E F 1 0 0 0 p F
0 .1 m F 1 5
4 7 m F 3 A G N D L P F 1 _ O U T
1 0 m F O u tp u t
4 4 .3 k W 4 .7 k W E c h o M o d e
D G N D 1
1 0 m F F e e d B a c k 2
5 O S C _ O 3 .3 k W
2 0 k W 6
R V C O 5 0 k W
O S C 0 .0 3 3 m F

2 0 k W 1 4 4 .3 k W
D e la y T im e L P F 2 _ O U T
5 6 0 p F
1 3
L P F 2 _ IN
1 0 k W
1 2
O P 2 _ O U T
4 .3 k W 6 8 0 0 p F
6 8 0 0 p F
7 C C 1 1 1
O P 2 _ IN
8 O P 1 _ IN 1 0
C C 0
6 8 0 0 p F
O P 1 _ O U T 9
0 .1 m F 0 .1 m F

H T 8 9 7 2

Note: 1. : Analog ground, : Digital ground


2. When the value of the Rosc increases, the range of the Delay time also increases. Please refer to the
ROSC-fOSC-Delay_time-Distortion Cross table for the ROSC & Delay time values.

Rev. 1.00 6 December 23, 2008


HT8972

Surround Mode
9 V
1 m F 1 k W 1 m F 1 k W 3 8 4 .7 m F
4 5 5 8 1
M IC 2 2 0 k W
4 M IC V O L
4 .7 k W 4 .7 k W 4 7 k W
4 7 k W
1 0 0 m F
3 9 p F
4 .7 k W
5 6 0 W
V C C 6 8 0 0 p F 4 .7 m F
4 .7 k W 4 .3 k W
2 2 m F
V C C 1 0 0 k W
1 1 6 1 0 k W
V C C L P F 1 _ IN
1 0 0 m F 2 R E F 1 0 0 0 p F
0 .1 m F 1 5
4 7 m F 3 A G N D L P F 1 _ O U T
4 4 .3 k W
D G N D
1 0 m F O u tp u t
3 .3 k W S u rro u n d M o d e
5 O S C _ O 1
2 0 k W 2
6 V C O
R O S C

2 0 k W 1 4 4 .3 k W
D e la y T im e L P F 2 _ O U T
5 6 0 p F
1 3
L P F 2 _ IN
1 0 k W
1 2
O P 2 _ O U T
4 .3 k W 6 8 0 0 p F
6 8 0 0 p F
7 C C 1 1 1
O P 2 _ IN
8 1 0
C C 0 O P 1 _ IN
6 8 0 0 p F
9
0 .1 m F 0 .1 m F O P 1 _ O U T

H T 8 9 7 2

Note: 1. : Analog ground, : Digital ground


2. When the value of the Rosc increases, the range of the Delay time also increases. Please refer to the
ROSC-fOSC-Delay_time-Distortion Cross table for the ROSC & Delay time values.

Rev. 1.00 7 December 23, 2008


HT8972

Package Information
16-pin DIP (300mil) Outline Dimensions

A A

1 6 9 1 6 9
B B
1 8 1 8

H H

C C

D D

E G I E G I
F F

Fig1. Full Lead Packages Fig2. 1/2 Lead Packages

· MS-001d (see fig1)

Dimensions in mil
Symbol
Min. Nom. Max.
A 780 ¾ 880
B 240 ¾ 280
C 115 ¾ 195
D 115 ¾ 150
E 14 ¾ 22
F 45 ¾ 70
G ¾ 100 ¾
H 300 ¾ 325
I ¾ ¾ 430

· MS-001d (see fig2)

Dimensions in mil
Symbol
Min. Nom. Max.
A 735 ¾ 775
B 240 ¾ 280
C 115 ¾ 195
D 115 ¾ 150
E 14 ¾ 22
F 45 ¾ 70
G ¾ 100 ¾
H 300 ¾ 325
I ¾ ¾ 430

Rev. 1.00 8 December 23, 2008


HT8972

· MO-095a (see fig2)

Dimensions in mil
Symbol
Min. Nom. Max.
A 745 ¾ 785
B 275 ¾ 295
C 120 ¾ 150
D 110 ¾ 150
E 14 ¾ 22
F 45 ¾ 60
G ¾ 100 ¾
H 300 ¾ 325
I ¾ ¾ 430

