HT8972 Voice Echo: Features
HT8972 Voice Echo: Features
HT8972 Voice Echo: Features
Voice Echo
Features
· Operating voltage: 4.5V~5.5V · Low distortion rate
· ADM algorithm - Echo mode: 1%
- Surround mode: 0.2%
· Low noise
- Echo mode: -85dB · Built-in 40Kb SRAM
- Surround mode: -90dB · Automatic reset function
· 16-pin DIP/SOP package
Applications
· Television · Video disc player
· Karaoke systems · Sound equipments
General Description
The HT8972 is an echo/surround effect processor. It is Its built-in 40Kb SRAM can generate delay time effect
designed for various audio systems including karaoke, and can control the delay time value through the exter-
television, sound equipments, etc. The chip consists of nal VCO resistor.
a built-in pre-amplifier, VCO or Voltage Control OSC,
The VCO circuit can reduce external components and
40Kb SRAM, A/D and D/A converters as well as delay
make it easy to adjust the delay time.
time control logic.
Block Diagram
L P F 1 _ IN L P F 1 _ O U T L P F 2 _ O U T L P F 2 _ IN O P 2 _ O U T O P 2 _ IN O P 1 _ IN O P 1 _ O U T C C 0 C C 1
4 .7 k W 4 .7 k W
M O D
C O M P D E M
L P F 2
L P F 1
1 /2 V C C D I D O 0 D O 1
M O M I C L O C K
A U T O
R E S E T
4 0 K B its
V C O
R A M
V C C R E F A G N D D G N D O S C _ O v c o
Pin Assignment
V C C 1 1 6 L P F 1 _ IN
R E F 2 1 5 L P F 1 _ O U T
A G N D 3 1 4 L P F 2 _ O U T
D G N D 4 1 3 L P F 2 _ IN
O S C _ O 5 1 2 O P 2 _ O U T
V C O 6 1 1 O P 2 _ IN
C C 1 7 1 0 O P 1 _ IN
C C 0 8 9 O P 1 _ O U T
H T 8 9 7 2
1 6 D IP -A /S O P -A
Pad Assignment
L P F 1 _ O U T
L P F 2 _ O U T
L P F 1 _ IN
L P F 2 _ IN
D G N D
A G N D
V C C
R E F
1 5 1 4 1 3 1 2 1 1 1 0
1 1 6
(0 ,0 )
2 3 4 5 6 7 8 9
V C O
C C 1
O P 1 _ O U T
O P 1 _ IN
C C 0
O P 2 _ IN
O P 2 _ O U T
O S C _ O
Pad Description
Pad No. Pad Name I/O Internal Connection Description
1 DGND I ¾ Digital ground
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed
in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
Test Conditions
Symbol Parameter Min. Typ. Max. Unit
VDD Conditions
VCC Operating Voltage ¾ ¾ 4.5 5.0 5.5 V
ICC Operating Current 5V ¾ ¾ 15 30 mA
GV Voltage Gain 5V RL=47kW ¾ -0.9 2.5 dB
VOMAX Maximum Output Voltage 5V THD=10% 0.9 1.8 ¾ Vrms
DVCC=-20dBV (0.1Vrms)
PSRR Power Supply Rejection Ratio 5V ¾ -40 -30 dB
f=100Hz
Functional Description
The HT8972 is an echo/surround effect generator with · Echo mode
built-in 40Kb SRAM. It ensures low distortion as well as
V O U T
low noise for processing audio signal delay. The chip
V IN L P F 1 A /D D e la y D /A L P F 2
provides two playing modes (echo and surround) and
the playing function block diagrams are shown as fol-
lows.