Rev. 1.00 9 December 23, 2008


HT8972

16-pin SOP (300mil) Outline Dimensions

1 6 9

A B

1 8

C '
G
D H

E F
a

· MS-013

Dimensions in mil
Symbol
Min. Nom. Max.
A 393 ¾ 419
B 256 ¾ 300
C 12 ¾ 20
C¢ 398 ¾ 413
D ¾ ¾ 104
E ¾ 50 ¾
F 4 ¾ 12
G 16 ¾ 50
H 8 ¾ 13
a 0° ¾ 8°

Rev. 1.00 10 December 23, 2008


HT8972

Product Tape and Reel Specifications


Reel Dimensions

D
T 2

A B C

T 1

SOP 16W (300mil)


Symbol Description Dimensions in mm
A Reel Outer Diameter 330.0±1.0
B Reel Inner Diameter 100.0±1.5
C Spindle Hole Diameter 13.0+0.5/-0.2
D Key Slit Width 2.0±0.5
T1 Space Between Flange 16.8+0.3/-0.2

T2 Reel Thickness 22.2±0.2

Rev. 1.00 11 December 23, 2008


HT8972

Carrier Tape Dimensions

P 0 P 1
D t

F
W
B 0
C

D 1 P
K 0
A 0

R e e l H o le

IC p a c k a g e p in 1 a n d th e r e e l h o le s
a r e lo c a te d o n th e s a m e s id e .

SOP 16W (300mil)


Symbol Description Dimensions in mm
W Carrier Tape Width 16.0±0.2
P Cavity Pitch 12.0±0.1
E Perforation Position 1.75±0.10
F Cavity to Perforation (Width Direction) 7.5±0.1
D Perforation Diameter 1.50+0.10/-0.00
D1 Cavity Hole Diameter 1.50+0.25/-0.00
P0 Perforation Pitch 4.0±0.1
P1 Cavity to Perforation (Length Direction) 2.0±0.1
A0 Cavity Length 10.9±0.1
B0 Cavity Width 10.8±0.1
K0 Cavity Depth 3.0±0.1
t Carrier Tape Thickness 0.30±0.05
C Cover Tape Width 13.3±0.1

Rev. 1.00 12 December 23, 2008


HT8972

Holtek Semiconductor Inc. (Headquarters)


No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan
Tel: 886-3-563-1999
Fax: 886-3-563-1189
http://www.holtek.com.tw

Holtek Semiconductor Inc. (Taipei Sales Office)


4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan
Tel: 886-2-2655-7070
Fax: 886-2-2655-7373
Fax: 886-2-2655-7383 (International sales hotline)

Holtek Semiconductor Inc. (Shanghai Sales Office)


G Room, 3 Floor, No.1 Building, No.2016 Yi-Shan Road, Minhang District, Shanghai, China 201103
Tel: 86-21-5422-4590
Fax: 86-21-5422-4705
http://www.holtek.com.cn

Holtek Semiconductor Inc. (Shenzhen Sales Office)


5F, Unit A, Productivity Building, Gaoxin M 2nd, Middle Zone Of High-Tech Industrial Park, ShenZhen, China 518057
Tel: 86-755-8616-9908, 86-755-8616-9308
Fax: 86-755-8616-9722

Holtek Semiconductor Inc. (Beijing Sales Office)


Suite 1721, Jinyu Tower, A129 West Xuan Wu Men Street, Xicheng District, Beijing, China 100031
Tel: 86-10-6641-0030, 86-10-6641-7751, 86-10-6641-7752
Fax: 86-10-6641-0125

Holtek Semiconductor Inc. (Chengdu Sales Office)


709, Building 3, Champagne Plaza, No.97 Dongda Street, Chengdu, Sichuan, China 610016
Tel: 86-28-6653-6590
Fax: 86-28-6653-6591

Holtek Semiconductor (USA), Inc. (North America Sales Office)


46729 Fremont Blvd., Fremont, CA 94538, USA
Tel: 1-510-252-9880
Fax: 1-510-252-9885
http://www.holtek.com

Copyright Ó 2008 by HOLTEK SEMICONDUCTOR INC.


The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek as-
sumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used
solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable
without further modification, nor recommends the use of its products for application that may present a risk to human life
due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices
or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information,
please visit our web site at http://www.holtek.com.tw.

Rev. 1.00 13 December 23, 2008

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