· Surround mode
V IN L P F 1 A /D D e la y D /A L P F 2 V O U T
Application Circuits
Echo Mode
9 V
1 m F 1 k W 1 m F 1 k W 3 8 4 .7 m F
4 5 5 8 1
M IC 2 2 0 k W
4 M IC V O L
4 .7 k W 4 .7 k W 4 7 k W
4 7 k W
1 0 0 m F
3 9 p F
4 .7 k W
5 6 0 W
V C C 6 8 0 0 p F 4 .7 m F
4 .7 k W 4 .3 k W
2 2 m F
V C C 1 0 0 k W
1 0 k W 4 .7 m F 2 .7 k W
1 V C C 1 6
L P F 1 _ IN
1 0 0 m F 2 R E F 1 0 0 0 p F
0 .1 m F 1 5
4 7 m F 3 A G N D L P F 1 _ O U T
1 0 m F O u tp u t
4 4 .3 k W 4 .7 k W E c h o M o d e
D G N D 1
1 0 m F F e e d B a c k 2
5 O S C _ O 3 .3 k W
2 0 k W 6
R V C O 5 0 k W
O S C 0 .0 3 3 m F
2 0 k W 1 4 4 .3 k W
D e la y T im e L P F 2 _ O U T
5 6 0 p F
1 3
L P F 2 _ IN
1 0 k W
1 2
O P 2 _ O U T
4 .3 k W 6 8 0 0 p F
6 8 0 0 p F
7 C C 1 1 1
O P 2 _ IN
8 O P 1 _ IN 1 0
C C 0
6 8 0 0 p F
O P 1 _ O U T 9
0 .1 m F 0 .1 m F
H T 8 9 7 2
Surround Mode
9 V
1 m F 1 k W 1 m F 1 k W 3 8 4 .7 m F
4 5 5 8 1
M IC 2 2 0 k W
4 M IC V O L
4 .7 k W 4 .7 k W 4 7 k W
4 7 k W
1 0 0 m F
3 9 p F
4 .7 k W
5 6 0 W
V C C 6 8 0 0 p F 4 .7 m F
4 .7 k W 4 .3 k W
2 2 m F
V C C 1 0 0 k W
1 1 6 1 0 k W
V C C L P F 1 _ IN
1 0 0 m F 2 R E F 1 0 0 0 p F
0 .1 m F 1 5
4 7 m F 3 A G N D L P F 1 _ O U T
4 4 .3 k W
D G N D
1 0 m F O u tp u t
3 .3 k W S u rro u n d M o d e
5 O S C _ O 1
2 0 k W 2
6 V C O
R O S C
2 0 k W 1 4 4 .3 k W
D e la y T im e L P F 2 _ O U T
5 6 0 p F
1 3
L P F 2 _ IN
1 0 k W
1 2
O P 2 _ O U T
4 .3 k W 6 8 0 0 p F
6 8 0 0 p F
7 C C 1 1 1
O P 2 _ IN
8 1 0
C C 0 O P 1 _ IN
6 8 0 0 p F
9
0 .1 m F 0 .1 m F O P 1 _ O U T
H T 8 9 7 2
Package Information
16-pin DIP (300mil) Outline Dimensions
A A
1 6 9 1 6 9
B B
1 8 1 8
H H
C C
D D
E G I E G I
F F
Dimensions in mil
Symbol
Min. Nom. Max.
A 780 ¾ 880
B 240 ¾ 280
C 115 ¾ 195
D 115 ¾ 150
E 14 ¾ 22
F 45 ¾ 70
G ¾ 100 ¾
H 300 ¾ 325
I ¾ ¾ 430
Dimensions in mil
Symbol
Min. Nom. Max.
A 735 ¾ 775
B 240 ¾ 280
C 115 ¾ 195
D 115 ¾ 150
E 14 ¾ 22
F 45 ¾ 70
G ¾ 100 ¾
H 300 ¾ 325
I ¾ ¾ 430
Dimensions in mil
Symbol
Min. Nom. Max.
A 745 ¾ 785
B 275 ¾ 295
C 120 ¾ 150
D 110 ¾ 150
E 14 ¾ 22
F 45 ¾ 60
G ¾ 100 ¾
H 300 ¾ 325
I ¾ ¾ 430
1 6 9
A B
1 8
C '
G
D H
E F
a
· MS-013
Dimensions in mil
Symbol
Min. Nom. Max.
A 393 ¾ 419
B 256 ¾ 300
C 12 ¾ 20
C¢ 398 ¾ 413
D ¾ ¾ 104
E ¾ 50 ¾
F 4 ¾ 12
G 16 ¾ 50
H 8 ¾ 13
a 0° ¾ 8°
D
T 2
A B C
T 1
P 0 P 1
D t
F
W
B 0
C
D 1 P
K 0
A 0
R e e l H o le
IC p a c k a g e p in 1 a n d th e r e e l h o le s
a r e lo c a te d o n th e s a m e s id e .